1. A mark position setting method, comprising:

acquiring position parameters of a film forming region;

determining a first candidate marking area on a preset substrate according to the film forming area position parameter;

acquiring an occupancy position parameter;

determining a second candidate marking region within the first candidate marking region according to the occupant position parameter;

acquiring coordinate constraint parameters;

determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter;

and determining the set position of the mark according to the mark position parameter.

2. The method of claim 1, wherein the step of obtaining the position parameters of the film formation region comprises:

acquiring edge size parameters of the preset substrate;

acquiring a size parameter of an edge guarantee area;

and determining the position parameters of the film forming area according to the edge dimension parameters of the preset substrate and the dimension parameters of the edge guarantee area.

3. The mark position setting method according to claim 1, wherein the step of acquiring the occupant position parameter includes:

detecting a marker occupancy within the first candidate marker region;

calculating positional data of the marker occupancy within the first candidate marker region;

determining an occupant position parameter from position data of the marker occupant within the first candidate marker region.

4. The mark position setting method according to claim 1, wherein the step of acquiring the occupant position parameter includes:

detecting a device occupancy within the first candidate marking region;

calculating position data of the device occupant within the first candidate marking region;

an occupant position parameter is determined from position data of the device occupant within the first candidate marking region.

5. The mark position setting method according to claim 1, wherein the step of determining a second candidate mark region within the first candidate mark region based on the occupant position parameter includes:

determining an occupation area of an occupation according to the occupation position parameters;

and removing the occupied area of the occupied object from the first candidate marking area to obtain the second candidate marking area.

6. The mark position setting method according to claim 1, wherein the coordinate constraint parameter includes a lateral coordinate constraint parameter, and the step of determining the mark position parameter in the second candidate mark region based on the coordinate constraint parameter includes:

determining the transverse coordinate of the mark according to the transverse coordinate constraint parameter;

and determining the mark position parameters according to the transverse coordinates of the mark.

7. The mark position setting method according to claim 6, wherein the coordinate constraint parameters further include a vertical coordinate constraint parameter, and the step of determining the mark position parameter in the second candidate mark region based on the coordinate constraint parameter further includes:

determining the longitudinal coordinate of the mark according to the longitudinal coordinate constraint parameter;

and determining the position parameters of the marks according to the transverse coordinates and the longitudinal coordinates.

8. The mark position setting method according to claim 1, wherein the coordinate constraint parameter includes a bidirectional coordinate constraint parameter, and the step of determining the mark position parameter in the second candidate mark region based on the coordinate constraint parameter further includes:

determining the transverse coordinate of the mark and the longitudinal coordinate of the mark according to the two-way coordinate constraint parameter;

and determining the mark position parameters according to the transverse coordinates of the mark and the longitudinal coordinates of the mark.

9. The mark position setting method according to claim 1, wherein the step of acquiring the coordinate constraint parameter further comprises:

acquiring a mark number parameter and a coordinate range parameter;

the step of determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter comprises:

determining the marker position parameter within the second candidate marker region based on the coordinate constraint parameter, the marker number parameter, and the coordinate range parameter.

10. A mark position setting apparatus, characterized by comprising:

the first acquisition module is used for acquiring position parameters of a film forming area;

a first determining module, configured to determine a first candidate mark region on a preset substrate according to the position parameter of the film forming region;

a second acquisition module for acquiring an occupancy position parameter;

a second determination module for determining a second candidate marking region within the first candidate marking region according to the occupant position parameter;

the third acquisition module is used for acquiring coordinate constraint parameters;

a third determining module, configured to determine a marker position parameter within the second candidate marker region based on the coordinate constraint parameter;

and the fourth determining module is used for determining the set position of the mark according to the mark position parameter.

Background

The mask plate is an essential tool in the manufacturing process of electronic devices such as display panels, and the mask plate is used for exposure or vapor phase positioning deposition, which is an important means in the manufacturing process of the display panels. In the use process of the mask plate, the mask plate needs to be positioned through various marks. At present, a method for designing a mask plate mark is that a designer manually sets a mark position according to a design rule and personal experience, and the method has high experience requirements and great dependence on the designer, high labor cost and time cost, and poor design consistency and accuracy.

Therefore, the existing method for manually designing the mask plate mark has the technical problems of high cost and poor accuracy.

Disclosure of Invention

The application provides a mark position setting method and a mark position setting device, which are used for solving the technical problems of high cost and poor accuracy existing in the existing method for manually designing a mask plate mark.

The application provides a mark position setting method, which comprises the following steps:

acquiring position parameters of a film forming region;

determining a first candidate marking area on a preset substrate according to the film forming area position parameter;

acquiring an occupancy position parameter;

determining a second candidate marking region within the first candidate marking region according to the occupant position parameter;

acquiring coordinate constraint parameters;

determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter;

and determining the set position of the mark according to the mark position parameter.

In the mark position setting method of the present application, the step of obtaining the position parameter of the film formation region includes:

acquiring edge size parameters of the preset substrate;

acquiring a size parameter of an edge guarantee area;

and determining the position parameters of the film forming area according to the edge dimension parameters of the preset substrate and the dimension parameters of the edge guarantee area.

In the mark position setting method of the present application, the step of acquiring the occupant position parameter includes:

detecting a marker occupancy within the first candidate marker region;

calculating positional data of the marker occupancy within the first candidate marker region;

determining an occupant position parameter from position data of the marker occupant within the first candidate marker region.

In the mark position setting method of the present application, the step of acquiring the occupant position parameter includes:

detecting a device occupancy within the first candidate marking region;

calculating position data of the device occupant within the first candidate marking region;

an occupant position parameter is determined from position data of the device occupant within the first candidate marking region.

In the marking position setting method of the present application, the step of determining a second candidate marking region within the first candidate marking region according to the occupant position parameter includes:

determining an occupation area of an occupation according to the occupation position parameters;

and removing the occupied area of the occupied object from the first candidate marking area to obtain the second candidate marking area.

In the mark position setting method of the present application, the coordinate constraint parameter includes a lateral coordinate constraint parameter, and the step of determining the mark position parameter in the second candidate mark region based on the coordinate constraint parameter includes:

determining the transverse coordinate of the mark according to the transverse coordinate constraint parameter;

and determining the mark position parameters according to the transverse coordinates of the mark.

In the mark position setting method of the present application, the coordinate constraint parameters further include a longitudinal coordinate constraint parameter, and the step of determining the mark position parameter in the second candidate mark region based on the coordinate constraint parameter further includes:

determining the longitudinal coordinate of the mark according to the longitudinal coordinate constraint parameter;

and determining the position parameters of the marks according to the transverse coordinates and the longitudinal coordinates.

In the mark position setting method of the present application, the coordinate constraint parameter includes a bidirectional coordinate constraint parameter, and the step of determining the mark position parameter in the second candidate mark region based on the coordinate constraint parameter further includes:

determining the transverse coordinate of the mark and the longitudinal coordinate of the mark according to the two-way coordinate constraint parameter;

and determining the mark position parameters according to the transverse coordinates of the mark and the longitudinal coordinates of the mark.

In the mark position setting method of the present application, the step of obtaining the coordinate constraint parameter further includes:

acquiring a mark number parameter and a coordinate range parameter;

the step of determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter comprises:

determining the marker position parameter within the second candidate marker region based on the coordinate constraint parameter, the marker number parameter, and the coordinate range parameter.

The present application also provides a mark position setting device, which includes:

the first acquisition module is used for acquiring position parameters of a film forming area;

a first determining module, configured to determine a first candidate mark region on a preset substrate according to the position parameter of the film forming region;

a second acquisition module for acquiring an occupancy position parameter;

a second determination module for determining a second candidate marking region within the first candidate marking region according to the occupant position parameter;

the third acquisition module is used for acquiring coordinate constraint parameters;

a third determining module, configured to determine a marker position parameter within the second candidate marker region based on the coordinate constraint parameter;

and the fourth determining module is used for determining the set position of the mark according to the mark position parameter.

The beneficial effect of this application is: the application provides a method and a device for setting a marking position, wherein the method for setting the marking position comprises the following steps: acquiring position parameters of a film forming region; determining a first candidate marking area on a preset substrate according to the film forming area position parameter; acquiring an occupancy position parameter; determining a second candidate marking region within the first candidate marking region according to the occupant position parameter; acquiring coordinate constraint parameters; determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter; and determining the set position of the mark according to the mark position parameter. According to the method, the candidate marking region is determined through the film forming region position parameter and the occupier position parameter, and the marking setting position is determined in the candidate marking region according to the coordinate constraint parameter.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a flowchart of an application scenario of a mark position setting method according to an embodiment of the present application.

Fig. 2 is a flowchart of a method for setting a mark position according to an embodiment of the present disclosure.

FIG. 3 is a schematic diagram of a markup layout set by the markup position setting method provided in the present application.

Fig. 4 is a schematic structural diagram of a mark position setting device according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides a method and a device for setting a marking position, wherein the method for setting the marking position comprises the following steps: acquiring position parameters of a film forming region; determining a first candidate marking area on a preset substrate according to the film forming area position parameter; acquiring an occupancy position parameter; determining a second candidate marking region within the first candidate marking region according to the occupant position parameter; acquiring coordinate constraint parameters; determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter; and determining the set position of the mark according to the mark position parameter. According to the mask plate marking method and device, the candidate marking area is determined through the film forming area position parameter and the occupier position parameter, the mark setting position is determined in the candidate marking area according to the coordinate constraint parameter, the setting of the marking position is conveniently carried out automatically, the accuracy of mask plate marking is favorably improved, and the production cost is favorably reduced.

Referring to fig. 1, fig. 1 is a flowchart illustrating an application scenario of a method for setting a mark position according to an embodiment of the present application. The typesetting design of the mask plate needs the following steps: typesetting; placing a fixed mark; routing arrangement; placing non-fixed marks; judging interference; exposure test analysis; and finishing typesetting of the mask plate. Wherein, typesetting is as follows: the dimensions and feature of the structure elements of the mask plate are determined. The fixed mark placing means that: and determining marks of fixed positions to be set on the mask plate, and manually setting the positions of the fixed marks. The routing arrangement is as follows: and laying test wires, functional wires and the like required by the mask plate on the mask plate. The non-fixed mark placement means: the mark position setting method provided by the embodiment of the application is just directed at the placement of the non-fixed mark. The interference judgment means: carrying out interference judgment on the fixed marks, the routing and the non-fixed marks which are also placed, and determining whether the fixed marks, the routing and the non-fixed marks are interfered with each other; and returning to the fixed mark placing again if the interference condition exists. The exposure test analysis means: carrying out function tests of the test wiring and the function wiring, carrying out exposure test, and judging whether a problem exists; and if the problem exists, returning to the step of routing layout again. And finally, completing the typesetting design of the mask plate.

Referring to fig. 2, fig. 2 is a flowchart of a method for setting a mark position according to an embodiment of the present disclosure. The method for setting the marking position provided by the embodiment of the application comprises the following steps:

step S101, obtaining the position parameters of the film forming region.

Specifically, the step of acquiring the position parameters of the film forming region comprises the following steps: acquiring edge size parameters of the preset substrate; acquiring a size parameter of an edge guarantee area; and determining the position parameters of the film forming area according to the edge dimension parameters of the preset substrate and the dimension parameters of the edge guarantee area.

For example, the edge dimension parameters of the predetermined substrate are obtained as follows: length 100 mm, width 80 mm; the size parameters of the edge guarantee area are obtained as follows: 15 mm from the edge; determining the position parameters of the film forming area according to the edge dimension parameters of the preset substrate and the dimension parameters of the edge guarantee area as follows: the dimension of the film forming area is 85 mm in length and 65 mm in width, a coordinate system is established in the film forming area, and dimension data of the edge of the film forming area is calibrated to obtain position parameters of the film forming area.

For another example, the Enclose to glass parameter is set: for defining the placement of the marks in the film-forming region, the distance of the film-forming region from the edge of the substrate may be set to 15 mm.

Step S102, determining a first candidate mark area on a preset substrate according to the film forming area position parameter.

Specifically, the position parameter of the film forming region is determined as a first candidate mark region corresponding to the film forming region on the predetermined substrate, and the first candidate mark region is an effective region for setting a mark position.

Step S103, acquiring the occupancy position parameter.

In particular, the occupancy includes both label occupancy and device occupancy. The marker occupancy is: the mark already existing in the first candidate mark region is, for example, a fixed mark set manually. The device occupancy refers to: the trace lines, electronic elements, and the like, which are already present in the first candidate mark region, such as the already set test trace lines and the already set function trace lines.

The step of acquiring occupant position parameters includes: detecting a marker occupancy within the first candidate marker region; calculating positional data of the marker occupancy within the first candidate marker region; determining an occupant position parameter from position data of the marker occupant within the first candidate marker region.

For example, set Forbidden Area parameter: the method is used for selecting the forbidden zone layer and is mainly used for preventing the newly-set marks from interfering with the marks in the forbidden zone.

Further, the step of obtaining the occupant position parameter further includes: detecting a device occupancy within the first candidate marking region; calculating position data of the device occupant within the first candidate marking region; an occupant position parameter is determined from position data of the device occupant within the first candidate marking region.

For example, setting a block Layer parameter: the method is used for selecting the barrier layer, and is mainly used for preventing the interference between a newly set mark and a barrier, wherein the barrier is a test wire, a functional wire and the like.

And step S104, determining a second candidate marking area in the first candidate marking area according to the occupancy position parameter.

Specifically, the step of determining a second candidate marking region within the first candidate marking region according to the occupant position parameter comprises: determining an occupation area of an occupation according to the occupation position parameters; and removing the occupied area of the occupied object from the first candidate marking area to obtain the second candidate marking area.

Step S105, coordinate constraint parameters are obtained.

Specifically, the coordinate constraint parameter includes at least one of a lateral coordinate constraint parameter, a longitudinal coordinate constraint parameter, and a bidirectional coordinate constraint parameter.

Optionally, the step of obtaining the coordinate constraint parameter further includes: and acquiring a mark number parameter and a coordinate range parameter. The parameter of the number of marks refers to a parameter for limiting the number of marks, and the parameter of the coordinate range refers to a parameter for limiting the range of coordinate values.

For example, the parameters for the coordinate ranges may be: a Max X Distance parameter used for limiting the maximum value of the X coordinate Distance of all the current marks; a Max Y Distance parameter used for limiting the maximum value of the Y coordinate Distance of all the current marks; a Min X Distance parameter used for limiting the minimum value of the X coordinate Distance of all the current marks; and a Min Y Distance parameter used for limiting the minimum value of the Y coordinate Distance of all the current marks.

And step S106, determining a mark position parameter in the second candidate mark area based on the coordinate constraint parameter.

The coordinate constraint parameters include lateral coordinate constraint parameters, and the step of determining marker location parameters within the second candidate marker region based on the coordinate constraint parameters includes: determining the transverse coordinate of the mark according to the transverse coordinate constraint parameter; and determining the mark position parameters according to the transverse coordinates of the mark.

For example, the X coordinate constraint parameter By Left and Right Sides Of Mask-column (unshared) is set, that is, two symmetrical columns in the second candidate mark region are required to be set for defining the new mark, that is, the horizontal coordinate Of the new mark is defined. Setting X: locate On n Cols, i.e., the number of newly set tags is defined.

Further, the coordinate constraint parameters further include a longitudinal coordinate constraint parameter, and the step of determining the marker position parameter in the second candidate marker region based on the coordinate constraint parameters further includes: determining the longitudinal coordinate of the mark according to the longitudinal coordinate constraint parameter; and determining the position parameters of the marks according to the transverse coordinates and the longitudinal coordinates.

For example, a Y-coordinate constraint parameter of Matrix On Y Distance Series is set, i.e. the mark Distance in the Y direction that must be maintained in each new column of marks is required. Setting Y: locate one m Rows, i.e., defines the number of newly set tags in each column.

Further, the coordinate constraint parameter comprises a bidirectional coordinate constraint parameter, and the step of determining the marker position parameter in the second candidate marker region based on the coordinate constraint parameter further comprises: determining the transverse coordinate of the mark and the longitudinal coordinate of the mark according to the two-way coordinate constraint parameter; and determining the mark position parameters according to the transverse coordinates of the mark and the longitudinal coordinates of the mark.

For example, XY is set, namely, it is required to set a mark at or near the Center point in the candidate mark region. Setting XY: by Corner Of Panel, i.e., specifies that a marker must be set for each center Of the marked area. Coordinates, i.e., the coordinate system in which the current mark is located, is set XY. By Lens' Center Line is set, i.e., it is specified that the mark is set within a certain range of a specific prism. Setting XY Mark Plaving By Scopes, i.e., setting a Mark within a specified X, Y coordinate region, a plurality of regions can be defined, one Mark being set for each region. Setting XY Matrix On n Cols & m Rows, namely requiring all newly-set marks to form a Matrix form of n Rows and m columns. Mirror X, i.e., all of the marks defining the current must form a symmetrical layout about the X axis. Mirror Y, i.e., all Marks that qualify for the current must form a symmetrical layout about the Y axis.

And step S107, determining the set position of the mark according to the mark position parameter.

Specifically, the specific setting position of the marker is determined in the second candidate marker region based on the specific marker position data determined in the above step, and the marker is set.

The above-described marker position setting method is explained below with reference to specific embodiments:

referring to fig. 3, fig. 3 is a schematic diagram of a mark layout set by the mark position setting method provided in the present application.

Firstly, determining the size data of a preset substrate: the preset substrate is respectively symmetrical along an X axis and a Y axis and exists at a symmetrical center O, and the boundary data of the preset substrate is 425 mm in the maximum size in the X direction and 700 mm in the maximum size in the Y direction.

Then, the size (20 mm) of the edge guarantee region was removed to obtain the size data of the film-forming region.

Then, the specific position of the mark in the film formation area is set according to the coordinate constraint parameters (in this embodiment, the number of the occupied objects in the film formation area is shown as 0), and the coordinate constraint parameters are specifically as follows:

all marks remain centrosymmetric about the center of symmetry O;

x1 is equal to X2, L is less than or equal to 746 mm;

y (+) and Y (-) are both less than or equal to 640 mm, and Y (+) and Y (-) may not be equal;

the marks are arranged in 3 rows and 2 columns, and the arrangement layout is symmetrical about the X axis and the Y axis, respectively.

In summary, the mark position setting method provided in the embodiment of the present application determines the candidate mark region by the film formation region position parameter and the occupant position parameter, and determines the mark setting position in the candidate mark region according to the coordinate constraint parameter, so that the mark position can be set automatically, which is beneficial to improving the accuracy of designing the mark of the mask plate and reducing the production cost.

An embodiment of the present invention further provides a mark position setting device, please refer to fig. 4, where the mark position setting device includes: a first obtaining module 401, a first determining module 402, a second obtaining module 403, a second determining module 404, a third obtaining module 405, a third determining module 406, and a fourth determining module 407.

The first obtaining module 401 is configured to obtain position parameters of a film forming region; the first determining module 402 is configured to determine a first candidate mark region on a predetermined substrate according to the position parameter of the film forming region; the second obtaining module 403 is configured to obtain an occupancy position parameter; the second determining module 404 is configured to determine a second candidate marking region within the first candidate marking region according to the occupant position parameter; the third obtaining module 405 is configured to obtain a coordinate constraint parameter; the third determining module 406 is configured to determine a marker position parameter within the second candidate marker region based on the coordinate constraint parameter; the fourth determining module 407 is configured to determine a setting position of the mark according to the mark position parameter.

The first obtaining module 401 is further configured to obtain an edge dimension parameter of the preset substrate, obtain a dimension parameter of an edge guarantee region, and determine a position parameter of the film forming region according to the edge dimension parameter of the preset substrate and the dimension parameter of the edge guarantee region.

The second acquiring module 403 is configured to detect a marker occupancy object in the first candidate marking region, calculate position data of the marker occupancy object in the first candidate marking region, and determine an occupancy position parameter according to the position data of the marker occupancy object in the first candidate marking region.

The second acquisition module 403 is further configured to detect a device occupancy within the first candidate marking region, to calculate position data of the device occupancy within the first candidate marking region, and to determine an occupancy position parameter from the position data of the device occupancy within the first candidate marking region.

The second determining module 404 is configured to determine an occupied area of an occupant according to the occupant position parameter, and further configured to remove the occupied area of the occupant from the first candidate marking area, so as to obtain the second candidate marking area.

The third determining module 406 is configured to determine the transverse coordinate of the mark according to the transverse coordinate constraint parameter, and is further configured to determine the mark position parameter according to the transverse coordinate of the mark.

The third determining module 406 is further configured to determine a longitudinal coordinate of the mark according to the longitudinal coordinate constraint parameter, and further determine a position parameter of the mark according to the transverse coordinate and the longitudinal coordinate.

The third determining module 406 is further configured to determine a transverse coordinate of the mark and a longitudinal coordinate of the mark according to the two-way coordinate constraint parameter, and further determine the mark position parameter according to the transverse coordinate of the mark and the longitudinal coordinate of the mark.

The third obtaining module 405 is further configured to obtain a mark number parameter and a coordinate range parameter. The third determining module 406 is further configured to determine the mark position parameter in the second candidate mark region based on the coordinate constraint parameter, the mark number parameter and the coordinate range parameter.

It should be noted that, although the present application has been described with reference to specific examples, the above-mentioned examples are not intended to limit the present application, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application shall be limited by the appended claims.