1. A prediction method of welding spot temperature is characterized by comprising the following steps:

establishing a virtual test environment according to the received test environment construction request;

determining a plurality of welding spot structural parameters associated with welding spots, and performing orthogonal experimental design on the plurality of welding spot structural parameters according to a received orthogonal experimental design request to generate a plurality of corresponding experimental combinations;

performing thermal simulation in the virtual test environment according to the plurality of experimental combinations, and determining the highest temperature of the welding spot corresponding to each experimental combination;

determining a primary-secondary relation among the structural parameters of the welding spots according to each experimental combination and the highest temperature of the welding spot corresponding to the experimental combination;

and establishing a prediction model between the plurality of welding spot structural parameters and the highest welding spot temperature according to the welding spot structural parameter value corresponding to each experimental combination, the highest welding spot temperature and the primary and secondary relations among the plurality of welding spot structural parameters.

2. The method of claim 1, wherein the creating a virtual test environment comprises:

establishing a virtual test box and a virtual three-dimensional model of an object to be tested;

the performing thermal simulation in the virtual test environment according to the plurality of experimental combinations comprises:

establishing a three-dimensional model to be tested with a corresponding welding spot structure, which corresponds to the plurality of experimental combinations one by one, according to the virtual three-dimensional model;

and performing thermal simulation on all the established three-dimensional models to be tested in the virtual test box.

3. The method of claim 1, wherein the determining the primary and secondary relationships between the plurality of solder joint structural parameters according to each experimental combination and its corresponding solder joint maximum temperature comprises:

inputting the highest temperature of the welding spot corresponding to each group of experimental combinations into an orthogonal design table formed by each experimental combination;

and performing range analysis on the plurality of welding spot structural parameters according to the orthogonal design table, and determining primary and secondary relations among the plurality of welding spot structural parameters according to a range value.

4. The method of claim 3, wherein each welding spot structural parameter has a plurality of different welding spot structural parameter values;

the step of analyzing the range of the structural parameters of the welding spots according to the orthogonal design table comprises the following steps:

determining the average value of the highest welding point temperature corresponding to each welding point structural parameter value under each welding point structural parameter according to the orthogonal design table;

and determining the maximum difference value between the average values of the highest temperature of the welding spots corresponding to different welding spot structural parameter values under each welding spot structural parameter, and determining the maximum difference value as the range value of the corresponding welding spot structural parameter.

5. The method of claim 3 or 4, wherein the determining the primary and secondary relationships between the plurality of weld spot structural parameters according to the range comprises:

and determining the primary and secondary relations among the plurality of welding spot structural parameters according to the magnitude sequence of the range values corresponding to each welding spot structural parameter, wherein the larger the range value is, the more dominant the corresponding welding spot structural parameter is.

6. The method of any of claims 1-4, wherein determining a plurality of weld site configuration parameters associated with the weld site comprises:

determining all welding spot structure parameters influencing the highest temperature of the welding spot of the object to be measured;

and selecting a plurality of welding spot structure parameters with the confidence degrees larger than a preset value from all the welding spot structure parameters as welding spot structure parameters related to the welding spots.

7. The method according to any one of claims 1 to 4, wherein the establishing a prediction model between the plurality of solder joint structure parameters and the solder joint maximum temperature according to the solder joint structure parameter value, the solder joint maximum temperature and the primary and secondary relationship between the plurality of solder joint structure parameters corresponding to each experimental combination comprises:

and taking the plurality of welding spot structural parameters as variables, taking the welding spot highest temperature as a response, performing partial least squares algorithm fitting according to the welding spot structural parameter value corresponding to each experimental combination, the welding spot highest temperature and the primary and secondary relations among the plurality of welding spot structural parameters, and establishing a prediction formula between the plurality of welding spot structural parameters and the welding spot highest temperature.

8. An apparatus for predicting a solder joint temperature, comprising:

the test environment building module is used for building a virtual test environment according to the received test environment building request;

the orthogonal experiment design module is used for determining a plurality of welding spot structural parameters related to the welding spot, carrying out orthogonal experiment design on the plurality of welding spot structural parameters according to the received orthogonal experiment design request and generating a plurality of corresponding experiment combinations;

the temperature determining module is used for performing thermal simulation in the virtual test environment according to the plurality of experimental combinations and determining the highest temperature of the welding spot corresponding to each experimental combination;

the primary and secondary relation determining module is used for determining the primary and secondary relation among the plurality of welding spot structural parameters according to each experimental combination and the highest temperature of the corresponding welding spot;

and the prediction model establishing module is used for establishing a prediction model between the plurality of welding spot structural parameters and the highest welding spot temperature according to the welding spot structural parameter value corresponding to each experimental combination, the highest welding spot temperature and the primary and secondary relations among the plurality of welding spot structural parameters.

9. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of a method for predicting a solder joint temperature according to any one of claims 1 to 7.

10. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor executes the computer program to perform the steps of a method for predicting solder joint temperature according to any one of claims 1-7.

Background

With the rapid development of portable electronic products, embedded chips have been carried into more and more electronic products, such as smart wearable devices, vehicle-mounted electronic devices, and the like. With the demand for miniaturization of portable electronic products, the integration level of embedded chips is required to be higher and higher, and in the case of high integration level, a smaller packaging area ratio, that is, more chips can be placed in a unit area, is required to be pursued in the embedded chip package. However, in high-density packaging, the chips are closely connected to each other, which generates greater heat power consumption, resulting in increased temperature of the electronic product, and the high temperature may reduce the reliability of the electronic components, shorten the service life of the electronic components, and thus cause failure of the electronic product. Therefore, heat dissipation restricts integration and miniaturization of the packaged product, which has become an urgent problem to be solved in the package design. Thermal management of chip packages has become an integral part of the product prior to its manufacture.

In order to realize the thermal management of the chip package, a high-thermal-conductivity material is used, and meanwhile, the optimization of the structural parameters of the product becomes a novel mode for carrying out thermal management on the packaged product. The method is characterized in that welding of a chip is inevitably involved in the chip packaging process, so that the highest temperature of a welding spot is predicted in the welding process, and further, the structural parameters of the welding spot are optimized, so that the method is a new way for effectively improving the heat dissipation performance of a packaged product. However, in the conventional prediction method, a product structure is usually designed, then a thermal test is performed on the product structure, and the highest temperature of the solder joint is predicted according to the thermal test result. However, this approach is costly and also has low accuracy.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: the method and the device for predicting the temperature of the welding spot, the readable storage medium and the electronic equipment are provided, and the highest temperature of the welding spot can be accurately predicted at low cost.

In order to solve the technical problems, the invention adopts a technical scheme that:

a prediction method of welding spot temperature comprises the following steps:

establishing a virtual test environment according to the received test environment construction request;

determining a plurality of welding spot structural parameters related to a welding spot, and performing orthogonal experimental design on the plurality of welding spot structural parameters according to a received orthogonal experimental design request to generate a plurality of corresponding experimental combinations;

performing thermal simulation in the virtual test environment according to the plurality of experimental combinations, and determining the highest temperature of the welding spot corresponding to each experimental combination;

determining a primary-secondary relation among the welding spot structure parameters according to each experimental combination and the corresponding welding spot highest temperature;

and establishing a prediction model between the plurality of welding spot structural parameters and the highest welding spot temperature according to the welding spot structural parameter value corresponding to each experimental combination, the highest welding spot temperature and the primary and secondary relations among the plurality of welding spot structural parameters.

In order to solve the technical problem, the invention adopts another technical scheme as follows:

an apparatus for predicting solder joint temperature, comprising:

the test environment building module is used for building a virtual test environment according to the received test environment building request;

the orthogonal experiment design module is used for determining a plurality of welding spot structural parameters related to the welding spot, carrying out orthogonal experiment design on the plurality of welding spot structural parameters according to the received orthogonal experiment design request and generating a plurality of corresponding experiment combinations;

the temperature determining module is used for performing thermal simulation in the virtual test environment according to the plurality of experimental combinations and determining the highest temperature of the welding spot corresponding to each experimental combination;

the primary and secondary relation determining module is used for determining the primary and secondary relation among the plurality of welding spot structural parameters according to each experimental combination and the highest temperature of the corresponding welding spot;

and the prediction model establishing module is used for establishing a prediction model between the plurality of welding spot structural parameters and the highest welding spot temperature according to the welding spot structural parameter value corresponding to each experimental combination, the highest welding spot temperature and the primary and secondary relations among the plurality of welding spot structural parameters.

In order to solve the technical problem, the invention adopts another technical scheme as follows:

a computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the above-mentioned method for predicting a solder joint temperature.

In order to solve the technical problem, the invention adopts another technical scheme as follows:

an electronic device comprises a memory, a processor and a computer program stored on the memory and running on the processor, wherein the processor executes the computer program to realize the steps of the welding spot temperature prediction method.

The invention has the beneficial effects that: firstly determining a plurality of welding spot structural parameters related to welding spots, carrying out orthogonal experimental design on the plurality of welding spot structural parameters to obtain a plurality of experimental combinations, then carrying out thermal simulation on the plurality of experimental combinations in a constructed virtual test environment, determining the highest welding spot temperature corresponding to each experimental combination, determining the primary and secondary relations among the plurality of welding spot structural parameters according to each experimental combination and the corresponding highest welding spot temperature thereof, and finally establishing a prediction model between the plurality of welding spot structural parameters and the highest welding spot temperature according to the welding spot structural parameter values, the highest welding spot temperature and the primary and secondary relations among the welding spot structural parameters, on one hand, carrying out thermal simulation by constructing the virtual test environment, testing based on actual products is not needed, simultaneously testing of the plurality of experimental combinations is realized through the orthogonal experimental design, and the experimental times are reduced, therefore, the experiment cost is reduced, on the other hand, the primary and secondary relations among a plurality of welding spot structural parameters are determined through orthogonal experiment results, and the primary and secondary relations are considered when a prediction model is established between the welding spot structural parameters and the highest temperature of the welding spots, so that the accuracy of the established prediction model is ensured, the prediction of the highest temperature of the welding spots can be accurately realized at low cost, the heat dissipation performance of packaged products can be pre-researched in advance, the failure risk of the products in the packaging design is reduced, the reliability of the packaged products is improved, and the design cost and the production cost are reduced.

Drawings

FIG. 1 is a flowchart illustrating steps of a method for predicting solder joint temperature according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a device for predicting solder joint temperature according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a virtual test box according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a test board according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of an eMCP model according to an embodiment of the present invention;

fig. 7 is a schematic distribution diagram of a solder joint on an eMCP model according to an embodiment of the present invention;

FIG. 8 is a cloud graph of solder joint temperatures corresponding to an experimental set according to an embodiment of the present invention;

fig. 9 is a schematic structural diagram of a solder joint structure according to an embodiment of the present invention.

Detailed Description

In order to explain technical contents, achieved objects, and effects of the present invention in detail, the following description is made with reference to the accompanying drawings in combination with the embodiments.

Referring to fig. 1, an embodiment of the present invention provides a method for predicting solder joint temperature, including:

establishing a virtual test environment according to the received test environment construction request;

determining a plurality of welding spot structural parameters related to a welding spot, and performing orthogonal experimental design on the plurality of welding spot structural parameters according to a received orthogonal experimental design request to generate a plurality of corresponding experimental combinations;

performing thermal simulation in the virtual test environment according to the plurality of experimental combinations, and determining the highest temperature of the welding spot corresponding to each experimental combination;

determining a primary-secondary relation among the welding spot structure parameters according to each experimental combination and the corresponding welding spot highest temperature;

and establishing a prediction model between the plurality of welding spot structural parameters and the highest welding spot temperature according to the welding spot structural parameter value corresponding to each experimental combination, the highest welding spot temperature and the primary and secondary relations among the plurality of welding spot structural parameters.

As can be seen from the above description, the beneficial effects of the present invention are: firstly determining a plurality of welding spot structural parameters related to welding spots, carrying out orthogonal experimental design on the plurality of welding spot structural parameters to obtain a plurality of experimental combinations, then carrying out thermal simulation on the plurality of experimental combinations in a constructed virtual test environment, determining the highest welding spot temperature corresponding to each experimental combination, determining the primary and secondary relations among the plurality of welding spot structural parameters according to each experimental combination and the corresponding highest welding spot temperature thereof, and finally establishing a prediction model between the plurality of welding spot structural parameters and the highest welding spot temperature according to the welding spot structural parameter values, the highest welding spot temperature and the primary and secondary relations among the welding spot structural parameters, on one hand, carrying out thermal simulation by constructing the virtual test environment, not needing to carry out test based on actual products, simultaneously realizing the test of the plurality of experimental combinations through the orthogonal experimental design, and reducing the experimental times, therefore, the experiment cost is reduced, on the other hand, the primary and secondary relations among a plurality of welding spot structural parameters are determined through orthogonal experiment results, and the primary and secondary relations are considered when a prediction model between the welding spot structural parameters and the highest welding spot temperature is established, so that the accuracy of the established prediction model is ensured, the highest welding spot temperature can be accurately predicted at low cost, the heat dissipation performance of a packaged product can be pre-researched in advance, the failure risk of the product in the packaging design is reduced, the reliability of the packaged product is improved, and the design cost and the production cost are reduced.

Further, the establishing a virtual test environment includes:

establishing a virtual test box and a virtual three-dimensional model of an object to be tested;

the performing thermal simulation in the virtual test environment according to the plurality of experimental combinations comprises:

establishing a three-dimensional model to be tested with a corresponding welding spot structure, which corresponds to the plurality of experimental combinations one by one, according to the virtual three-dimensional model;

and performing thermal simulation on all the established three-dimensional models to be tested in the virtual test box.

According to the description, when the test environment is built, the virtual test box is built besides the virtual three-dimensional model corresponding to the object to be tested, so that the three-dimensional models to be tested with the welding spot structures corresponding to each experimental combination are subjected to thermal simulation in the virtual test box, the accuracy of the test result is ensured, and the accuracy of the welding spot temperature prediction is further ensured.

Further, the determining the primary and secondary relationship among the plurality of welding spot structural parameters according to each experimental combination and the welding spot maximum temperature corresponding to the experimental combination comprises:

inputting the highest temperature of the welding spot corresponding to each group of experimental combinations into an orthogonal design table formed by each experimental combination;

and performing range analysis on the plurality of welding spot structural parameters according to the orthogonal design table, and determining primary and secondary relations among the plurality of welding spot structural parameters according to the range value.

Furthermore, each welding spot structure parameter has a plurality of different welding spot structure parameter values;

the step of analyzing the range of the structural parameters of the welding spots according to the orthogonal design table comprises the following steps:

determining the average value of the highest welding point temperature corresponding to each welding point structural parameter value under each welding point structural parameter according to the orthogonal design table;

and determining the maximum difference value between the average values of the highest temperature of the welding spots corresponding to different welding spot structural parameter values under each welding spot structural parameter, and determining the maximum difference value as the range value of the corresponding welding spot structural parameter.

From the above description, it can be known that the primary and secondary relationships of a plurality of different welding spot structural parameters can be conveniently and rapidly determined by means of orthogonal experiments and range analysis, and the primary and secondary relationships can be applied to the establishment of a subsequent prediction model, so that the accuracy of the predicted maximum temperature of the welding spot is further improved.

Further, the determining the primary and secondary relationships among the plurality of welding spot structure parameters according to the range includes:

and determining the primary and secondary relations among the plurality of welding spot structure parameters according to the magnitude sequence of the range values corresponding to each welding spot structure parameter, wherein the larger the range value is, the more dominant the corresponding welding spot structure parameter is.

It can be known from the above description that the larger the range value is, the more dominant the corresponding welding spot structural parameters are, and the primary and secondary relationships between the welding spot structural parameters can be conveniently and quickly determined according to the range value.

Further, the determining a plurality of weld spot structural parameters associated with the weld spot comprises:

determining all welding spot structure parameters influencing the highest temperature of the welding spot of the object to be measured;

and selecting a plurality of welding spot structure parameters with the confidence degrees larger than the preset value from all the welding spot structure parameters as welding spot structure parameters related to the welding spots.

According to the description, the welding spot structural parameters for establishing the preset model are selected according to the confidence coefficient, so that the relevance between the selected welding spot structural parameters and the highest welding spot temperature can be ensured, and the accuracy of the preset welding spot highest temperature is further ensured.

Further, the establishing a prediction model between the plurality of welding spot structural parameters and the welding spot maximum temperature according to the welding spot structural parameter value, the welding spot maximum temperature and the primary and secondary relationship among the plurality of welding spot structural parameters corresponding to each experimental combination includes:

and taking the plurality of welding spot structural parameters as variables, taking the welding spot highest temperature as a response, performing partial least squares algorithm fitting according to the welding spot structural parameter value corresponding to each experimental combination, the welding spot highest temperature and the primary and secondary relations among the plurality of welding spot structural parameters, and establishing a prediction formula between the plurality of welding spot structural parameters and the welding spot highest temperature.

According to the description, the partial least square algorithm is used for fitting the structural parameter value of the welding spot and the highest temperature of the welding spot corresponding to each experimental combination according to the primary-secondary relation among the structural parameters of the welding spots, so that a prediction formula between the structural parameters of the welding spots and the highest temperature of the welding spot is established, the established prediction formula is guaranteed to be closer to the actual situation, the prediction formula can accurately predict the corresponding highest temperature of the welding spot based on the actual welding spot structure in the actual production process, the marketing time of products is shortened, and the trial-and-error cost of the process is reduced.

Referring to fig. 2, another embodiment of the present invention provides a solder joint temperature prediction apparatus, including:

the test environment building module is used for building a virtual test environment according to the received test environment building request;

the orthogonal experiment design module is used for determining a plurality of welding spot structural parameters related to the welding spot, carrying out orthogonal experiment design on the plurality of welding spot structural parameters according to the received orthogonal experiment design request and generating a plurality of corresponding experiment combinations;

the temperature determining module is used for performing thermal simulation in the virtual test environment according to the plurality of experimental combinations and determining the highest temperature of the welding spot corresponding to each experimental combination;

the primary and secondary relation determining module is used for determining the primary and secondary relation among the plurality of welding spot structural parameters according to each experimental combination and the highest temperature of the corresponding welding spot;

and the prediction model establishing module is used for establishing a prediction model between the plurality of welding spot structural parameters and the highest welding spot temperature according to the welding spot structural parameter value corresponding to each experimental combination, the highest welding spot temperature and the primary and secondary relations among the plurality of welding spot structural parameters.

Another embodiment of the present invention provides a computer-readable storage medium having stored thereon a computer program, which when executed by a processor, implements the steps in the method for predicting solder joint temperature described above.

Referring to fig. 3, another embodiment of the present invention provides an electronic device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method for predicting the solder joint temperature when executing the computer program.

The method, the device, the readable storage medium and the electronic device for predicting the solder joint temperature in the embodiment can be applied to various application scenarios involving soldering and requiring a solder joint structure, and are particularly suitable for predicting the highest solder joint temperature of electronic packaging products, such as various embedded chips:

the following description of the embedded Multi-Chip Package (eMCP) and the like is made by way of specific embodiments:

example one

Referring to fig. 1, a method for predicting solder joint temperature includes the steps of:

s1, establishing a virtual test environment according to the received test environment construction request;

wherein the establishing of the virtual test environment comprises:

establishing a virtual test box and a virtual three-dimensional model of an object to be tested;

specifically, a three-dimensional model of a test case can be established by using three-dimensional drawing software, the test case is a JEEDC thermal test case, namely a JEDEC standard case (JEDEC51-2), as shown in fig. 4, the cabinet has a cubic structure, the size is 30.48mm × 30.48mm × 30.48mm, the material of each side surface is Al, the thickness is 3.15mm, and the thermal conductivity coefficient is 308;

a test board is arranged in the cabinet, the test board is a JEDEC standard test board (JEDEC51-7), the structural diagram of the test board is shown in fig. 5, the size of the test board is 114.3mm × 76.2mm × 1.6mm, the material is FR4 (Othotropic), the thermal conductivity coefficient kxy is 22.3w/mK, and the kz is 0.3822.3w/mK, the test board is arranged in the cabinet through a rack, the size of the rack is 190mmx170mmx12.5mm, and the thermal conductivity coefficient is 0.2 w/mK;

the object to be measured in this embodiment is an eMCP, the corresponding virtual three-dimensional model is an eMCP model, a structural schematic diagram of the virtual three-dimensional model is shown in fig. 6, a size of a substrate is 10mm × 10mm × 0.18mm, a thermal conductivity is 0.45w/mK, first, two capacitors are arranged on the substrate, a size of the capacitor 1 is 0.61mm × 0.22mm × 0.3mm, a size of the capacitor 2 is 0.38mm × 0.93mm × 0.3mm, the two capacitors are both Ltcc and the thermal conductivity is 160;

a pad layer 1, a Dram1 chip, a pad layer 2, a Dummy1 chip, a pad layer 3 and a Dram2 chip are sequentially arranged on the substrate and on one side of the two capacitors, the thicknesses of the two chips are respectively 0.02mm, 0.06mm, 0.02mm and 0.06mm, the length and width dimensions are unified to be 7.666mm multiplied by 8.7991mm, a pad layer 4 and a Dummy2 chip are sequentially arranged right above the Dram2 chip, the thicknesses of the two chips are respectively 0.02mm and 0.06mm, and the length and width dimensions are respectively 7mm multiplied by 6.4 mm;

flash1 and Flash2 are sequentially placed on the Dummy2 from bottom to top, the thickness of the Flash is 0.06mm, the cushion layers are respectively a cushion layer 5 and a cushion layer 6, the thickness of the cushion layer 5 and the thickness of the cushion layer 6 are both 0.02mm, a small substrate and a Control chip are arranged beside the Dummy2 chip, the thickness of the Control chip and the thickness of the small substrate are respectively 0.15mm and 0.13mm, the thickness of the cushion layer of the Control chip and the small substrate are respectively 0.1mm and 0.2mm, the thickness of the cushion layer of the Control chip and the small substrate is respectively 0.8 mm and 9 mm, the thickness of the cushion layer of the Control chip and the small substrate is respectively 0.1mm and 0.2mm, the material of the Dram1, the Dram2, the Control, the Flash1 and the Flash2 is Si, the heat conductivity is 160, and the heat power is 0.42w, 0.84w, 0.282w under the full load condition;

the number of the welding spots on the eMCP model is 136, the distance between the welding spots is 0.5mm, and the welding spots are positioned below the substrate, as shown in FIG. 7;

s2, determining a plurality of welding spot structural parameters related to the welding spot, and performing orthogonal experimental design on the plurality of welding spot structural parameters according to the received orthogonal experimental design request to generate a plurality of corresponding experimental combinations;

s3, performing thermal simulation in the virtual test environment according to the plurality of experimental combinations, and determining the highest temperature of the welding spot corresponding to each experimental combination;

wherein the performing thermal simulation in the virtual test environment according to the plurality of experimental combinations comprises:

establishing a three-dimensional model to be tested with a corresponding welding spot structure, which corresponds to the plurality of experimental combinations one by one, according to the virtual three-dimensional model;

performing thermal simulation on all established three-dimensional models to be tested in the virtual test box, wherein all the three-dimensional models to be tested are different in welding spot structure, other test conditions, such as a case model and a test board model are not changed, and simulation setting conditions are as follows: the ambient temperature, the radiation type and the number of iteration steps are kept consistent;

in the embodiment, the boundary condition is natural convection, the thermal radiation is considered to define the flow mode as laminar flow, the radiation type is a DO radiation model, the environment temperature is set to be 25 ℃, the established three-dimensional model to be tested is subjected to grid division to obtain a grid with good grid quality, corresponding thermal load is applied, iteration steps are set, simulation calculation is performed until simulation convergence and the temperature is stable, a welding spot temperature cloud picture of the model is obtained, as shown in fig. 8, the welding spot temperature cloud picture corresponding to a certain experimental combination is used, and the highest welding spot temperature corresponding to each experimental combination can be determined through the welding spot temperature cloud picture;

s4, determining primary and secondary relations among the welding spot structure parameters according to each experimental combination and the corresponding welding spot highest temperature;

s5, establishing a prediction model between the welding spot structure parameters and the welding spot maximum temperature according to the welding spot structure parameter value corresponding to each experimental combination, the welding spot maximum temperature and the primary and secondary relations among the welding spot structure parameters.

Example two

The embodiment specifically defines how to select the welding spot structure parameters and determine the primary and secondary relations among the welding spot structure parameters:

specifically, determining a plurality of solder joint structural parameters associated with the solder joint includes:

determining all welding spot structure parameters influencing the highest temperature of the welding spot of the object to be measured;

selecting a plurality of welding spot structural parameters with the confidence degrees larger than a preset value from all the welding spot structural parameters as welding spot structural parameters related to welding spots;

in an optional embodiment, the solder joint structure parameters affecting the highest solder joint temperature of the eMCP include: the height of welding points, the diameter of a welding pad, the diameter of the welding points, the material of the welding points and the spacing of the welding points;

when selecting the key factors influencing the highest temperature of the welding spot of the packaging product to be tested, and when the selected confidence coefficient is 90%, the factors influencing the highest temperature of the welding spot of the packaging product comprise: the height of the welding spot, the diameter of the welding spot and the corresponding schematic diagram of the welding spot structure are shown in FIG. 9;

then, when performing the orthogonal experimental design, each factor selects 3 horizontal values, that is, each welding point structural parameter has 3 different welding point structural parameter values, as shown in table 1:

TABLE 1

Inputting 3 levels into an orthogonal design table according to a factor level table listed in table 1 to obtain 9 groups of thermal simulation combination models, wherein each thermal simulation combination model has a corresponding welding spot structural parameter value, when the 9 groups of thermal simulation combination models are simulated, the simulation environment and the simulation conditions are kept consistent, after each group of thermal simulation is completed, the simulation result of each group is recorded, the highest temperature of the welding spot of the chip in each group of simulation is collected and input into the orthogonal design table obtained according to the 9 groups of thermal simulation combination models, and the obtained orthogonal design table corresponding to each experimental combination is shown in table 2:

TABLE 2

Performing range analysis on the plurality of welding spot structure parameters according to the orthogonal design table in table 2, and determining primary and secondary relations among the plurality of welding spot structure parameters according to a range value;

the step of analyzing the range of the structural parameters of the welding spots according to the orthogonal design table comprises the following steps:

determining the average value of the highest welding point temperature corresponding to each welding point structural parameter value under each welding point structural parameter according to the orthogonal design table;

determining the maximum difference value between the average values of the highest temperature of the welding spots corresponding to different welding spot structural parameter values under each welding spot structural parameter, and determining the maximum difference value as the range value of the corresponding welding spot structural parameter;

determining primary and secondary relations among a plurality of welding spot structure parameters according to the magnitude sequence of the range values corresponding to each welding spot structure parameter, wherein the larger the range value is, the more dominant the corresponding welding spot structure parameter is;

specifically, according to the experimental data corresponding to each experimental combination listed in table 2, the average of the highest temperature of the welding spot corresponding to different welding spot structural parameter values under each welding spot structural parameter is obtained, and the range analysis result table is formed, as shown in table 3:

TABLE 3

Horizontal mean value	Pad diameter	Diameter of welding spot	Height of solder joint
				Mean value 1	85.156	87.614	87.614
Mean value 2	83.611	95.374	92.227
				Mean value 3	94.540	81.42	83.466
Extreme difference R	10.929	13.954	8.761
				Range ordering	2	1	3

As can be seen from table 3, the primary and secondary relationships and the arrangement of the key factors for the highest temperature of the eMCP solder joint are obtained according to the range analysis result, and the factors are in the order of the range from large to small: solder joint diameter > pad diameter > solder joint height.

Therefore, in the embodiment, the diameter of the welding spot is the most critical factor influencing the highest temperature of the welding spot of the eMMC packaging product, and then the diameter of the welding spot and the height of the welding spot are the most important factors in the subsequent packaging design, so that the heat dissipation performance of the eMMC packaging product is improved, and the reliability of the product is improved.

EXAMPLE III

The embodiment specifically defines how to establish a prediction formula between a plurality of welding spot structural parameters and the highest welding spot temperature:

specifically, the plurality of welding spot structural parameters are used as variables, the highest welding spot temperature is used as a response, partial least squares algorithm fitting is carried out according to the welding spot structural parameter value corresponding to each experimental combination, the highest welding spot temperature and the primary and secondary relations among the plurality of welding spot structural parameters, and a prediction formula between the plurality of welding spot structural parameters and the highest welding spot temperature is established;

in an optional embodiment, a prediction formula between structural parameters of a welding spot and the highest temperature of the welding spot is performed by using fitting software Istopt, a global general optimization algorithm is adopted, the diameter (x1) of the welding spot, the diameter (x2) of a bonding pad and the height (x3) of the welding spot are taken as variables, the highest temperature y of the welding spot is used as a response, and a primary-secondary relation among the diameter (x1), the diameter (x2) of the bonding pad and the height of the welding spot is defined, according to data in table 3, a finally obtained fitting formula is as follows:

y＝14995.6177*x1^2+8806.1511*x2^2+13493.7777*x3∧2+22621.7688*x1*x2 +(-31251.7110)*x2*x3+(-33423.0444)*x1*x3+(-6656.8126) *x1+(-3961.2619)*x2+12263.7107*x3

example four

Referring to fig. 2, an apparatus for predicting solder joint temperature includes:

the test environment building module is used for building a virtual test environment according to the received test environment building request;

the orthogonal experiment design module is used for determining a plurality of welding spot structural parameters related to the welding spot, carrying out orthogonal experiment design on the plurality of welding spot structural parameters according to the received orthogonal experiment design request and generating a plurality of corresponding experiment combinations;

the temperature determining module is used for performing thermal simulation in the virtual test environment according to the plurality of experimental combinations and determining the highest temperature of the welding spot corresponding to each experimental combination;

the primary and secondary relation determining module is used for determining the primary and secondary relation among the plurality of welding spot structural parameters according to each experimental combination and the highest temperature of the corresponding welding spot;

and the prediction model establishing module is used for establishing a prediction model between the plurality of welding spot structural parameters and the highest welding spot temperature according to the welding spot structural parameter value corresponding to each experimental combination, the highest welding spot temperature and the primary and secondary relations among the plurality of welding spot structural parameters.

EXAMPLE five

A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, implements each step in a solder joint temperature prediction method according to any one of the first to third embodiments.

EXAMPLE six

Referring to fig. 3, an electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor, where the processor executes the computer program to implement the steps of the method for predicting solder joint temperature according to any one of the first to third embodiments.

To sum up, the method, the device, the computer readable storage medium and the electronic device for predicting the solder joint temperature provided by the invention realize the prediction of the highest solder joint temperature of the eMCP packaging product based on the orthogonal design, firstly select factors influencing the highest solder joint temperature according to the confidence coefficient, then design each factor to have different horizontal values by the orthogonal experiment method, thereby obtaining a plurality of groups of experiment combinations, arrange the solder joints with corresponding structures on the pre-established eMCP model according to each group of experiment combinations, perform thermal simulation under the unified experiment environment and experiment conditions, obtain the highest solder joint temperature corresponding to each group of experiment combinations, perform range analysis on the obtained experiment results, determine the primary and secondary relations among the structural parameters of each solder joint, adopt the partial least square algorithm to fit based on the primary and secondary relations of the structural parameters of each solder joint and the obtained experiment results, establishing a prediction formula between the structural parameters of the plurality of welding spots and the highest temperature of the welding spots; the design orthogonal table can obtain comparatively accurate experimental values, and adopt thermal simulation to replace the experiment, can the biggest reduction cost, consequently, can reduce the group number of emulation with the experiment under the condition of determining solder joint structural parameter, obtain relatively accurate result through the predictive formula, and can carry out the preliminary study to the heat dispersion of encapsulation product in advance through the predictive formula, the failure risk that the product appears in the encapsulation design has been reduced, improve the reliability of encapsulation product, reduce the cost of company's design and production product.

In the above embodiments provided in the present application, it should be understood that the disclosed method, apparatus, computer-readable storage medium, and electronic device may be implemented in other ways. For example, the above-described device embodiments are merely illustrative, and for example, the division of the modules is only one logical functional division, and other divisions may be realized in practice, for example, a plurality of components or modules may be combined or integrated into another device, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or components or modules, and may be in an electrical, mechanical or other form.

The components described as separate parts may or may not be physically separate, and parts displayed as components may or may not be physical modules, may be located in one place, or may be distributed on a plurality of network modules. Some or all of the components can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional modules in the embodiments of the present invention may be integrated into one processing module, or each component may exist alone physically, or two or more modules are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode.

The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium and includes instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes.

It should be noted that, for the sake of simplicity, the above-mentioned method embodiments are described as a series of acts or combinations, but those skilled in the art should understand that the present invention is not limited by the described order of acts, because some steps can be performed in other orders or simultaneously according to the present invention. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred and that no acts or modules are necessarily required of the invention.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to the related technical fields are included in the scope of the present invention.