1. A housing structure of an electronic device, comprising:

a substrate having a reference surface;

the first circuit board is arranged on the substrate and erected on the reference surface, and is provided with a first surface;

a second circuit board disposed on the substrate and standing on the reference surface, the second circuit board having a second surface, the first surface and the second surface facing each other and spaced apart from each other;

the first slot is arranged on the first surface; and

and the second slot is arranged on the second surface, and the projection from the first slot to the reference surface is at least partially overlapped with the projection from the second slot to the reference surface.

2. The rack structure of claim 1, wherein a bottom edge of the second slot is farther from the reference plane than a top edge of the first circuit board, the second circuit board defines a yield opening, and the first slot is closer to the reference plane than the second slot and corresponds to the yield opening.

3. The chassis structure of an electronic device according to claim 1, wherein the first slot is located between the first surface and an extended surface of the second surface, and the second slot is located between the extended surface of the first surface and the second surface.

4. The rack structure of an electronic device according to claim 1, wherein the substrate comprises an interposer, a first interposer slot and a second interposer slot, the interposer has the reference surface, the first interposer slot and the second interposer slot are disposed on the reference surface, the first circuit board is inserted into the first interposer slot and electrically connected to the interposer, and the second circuit board is inserted into the second interposer slot and electrically connected to the interposer.

5. The rack structure of claim 4, further comprising at least one adapter circuit board, wherein the substrate comprises at least one third interposer, the interposer circuit board has a back surface facing away from the reference surface, the at least one third interposer is disposed on the back surface, and the at least one adapter circuit board is electrically inserted into the at least one third interposer.

6. The rack structure of claim 5, further comprising a carrier tray having a through opening, wherein the interposer circuit board is disposed on the carrier tray and overlaps the through opening, and wherein the at least one third interposer slot passes through the through opening.

7. The rack structure of claim 6, further comprising an I-shaped supporting frame, wherein the I-shaped supporting frame comprises a central section and two side sections, the two side sections are respectively connected to two ends of the central section to form the I-shaped supporting frame into an I shape, the two side sections are disposed on the carrier tray, and the central section passes through between the first surface and the second surface and between the first slot and the second slot.

8. A housing structure of an electronic device, comprising:

a substrate;

the first circuit board is arranged on the substrate and is provided with a first surface;

a second circuit board disposed on the substrate, the second circuit board having a second surface, the first surface and the second surface facing each other and spaced apart from each other;

the first slot is arranged on the first surface, and a first edge is arranged on one side, close to the second circuit board, of the first slot; and

the second slot is arranged on the second surface, a second edge is arranged on one side, close to the first circuit board, of the second slot, and the second edge is close to the first circuit board compared with the first edge.

9. An electronic device, comprising:

a frame structure, comprising: a carrying tray; the substrate is arranged on the bearing disc and provided with a reference surface; the first circuit board is arranged on the substrate and erected on the reference surface, and is provided with a first surface; a second circuit board disposed on the substrate and standing on the reference surface, the second circuit board having a second surface, the first surface and the second surface facing each other and spaced apart from each other; the first slot is arranged on the first surface, and the projection of the first slot to the extension surface of the second surface avoids the second circuit board; the second slot is arranged on the second surface, the projection of the second slot to the extension surface of the first surface avoids the first circuit board, and the projection of the first slot to the reference surface is at least partially overlapped with the projection of the second slot to the alignment surface; the I-shaped support frame comprises a central section and two side sections, the two side sections are respectively connected to two ends of the central section to enable the I-shaped support frame to be formed into an I shape, the two side sections are arranged on the bearing disc, and the central section penetrates through the space between the first surface and the second surface and the space between the first slot and the second slot;

the first electronic element is arranged on the I-shaped supporting frame, is inserted into the first slot and is electrically connected to the substrate through the first circuit board; and

the second electronic element is arranged on the I-shaped supporting frame, the second electronic element is inserted into the second slot and is electrically connected to the substrate through the second circuit board, and the projection of the first electronic element to the reference surface is at least partially overlapped with the projection of the second electronic element to the reference surface.

10. The electronic device of claim 9, wherein the bottom edge of the two slots is farther from the reference plane than the top edge of the first circuit board, the second circuit board defines a abdication opening, and the first slot is closer to the reference plane than the second slot and corresponds to the abdication opening.

Background

With the development and progress of science and technology, computers have become an indispensable necessity in daily life of people. In order to satisfy various functional requirements of a computer, a motherboard of the computer usually has a plurality of functional expansion slots for installing some functional expansion cards such as a display card, a sound card, and a network card to enhance additional functions.

Because the width of the current server is limited, it is difficult to insert four display cards simultaneously under the condition of flat insertion, so if there are four display cards, the display cards can be installed in the server with the height larger than 3U only by a direct insertion mode. However, it is not satisfactory to mount four display cards at the same time for a server having a height of 2U or less. Therefore, how to reduce the total width of multiple display cards when they are lying down is a major issue in design.

Disclosure of Invention

The invention provides an electronic device and a frame structure thereof, which are used for reducing the total width required by a plurality of electronic devices when the electronic devices are laid down and are matched with servers with various heights.

An embodiment of the present invention provides a rack structure of an electronic device, including a substrate, a first circuit board, a second circuit board, a first slot and a second slot. The substrate has a reference surface. The first circuit board is arranged on the substrate and erected on the datum plane, and the first circuit board is provided with a first surface. The second circuit board is arranged on the substrate and erected on the reference surface, the second circuit board is provided with a second surface, and the first surface and the second surface face each other and are spaced from each other. The first slot is arranged on the first surface. The second slot is arranged on the second surface, and the projection from the first slot to the reference surface is at least partially overlapped with the projection from the second slot to the reference surface.

Another embodiment of the present invention provides a rack structure of an electronic device, including a substrate, a first circuit board, a second circuit board, a first slot and a second slot. The first circuit board is arranged on the substrate and is provided with a first surface. The second circuit board is arranged on the substrate and provided with a second surface, and the first surface and the second surface face each other and are spaced from each other. The first slot is arranged on the first surface, and a first edge is arranged on one side, close to the second circuit board, of the first slot. The second slot is arranged on the second surface, a second edge is arranged on one side, close to the first circuit board, of the second slot, and the second edge is close to the first circuit board compared with the first edge.

Another embodiment of the present invention provides an electronic device, which includes a frame structure, a first electronic component and a second electronic component. The rack structure comprises a substrate, a first circuit board, a second circuit board, a first slot, a second slot and an I-shaped supporting frame. The substrate has a reference surface. The first circuit board is arranged on the substrate and erected on the datum plane, and the first circuit board is provided with a first surface. The second circuit is arranged on the substrate and erected on the reference surface, the second circuit board is provided with a second surface, and the first surface and the second surface face each other and are spaced from each other. The first slot is arranged on the first surface. The second slot is arranged on the second surface. The projection of the first slot to the reference plane is at least partially overlapped with the projection of the second slot to the collimation plane. The I-shaped support frame comprises a central section and two side sections. The two side sections are respectively connected to two ends of the central section so that the I-shaped support frame is formed into an I shape. The two side sections are arranged on the bearing plate, and the central section penetrates through the space between the first surface and the second surface and the space between the first slot and the second slot. The first electronic element is arranged on the I-shaped support frame. The first electronic element is inserted into the first slot and is electrically connected to the substrate through the first circuit board. The second electronic element is arranged on the I-shaped support frame. The second electronic element is inserted into the second slot and is electrically connected to the substrate through the second circuit board. The projection of the first electronic element to the reference plane and the projection of the second electronic element to the reference plane at least partially overlap.

According to the electronic device and the rack structure thereof in the above embodiments, through the design that the projection from the first slot to the reference plane is at least partially overlapped with the projection from the second slot to the reference plane, or the second edge of the second slot is closer to the first circuit board than the first edge of the first slot, the total of the width of the first electronic element and the width of the second electronic element can be equal to or slightly smaller than the width of the carrier tray.

The foregoing summary of the invention and the following detailed description of the embodiments are provided to illustrate and explain the principles of the invention and to provide further explanation of the invention as claimed.

Drawings

Fig. 1 is a schematic perspective view of an electronic device according to an embodiment of the invention;

FIG. 2 is an exploded view of the electronic device of FIG. 1;

FIG. 3 is an assembled perspective view of the electronic device of FIG. 2;

fig. 4 is a top view of the electronic device of fig. 1.

Labeled as: 1-electronic device, 10-chassis structure, 20-first electronic component, 30-second electronic component, 100-carrier tray, 110-through opening, 200-substrate, 210-interposer circuit board, 211-reference plane, 212-back plane, 220-first interposer slot, 230-second interposer slot, 240-third interposer slot, 300-first circuit board, 310-first surface, 320-top edge, 400-second circuit board, 410-second surface, 420-offset opening, 500-first slot, 510-first edge, 600-second slot, 610-second edge, 620-bottom edge, 700-I-shaped support frame, 710-center section, 720-side section, 800-offset circuit board, P1, 100-carrier tray, 100-through opening, 200-base edge, 400-second circuit board, 410-second surface, 420-offset opening, 500-first slot, 510-first edge, 600-second slot, 610-second edge, 620-bottom edge, 700-I-shaped support frame, 710-center section, 720-side section, 800-offset circuit board, P1, B-I-shaped support frame, B-frame, and P-frame, P2-projection, W1, W2, WT-width.

Detailed Description

Please refer to fig. 1-2. Fig. 1 is a schematic perspective view of an electronic device 1 according to an embodiment of the invention. Fig. 2 is an exploded view of the electronic device 1 in fig. 1.

The electronic device 1 of the present embodiment is, for example, a server, and the height thereof is, for example, 1U. The electronic device 1 includes a frame structure 10, two first electronic components 20 and two second electronic components 30. The first electronic component 20 and the second electronic component 30 are, for example, display cards, and are mounted on the rack structure 10. In the present embodiment, the number of the first electronic component 20 and the second electronic component 30 is two, but not limited thereto, and for convenience of description, the connection relationship between the components will be described below with only a single first electronic component 20 and a single second electronic component 30, and the description of the rack structure 10 is adjusted accordingly.

The frame structure 10 includes a tray 100, a substrate 200, a first circuit board 300, a second circuit board 400, a first slot 500 and a second slot 600. The carrier tray 100 is, for example, a housing of a server or a tray that is retracted into the housing of the server. In addition, in this embodiment and other embodiments, the frame structure 10 may further include an i-shaped supporting frame 700. The I-shaped supporting frame 700 comprises a central section 710 and two side sections 720. The two side sections 720 are connected to both ends of the central section 710, respectively, so that the I-shaped supporting bracket 700 is formed in an I-shape. The two side sections 720 are disposed on the carrier tray 100.

Please refer to fig. 2 and fig. 3. Fig. 3 is an assembled perspective view of the electronic device in fig. 2, i.e., a perspective view of the substrate 200, the first circuit board 300, the second circuit board 400, the first slot 500 and the second slot 600 assembled together.

The substrate 200 is disposed on the susceptor 100. The first circuit board 300 is disposed on the substrate 200, such that the first circuit board 300 is electrically connected to the substrate 200. The first circuit board 300 has a first surface 310. The second circuit board 400 is disposed on the substrate 200, such that the second circuit board 400 is electrically connected to the substrate 200. The second circuit board 400 has a second surface 410. The first surface 310 and the second surface 410 face each other and are spaced apart from each other.

In the present embodiment, the substrate 200 includes an interposer 210, a first interposer 220 and a second interposer 230. The interposer 210 has a reference surface 211 and a back surface 212. The first interposer 220 and the second interposer 230 are disposed on the reference plane 211. The first circuit board 300 is inserted into the first interposer slot 220 and electrically connected to the interposer circuit board 210 and erected on the reference surface 211. The second circuit board 400 is inserted into the second interposer 230 and electrically connected to the interposer 210 and erected on the reference plane 211.

The first slot 500 is disposed on the first surface 310 and electrically connected to the first circuit board 300. The projection of the first slot 500 to the extension surface of the second surface 410 avoids the second circuit board 400. The second socket 600 is disposed on the second surface 410 and electrically connected to the second circuit board 400. The projection of the second slot 600 to the extension surface of the first surface 310 avoids the first circuit board 300. In addition, the central section 710 of the i-shaped supporting bracket 700 passes between the first surface 310 and the second surface 410 and between the first slot 500 and the second slot 600.

In the present embodiment, the first slot 500 is located between the first surface 310 and the extension surface of the second surface 410, and the second slot 600 is located between the extension surface of the first surface 310 and the second surface 410. In addition, the bottom edge 620 of the second slot 600 is farther from the reference plane 211 than the top edge 320 of the first circuit board 300, the second circuit board 400 is provided with a yielding opening 420, and the first slot 500 is closer to the reference plane 211 than the second slot 600 and corresponds to the yielding opening 420. That is, the sockets of the first socket 500 and the second socket 600 are not blocked by the first circuit board 300 or the second circuit board 400.

In the present embodiment, the projection of the first slot 500 onto the reference plane 211 and the projection of the second slot 600 onto the reference plane 211 are at least partially overlapped to reduce the total width required when the electronic component is laid down. In detail, the first electronic component 20 is disposed on the i-shaped supporting frame 700. The first electronic component 20 is inserted into the first slot 500 and electrically connected to the substrate 200 via the first circuit board 300. The second electronic component 30 is disposed on the i-shaped supporting frame 700. The second electronic component 30 is inserted into the second slot 600 and electrically connected to the substrate 200 via the second circuit board 400. The projection from the first socket 500 to the reference plane 211 is at least partially overlapped with the projection from the second socket 600 to the reference plane 211, so that the projection from the first electronic component 20 to the reference plane 211 is at least partially overlapped with the projection from the second electronic component 30 to the reference plane 211, thereby reducing the total width required when the first electronic component 20 and the second electronic component 30 lie down.

Although the projection of the first socket 500 onto the reference plane 211 and the projection of the second socket 600 onto the reference plane 211 are at least partially overlapped, the present invention is not limited thereto, and in other embodiments, the projection of the first socket onto the reference plane and the projection of the second socket onto the reference plane may not be overlapped. In detail, the first slot 500 has a first edge 510 at a side close to the second circuit board 400. The second slot 600 has a second edge 610 at a side close to the first circuit board 300. As long as the second edge 610 of the second socket 600 is closer to the first circuit board 300 than the first edge 510 of the first socket 500, the total width of the electronic device required for lying down can be reduced.

In this embodiment, the rack structure 10 may further include a plurality of adapting circuit boards 800. The substrate 200 may further include a plurality of third interposer slots 240, the plurality of third interposer slots 240 are disposed on the back surface 212, and the plurality of through circuit boards 800 are electrically inserted into the plurality of third interposer slots 240, respectively.

In the present embodiment, the number of the adapting circuit board 800 and the third interposer 240 is plural, but not limited thereto. In other embodiments, the number of the adapting circuit board and the third intermediate slot may be changed to be single.

In the embodiment, the carrier tray 100 has a through opening 110, the interposer circuit board 210 is disposed on the carrier tray 100 and overlaps the through opening 110, and at least one third slot passes through the through opening 110.

In the present embodiment, the i-shaped supporting frame 700 is fixed to the carrier tray 100 through the side section 720, but not limited thereto. In other embodiments, the I-shaped support frame is fixed to the carrier tray through the central section.

In the embodiment, the first electronic component 20, the second electronic component 30, the substrate 200, the first circuit board 300, the second circuit board 400, the first slot 500 and the second slot 600 are fixed on the carrier tray 100 through the i-shaped supporting frame 700, but not limited thereto. The first electronic component 20, the second electronic component 30, the substrate 200, the first circuit board 300, the second circuit board 400, the first slot 500 and the second slot 600 may also be fixed on the carrier tray 100 through a support frame with other shapes.

Please refer to fig. 4. Fig. 4 is a top view of the electronic device of fig. 1. The two first electronic components 20 and the two second electronic components 30 are respectively inserted into the two first slots 500 and the two second slots 600. Since the projection of the first slot 500 to the reference plane 211 is at least partially overlapped with the projection of the second slot 600 to the reference plane 211, or the second edge 610 of the second slot 600 is closer to the first circuit board 300 than the first edge 510 of the first slot 500, the total width required for the first electronic component 20 and the second electronic component 30 to lie down can be reduced to the width WT of the carrier tray 100. That is to say, originally, the sum of the width W1 of the first electronic component 20 and the width W2 of the second electronic component 30 is greater than the width WT of the carrier tray 100, but the projection from the first slot 500 to the reference plane 211 at least partially overlaps the projection from the second slot 600 to the reference plane 211, or the second edge 610 of the second slot 600 is closer to the first circuit board 300 than the first edge 510 of the first slot 500, so that the two electronic components 30 of the first electronic component 20 and the two electronic components 30 can be placed in the carrier tray 100 with the width WT.

According to the electronic device and the rack structure thereof in the above embodiments, by the design that the projection from the first slot to the reference plane is at least partially overlapped with the projection from the second slot to the reference plane, or the second edge of the second slot is closer to the first circuit board than the first edge of the first slot, the total of the widths of the two first electronic elements and the width of the two second electronic elements can be equal to or slightly smaller than the width of the carrier tray.

Although the present invention has been described with reference to the foregoing embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.