1. A system, comprising:

a printed circuit board on which a processor is on;

a first fan coupled to the printed circuit board such that a first airflow path for cooling the processor passes through the first fan at a remote distance outside a boundary of the printed circuit board; and

a second fan coupled to the printed circuit board such that a second airflow path for cooling the processor passes through the second fan within the boundary of the printed circuit board.

2. The system of claim 1, wherein a third airflow path extends from the second fan to the first fan and couples the second airflow path to the first airflow path.

3. The system of claim 1, wherein the first airflow path has a lower air pressure and a higher flow rate than the second airflow path.

4. The system of claim 1, wherein the first fan is arranged relative to the second fan such that an amount of air recirculated by the second fan is reduced during operation of the first fan.

5. The system of claim 1, wherein the first airflow path passes through a heat sink thermally coupled to at least one of the printed circuit board or the processor before passing through the first fan.

6. The system of claim 1, wherein the first airflow path passes through a heat sink after passing through the first fan, the heat sink being thermally coupled to at least one of the printed circuit board or the processor.

7. The system of claim 1, wherein the first airflow path is substantially linear and the second airflow path is curved at least 90 degrees.

8. A system, comprising:

a printed circuit board on which a processor is on; and

a first fan coupled to the printed circuit board such that a first airflow path for cooling the processor passes through the first fan substantially perpendicular to the printed circuit board at a remote distance outside a boundary of the printed circuit board.

9. The system of claim 8, wherein the boundary comprises an edge of the printed circuit board.

10. The system of claim 8, wherein an axis of the first fan is disposed substantially perpendicular to the printed circuit board.

11. The system of claim 8, wherein the system has a first width and the printed circuit board has a second width that is less than the first width.

12. The system of claim 8, further comprising a heat sink wider than the printed circuit board, wherein the first airflow path intersects the heat sink.

13. The system of claim 8, further comprising a heat sink having a first width, wherein the printed circuit board has a second width, the first fan has a third width, and the first width is equal to a sum of the second width and the third width.

14. The system of claim 8, further comprising a heat sink thermally coupled to the printed circuit board, wherein the heat sink extends across the boundary of the printed circuit board and intersects the first airflow path, and wherein the first fan is embedded within the heat sink.

15. A computing device, comprising:

a printed circuit board on which a processor is on;

a first fan coupled to the printed circuit board such that a first airflow path for cooling the processor passes through the first fan at a remote distance outside a boundary of the printed circuit board; and

a second fan coupled to the printed circuit board such that a second airflow path for cooling the processor passes through the second fan within the boundary of the printed circuit board.

16. The computing device of claim 15, wherein a third airflow path extends from the second fan to the first fan and couples the second airflow path to the first airflow path.

17. The computing device of claim 15, wherein the first airflow path has a lower air pressure and a higher flow velocity than the second airflow path.

18. The computing device of claim 15, wherein the processor comprises a graphics processing unit or a central processing unit that generates heat when performing processing operations, and the first fan dissipates at least a portion of the heat via the first airflow path.

19. The computing device of claim 15, wherein the first airflow path passes through a heat sink comprising a plurality of fins.

20. The computing device of claim 15, wherein the first airflow path passes through a heat sink comprising zero or more heat pipes.

Background

Field of various embodiments

Conventional computer systems typically include at least one Central Processing Unit (CPU) and at least one Graphics Processing Unit (GPU). The CPU executes various types of software applications, while the GPU performs graphics processing operations on behalf of the CPU. Some types of computer systems may include a GPU integrated on a motherboard on which the CPU is located; however, other types of computer systems may include a GPU in a graphics subsystem that is coupled to a motherboard through a peripheral component interconnect express (PCIe) slot.

Conventional graphics subsystems typically include a Printed Circuit Board (PCB) on which the GPU resides, at least one fan, and a heat sink. The GPU is typically integrated into a PCB and electronically coupled to other various electronic components. The heat sink is thermally coupled to the GPU and/or the PCB and includes a set of heat sinks. The fan is typically disposed adjacent the heat sink and configured to direct airflow toward the heat sink.

During operation, the heat generated by the GPU needs to be dissipated to prevent overheating. In this regard, the heat sink is configured to extract heat generated by the GPU and dissipate the heat through the heat sink to the entire environment. The fan simultaneously circulates air through the fins to provide a convective cooling effect that increases the rate of heat dissipation. In this manner, the heat sink and fan may work in concert to cool the GPU and maintain the operating temperature of the GPU within a specified range

Generally, a GPU running at a higher frequency will generate more heat than a GPU running at a lower frequency. Therefore, GPU subsystems that include GPUs that operate at higher frequencies require more efficient cooling to prevent overheating. One way to provide more efficient heat dissipation for a GPU is to implement larger fans that can increase the air circulation rate over the heat sink fins. However, this approach has limited applicability because the PCIe slot in which the graphics subsystem resides has a particular form factor and cannot physically accommodate fans larger than a particular size. Thus, conventional graphics subsystems typically cannot be equipped with GPUs that run at relatively high frequencies.

As previously mentioned, what is needed in the art is a way to more efficiently cool a GPU within a graphics subsystem.

Disclosure of Invention

Various embodiments include a system comprising a printed circuit board with a processor on the printed circuit board, the system comprising a first fan coupled to the printed circuit board such that a first airflow path for cooling the processor passes through the first fan at a distance outside a boundary of the printed circuit board, and a second fan coupled to the printed circuit board such that a second airflow path for cooling the processor passes through the second fan within the boundary of the printed circuit board.

At least one technical advantage of the disclosed techniques over the prior art is that a graphics subsystem may be equipped with a higher performance GPU relative to GPUs typically included in conventional graphics subsystems.

Drawings

So that the manner in which the above recited features of the various embodiments can be understood in detail, a more particular description of the inventive concept, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this inventive concept and are therefore not to be considered limiting of its scope in any way, for the invention may admit to other equally effective embodiments.

FIG. 1 illustrates a graphics subsystem configured to implement one or more aspects of various embodiments;

FIG. 2 illustrates how air circulates within the graphics subsystem of FIG. 1, in accordance with various embodiments;

FIG. 3 illustrates a graph of axial fan flow rate as a function of pressure in accordance with various embodiments;

FIG. 4 illustrates a computer chassis housing the graphics subsystem of FIG. 1, in accordance with various embodiments;

FIG. 5 illustrates an alternative computer chassis housing the graphics subsystem of FIG. 1, in accordance with various embodiments; and

FIG. 6 illustrates an exemplary computing device including the graphics subsystem of FIG. 1, in accordance with various embodiments.

Detailed Description

In the following description, numerous specific details are set forth to provide a more thorough understanding of various embodiments. It will be apparent, however, to one skilled in the art that the inventive concept may be practiced without one or more of these specific details.

As described above, GPU subsystems that include GPUs operating at high frequencies require more efficient cooling to prevent overheating. Larger fans can provide more efficient cooling by increasing the rate of air circulation through the heat sink. However, the PCIe slot in which the graphics subsystem resides has a particular form factor and typically cannot physically accommodate a fan larger than a particular size. Thus, conventional graphics subsystems can typically only be equipped with GPUs that run at lower frequencies.

To address these issues, various embodiments include a graphics subsystem that includes a PCB, a set of fans, and a heat sink. The GPU is integrated into the PCB. The PCB is shortened to occupy a smaller portion of the width of the graphics subsystem than the PCB in a conventional graphics subsystem. A heat sink is coupled to the PCB and/or the GPU and is configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem than the PCB. The first fan is disposed partially or completely beyond an edge of the PCB and is configured to direct air along a first airflow path through a portion of the heat sink that extends beyond the edge of the PCB and out of the graphics subsystem. The second fan is configured to direct air through the heat sink along a second airflow path and toward the GPU. Since the first air flow path is not obstructed by the PCB, air passing through the first air flow path has a low air pressure and a high flow rate, thereby improving the convective cooling capability of the heat sink. Further, some of the air passing through the second airflow path may mix with the air passing through the first airflow path, thereby reducing recirculation of the warmer air by the second fan.

At least one technical advantage of the disclosed design over the prior art is that with the disclosed design, a graphics subsystem may be equipped with a higher performance GPU relative to GPUs typically included in conventional graphics subsystems. Thus, the disclosed design enables higher performance GPUs to be implemented in a computer system without substantial risk of overheating. These technical advantages represent one or more technological advances over prior art methods.

Overview of the System

FIG. 1 illustrates a graphics subsystem configured to implement one or more aspects of various embodiments. As shown, graphics subsystem 100 includes PCB 110, fans 120 and 130, and heat sink 140. PCB 110 is disposed proximate to top side 102 of graphics subsystem 100 and includes GPU112 and various other electronic components. In one embodiment, PCB 110 may include any technically feasible type of processor in addition to or in place of GPU112, such as one or more Central Processing Units (CPUs), among other types of processors. In such embodiments, graphics subsystem 100 may be implemented as a universal add-on card. Fan 120 is disposed proximate to bottom side 104 of graphics subsystem 100 and is partially or fully embedded in heat sink 140. In various embodiments, fan 130 is disposed near top side 102 of graphics subsystem 100, or at any other technically feasible location within graphics subsystem 100. Fan 130 is disposed near top side 102 of graphics subsystem 100 and is partially or fully embedded in heat sink 140. In various embodiments, one or both of fans 120 and 130 need not be embedded in heat sink 140. In some embodiments, the fan 120 may be omitted entirely. In one embodiment, fans 120 and/or 130 may be axial fans having an axis substantially perpendicular to PCB 110. In this context, the term "substantially perpendicular" means that the axis of the axial fan is disposed within a certain angle range perpendicular with respect to the PCB 110. Heat sink 140 is thermally coupled to PCB 110 and/or GPU112 and is configured to extract heat from PCB 110 and/or GPU 112. The heat sink 140 may include any technically feasible type of heat dissipating and/or conducting mechanism, including heat sinks, heat pipes, and the like.

Also as shown, the width of the graphics subsystem 100 is about W1, the width of the PCB 110 is about W2, and the width of the fan 130 is about W3. PCB 110 occupies only a portion of the total width W1 of graphics subsystem 100, and thus graphics subsystem 100 may exist to accommodate fan 130 adjacent to PCB 110. In this configuration, fans 120 and 130 may cool PCB 110 and/or GPU112 more efficiently than conventional designs, as described in more detail below in conjunction with fig. 2, than otherwise.

FIG. 2 illustrates how air circulates within the graphics subsystem of FIG. 1, in accordance with various embodiments. As shown, during operation, fan 120 draws air along airflow path 200 and directs the air through heat sink 140 toward PCB 110 and/or GPU 112. Heat sink 140 transfers heat extracted from PCB 110 and/or GPU112 to the air via a heat transfer mechanism, such as a heat sink. A portion of the heated air is recirculated along airflow paths 202(0) and 202(1), with other portions of the heated air exiting graphics subsystem 100 along airflow path 204 and other portions of the heated air being drawn into fan 130 along airflow path 206.

Also as shown, during operation, the fan 130 draws air through the heat sink 140 along an airflow path 210. Heat sink 140 transfers heat extracted from PCB 110 and/or GPU112 into the air. The fan 130 then directs the heated air along an airflow path 212 out of the graphics subsystem 100. At least a portion of the airflow path 210 and/or the airflow path 212 is substantially linear. As referred to herein, the term "substantially linear" may refer to any path that curves less than a threshold amount of curvature. As described above, fan 130 also draws heated air along airflow path 206 and directs the air along airflow path 212 out of graphics subsystem 100. One advantage of the disclosed design is that the fan 130 draws fresh air through the radiator 140 and, as found in conventional designs, the fresh air has a lower temperature than the air that the fan exhausts through the radiator. Thus, the disclosed design may provide greater convective cooling than conventional designs. In one embodiment, the fan 130 may be configured to exhaust air through the heat sink 140. In various other embodiments, graphics subsystem 100 may include three or more fans, where any of those fans are configured to direct air through any portion of heat sink 140. For example, a third fan may be configured to direct air such that the air passes through any portion of the heat sink 140 in addition to the fans 120 and 130.

The airflow paths 210 and 212 are relatively unobstructed by the PCB 110 and the heat sink 140. As a result, the fan 130 can direct air along the airflow paths 210 and 212 at a low air pressure and a high flow rate, thereby obtaining greater heat transfer from the heat sink 140. Additionally, because the fan 130 draws heated air from the fan 120 along the airflow path 206, the lower temperature of the air that the fan 130 may heat is recirculated along the airflow path 202, which increases the rate of heat transfer through the heat sink 140. With the above techniques, the high-performance GPU112 may be integrated into a graphics subsystem that has sufficient cooling to prevent overheating during operation. The performance of fans 120 and 130 is described in more detail below in conjunction with fig. 3.

Fan performance comparison

FIG. 3 is a graph of axial fan airflow versus pressure according to various embodiments. As shown, the graph 300 plots pressure 302 as a function of flow rate 304. Fan performance curve 310 represents the performance of an axial fan similar to fan 120 and/or fan 130. The fan performance curve 310 describes how the air pressure varies with different flow rates of the fan when the fan is rotating at a constant speed. The fan will direct airflow at different flow rates depending on the presence of various physical obstructions that obstruct one or more airflow paths through the fan.

The impedance curves 320 and 330 correspond to separate regions of the graphics subsystem 100 and describe how changes in flow rate within those regions cause changes in air pressure. In particular, obstruction curve 320 corresponds to the area of graphics subsystem 100 where fan 120 is located and indicates that an increased flow rate results in an increase in air pressure. The obstruction curve 330 corresponds to the area of the graphics subsystem 100 where the fan 130 is located, and indicates that an increased flow rate similarly results in an increase in air pressure.

Comparing the impedance curves 320 and 330 shows that as the flow rate increases, the pressure near the fan 120 increases more rapidly than the pressure near the fan 130. The pressure rises faster near fan 120 because PCB 110 creates a significant physical barrier to the airflow directed by fan 120, which forces the airflow to turn and either recirculate along airflow path 202 or exit the graphics subsystem along airflow path 204. Conversely, the pressure rise is slower when proximate to the fan 130 because the heat sink 140 does not create a significant physical barrier to the airflow directed by the fan 130, but rather allows the airflow to travel relatively unimpeded through the heat sink 140 along the airflow path 212.

An intersection 322 between the fan performance curve 310 and the blockage curve 320 represents an operating point of the fan 120 at a given fan speed, and an intersection 332 between the fan performance curve 310 and the blockage curve 330 represents an operating point of the fan 130 at the given fan speed. As shown, the fan 130 may achieve a higher flow rate at a lower pressure than the fan 120. Thus, the fan 130 achieves more efficient convective cooling than the fan 120 or other conventional fan designs, and thus more efficient heat transfer from the heat sink 140 to the environment. As described above, the fan 130 also increases the efficiency of the fan 120 in transferring heat from the heat sink 140 by absorbing a portion of the heated air that is recirculated along the airflow path 202.

Exemplary embodiments of a graphics subsystem

FIG. 4 illustrates a computer chassis housing the graphics subsystem of FIG. 1, in accordance with various embodiments. As shown, computer chassis 400 includes graphics subsystem 100, exhaust fan 402, and intake fan 404. In operation, intake fan 404 directs air along airflow path 410 to graphics subsystem 100. Graphics subsystem 100 cools PCB 110 and/or GPU112 using air via fans 120 and 130, and then expels the heated air along airflow paths 420 and 430. An exhaust fan 402 facilitates removal of heated air from within the computer chassis 400. Computer chassis 400 may also include a computing device coupled to graphics subsystem 100. An exemplary computing device is described below in conjunction with fig. 5.

FIG. 5 illustrates an alternative computer chassis housing the graphics subsystem of FIG. 1, in accordance with various embodiments. As shown, computer chassis 500 includes graphics subsystem 100, exhaust fan 502, and intake fan 504. In operation, intake fan 504 directs air along airflow path 510 to graphics subsystem 100. Graphics subsystem 100 cools PCB 110 and/or GPU112 using air via fans 120 and 130, and then expels the heated air along airflow paths 520 and 530. The exhaust fan 502 helps remove heated air from within the computer chassis 500. In one embodiment, computer chassis 500 may be configured to house a small computer system. For example, computer chassis 500 may be a mini-ITX type chassis.

Referring generally to fig. 4-5, graphics subsystem 100 may be implemented within a computer chassis of any technically feasible type. Further, the graphics subsystem may be coupled to any technically feasible type of computing device. An exemplary computing device to which the graphics subsystem may be coupled is described below in conjunction with fig. 6.

FIG. 6 illustrates an exemplary computing device including the graphics subsystem of FIG. 1, in accordance with various embodiments. As shown, computing device 600 includes one or more processors 602, input/output (I/O) devices 604, and memory 606 including one or more software applications 610. Computing device 600 also includes a graphics subsystem 100 that may be coupled to computing device 600 through a PCIe slot and interconnected with any other components of computing device 600 in any technically feasible manner. In various embodiments, graphics subsystem 100 may be coupled to computing device 600 through any technically feasible type of interface beyond those conforming to the PCIe standard. Processor 602 is configured to execute one or more software applications 610 and offload graphics processing operations associated with the one or more software applications 610 to graphics subsystem 100 for processing via GPU 112. Graphics subsystem 100 returns processing results, such as rendered pixels, to computing device 600 for display via a display device that may reside within, for example, I/O device 604. In various embodiments, the computing device 600 may be implemented as a server computer (or virtualized instance thereof) and reside within a data center. In general, graphics subsystem 100 may be implemented in any technically feasible type of computer system.

In summary, the graphics subsystem includes a PCB, a set of one or more fans, and a heat sink. The GPU is integrated into the PCB. The PCB is shortened to occupy a smaller portion of the width of the graphics subsystem than the PCB in a conventional graphics subsystem. A heat sink is coupled to the PCB and/or the GPU and is configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem than the PCB. The first fan is disposed partially or completely beyond an edge of the PCB and is configured to direct air along a first airflow path through a portion of the heat sink that extends beyond the edge of the PCB and out of the graphics subsystem. The second fan is configured to direct air through the heat sink along a second airflow path and toward the GPU. Since the first air flow path is not obstructed by the PCB, air passing through the first air flow path has a low air pressure and a high flow rate, thereby improving the convective cooling capability of the heat sink. In addition, at least some of the air passing through the second airflow path mixes with the air passing through the first airflow path, thereby reducing recirculation of warmer air by the second fan.

At least one technical advantage of the disclosed design over the prior art is that with the disclosed design, a graphics subsystem may be equipped with a higher performance GPU relative to GPUs typically included in conventional graphics subsystems. Thus, the disclosed design enables higher performance GPUs to be implemented in a computer system without substantial risk of overheating. These technical advantages represent one or more technological advances over prior art approaches.

1. Some embodiments include a system comprising a printed circuit board, a processor on the printed circuit board, a first fan coupled to the printed circuit board such that a first airflow path for cooling the processor passes through the first fan at a distance outside a boundary of the printed circuit board, and a second fan coupled to the printed circuit board such that a second airflow path for cooling the processor passes through the second fan within the boundary of the printed circuit board.

2. The system of claim 1, wherein the third airflow path extends from the second fan to the first fan and couples the second airflow path to the first airflow path.

3. The system of any of claims 1-2, wherein the first gas flow path has a lower gas pressure and a higher flow rate than the second gas flow path.

4. A system according to any of claims 1-3, wherein the first fan is arranged relative to the second fan such that the amount of air recirculated by the second fan is reduced during operation of the first fan.

5. The system of any of claims 1-4, wherein the first airflow path passes through a heat sink thermally coupled to at least one of the printed circuit board or the processor before passing through the first fan.

6. The system of any of claims 1-5, wherein the first airflow path passes through a heat sink after passing through the first fan, the heat sink thermally coupled to at least one of the printed circuit board or the processor.

7. The system of any of claims 1-6, wherein the first airflow path is substantially linear and the second airflow path is curved at least 90 degrees.

8. Some embodiments include a system comprising a printed circuit board with a processor on the printed circuit board and a first fan coupled to the printed circuit board such that a first airflow path for cooling the processor passes through the first fan substantially perpendicular to the printed circuit board at a distance outside a boundary of the printed circuit board.

9. The system of claim 8, wherein the boundary comprises an edge of the printed circuit board.

10. A system according to any of claims 8-9, wherein the axis of the first fan is arranged substantially perpendicular to the printed circuit board.

11. The system of any of claims 8-10, wherein the system has a first width and the printed circuit board has a second width that is less than the first width.

12. The system of any of claims 8-11, further comprising a heat sink wider than the printed circuit board, wherein the first airflow path intersects the heat sink.

13. The system of any of claims 8-12, further comprising a heat sink having a first width, wherein the printed circuit board has a second width and the first fan has a third width, the first width being equal to a sum of the second width and the third width.

14. The system of any of claims 8-13, further comprising a heat sink thermally coupled to the printed circuit board, wherein the heat sink extends across a boundary of the printed circuit board and intersects the first airflow path, and wherein the first fan is embedded within the heat sink.

15. Some embodiments include a computing device comprising a printed circuit board, a first fan, and a second fan, the processor on the printed circuit board, the first fan coupled to the printed circuit board such that a first airflow path for cooling the processor passes through the first fan at a distance outside a boundary of the printed circuit board, the second fan coupled to the printed circuit board such that a second airflow path for cooling the processor passes through the second fan inside the boundary of the printed circuit board.

16. The computing device of claim 15, wherein the third airflow path extends from the second fan to the first fan and couples the second airflow path to the first airflow path.

17. The computing device of any of claims 15-16, wherein the first airflow path has a lower air pressure and a higher flow rate than the second airflow path.

18. The computing device of any of claims 15 to 17, wherein the processor comprises a graphics processing unit or a central processing unit that generates heat when performing processing operations, and the first fan dissipates at least a portion of the heat via the first airflow path.

19. The computing device of any of claims 15-18, wherein the first airflow path passes through a heat sink comprising a plurality of fins.

20. The computing device of any of claims 15-19, wherein the first airflow path passes through a heat sink comprising zero or more heat pipes.

Any claim element recited in any claim in any way and/or any and all combinations of elements described in this application are within the intended scope of the present embodiments and protection.

The description of the various embodiments has been presented for purposes of illustration, but is not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments.

Aspects of the present embodiments may be embodied as a system, method or computer program product. Accordingly, aspects of the present disclosure may take the form of an entirely hardware embodiment, an entirely software embodiment (including firmware, resident software, micro-code, etc.) or an embodiment combining software and hardware aspects that may all generally be referred to herein as a "module," system, "or" computer. Furthermore, aspects of the present disclosure may take the form of a computer program product embodied on one or more computer-readable media having computer-readable program code thereon.

Any combination of one or more computer-readable media may be utilized. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer readable storage medium may be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer readable storage medium would include the following: an electrical connection having one or more wires, a portable computer diskette, a hard disk, a Random Access Memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any other suitable combination of the foregoing. In the context of this document, a computer readable storage medium may be any tangible medium that can contain, or store a program for use by or in connection with an instruction execution system, apparatus, or device.

Aspects of the present disclosure are described above with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems) and computer program products according to embodiments of the disclosure. It will be understood that each block of the flowchart illustrations and/or block diagrams, and combinations of blocks in the flowchart illustrations and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus to produce a machine. The instructions, when executed via a processor of a computer or other programmable data processing apparatus, enable the functions/acts specified in the flowchart and/or block diagram block or blocks to be performed. Such a processor may be, but is not limited to, a general purpose processor, a special purpose processor, an application specific processor, or a field programmable gate array.

The flowchart and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to various embodiments of the present disclosure. In this regard, each block in the flowchart or block diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks shown in succession may, in fact, be executed substantially concurrently, or the blocks may sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and/or flowchart illustration, and combinations of blocks in the block diagrams and/or flowchart illustration, can be implemented by special purpose hardware-based systems which perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.