1. The LDS composite material is characterized by comprising a high-dielectric resin matrix composite material and a metal film loaded on the surface of the high-dielectric resin matrix composite material.

2. The LDS composite material as recited in claim 1, wherein the high dielectric resin matrix composite material is a PCT resin matrix composite material, and the metal thin film is a tin layer and/or a copper layer.

3. A method for preparing the LDS composite material according to claim 1 or 2, comprising:

s100, depositing a first layer of metal film on the high-dielectric-resin-based composite material;

s200, continuously depositing on the first layer of metal film to form a second layer of metal film;

s300, sequentially repeating the step S100 and the step S200 until the number of layers of the metal film reaches a preset value, and obtaining the LDS composite material; wherein the content of the first and second substances,

the first layer of metal film is made of a different material than the second layer of metal film.

4. The method according to claim 3, wherein the method of preparing the high dielectric resin-based composite material in step S100 includes:

s101, adding a silane coupling agent into expanded graphite in the presence of an organic solvent, mixing and stirring for 10-20min, adding boric acid, continuously stirring for 1-2h, removing filter residues, and drying to obtain modified expanded graphite;

s102, mixing 1, 4-cyclohexanedimethanol and terephthalic acid in the presence of a catalyst to perform an esterification reaction to obtain a pre-product;

s103, adding modified expanded graphite and polyethylene glycol into the pre-product, and after pre-polymerization treatment and final polymerization treatment in sequence, granulating, melting and extruding for molding to obtain the high-dielectric-resin-based composite material.

5. The preparation method according to claim 4, wherein the step S100 further comprises the step of pretreating the high dielectric resin-based composite material, and the pretreatment process comprises the following steps: and sequentially eluting the high-dielectric resin matrix composite material for 2-5 times by using deionized water and ethanol.

6. The preparation method according to claim 3, wherein the deposition of the metal film is atomic layer deposition, the first metal film is a copper film, the second metal film is a tin film, and the copper film and the tin film are sequentially arranged on the surface of the high dielectric resin-based composite material.

7. The manufacturing method according to claim 6, wherein the preset value of the number of layers of the metal thin film in step S300 is 10 to 20 layers.

8. The production method according to claim 6 or 7, characterized in that the copper thin film and the tin thin film are provided by micro-and/or nano-sized tin-copper compounds.

9. The production method according to claim 8, wherein the tin-copper compound is supported on a molecular sieve.

10. An LDS antenna, wherein the LDS antenna is made of the LDS composite material of claim 1 or 2.

Background

The LDS (i.e. laser direct structuring) material has been industrially applied at present, represented by apple, samsung, etc., and the application thereof in mobile phones is particularly wide and prominent, and mobile phones mainstream in China at present also begin to use such material as the material of mobile phone antennas. Internationally, since 2009, ordinary LDS materials are mainly represented by international companies and enterprises such as DSM (imperial man), SABIC (SABIC foundation) and the like, however, with the continuous development of 5G technology, the materials that have been commercialized have been difficult to meet the use requirements of mobile phone antennas in terms of dielectric properties and other properties.

Disclosure of Invention

Therefore, the embodiment of the invention provides an LDS composite material and a preparation method thereof, and an LDS antenna, wherein a high-dielectric resin matrix composite material is used as a substrate, a metal material is used as a laser activation enhancing system, and the epitaxial growth of a film on the substrate is controlled layer by sequentially depositing the film on the substrate, so that the film has good uniformity, high compactness and high shape retention, the surface activation performance of the material under the condition of laser irradiation in the later use process is effectively improved, and the use requirement of the material in a 5G mobile phone antenna is further met.

In order to achieve the above object, an embodiment of the present invention provides the following:

in one aspect of the embodiment of the invention, an LDS composite material is provided, which comprises a high dielectric resin matrix composite material and a metal thin film loaded on the surface of the high dielectric resin matrix composite material.

In a preferred embodiment of the present invention, the high dielectric resin-based composite material is a PCT resin-based composite material, and the metal thin film is a tin layer and/or a copper layer.

In another aspect of an embodiment of the present invention, there is also provided a method for preparing the LDS composite material, including:

s100, depositing a first layer of metal film on the high-dielectric-resin-based composite material;

s200, continuously depositing on the first layer of metal film to form a second layer of metal film;

s300, sequentially repeating the step S100 and the step S200 until the number of layers of the metal film reaches a preset value, and obtaining the LDS composite material; wherein the content of the first and second substances,

the first layer of metal film is made of a different material than the second layer of metal film.

As a preferable aspect of the present invention, the method for preparing the high dielectric resin-based composite material in step S100 includes:

s101, adding a silane coupling agent into expanded graphite in the presence of an organic solvent, mixing and stirring for 10-20min, adding boric acid, continuously stirring for 1-2h, removing filter residues, and drying to obtain modified expanded graphite;

s102, mixing 1, 4-cyclohexanedimethanol and terephthalic acid in the presence of a catalyst to perform an esterification reaction to obtain a pre-product;

s103, adding modified expanded graphite and polyethylene glycol into the pre-product, and after pre-polymerization treatment and final polymerization treatment in sequence, granulating, melting and extruding for molding to obtain the high-dielectric-resin-based composite material.

As a preferable scheme of the present invention, the step S100 further includes a step of pretreating the high dielectric resin-based composite material, and the pretreatment process includes: and sequentially eluting the high-dielectric resin matrix composite material for 2-5 times by using deionized water and ethanol.

As a preferable scheme of the invention, the deposition of the metal film adopts atomic layer deposition, the first layer of metal film is a copper film, the second layer of metal film is a tin film, and the copper film and the tin film are sequentially arranged on the surface of the high dielectric resin-based composite material.

As a preferable embodiment of the present invention, in step S300, the number of layers of the metal thin film is set to a preset value of 10 to 20 layers.

As a preferred aspect of the present invention, the copper thin film and the tin thin film are provided by a micro-and/or nano-sized tin-copper compound.

In a preferred embodiment of the present invention, the tin-copper compound is supported on a molecular sieve.

An LDS antenna, the LDS antenna is made of the LDS composite material.

The embodiment of the invention has the following advantages:

1) the method comprises the following steps of taking a high-dielectric resin-based composite material as a substrate, alternately depositing metal films on the surface of the substrate, and enabling each layer of film to be a monoatomic layer which is epitaxially grown on the surface of the substrate, so that the process of controlling the growth of the film is accurately formed;

2) through the number of film layers that predetermine at the substrate surface deposit, realize the adjustment of physicochemical properties such as its dielectric properties through the control to the number of film layers to realize the controllable effect of dielectric parameter.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.

Fig. 1 is a flowchart of a method for preparing an LDS composite material according to an embodiment of the present invention.

Detailed Description

The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The invention provides an LDS composite material, which comprises a high dielectric resin matrix composite material and a metal film loaded on the surface of the high dielectric resin matrix composite material.

The surface of the LDS composite material is activated under the condition of high-energy laser irradiation, so that metal seeds are formed on the surface of the LDS composite material, and an efficient and accurate metallization forming process can be carried out after the LDS composite material is processed into a manufactured part, so that a metal circuit with an MID structure is obtained, and the LDS composite material effectively meets the use requirements of a 5G antenna.

In a preferred embodiment of the present invention, in order to further improve the coupling characteristics between the materials and reduce the dielectric loss thereof, the high dielectric resin-based composite material is a PCT resin-based composite material, and the metal thin film is a tin layer and/or a copper layer.

As shown in fig. 1, the invention further provides a preparation method of the LDS composite material, which comprises the following steps:

s100, depositing a first layer of metal film on the high-dielectric-resin-based composite material;

s200, continuously depositing on the first layer of metal film to form a second layer of metal film;

s300, sequentially repeating the step S100 and the step S200 until the number of layers of the metal film reaches a preset value, and obtaining the LDS composite material; wherein the content of the first and second substances,

the first layer of metal film is made of a different material than the second layer of metal film.

Through the arrangement, the first layer of metal film and the second layer of metal film are alternately introduced, and each layer of film is only a monoatomic layer epitaxially grown on the substrate, so that the epitaxial growth of the film is accurately controlled layer by layer, the film has the advantages of good uniformity, high density, high conformality and the like, and the thin, uniform and compact film is deposited on the surface of the substrate in such a way, so that the overall physical and chemical properties are effectively improved on the premise of not changing due to the bulk property.

In a further preferred embodiment, the preparation method of the high dielectric resin-based composite material in step S100 includes:

s101, adding a silane coupling agent into the expanded graphite in the presence of an organic solvent, mixing and stirring for 10-20min, adding boric acid, continuously stirring for 1-2h, removing filter residues, and drying to obtain the modified expanded graphite.

S102, mixing 1, 4-cyclohexanedimethanol and terephthalic acid in the presence of a catalyst to perform esterification reaction to obtain a pre-product.

S103, adding modified expanded graphite and polyethylene glycol into the pre-product, and performing pre-polymerization treatment and final polymerization treatment in sequence, granulating, melting and extruding for molding to obtain the high-dielectric resin matrix composite material.

Of course, the high dielectric resin matrix composite material can be a block structure, so that the surface of the high dielectric resin matrix composite material is convenient for depositing a film, meanwhile, the expanded graphite is convenient to load on a pre-product by modifying the expanded graphite in the mode, and polyethylene glycol is added in the polycondensation process to be embedded in a polymer, so that the whole dielectric resin matrix composite material is stable in structure and has certain filling pores.

In a further preferred embodiment, in order to elute the polyethylene glycol and the like in the filled pores so as to form the entire high dielectric resin-based composite material into a dense and uniform porous structure, the step S100 further includes a pretreatment of the high dielectric resin-based composite material, and the pretreatment includes: and sequentially eluting the high-dielectric resin matrix composite material for 2-5 times by using deionized water and ethanol. Thereby effectively improving the uniformity of the film generation.

In a further preferred embodiment, the deposition of the film is atomic layer deposition, the first layer of metal film is a copper film, the second layer of metal film is a tin film, and the copper film and the tin film are sequentially arranged on the surface of the high-dielectric resin-based composite material. Therefore, the perfect balance of dielectric constant and dielectric loss is achieved by utilizing the coupling characteristics of different dielectric powder materials.

In a more preferred embodiment of the present invention, in step S300, the number of layers of the metal thin film is 10 to 20.

In a further preferred embodiment, the copper thin film and the tin thin film are provided by micro-and/or nano-sized tin-copper compounds. The tin-copper compound is loaded on a molecular sieve. The LDS composite material with laser selective metallization is obtained by compounding a nano/submicron laser activation enhancement system, a low-cost molecular sieve loaded nano tin-copper compound system and a high-dielectric resin matrix composite material.

The invention also provides an application of the LDS composite material, and an LDS antenna is manufactured by applying the LDS composite material.

The results of testing the high temperature resistance, dielectric coefficient, dielectric loss, notched impact resistance, material bending and milling and thermal conductivity of the LDS composite material A1, the LDS composite material A2, the reinforced thermal conductivity PA 6-based composite material D1 produced by SABIC, the 30% GF reinforced PC-based LDS antenna material D2 produced by SABIC and the reinforced thermal conductivity PA 46-based composite material D3 produced by DSM company are shown in Table 1.

TABLE 1

Wherein Tg is the glass transition temperature of the plastic.

Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.