1. A stretchable device, comprising:

a substrate including a plurality of first regions having a first stiffness and second regions between adjacent ones of the plurality of first regions and having a second stiffness lower than the first stiffness;

a cell device array including a plurality of cell devices on separate respective ones of the plurality of first regions of the substrate; and

an encapsulant covering the array of unit devices,

wherein the array of cell devices comprises:

a plurality of pixel electrodes isolated on separate respective ones of the plurality of first regions of the substrate,

a plurality of common electrodes isolated on separate respective ones of the plurality of first regions of the substrate, the stretchable device being configured to apply the same voltage to the plurality of common electrodes, an

A plurality of active layers on separate respective ones of the plurality of first regions of the substrate, each active layer between an individual one of the plurality of pixel electrodes and an individual one of the plurality of common electrodes.

2. The stretchable device defined in claim 1 wherein the substrate comprises an elastomer.

3. The stretchable device according to claim 1, wherein a difference between an elastic modulus of the plurality of first regions of the substrate and an elastic modulus of the second region of the substrate is 100 times or more.

4. A stretchable device according to claim 1, wherein

An elongation of the plurality of first regions of the substrate is less than or equal to 5%, and

the elongation of the second region of the substrate is 10% to 100%.

5. A stretchable device according to claim 1, wherein

The plurality of first regions of the substrate each have an island shape and are out of direct contact with each other, an

The second region of the substrate is a single continuous structure in the substrate.

6. The stretchable device of claim 1, further comprising:

and a connection electrode connecting the plurality of common electrodes.

7. A stretchable device according to claim 6, wherein

The connection electrode is on the second region of the substrate, or

The connection electrode is on both the first region and the second region of the substrate.

8. A stretchable device according to claim 6, wherein the connecting electrodes are stretchable electrodes.

9. The stretchable device defined in claim 8 wherein the connecting electrode comprises conductive nanostructures.

10. The stretchable device defined in claim 6, further comprising:

a pixel defining layer between adjacent unit devices of the unit device array, the pixel defining layer having via holes corresponding to separate respective unit devices of the unit device array,

wherein each common electrode is connected to the connection electrode through a separate one of the via holes of the pixel defining layer.

11. A stretchable device according to claim 10, wherein the pixel defining layer comprises an elastomer.

12. The stretchable device defined in claim 1 wherein the encapsulant comprises a plurality of encapsulants that are out of direct contact with one another and on separate ones of the plurality of first regions of the substrate.

13. The stretchable device according to claim 12, wherein the plurality of encapsulants and the plurality of common electrodes have the same planar shape.

14. The stretchable device defined in claim 1 wherein the encapsulant is over an entire surface of the substrate and comprises a cured product of a photo-elastomer.

15. The stretchable device according to claim 14, wherein the photosensitive elastomer is curable at a temperature of less than or equal to 100 ℃.

16. The stretchable device according to claim 1, wherein each active layer is a light emitting layer or a photoelectric conversion layer.

17. A stretchable device according to claim 16, wherein

Each active layer is the light emitting layer, an

The light emitting layer includes an organic light emitting material, an inorganic light emitting material, a quantum dot, a perovskite, or a combination thereof.

18. A display panel comprising the stretchable device of claim 1.

19. A sensor comprising a stretchable device according to claim 1.

20. The sensor of claim 19, wherein the sensor comprises:

a light emitting diode configured to emit first light; and

a photoelectric conversion device configured to sense second light generated based on reflection of the first light by an object,

wherein at least one of the light emitting diode and the photoelectric conversion device comprises the stretchable device.

21. The sensor of claim 19, wherein the sensor is a biosensor.

22. An electronic device comprising the stretchable device of claim 1.

23. An electronic device comprising the display panel according to claim 18.

24. An electronic device comprising the sensor of claim 19.

Background

Recently, research has been conducted on attachable devices that attach display devices or biological devices, such as smart skin devices, soft robots, and biomedical devices, directly to skin or clothing.

However, since such attachable device needs to have stretchability in any direction according to the movement of the living body while being capable of maintaining its original performance after recovery, a new structure different from the conventional device is required.

Disclosure of Invention

Some example embodiments provide stretchable devices having new structures.

Some example embodiments provide a display panel including a stretchable device.

Some example embodiments provide a sensor comprising a stretchable device.

Some example embodiments provide an electronic device including a stretchable device, a display panel, or a sensor.

According to some example embodiments, a stretchable device may include a substrate. The substrate may include a plurality of first regions having a first stiffness and second regions between adjacent ones of the plurality of first regions and having a second stiffness lower than the first stiffness. The stretchable device may comprise an array of unit devices. The cell device array may include a plurality of cell devices on separate respective ones of the plurality of first regions of the substrate. The stretchable device may comprise an encapsulant covering the array of unit devices. The cell device array may include: a plurality of pixel electrodes isolated on separate respective first regions of the plurality of first regions of the substrate; a plurality of common electrodes isolated on separate respective ones of the plurality of first regions of the substrate, each of the plurality of common electrodes facing a separate one of the plurality of pixel electrodes, the stretchable device being configured to apply the same voltage to the plurality of common electrodes; and a plurality of active layers on separate respective ones of the plurality of first regions of the substrate, each active layer between an individual one of the plurality of pixel electrodes and an individual one of the plurality of common electrodes.

The substrate may comprise an elastomer.

The difference between the modulus of elasticity of the plurality of first regions of the substrate and the modulus of elasticity of the second region of the substrate may be about 100 times or more.

The elongation of the first region of the substrate may be less than or equal to about 5% and the elongation of the second region of the substrate may be about 10% to about 100%.

The plurality of first regions of the substrate may each have an island shape and be out of direct contact with each other, and the second region of the substrate may be a single continuous structure in the substrate.

The stretchable device may further include a connection electrode connecting the plurality of common electrodes.

The connection electrode may be on the second region of the substrate, or the connection electrode may be on both the first region and the second region of the substrate.

The connection electrode may be a stretchable electrode.

The connecting electrode may include a conductive nanostructure.

The stretchable device may further include a pixel defining layer between adjacent unit devices of the unit device array, the pixel defining layer having via holes corresponding to the separate respective unit devices of the unit device array. Each common electrode may be connected to the connection electrode through a separate one of the via holes of the pixel defining layer.

The pixel defining layer may include an elastomer.

The encapsulant may include a plurality of encapsulants out of direct contact with each other and on separate ones of the plurality of first regions of the substrate.

The plurality of encapsulants and the plurality of common electrodes may have the same planar shape.

The encapsulant may be on the entire surface of the substrate and include a cured product of the photo-elastomer.

The encapsulant can include a cured product of a photosensitive elastomer curable at a temperature of less than or equal to about 100 ℃.

The active layer may be a light emitting layer or a photoelectric conversion layer.

The active layer may be a light emitting layer, and the light emitting layer may include an organic light emitting material, an inorganic light emitting material, a quantum dot, a perovskite, or a combination thereof.

A display panel may include a stretchable device.

A sensor may include a stretchable device.

The sensor may include: a light emitting diode configured to emit first light; and a photoelectric conversion device configured to sense second light generated based on reflection of the first light by the object. At least one of the light emitting diode and the photoelectric conversion device may comprise a stretchable device.

The sensor may be a biosensor.

An electronic device may include a stretchable device, a display panel, and/or a sensor.

According to some example embodiments, a stretchable device may include a substrate. The substrate may include a first region having a first stiffness and a second region adjacent to the first region and having a second stiffness lower than the first stiffness. The stretchable device may include a cell device on a first region of a substrate and an encapsulant covering the cell device. The unit device may include a pixel electrode on the first region of the substrate, a common electrode on the pixel electrode, and an active layer between the pixel electrode and the common electrode.

The substrate may comprise an elastomer.

The difference between the modulus of elasticity of the first region of the substrate and the modulus of elasticity of the second region of the substrate may be about 100 times or more.

The elongation of the first region of the substrate may be less than or equal to about 5% and the elongation of the second region of the substrate may be about 10% to about 100%.

The second region of the substrate may completely surround the first region of the substrate in a horizontal direction extending parallel to the substrate.

The stretchable device may further include a connection electrode connected to the common electrode. The connection electrode may be on the second region of the substrate, or the connection electrode may be on both the first region and the second region of the substrate.

The connection electrode may be a stretchable electrode.

The connecting electrode may include a conductive nanostructure.

The active layer may be a light emitting layer or a photoelectric conversion layer.

The stretchable device may flexibly respond to external forces or external movements in a specific (or alternatively, predetermined) direction such as twisting, pressing and pulling it, while preventing damage or destruction of the unit device, so that it may be effectively applied to attachable devices directly attached to skin or clothing.

Drawings

Figure 1 is a schematic view showing an example of a pixel arrangement of a stretchable device according to some example embodiments,

figure 2 is a cross-sectional view taken along line II-II of the example of the stretchable device of figure 1 according to some example embodiments,

figure 3 is a top view illustrating an example of a substrate of the stretchable device of figures 1 and 2 according to some example embodiments,

FIG. 4, FIG. 5, FIG. 6, FIG. 7, FIG. 8, FIG. 9, FIG. 10, FIG. 11, and FIG. 12 are cross-sectional views sequentially illustrating an example of a method of manufacturing the stretchable device of FIGS. 1 and 2 according to some example embodiments,

figure 13, figure 14, figure 15, and figure 16 are cross-sectional views sequentially illustrating examples of methods of manufacturing the stretchable device of figures 1 and 2 according to some example embodiments,

figure 17 is a cross-sectional view taken along line II-II of another example of the stretchable device of figure 1 according to some example embodiments,

figure 18 is a cross-sectional view taken along line II-II of another example of the stretchable device of figure 1 according to some example embodiments,

figure 19 is a cross-sectional view taken along line II-II of another example of the stretchable device of figure 1 according to some example embodiments,

figure 20 is a cross-sectional view taken along line II-II of another example of the stretchable device of figure 1 according to some example embodiments,

figure 21 is a cross-sectional view taken along line II-II of another example of the stretchable device of figure 1 according to some example embodiments,

fig 22 is a schematic view showing an example of a skin type display panel,

figures 23 and 24 are schematic views showing examples of an attached biosensor according to some example embodiments,

FIG. 25 is a schematic view showing an example of operation of a biosensor according to some example embodiments, an

Fig. 26 is a schematic diagram of an electronic device according to some example embodiments.

Detailed Description

Hereinafter, some example embodiments are described in detail so that those skilled in the art can easily implement them. However, the structure of practical application may be implemented in various different forms and is not limited to the example embodiments described herein.

In the drawings, the thickness of layers, films, panels, regions, etc. are exaggerated for clarity.

It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present (i.e., indirectly on the other element). In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present.

It will be understood that elements and/or properties thereof may be referred to herein as being "the same" or "equal" to other elements and/or properties thereof, and it will be understood that elements and/or properties thereof that are referred to herein as being "the same" or "equal" to other elements and/or properties thereof may be "the same" or "equal" or "substantially the same" as the other elements and/or properties thereof. An element that is "substantially the same" or "substantially equal" to another element and/or property thereof is to be understood as including an element and/or property thereof that is the same or equal to the other element and/or property thereof within manufacturing and/or material tolerances. An element that is the same or substantially the same as another element and/or property thereof may be structurally the same or substantially the same, functionally the same or substantially the same, and/or compositionally the same or substantially the same as the other element and/or property thereof.

It will be understood that elements and/or properties thereof described herein as "substantially" identical encompass elements and/or properties thereof having a relative difference in magnitude of equal to or less than 10%. Further, whether an element and/or property thereof is modified to be "substantially," it will be understood that such element and/or property thereof should be interpreted as including manufacturing or operating tolerances (e.g., ± 10%) around the recited element and/or property thereof.

When the term "about" or "substantially" is used in this specification in connection with a numerical value, it is intended that the associated numerical value include a tolerance of ± 10% around the numerical value recited. When a range is specified, the range includes all values therebetween, such as 0.1% increments.

Hereinafter, the term "combination" includes mixtures and two or more stacked structures.

Hereinafter, a stretchable device according to some example embodiments is described with reference to the accompanying drawings.

Fig. 1 is a schematic view illustrating an example of a pixel arrangement of a stretchable device according to some example embodiments.

Referring to fig. 1, the stretchable device 200 may include a plurality of pixels PX, which may be repeatedly arranged in a matrix form along rows and/or columns. The stretchable device 200 may include a unit pixel group "a" repeatedly arranged, and the plurality of pixels PX included in the unit pixel group "a" may have an arrangement such as, but not limited to, 3 × 1, 2 × 2, 3 × 3, or 4 × 4. In some example embodiments, the arrangement of the pixels PX may be a bayer matrix, a PenTile matrix, and/or a diamond matrix, but is not limited thereto.

In some example embodiments, each pixel PX may include a unit device 150A, and each unit device 150A may independently display red R, green G, blue B, or a combination thereof such as white W. In some example embodiments, the unit pixel group "a" may have an arrangement such as RGB, RGBG, or RGBW, but is not limited thereto.

In some example embodiments, each pixel PX may include a cell arrangement 150A, and each cell arrangement 150A may be configured to selectively absorb or sense light of the red wavelength spectrum R, light of the green wavelength spectrum G, light of the blue wavelength spectrum B, light of the entire visible wavelength spectrum W, or light of the infrared wavelength spectrum IR. In some example embodiments, the unit pixel group "a" may have an arrangement such as RGB, RGBG, RGBW, or rgbiir, but is not limited thereto. In some example embodiments, for example, as shown in fig. 1, each individual pixel PX may be defined as an individual unit device 150A. As shown in fig. 2, in some example embodiments, each individual pixel PX may be defined as an individual portion of the stretchable device having a horizontal boundary defined by an individual opening 161, and include some or all portions of the stretchable device vertically overlapping the individual opening 161 (e.g., overlapping in a direction perpendicular to the extension of the substrate 110). As described herein, the horizontal direction may refer to a direction parallel to the substrate 110 extending, and the vertical direction may refer to a direction perpendicular to the substrate 110 extending.

The cell devices 150A may be repeatedly arranged along rows and/or columns to form the cell device array 150.

In the drawings, although all the pixels PX are depicted as having the same size, the present disclosure is not limited thereto. One or more pixels PX belonging to the unit pixel group "a" may be larger or smaller than the other pixels PX. In the drawings, although all the pixels PX are depicted as having the same shape, the present disclosure is not limited thereto. One or more pixels PX belonging to the unit pixel group "a" may have a different shape from the other pixels PX.

Fig. 2 is a sectional view taken along line II-II of the example of the stretchable device of fig. 1, and fig. 3 is a top view illustrating an example of arrangement of first and second regions of a substrate of the stretchable device of fig. 1 and 2.

Referring to fig. 2, the stretchable device 200 according to some example embodiments includes a substrate 110, a transistor 120, a connection electrode 130, an insulating layer 140, a unit device 150A, a pixel defining layer 160, and an encapsulant 170. The encapsulant 170 may be interchangeably referred to herein as an encapsulation layer, an encapsulation structure, etc. As further shown, the encapsulant 170 may include a plurality of separate encapsulants 170S.

The substrate 110 may be a stretchable substrate and may include an elastomer. The elastomer may include an organic elastomer, an organic-inorganic elastomer, an inorganic-like elastomer material, or a combination thereof. In some example embodiments, the organic elastomer or organic-inorganic elastomer may be a substituted or unsubstituted polyorganosiloxane (such as polydimethylsiloxane), an elastomer comprising substituted or unsubstituted butadiene moieties (such as styrene-ethylene-butylene-styrene), an elastomer comprising urethane moieties, an elastomer comprising acrylic moieties, an elastomer comprising olefinic moieties, or a combination thereof, but is not limited thereto. Inorganic elastomer-like materials may include, but are not limited to, elastic ceramics, elastic solid metals, liquid metals, or combinations thereof.

Referring to fig. 3, the substrate 110 may include regions having different rigidities, and in some example embodiments, may include a first region 110A having a relatively high rigidity (e.g., a first rigidity) and a second region 110B having a relatively low rigidity (e.g., a second rigidity, wherein the second rigidity is lower than the first rigidity) compared to the first region 110A. Here, the stiffness (e.g., the first and/or second stiffness) may represent a degree of resistance to deformation when a force is applied from the outside. A relatively high stiffness (e.g., a first stiffness) may mean that the resistance to deformation is relatively large, such that the deformation is small, while a relatively low stiffness (e.g., a second stiffness) may mean that the resistance to deformation is relatively small, such that the deformation is large.

Stiffness can be evaluated by elastic modulus (e.g., a particular stiffness or range thereof canTo correspond to a particular modulus of elasticity or range thereof), and a high modulus of elasticity may mean a high stiffness and a low modulus of elasticity may mean a low stiffness. In some example embodiments, the elastic modulus may be young's modulus at room temperature (about 25 ℃). The difference between the elastic modulus of the first region 110A and the second region 110B of the substrate 110 may be about 100 times or more, and the elastic modulus of the first region 110A may be about 100 times greater than the elastic modulus of the second region 110B (e.g., the elastic modulus of the first region 110A may be greater than the elastic modulus of the second region 110B by a factor equal to or greater than about 100). The difference between the elastic modulus of the first region 110A and the elastic modulus of the second region 110B may be about 100 to 100,000 times in the above range, and the elastic modulus of the first region 110A may be about 100 to about 100,000 times as large as the elastic modulus of the second region 110B (for example, the elastic modulus of the first region 110A may be greater than the elastic modulus of the second region 110B by a factor equal to or greater than about 100 and less than or equal to about 100,000), but is not limited thereto. In some example embodiments, the elastic modulus of the first region 110A may be about 10⁷Pa to about 10¹²Pa, the second region 110B can have an elastic modulus of greater than or equal to about 10²Pa and less than about 10⁷Pa, but is not limited thereto. For example, the first region 110A having the first stiffness may have about 10⁷Pa to about 10¹²Pa, the second region 110B having a second stiffness that is lower than the first stiffness may have an elastic modulus greater than or equal to about 10²Pa and less than about 10⁷Pa and an elastic modulus smaller than that of the first region 110A. Thus, it will be understood that a substrate having a first region having a first stiffness and a second region having a second stiffness lower than the first stiffness may mean a substrate having a first region having a first modulus of elasticity and a second region having a second modulus of elasticity less than the first modulus of elasticity.

The elongation rates of the first and second regions 110A and 110B of the substrate 110 may be different from each other due to the aforementioned difference in stiffness, and the elongation rate of the second region 110B may be higher than that of the first region 110A. Here, the elongation may be a percentage change in length that increases to a breaking point with respect to an initial length. In some example embodiments, the elongation of the first region 110A of the substrate 110 may be less than or equal to about 5%, and within this range may be about 0% to about 5%, about 0% to about 4%, about 0% to about 3%, about 0% to about 2%, about 0% to about 1%, about 0.5% to about 5%, about 0.5% to about 4%, about 0.5% to about 3%, about 0.5% to about 2%, or about 1% to about 2%. In some exemplary embodiments, the elongation of the second region 110B of the substrate 110 may be greater than or equal to about 10%, and within this range may be about 10% to about 1000%, about 10% to about 800%, about 10% to about 700%, about 10% to about 500%, about 10% to about 300%, about 10% to about 200%, about 10% to about 100%, about 10% to about 90%, about 10% to about 80%, about 10% to about 70%, about 10% to about 60%, about 10% to about 50%, about 10% to about 40%, about 20% to about 70%, about 20% to about 60%, about 20% to about 50%, or about 20% to about 40%. Thus, it will be understood that a substrate having a first region having a first stiffness and a second region having a second stiffness lower than the first stiffness may mean a substrate having a first region having a first elongation and a second region having a second elongation higher than the first elongation.

The plurality of first regions 110A of the substrate 110 may have island shapes separated from each other (e.g., a plurality of island structures out of direct contact with each other), and may be repeatedly arranged in a matrix form along rows and/or columns to correspond to the pixels PX of the stretchable device 200. However, the arrangement of the plurality of first regions 110A of the substrate 110 is not limited thereto, and may be changed according to the arrangement of the pixels PX. A unit device 150A, which will be described later, is disposed on each first region 110A of the substrate 110.

Although at least the example embodiments illustrated in fig. 1 to 3 show the stretchable device 200 in which the substrate 110 includes many first regions 110A and surrounding second regions 110B, the example embodiments are not limited thereto. For example, in some example embodiments, a stretchable device may include a single first region 110A and a single second region 110B adjacent to the first region 110A and may partially or completely surround the first region 110A. Such a stretchable device 200 may comprise a single unit device 150A on the first zone 110A.

The second region 110B of the substrate 110 may be a region other than the plurality of first regions 110A, and may be continuously connected as a whole (e.g., may be a single continuous structure within the substrate 110, or a single piece of material surrounding many separate first regions 110A in the substrate 110). For example, where the substrate 110 includes a plurality of first regions 110A (e.g., first regions 110A having an island structure and being out of direct contact with each other), the second regions 110B may be between adjacent first regions 110A (e.g., the second regions 110B may be a single region between some or all of the adjacent first regions 110A of the substrate 110). The second region 110B of the substrate 110 may be a region providing stretchability to the stretchable device 200. Due to the relatively low stiffness and the relatively high elongation of the second region 110B, the substrate 110 may flexibly respond to external forces or external movements such as twisting, pressing, and/or pulling, and may be easily restored to its original state.

In some example embodiments, the first region 110A of the substrate 110 may have a different shape than the second region 110B of the substrate 110. In some example embodiments, the first region 110A of the substrate 110 may be flat, and the second region 110B may include a two-dimensional or three-dimensional stretchable structure. In some example embodiments, the two-dimensional or three-dimensional stretchable structure may have a wavy shape, a wrinkled shape, a pop-up shape, or a non-coplanar grid shape, but is not limited thereto.

In some example embodiments, the first region 110A of the substrate 110 may include a different material than the second region 110B. In some example embodiments, the first region 110A of the substrate 110 may include an inorganic material, an organic material, and/or an organic-inorganic material having relatively high rigidity and relatively low elongation, and the second region 110B of the substrate 110 may include an inorganic material, an organic material, and/or an organic-inorganic material having relatively low rigidity and relatively high elongation. In some example embodiments, the first region 110A of the substrate 110 may include an organic material (including polycarbonate, polymethylmethacrylate, polyethylene terephthalate, polyethylene naphthalate, polyimide, polyamide, polyamideimide, polyethersulfone, or a combination thereof), a carbon structure (such as diamond carbon), or a combination thereof, and the second region 110B of the substrate 110 may include an organic elastomer or an organic-inorganic elastomer (including substituted or unsubstituted polyorganosiloxanes (such as polydimethylsiloxane), elastomers comprising substituted or unsubstituted butadiene moieties (such as styrene-ethylene-butylene-styrene), elastomers comprising urethane moieties, elastomers comprising acrylic moieties, elastomers comprising olefinic moieties, or a combination thereof), an inorganic-like elastomer material (such as an elastic ceramic, a ceramic, a resilient solid metal, a liquid metal, or a combination thereof), but is not limited thereto. In some example embodiments, the first region 110A and the second region 110B may be joined together, for example, by applying an epoxy, and/or may be at least partially welded together.

In some example embodiments, the first region 110A and the second region 110B of the substrate 110 may be formed of the same material (e.g., may be part of a monolithic piece of material) and may be defined, at least in part, as separate regions having different stiffnesses due to different conditions, such as a degree of polymerization and/or a degree of curing. In some example embodiments, the substrate 110 may include a first region 110A having a relatively high stiffness and a second region 110B having a relatively low stiffness, the first region 110A and the second region 110B being formed by varying a degree of polymerization, a type and content of a curing agent, and/or a curing temperature based on polydimethylsiloxane (e.g., based on varying application of one or more curing agents and/or varying a curing temperature across different regions of a monolithic polydimethylsiloxane material).

The transistor 120 and the connection electrode 130 are formed on the substrate 110. The transistor 120 may be on the first region 110A of the substrate 110, on the second region 110B of the substrate 110, or on both the first region 110A and the second region 110B of the substrate 110. The connection electrode 130 may be on the first region 110A of the substrate 110, on the second region 110B of the substrate 110, or on both the first region 110A and the second region 110B of the substrate 110. When the transistor 120 is on the second region 110B of the substrate 110, the transistor 120 may be a stretchable transistor.

One or two or more transistors 120 may be included in each pixel PX, and may be connected to a plurality of signal lines (not shown). The plurality of signal lines may include a gate line for transmitting a gate signal (or a scan signal), a data line for transmitting a data signal, and a driving voltage line for transmitting a driving voltage. At least a part of the plurality of signal lines may be stretchable wiring lines.

In some example embodiments, the transistor 120 may include a switching transistor and/or a driving transistor. The switching transistor may be electrically connected to the gate line and the data line, and may include a first gate electrode connected to the gate line, a first source electrode connected to the data line, a first drain electrode facing the first source electrode, and a first semiconductor electrically connected to the first source electrode and the first drain electrode, respectively. The driving transistor may include a second gate electrode electrically connected to the first drain electrode, a second source electrode connected to the driving voltage line, a second drain electrode facing the second source electrode, and a second semiconductor electrically connected to the second source electrode and the second drain electrode, respectively. In some example embodiments, the first semiconductor and the second semiconductor may each include a semiconductor material and an elastomer. In some example embodiments, the first semiconductor and the second semiconductor may each include an organic semiconductor material and an elastomer.

The connection electrode 130 may be electrically connected to a plurality of common electrodes 152A, which will be described later, and may be an electrode to which a common voltage is applied for the operation of the cell device 150A. The connection electrode 130 may be on the second region 110B of the substrate 110, or may be disposed on both the first region 110A and the second region 110B of the substrate 110. The connection electrode 130 may be a single continuous electrode that is connected to each common electrode 152A of the plurality of common electrodes 152A (e.g., the connection electrode 130 may be a single piece of material). As shown in at least fig. 1, the connection electrode 130 may have a wave shape such that, although at least the cross-sectional view shown in fig. 2 shows separate portions of the connection electrode 130 connected to separate common electrodes 152A, the separate portions of the connection electrode 130 are portions of a single continuous (e.g., monolithic) connection electrode 130 connected (e.g., electrically connected) to each common electrode 152A.

The connection electrode 130 may be a stretchable electrode, and in some example embodiments, may include a stretchable conductor or may have a stretchable wave shape. In some example embodiments, the stretchable conductor may include conductive nanostructures, e.g., conductive nanoparticles, conductive nanoflakes, conductive nanowires, conductive nanotubes, or combinations thereof, e.g., nanoparticles, nanoflakes, nanowires, nanotubes, or combinations thereof (such as silver nanoparticles, silver nanoflakes, silver nanowires, silver nanotubes, graphene, graphite, or combinations thereof) including low resistance conductors (such as silver, gold, copper, aluminum, etc.) or carbon conductors, but is not limited thereto. When the connection electrode 130 has a stretchable wave shape, the connection electrode 130 may include a low-resistance conductor such as silver, gold, copper, aluminum, an alloy thereof, or a combination thereof.

An insulating layer 140 is formed on the transistor 120 and the connection electrode 130. The insulating layer 140 may include an organic insulating material, an inorganic insulating material, or an organic-inorganic insulating material, and in some example embodiments, may include: an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride; an organic insulating material such as polyimide; or an organic-inorganic insulating material such as polyorganosiloxane or polyorganosiloxane nitride. The insulating layer 140 may be a stretchable insulating layer, and may include an elastomer in some example embodiments. The elastomer may include the aforementioned organic elastomers, organic-inorganic elastomers, inorganic-like elastomer materials, or combinations thereof, but is not limited thereto. The insulating layer 140 has a plurality of contact holes 142 exposing the transistors 120.

The cell device array 150 is formed on the insulating layer 140. The unit device array 150 may include a plurality of unit devices 150A repeatedly arranged along rows and/or columns, and each unit device 150A of the plurality of unit devices 150A may be disposed on the first region 110A of the substrate 110. In the case where the substrate 110 includes a plurality of first regions 110A, the unit device array 150 may include a plurality of unit devices 150A on separate respective first regions 110A among the plurality of first regions 110A of the substrate 110. Each cell arrangement 150A may be a diode or a transistor in some example embodiments.

The unit device array 150 may include: a plurality of pixel electrodes 151A respectively isolated on a plurality of first regions 110A of the substrate 110 (e.g., respectively isolated on separate respective first regions 110A of the substrate 110); a plurality of common electrodes 152A respectively isolated on the plurality of first regions 110A of the substrate 110 (e.g., respectively isolated on separate respective first regions 110A of the substrate 110) and facing the plurality of pixel electrodes 151A (e.g., each individual common electrode 152A facing an individual pixel electrode 151A of the plurality of pixel electrodes 151A); and a plurality of active layers 153A between the plurality of pixel electrodes 151A and the plurality of common electrodes 152A (e.g., each individual active layer 153A is between an individual pixel electrode 151A and an individual common electrode 152A) and on the plurality of first regions 110A of the substrate 110 (e.g., each individual active layer 153A is on an individual first region 110A of the plurality of first regions 110A).

The pixel electrodes 151A may be repeatedly arranged along rows and/or columns to form a pixel electrode array, the common electrodes 152A may be repeatedly arranged along rows and/or columns to form a common electrode array, and the active layers 153A may be repeatedly arranged along rows and/or columns to form an active layer array.

The unit device 150A including the pixel electrode 151A, the common electrode 152A, and the active layer 153A may be on the first region 110A of the substrate 110 having relatively high rigidity, and the unit device 150A may not be on the second region 110B of the substrate 110 having relatively low rigidity. Accordingly, the unit device 150A including the pixel electrode 151A, the common electrode 152A, and the active layer 153A is substantially unaffected by an external force or external movement such as twisting, pressing, and/or pulling the stretchable device 200. Therefore, materials for improving the performance of the pixel electrode 151A, the common electrode 152A, and the active layer 153A can be freely selected, and damage or destruction due to tensile deformation caused by an external force or external movement can be reduced or prevented.

Each of the pixel electrode 151A and the common electrode 152A may be independently made of a low-resistance conductor, and in some example embodiments, may be independently made of a metal, a conductive oxide, and/or a conductive organic material. In some example embodiments, the pixel electrode 151A and the common electrode 152A may be independently made of: metals such as aluminum, silver, gold, copper, magnesium, nickel, molybdenum, or alloys thereof; conductive oxides such as Indium Tin Oxide (ITO), Indium Zinc Oxide (IZO), Zinc Tin Oxide (ZTO), Aluminum Tin Oxide (ATO), and Aluminum Zinc Oxide (AZO); and/or conductive organic materials such as Polyacetylene (PA), polypyrrole (PPy), Polythiophene (PT), Polyaniline (PA), and poly (3, 4-ethylenedioxythiophene).

The pixel electrode 151A and the common electrode 152A may be transparent or opaque electrodes, respectively. The transparent electrode may have a transmittance of greater than or equal to about 80% and may include a metal thin film or the aforementioned conductive oxide, a conductive organic material, and/or a carbon conductor, and in some example embodiments, the opaque electrode may have a transmittance of less than about 10% or a reflectance of greater than or equal to about 5%, and may include a metal.

Each pixel electrode 151A may be electrically connected to the transistor 120 in a corresponding pixel PX, and may be independently driven for the corresponding pixel PX. The plurality of common electrodes 152A are electrically connected to the connection electrode 130, and based on a specific voltage (in some example embodiments, a reference voltage) being applied to the connection electrode 130 connected to each common electrode 152A, a common voltage (e.g., the same voltage) may be applied to each common electrode 152A. Accordingly, it will be appreciated that the stretchable device 200 according to some example embodiments is configured to apply a common voltage (e.g., the same voltage) to the common electrode 152A (e.g., apply the same voltage to the common electrode 152A at the same time or substantially the same time). It will be appreciated that in some example embodiments, the stretchable device 200 includes a plurality of connection electrodes 130 connected to separate sets of common electrodes 152A (e.g., a plurality of separate pieces of material that may be at least partially detached from direct contact with each other), and the stretchable device 200 is configured to enable a common voltage (e.g., the same voltage) to be applied to the common electrodes 152A based on the common voltage being applied to the plurality of connection electrodes 130 (e.g., by the common voltage being applied to a single piece of connection circuitry electrically connected to each connection electrode 130).

The active layer 153A may include a light emitting layer or a photoelectric conversion layer.

The light emitting layer may include an organic material, an inorganic material, an organic-inorganic material, or a combination thereof configured to emit light, and in some example embodiments, may include an organic light emitting material, an inorganic light emitting material, a quantum dot, a perovskite, or a combination thereof, but is not limited thereto.

When the light emitting layer includes an organic light emitting material, the unit device 150A may be an organic light emitting diode. When the light emitting layer includes an inorganic light emitting material, the unit device 150A may be an inorganic light emitting diode.

When the light emitting layer includes quantum dots, the unit device 150A may be a quantum dot light emitting diode. When the light emitting layer includes perovskite, the unit device 150A may be a perovskite light emitting diode.

The photoelectric conversion layer may be configured to selectively absorb light in at least a part of a wavelength spectrum and convert the absorbed light into an electrical signal, and may be configured to absorb at least one of light in, for example, a blue wavelength spectrum (hereinafter, referred to as "blue light"), light in a green wavelength spectrum (hereinafter, referred to as "green light"), light in a red wavelength spectrum (hereinafter, referred to as "red light"), and light in an infrared wavelength spectrum (hereinafter, referred to as "infrared light"), and convert the absorbed light into an electrical signal.

In some example embodiments, the photoelectric conversion layer may be configured to selectively absorb one of blue light, green light, red light, and infrared light, and may convert the absorbed light into an electrical signal. Here, selective absorption of light from one of blue, green, red, and infrared light means that the absorption spectrum has a maximum absorption wavelength (λ) in a wavelength spectrum of greater than or equal to about 380nm and less than about 500nm, about 500nm to about 600nm, greater than about 600nm and less than or equal to about 700nm, or greater than about 700nm and less than or equal to about 3000nm_max) And the absorption spectrum in the corresponding wavelength spectrum is significantly higher than the absorption spectrum in the other wavelength spectrumSpectra. Here, "significantly high" may mean that about 70% to about 100%, about 75% to about 100%, about 80% to about 100%, about 85% to about 100%, about 90% to about 100%, or about 95% to about 100% of the total area of the absorption spectrum may, for example, belong to the corresponding wavelength spectrum.

The photoelectric conversion layer may include a p-type semiconductor and an n-type semiconductor to form a pn junction, at least one of the p-type semiconductor and the n-type semiconductor may be a light absorbing material, and at least one of the p-type semiconductor and the n-type semiconductor may be a wavelength selective light absorbing material. In some example embodiments, at least one of the p-type semiconductor and the n-type semiconductor may have a maximum absorption wavelength (λ) in a wavelength spectrum of greater than or equal to about 380nm and less than 500nm, about 500nm to about 600nm, greater than about 600nm and less than or equal to about 700nm, or greater than about 700nm and less than or equal to about 3000nm_max). The p-type semiconductor and the n-type semiconductor may have peak absorption wavelengths (λ) in the same or different wavelength spectra_max). The p-type semiconductor and the n-type semiconductor may be an organic material, an inorganic material, or an organic-inorganic material, respectively. In some example embodiments, at least one of the p-type semiconductor and the n-type semiconductor may be an organic material.

The unit device 150A may further include an auxiliary layer (not shown) between the pixel electrode 151A and the active layer 153A and/or between the common electrode 152A and the active layer 153A. In some example embodiments, the auxiliary layer may be a charge auxiliary layer, a light emission auxiliary layer, and/or an absorption auxiliary layer. In some example embodiments, the charge assist layer may be one or more layers selected from a hole injection layer, a hole transport layer, an electron blocking layer, an electron injection layer, an electron transport layer, and a hole blocking layer. The auxiliary layers may each independently include an organic material, an inorganic material, or an organic-inorganic material.

The pixel defining layer 160 may be formed on the entire surface of the insulating layer 140, and may be a continuous film having a plurality of openings 161 and via holes 162 (see fig. 10). As shown, the pixel defining layer 160 may be at least partially between adjacent cell devices 150A of the cell device array 150 (e.g., between adjacent cell devices 150A of the cell device array 150 in a horizontal direction extending parallel to the substrate 110). A plurality of openings 161 may be disposed on the first region 110A of the substrate 110 to define each pixel PX and expose each unit device 150A. In some example embodiments, the shape and size of each pixel PX may be determined according to the shape and size of the corresponding opening 161. The plurality of via holes 162 may be channels that electrically connect the common electrode 152A to the connection electrode 130, and may be filled with a conductor that is the same as or different from a conductor forming the common electrode 152A. Accordingly, the pixel defining layer 160 may be understood to have the via holes 162 corresponding to the divided respective unit devices 150A and/or the divided respective pixels PX. The pixel defining layer 160 may be understood as having openings 161 corresponding to the separate respective unit devices 150A and/or corresponding to (e.g., at least partially defining) the separate respective pixels PX. As shown in fig. 2, the pixel PX may be defined by a horizontal outer boundary (e.g., an edge between the sidewall of the opening 161 and the upper surface of the pixel defining layer 160) of the sidewall (e.g., an inclined sidewall) of the opening 161. In some example embodiments, the pixels PX may be defined by horizontal inner boundaries of sidewalls of the openings 161 (e.g., edges between the sidewalls of the openings 161 and upper surfaces of the corresponding common electrodes 151A exposed by the respective openings 161).

It will be understood that in some example embodiments, the pixel defining layer 160 may not be present in the stretchable device 200. In some example embodiments, when the pixel defining layer 160 is not present, the aforementioned opening 161 may be at least partially formed in the upper surface of the insulating layer 140 (e.g., as a recess) to define the pixel PX, and at least the pixel electrode 151A and/or all of the unit devices 150A may be located thereon (e.g., the divided unit devices 150A are on the divided recesses in the insulating layer 140), and the via hole 162 and the contact hole 142 may extend through the insulating layer 140 as described and illustrated in the drawings.

The pixel defining layer 160 may include an organic insulating material, an inorganic insulating material, and/or an organic-inorganic insulating material, for example: an inorganic insulating material such as silicon oxide, silicon nitride, or silicon oxynitride; an organic insulating material such as polyimide; or an organic-inorganic insulating material such as polyorganosiloxane or polyorganosiloxane nitride. The pixel defining layer 160 may be a stretchable insulating layer, and may include an elastomer in some example embodiments. The elastomer may include the aforementioned organic elastomers, organic-inorganic elastomers, inorganic-like elastomer materials, or combinations thereof, but is not limited thereto.

The encapsulants 170 may be separately isolated on the first area 110A of the substrate 110, and each of the encapsulants 170 may individually cover the corresponding unit device 150A or the corresponding pixel PX such that the encapsulants 170 cover the unit device array 150. To reiterate, in the case where the substrate 110 includes a plurality of first areas 110A, the encapsulant 170 may include a plurality of separate encapsulants 170S (which may be in direct contact with each other) on separate respective unit devices 150A and which overlap with separate respective first areas 110A of the plurality of first areas 110A in a vertical direction extending perpendicular to the substrate 110 on separate respective first areas 110A of the plurality of first areas 110A. Accordingly, as shown in fig. 2, a plurality of encapsulants 170S may cover the separated respective unit devices 150A from vertical exposure. While the side edges of the common electrodes 152A are exposed by the encapsulants 170S as shown in fig. 2, it will be appreciated that in some example embodiments, the encapsulants 170S may completely cover the separate respective underlying cell devices 150A, including the side edges of their respective common electrodes 152A, in both the vertical and lateral directions (e.g., as shown in at least fig. 16). Adjacent encapsulants 170S are spaced apart from each other (e.g., out of direct contact with each other) with the second region 110B of the substrate 110 disposed therebetween (e.g., the plurality of encapsulants 170S may not vertically overlap the second region 110B, e.g., do not overlap the second region 110B in a direction extending perpendicular to the substrate 110). In some example embodiments, the encapsulant 170 (e.g., the plurality of encapsulants 170S) may have the same planar shape as the common electrode 152A.

As described above, the encapsulant 170 is formed to individually cover each unit device 150A or each pixel PX on the first area 110A of the substrate 110 (for example, the encapsulant 170 may include a plurality of encapsulants 170S that are out of direct contact with each other, and each individual encapsulant 170S is configured to cover an individual unit device 150A or pixel PX), so that the encapsulant 170 may be substantially unaffected by external force or external movement such as twisting, pressing, and/or pulling the stretchable device 200, and thus, a material for improving performance of the encapsulant 170 may be freely selected, and damage or breakage due to tensile deformation caused by the external force or external movement may be reduced or prevented.

In some example embodiments, the encapsulant 170 may include an organic material, an inorganic material, and/or an organic/inorganic material, and may include one or more layers. In some example embodiments, the encapsulant 170 may include an oxide, nitride, and/or oxynitride, such as an oxide, nitride, and/or oxynitride including aluminum (Al), titanium (Ti), zirconium (Zr), hafnium (Hf), tantalum (Ta), silicon (Si), or a combination thereof. In some example embodiments, the encapsulant 170 may include layers having different refractive indices that are alternately stacked. In some example embodiments, first layers including a first material selected from the group consisting of an oxide, a nitride, and an oxynitride, and second layers including a second material selected from the group consisting of an oxide, a nitride, and an oxynitride having a higher refractive index than the first material may be alternately stacked.

The encapsulant 170 may protect the cell unit 150A and effectively block or prevent inflow of oxygen, moisture, and/or contaminants from the outside. In some example embodiments, when the stretchable device 200 is included in a display device or a biological device attached to a living body, the encapsulant 170 may prevent biological secretions, such as sweat, from flowing into the stretchable device 200, thereby preventing degradation of the stretchable device 200.

In this manner, the stretchable device 200 according to some example embodiments includes the substrate 110, the substrate 110 including the first region 110A having relatively high stiffness and relatively low elongation and the second region 110B having relatively low stiffness and relatively high elongation, and thus may flexibly respond to an external force or external movement such as twisting, pressing and/or pulling in a specific (or alternatively, predetermined) direction.

Further, since the stretchable device 200 according to some example embodiments includes the unit device 150A disposed on the first region 110A of the substrate 110, a material for improving performance of constituent elements of the unit device 150A may be freely selected, and when the substrate 110 is stretched by an external force or an external movement, the unit device 150A may be prevented from being stretched and thus damaged or broken.

In addition, the stretchable device 200 according to some example embodiments may prevent or reduce damage or breakage of the common electrode 152A and the encapsulant 170 by isolating the common electrode 152A and the encapsulant 170 not continuously but separately in each unit device 150A when the substrate 110 is stretched by an external force or an external movement. Accordingly, materials for improving the performance of the common electrode 152A and the encapsulant 170 may be freely selected, and thus the stretchable device 200 may be effectively implemented without deteriorating the performance of the common electrode 152A and the encapsulant 170.

Hereinafter, examples of methods of manufacturing the stretchable device of fig. 1 and 2 according to some example embodiments are described with reference to the accompanying drawings.

Fig. 4, 5, 6, 7, 8, 9, 10, 11, and 12 are cross-sectional views sequentially illustrating examples of a method of manufacturing the stretchable device of fig. 1 and 2 according to some example embodiments.

Referring to fig. 4 together with fig. 3, a substrate 110 including a first region 110A having relatively high stiffness and relatively low elongation and a second region 110B having relatively low stiffness and relatively high elongation is prepared. The first regions 110A of the substrate 110 may be repeatedly arranged in an island shape along rows and/or columns and disposed at positions where the cell devices 150A are to be formed. The second region 110B of the substrate 110 may be a region other than the first region 110A, and may be continuously connected to the first region 110A.

The first and second regions 110A and 110B of the substrate 110 may be formed in various methods for varying the stiffness and elongation, but are not limited to a specific method.

In some example embodiments, after the positions of the first and second regions 110A and 110B for the substrate 110 are set, a two-dimensional or three-dimensional stretchable structure may be disposed on the position of the second region 110B for the substrate 110. In some example embodiments, the two-dimensional or three-dimensional stretchable structure may have a wavy shape, a wrinkled shape, a pop-up shape, or a non-coplanar grid shape, but is not limited thereto. In some example embodiments, the two-dimensional or three-dimensional structure may be realized by imprinting or photolithography, but is not limited thereto.

In some example embodiments, after the substrate 110 including the elastomer having the relatively low stiffness and the relatively high elongation is prepared, the structure including the material having the relatively high stiffness and the relatively low elongation is selectively disposed at a position where the first region 110A is to be formed, to provide the plurality of first regions 110A. In some example embodiments, the material having relatively high stiffness and relatively low elongation may be an organic material (such as polycarbonate, polymethylmethacrylate, polyethylene terephthalate, polyethylene naphthalate, polyimide, polyamide, polyamideimide, polyethersulfone, or a combination thereof), a carbon structure (such as diamond carbon), but is not limited thereto. Here, the region in which the structure is not disposed may be the second region 110B of the substrate 110.

In some example embodiments, after setting the positions for forming the first and second regions 110A and 110B of the substrate 110, the type, degree of polymerization, and/or degree of curing of the base polymer may be changed to form the first and second regions 110A and 110B having different rigidities and elongations at the positions where the first and second regions 110A and 110B of the substrate 110 are to be formed.

In some example embodiments, the stiffness of the substrate 110 may be varied by using Polydimethylsiloxane (PDMS) as a base polymer but changing the degree of polymerization of a polymer chain composed of Si — O bonds.

In some example embodiments, the stiffness of the substrate 110 may be varied by using Polydimethylsiloxane (PDMS) as a base polymer but varying the type and number of side chains linked to the Polydimethylsiloxane (PDMS).

In some example embodiments, the stiffness of the substrate 110 may be varied by using Polydimethylsiloxane (PDMS) as a base polymer but adjusting a composition ratio of the PDMS and the curing agent. As the amount of the curing agent increases, the stiffness may increase, and in some example embodiments, the amount of the curing agent with respect to the amount of the base polymer at a position where the first region 110A of the substrate 110 is to be formed may be greater than the amount of the curing agent with respect to the amount of the base polymer at a position where the second region 110B of the substrate 110 is to be formed.

In some example embodiments, the stiffness of the substrate 110 may be varied by using Polydimethylsiloxane (PDMS) as a base polymer but varying the curing temperature and/or time. As the curing temperature is higher and the curing time is longer, the stiffness may be higher, in some example embodiments, the curing temperature at a location where the first region 110A of the substrate 110 is to be formed may be higher than the curing temperature at a location where the second region 110B of the substrate 110 is to be formed, and in some example embodiments, the curing time at a location where the first region 110A of the substrate 110 is to be formed may be longer than the curing time at a location where the second region 110B of the substrate 110 is to be formed.

Referring to fig. 5, a plurality of signal lines (not shown), transistors 120, and connection electrodes 130 are formed on a substrate 110. The connection electrode 130 may be formed together with the signal line, but is not limited thereto.

Referring to fig. 6, an insulating layer 140 is formed on the entire surface of the substrate 110. The insulating layer 140 may be formed by coating, deposition, imprinting, etc., but is not limited thereto. The insulating layer 140 has a contact hole 142 exposing the transistor 120 of each Pixel (PX).

Referring to fig. 7, a conductor for a pixel electrode is formed on the insulating layer 140, and then photolithography is performed on the conductor to form a pixel electrode 151A. Each pixel electrode 151A is separately formed in the first region 110A of the substrate 110 and electrically connected to the transistor 120 through the contact hole 142 of the insulating layer 140.

Referring to fig. 8, an organic layer is formed on the entire surface of the insulating layer 140 and patterned to form a pixel defining layer 160 having a plurality of openings 161 exposing the pixel electrodes 151A.

Referring to fig. 9, an active layer 153A is formed on each pixel electrode 151A. The active layer 153A may be formed by coating, depositing, or imprinting a light emitting material or a light absorbing material, but is not limited thereto.

In some example embodiments, the active layer 153A may be formed by arranging side by side or stacking light emitting materials configured to emit light in different wavelength spectrums in a vertical direction. In some example embodiments, in the first, second, and third pixels arranged adjacently, the active layer 153A of the first pixel may include a light emitting material configured to emit light in a red wavelength spectrum, the active layer 153A of the second pixel may include a light emitting material configured to emit light in a green wavelength spectrum, and the active layer 153A of the third pixel may include a light emitting material configured to emit light in a blue wavelength spectrum.

In some example embodiments, the active layer 153A may be formed by stacking light absorbing materials configured to absorb light in different wavelength spectrums in a side-by-side arrangement (e.g., aligned parallel to the substrate 110) or in a vertical direction (e.g., in a direction perpendicular to the substrate 110). In some example embodiments, in the first, second, and third pixels arranged adjacently, the active layer 153A of the first pixel may include a light absorbing material configured to absorb light in a red wavelength spectrum, the active layer 153A of the second pixel may include a light absorbing material configured to absorb light in a green wavelength spectrum, and the active layer 153A of the third pixel may include a light absorbing material configured to absorb light in a blue wavelength spectrum.

Referring to fig. 10, a via hole 162 exposing the connection electrode 130 is formed in the pixel defining layer 160 and the insulating layer 140. Subsequently, the conductive layer 152 for the common electrode is formed on the entire surface of the pixel defining layer 160 and the active layer 153A. The conductive layer 152 for the common electrode is electrically connected to the connection electrode 130 through the pixel defining layer 160 and the via hole 162 in the insulating layer 140. Accordingly, each common electrode 152A to be formed later may be connected to the connection electrode 130 through a separate via hole 162 (e.g., a via hole corresponding to the respective unit device 150A including the common electrode 152A) in the pixel defining layer 160 and the insulating layer 140.

Referring to fig. 11, a film 170-1 for an encapsulant is formed on the entire surface of the conductive layer 152 for the common electrode. The film 170-1 for the encapsulant may be formed in a coating, deposition, or imprinting method, but is not limited thereto.

Referring to fig. 12, the film 170-1 for the encapsulant is subjected to photolithography to form the encapsulant 170 including a plurality of encapsulants 170S respectively isolated on the first region 110A of the substrate 110. The encapsulants 170S may individually cover each unit device 150A, and adjacent encapsulants 170S may be separated from each other with the second region 110B of the substrate 110 therebetween.

Referring to fig. 2, the conductive layer 152 for the common electrode is subjected to photolithography using the encapsulant 170 as a mask to form a plurality of common electrodes 152A respectively isolated on the first region 110A of the substrate 110. Here, since the encapsulant 170 serves as a mask to form the common electrode 152A, the encapsulant 170 and the common electrode 152A may have substantially the same planar shape. The lithography may be wet etching or dry etching.

In the following, examples of methods of manufacturing the stretchable device of fig. 1 and 2 are shown, according to some example embodiments.

Fig. 13, 14, 15, and 16 are cross-sectional views sequentially illustrating examples of methods of manufacturing the stretchable device of fig. 1 and 2, according to some example embodiments.

First, as shown in fig. 4 to 9, the transistor 120, the connection electrode 130, the insulating layer 140, the pixel defining layer 160, the pixel electrode 151A, and the active layer 153A are formed on the substrate 110 having the first region 110A and the second region 110B as described above.

Referring to fig. 13 and 14, a mask 70 is disposed over the active layer 153A. The mask 70 may have a fine opening part 70A and a fine blocking part 70B, and in some example embodiments, may be a fine metal mask FMM. The fine opening portion 70A of the mask 70 may have substantially the same size as that of the common electrode 152A to be formed later. After a source for supplying a conductor is disposed on the mask 70, a conductor is selectively deposited on the active layer 153A and a portion of the pixel defining layer 160 adjacent thereto through the fine opening portion 70A of the mask 70 to form the common electrode 152A. Subsequently, the mask 70 is removed.

Referring to fig. 15, a film 170-1 for an encapsulant is formed on the entire surface of the common electrode 152A and the pixel defining layer 160. The film 170-1 for the encapsulant may be formed in a coating, deposition, or imprinting method, but is not limited thereto.

Referring to fig. 16, the film 170-1 for the encapsulant is subjected to photolithography to form the encapsulant 170 including a plurality of encapsulants 170S respectively isolated on the first region 110A of the substrate 110. The encapsulants 170S may individually cover each unit device 150A, and adjacent encapsulants 170S may be separated from each other with the second region 110B of the substrate 110 therebetween.

In the following, another example of a stretchable device according to some example embodiments is described.

Figure 17 is a cross-sectional view taken along line II-II of another example of the stretchable device of figure 1 according to some example embodiments.

Referring to fig. 17, as with the example embodiment shown in fig. 2, the stretchable device 200 according to the example embodiment shown in fig. 17 includes: a substrate 110 having a first region 110A and a second region 110B; a transistor 120; a connection electrode 130; an insulating layer 140; a plurality of unit devices 150A each including a pixel electrode 151A, an active layer 153A, and a common electrode 152A; a pixel defining layer 160; and an encapsulant 170.

However, in the stretchable device 200 according to the example embodiment shown in fig. 17, unlike the example embodiment shown in fig. 2, the connection electrode 130 may be disposed on the insulating layer 140, and in some example embodiments, may be disposed on the same layer as the pixel electrode 151A. The connection electrode 130 may be electrically connected to the common electrode 152A through a via hole 162 in the pixel defining layer 160.

In the following, another example of a stretchable device according to some example embodiments is described.

Figure 18 is a cross-sectional view taken along line II-II of another example of the stretchable device of figure 1 according to some example embodiments.

Referring to fig. 18, as with the example embodiment shown in fig. 2, the stretchable device 200 according to the example embodiment shown in fig. 18 includes: a substrate 110 having a first region 110A and a second region 110B; a transistor 120; a connection electrode 130; an insulating layer 140; a plurality of unit devices 150A each including a pixel electrode 151A, an active layer 153A, and a common electrode 152A; a pixel defining layer 160; and an encapsulant 170.

However, in the stretchable device 200 according to the example embodiment shown in fig. 18, unlike the example embodiment shown in fig. 2, the pixel defining layers 160 may be separately present on the first regions 110A of the substrate 110 as the encapsulants 170, and separated in each pixel PX with the second region 110B of the substrate 110 therebetween. Each individual pixel defining layer 160 has an opening 161 and a via hole 162, and the specific details thereof are described above.

Since the stretchable device 200 according to the example embodiment shown in fig. 18 includes the common electrode 152A, the encapsulant 170, and the pixel defining layer 160 each isolated in each pixel PX on the first region 110A of the substrate 110, when the substrate 110 is stretched by an external force or an external movement, it is possible to prevent the common electrode 152A, the encapsulant 170, and the pixel defining layer 160 from being damaged or broken, and thus it is possible to freely select materials for improving the performance of the common electrode 152A, the encapsulant 170, and the pixel defining layer 160, compared to the case of including the common electrode 152A, the encapsulant 170, and/or the pixel defining layer 160 each continuously formed. Accordingly, the stretchable device 200 can be effectively implemented without deteriorating the performance of the common electrode 152A, the encapsulant 170, and the pixel defining layer 160.

In the following, another example of a stretchable device according to some example embodiments is described.

Figure 19 is a cross-sectional view taken along line II-II of another example of the stretchable device of figure 1 according to some example embodiments.

Referring to fig. 19, as with the example embodiment shown in fig. 2, the stretchable device 200 according to the example embodiment shown in fig. 19 includes: a substrate 110 having a first region 110A and a second region 110B; a transistor 120; a connection electrode 130; an insulating layer 140; a plurality of unit devices 150A each including a pixel electrode 151A, an active layer 153A, and a common electrode 152A; a pixel defining layer 160; and an encapsulant 170.

However, unlike the example embodiment shown in fig. 2, the stretchable device 200 according to the example embodiment shown in fig. 19 may include the encapsulant 170 continuously disposed on the entire surface of the substrate 110. The encapsulant 170 may include a cured product of a photosensitive elastomer. Here, the encapsulant 170 may include an elastomer that may be stretched together when the substrate 110 is stretched by an external force or an external motion. Accordingly, when the substrate 110 is stretched by an external force or an external movement, the encapsulant 170 may also be neither ruptured nor damaged, but flexibly stretchable, thus effectively blocking or preventing inflow of oxygen, moisture, and/or contaminants from the outside and thus effectively protecting the plurality of unit devices 150A. In addition, since patterning including photolithography and development of the thin film 170-1 for the encapsulant may be omitted in some example embodiments, the process may be simplified, and the unit device 150A thereunder may be prevented from being damaged during the patterning.

In some example embodiments, the encapsulant 170 may be formed of an elastomer that is crosslinkable by heat or light, a mixture of an elastomer and a photoreactive material that is sensitive to heat or light, or a combination thereof. In some example embodiments, the encapsulant 170 may be formed of a photosensitive elastomer, a mixture of an elastomer and a photosensitive material, or a combination thereof. In some example embodiments, the encapsulant 170 may be formed of a photosensitive elastomer capable of low temperature processing (e.g., a cured product of the photosensitive elastomer), and in some example embodiments, may be formed of a photosensitive elastomer curable at a temperature lower than a glass transition temperature (Tg) of the substrate 110, for example, a photosensitive elastomer curable at: less than or equal to about 150 ℃, less than or equal to about 120 ℃, less than or equal to about 100 ℃, about 28 ℃ to about 150 ℃, about 28 ℃ to about 120 ℃, about 28 ℃ to about 100 ℃, about 40 ℃ to about 150 ℃, about 40 ℃ to about 120 ℃, about 40 ℃ to about 100 ℃, about 50 ℃ to about 150 ℃, about 50 ℃ to about 120 ℃, or about 50 ℃ to about 100 ℃. In this way, the encapsulant 170 is formed of a photosensitive elastomer capable of low-temperature processing, thereby preventing the substrate 110 made of the elastomer from being thermally damaged, such as thermal expansion or thermal contraction, during curing.

In some example embodiments, the photosensitive elastomer may be selected from elastomers having a photosensitive functional group, and may have an elastomer as a main chain and at least one photosensitive functional group in a side chain. The photosensitive elastomer may include, for example, a substituted or unsubstituted polysiloxane (such as polydimethylsiloxane), an elastomer containing a substituted or unsubstituted butadiene moiety (such as styrene-ethylene-butylene-styrene), an elastomer containing a urethane moiety, an elastomer containing an acrylic moiety, an elastomer containing an olefinic moiety, or a combination thereof as a backbone of the elastomer, and includes a photosensitive functional group bonded to the backbone, such as a substituted or unsubstituted vinyl group, or a substituted or unsubstituted (meth) acrylic group. In some exemplary embodiments, the photosensitive elastomer may be polyisoprene having an acrylic group having the following structural unit shown in chemical formula 1, but is not limited thereto.

[ chemical formula 1]

In some example embodiments, the mixture of the elastomer and the photoreactive material sensitive to heat or light may include an elastomer selected from substituted or unsubstituted polysiloxanes (such as polydimethylsiloxane), elastomers containing substituted or unsubstituted butadiene moieties (such as styrene-ethylene-butylene-styrene), elastomers containing urethane moieties, elastomers containing olefinic moieties, or combinations thereof with azides, but is not limited thereto.

In the following, another example of a stretchable device according to some example embodiments is described.

Figure 20 is a cross-sectional view taken along line II-II of another example of the stretchable device of figure 1 according to some example embodiments.

Referring to fig. 20, as with the example embodiment shown in fig. 2, the stretchable device 200 according to the example embodiment shown in fig. 20 includes: a substrate 110 having a first region 110A and a second region 110B; a transistor 120; a connection electrode 130; an insulating layer 140; a plurality of unit devices 150A each including a pixel electrode 151A, an active layer 153A, and a common electrode 152A; a pixel defining layer 160; and an encapsulant 170.

However, with respect to the stretchable device 200 according to the example embodiment shown in fig. 20, unlike the example embodiment shown in fig. 2, the connection electrode 130 may be disposed on the insulating layer 140, and in some example embodiments, may be disposed on the same layer as the pixel electrode 151A. The connection electrode 130 may be electrically connected to the common electrode 152A through a via hole 162 in the pixel defining layer 160.

In the following, another example of a stretchable device according to some example embodiments is described.

Figure 21 is a cross-sectional view taken along line II-II of another example of the stretchable device of figure 1 according to some example embodiments.

Referring to fig. 21, as with the example embodiment shown in fig. 2, the stretchable device 200 according to the example embodiment shown in fig. 21 includes: a substrate 110 having a first region 110A and a second region 110B; a transistor 120; a connection electrode 130; an insulating layer 140; a plurality of unit devices 150A each including a pixel electrode 151A, an active layer 153A, and a common electrode 152A; a pixel defining layer 160; and an encapsulant 170.

However, in the stretchable device 200 according to the example embodiment shown in fig. 21, unlike the example embodiment shown in fig. 2, the pixel defining layers 160 are respectively isolated on the first regions 110A of the substrate 110 and are separated in each pixel PX with the second region 110B of the substrate 110 therebetween. Each individual pixel defining layer 160 has an opening 161 and a via hole 162, and the specific details thereof are described above.

The aforementioned stretchable device 200 may be applied to various devices requiring stretchability, and in some example embodiments, may be applied to wearable devices, skin-like devices, large area conformal displays, smart garments, and the like, but is not limited thereto.

In some example embodiments, the aforementioned stretchable device 200 may be included in a skin-type display panel.

Fig. 22 is a schematic view illustrating an example of a skin-type display panel according to some example embodiments.

The skin type display panel 300A may be an ultra-thin display panel, and may be attached to a part of a living body such as a hand. The skin type display panel 300A may display specific (or alternatively, predetermined) information such as various characters and/or images. In some example embodiments, the skin type display panel 300A may include an inorganic light emitting diode, a micro light emitting diode, an organic light emitting diode, a quantum dot light emitting diode, or a perovskite light emitting diode, but is not limited thereto.

In some example embodiments, the stretchable device 200 may be included in a sensor. As shown in fig. 23-24, the sensor may be a biosensor, but example embodiments are not limited thereto.

Fig. 23 and 24 are schematic views illustrating examples of biosensors according to some example embodiments.

The biosensor 300B may be an attachable biosensor, and may be attached to a surface of a living body (such as skin), a living body (such as an organ), or an indirect mechanism for contacting the living body (such as clothing) to detect and measure biological information such as a biological signal. In some example embodiments, the biosensor 300B includes an Electroencephalogram (EGG) sensor, an Electrocardiogram (ECG) sensor, a Blood Pressure (BP) sensor, an Electromyogram (EMG) sensor, a Blood Glucose (BG) sensor, a photoplethysmography (PPG) sensor, an accelerometer, a Radio Frequency Identification (RFID) antenna, an inertial sensor, an activity sensor, a strain sensor, a motion sensor, or a combination thereof, but is not limited thereto. The biosensor 300B may be attached to a living body in a very thin patch type or a band type, so that biological information may be monitored in real time.

Fig. 25 is a schematic view illustrating an example of an operation of a biosensor according to some example embodiments.

Referring to fig. 25, the biosensor 300B includes a light emitting diode 310 and a photoelectric conversion device 320. In some example embodiments, the light emitting diode 310 may include an inorganic light emitting diode, an organic light emitting diode, or a micro light emitting diode. In some example embodiments, the photoelectric conversion device 320 may include a photodiode or a photoelectric conversion layer.

The light emitting diode 310 may be configured to emit a first light Ll (e.g., light having a first wavelength spectrum) for sensing a biological signal. The light emitting diode 310 may be, for example, an infrared light emitting diode configured to emit the first light (L1) in an infrared wavelength region (e.g., wavelength spectrum), or a visible light emitting diode configured to emit the first light (L1) in a visible wavelength region. The first light (L1) emitted from the light emitting diode 310 may be reflected by an object (subject)400 (e.g., a body such as skin or blood vessels) or absorbed into the object 400. In some example embodiments, the aforementioned stretchable device 200 may be included in the light emitting diode 310.

The photoelectric conversion apparatus 320 may be configured to sense the second light (L2) reflected by the object 400 from the first light (L1) emitted from the light emitting diode 310 and thus convert the second light (L2) into an electrical signal. Restated, the photoelectric conversion device 320 may be configured to sense the second light (L2) based on reflection of the first light (L1) by an object (object), such as the object 400. The electrical signal converted from the reflected second light (L2) may include biometric information. The electrical signal including the biometric information may be transmitted to a sensor Integrated Circuit (IC) (not shown) or a processor (not shown). In some example embodiments, the aforementioned stretchable device 200 may be included in the photoelectric conversion device 320.

In some example embodiments, the aforementioned stretchable device 200 may be included in the light emitting diode 310 and the photoelectric conversion device 320, respectively. Thus, it will be understood that at least one of the light emitting diode 310 and the photo-conversion device 320 may comprise the stretchable device 200.

As an example, the biosensor 300B may be a photoplethysmography (PPG) sensor, the biological information may include heart rate, oxygen saturation, stress, arrhythmia, blood pressure, etc., and may be obtained by analyzing a waveform of the electrical signal.

In some example embodiments, the biosensor 300B may be an Electromyography (EMG) sensor or a strain sensor attached to a joint for rehabilitation therapy of patients with joint and muscle problems. An Electromyography (EMG) sensor or strain sensor may be attached to a desired location to quantitatively measure muscle movement or joint movement to obtain data required for rehabilitation.

The aforementioned skin-type display panel or biosensor may be included in various electronic devices, and the electronic devices may further include a processor (not shown) and a memory (not shown).

Fig. 26 is a schematic diagram of an electronic device according to some example embodiments. The electronic device 2600 shown in fig. 26 may be an electronic device according to any example embodiment.

Referring to fig. 26, the electronic device 2600 includes a processor 2620, a memory 2630, a sensor 2640, and a display device 2650 electrically connected via a bus 2610. The sensor 2640 may be any sensor according to any example embodiment. The display device 2650 may be any display panel according to any example embodiment. In the example embodiment shown in fig. 26, the electronic device 2600 may include both the sensor 2640 and the display device 2650, but the example embodiments are not limited thereto: in some example embodiments, the electronic device 2600 may include one of a sensor 2640 and a display device 2650.

In some example embodiments, some or all of the components of the electronic device 2600 may include or be included in a stretchable device according to any example embodiment. For example, in some example embodiments, the electronic device 2600 may include a stretchable device 200 including at least one of a sensor 2640 and a display device 2650, and the memory 2630, processor 2620, and bus 2610 may be on the substrate 110 of the stretchable device 200 and coupled to the array of unit devices 150 of the stretchable device 200, e.g., based on the connection electrode(s) 130 being coupled to the bus 2610, coupled to the processor 2620 independently of the bus 2610, etc. In some example embodiments, the stretchable device 200 may be limited to the sensors 2640 and/or the display devices 2650 included in the electronic device 2600, wherein the bus 2610, the memory 2630, and the processor 2620 are external to and coupled with the stretchable device 200 (e.g., via the bus 2610) to establish the electronic device 2600.

The processor 2620 may execute stored programs and, thus, perform at least one function, including controlling the sensor 2640 and/or displaying images on the display device 2650. Processor 2620 may generate an output.

While the inventive concept has been described in connection with what is presently considered to be practical example embodiments, it is to be understood that the inventive concept is not limited to the example embodiments described above. On the contrary, the inventive concept is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

This application claims priority and benefit to korean patent application No. 10-2020-0032719, filed on the korean intellectual property office on 17.3.2020, which is hereby incorporated by reference in its entirety.