1. A silicon carbide flaw detection device is characterized in that: the device comprises a support frame, wherein an objective table and an imaging device are arranged on the support frame, the imaging device is positioned above the objective table, a through hole is formed in the objective table, a first light source irradiating the objective table is arranged at a position, between the imaging device and the objective table, of the support frame, and a transmission light source irradiating the objective table is arranged at a position, below the objective table, of the support frame;

the position that the support frame is located the below of transmission light source still is provided with the polarized light source of shining to the objective table, the position that the support frame is located the imaging device below is provided with the error checking device, the error checking device is rotatable and breaks away from imaging device under.

2. The silicon carbide defect inspection apparatus of claim 1, wherein: first light source is including setting up the first linking arm on the support frame, set up first luminous lamp on the first linking arm, and the one end of keeping away from the support frame at first linking arm is fixed with first installation frame, first installation frame link up from top to bottom, and is equipped with the trompil towards one side of first luminous lamp, the first semi-reflecting mirror that is provided with of slope in the first installation frame, the mirror surface and the objective table surface of first semi-reflecting mirror are 45 degrees angles, and the cross-section of first semi-reflecting mirror upper end and trompil is 45 degrees angles.

3. The silicon carbide defect inspection apparatus of claim 1, wherein: the transmission light source is including setting up the second linking arm to the support frame lower extreme, be fixed with the second luminescent light on the second linking arm, and the one end that the support frame was kept away from to the second linking arm is provided with the second installation frame, link up from top to bottom to the second installation frame, and be equipped with the hole towards one side of second luminescent light, the second semi-reflecting mirror that is equipped with of second installation frame internal slope, the mirror surface lower extreme of second semi-reflecting mirror is 45 degrees angles with the objective table surface, and the second semi-reflecting mirror upper end is 45 degrees angles with the cross-section in hole.

4. The silicon carbide defect inspection apparatus of claim 1, wherein: polarized light source is including setting up the third linking arm to on the support frame, the one end that the support frame was kept away from to the third linking arm is fixed with the third luminescent light, third linking arm end fixing has first polaroid, directly over first polaroid is located the third luminescent light, but the first polaroid of movable messenger of third portion linking arm removes other positions.

5. The silicon carbide defect inspection apparatus of claim 1, wherein: the device comprises a support frame, wherein a first connecting arm is arranged on the support frame, a second polaroid is arranged on the first connecting arm, and the first connecting arm can move to enable the second polaroid to move to the position under the imaging device.

6. The silicon carbide defect inspection apparatus of claim 1, wherein: the edge of the through hole of the objective table is provided with a plurality of supporting fulcrums.

Background

The silicon carbide substrate sheet is a translucent wafer, and various defects are generated in the crystal material of the silicon carbide substrate sheet during the growth process, wherein the defects include defects in the substrate sheet such as micropipes, wrapping, or defects on the surface of the substrate sheet such as scratches, edge chipping, and the like. Therefore, different methods are adopted in the industry to check and detect the defects, and the current detection mode is generally that whether the defects exist in the silicon carbide substrate sheet is directly observed through manual observation by naked eyes, so that the detection is relatively laborious and is not accurate enough.

Disclosure of Invention

Therefore, the embodiment of the invention provides silicon carbide flaw detection equipment, which aims to solve the problems that in the prior art, the detection is relatively laborious and not accurate because the defects of the silicon carbide substrate sheet are directly observed by naked eyes.

In order to achieve the above object, the embodiments of the present invention provide the following technical solutions:

according to the first aspect of the embodiment of the invention, the silicon carbide flaw detection equipment comprises a support frame, wherein an objective table and an imaging device are arranged on the support frame, the imaging device is positioned above the objective table, a through hole is formed in the objective table, a first light source irradiating the objective table is arranged at a position of the support frame between the imaging device and the objective table, and a transmission light source irradiating the objective table is arranged at a position of the support frame below the objective table;

the position that the support frame is located the below of transmission light source still is provided with the polarized light source of shining to the objective table, the position that the support frame is located the imaging device below is provided with the error checking device, the error checking device is rotatable and breaks away from imaging device under.

Further, first light source is including setting up the first connecting arm on the support frame, set up first luminous lamp on the first connecting arm, and the one end of keeping away from the support frame at first connecting arm is fixed with first installation frame, link up from top to bottom first installation frame, and be equipped with the trompil towards one side of first luminous lamp, the first installation frame inslot slope be provided with first semi-reflecting mirror, the mirror surface and the objective table surface of first semi-reflecting mirror are 45 degrees angles, and the cross-section of first semi-reflecting mirror upper end and trompil is 45 degrees angles.

Further, the transmission light source is including setting up the second linking arm to the support frame lower extreme, be fixed with the second luminescent light on the second linking arm, and the one end that the support frame was kept away from to the second linking arm is provided with the second installation frame, link up from top to bottom to the second installation frame, and be equipped with the hole towards one side of second luminescent light, the second installation frame inslot slope be equipped with the second semi-reflecting mirror, the mirror surface lower extreme and the objective table surface of second semi-reflecting mirror are 45 degrees angles, and the second semi-reflecting mirror upper end is 45 degrees angles with the cross-section in hole.

Further, polarized light source is including setting up the third linking arm on the support frame, the one end that the support frame was kept away from to the third linking arm is fixed with the third luminescent light, third linking arm end fixing has first polaroid, first polaroid is located directly over the third luminescent light, the portable first polaroid of messenger of third portion linking arm removes other positions.

Furthermore, the deviation checking device comprises a fourth connecting arm arranged on the supporting frame, a second polaroid is arranged on the fourth connecting arm, and the fourth connecting arm can move to enable the second polaroid to move under the imaging device.

Furthermore, a plurality of supporting fulcrums are arranged on the edge of the through hole of the object stage.

The embodiment of the invention has the following advantages: through the arrangement of the imaging device, the first light source, the transmission light source and the polarized light source which are arranged on the support frame and the arrangement of the polarization tester, when the silicon carbide substrate slice is detected, the silicon carbide substrate slice can be placed on the objective table, then the first light source and the transmission light source are respectively used for irradiating the silicon carbide substrate slice on the objective table, and the imaging device is respectively used for shooting pictures to determine whether the upper surface and the lower surface of the negative slice have flaws such as scratches, namely the first light source sees the upper surface flaws, the transmission light source and the imaging device are externally added with the first light source for seeing the lower surface flaws, then the polarization light source is used for irradiating the negative slice, so that the polarization tester is positioned below the imaging device and is used for shooting, thereby detecting whether the inner part of the negative slice has flaws, wherein the polarization tester can be always positioned below the imaging device and also can be moved away, and the detection of the silicon carbide substrate slice to the upper, therefore, whether the silicon carbide substrate has flaws or not can be relatively and directly seen through observing the picture, the detection is more convenient, and meanwhile, the detection result is more accurate.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.

Fig. 1 is a schematic structural diagram of a silicon carbide defect detecting apparatus according to embodiment 1 of the present invention.

Fig. 2 is a front sectional view of a first mounting frame of a silicon carbide defect detecting apparatus according to embodiment 1 of the present invention.

Fig. 3 is a front sectional view of a second mounting frame of the silicon carbide flaw detection apparatus according to embodiment 1 of the present invention.

Fig. 4 is a schematic top view of a stage of a silicon carbide flaw detection apparatus according to embodiment 1 of the present invention.

Fig. 5 is a schematic structural diagram of a silicon carbide defect detecting apparatus according to embodiment 2 of the present invention.

In the figure: 1. a support frame; 2. an object stage; 21. a supporting fulcrum; 3. a camera; 4. a first light source; 41. a first connecting arm; 42. a first LED lamp; 43. a first mounting frame; 44. a first half mirror; 5. a transmissive light source; 51. a second connecting arm; 52. a second LED lamp; 53. a second mounting frame; 54. a second half mirror; 6. a polarized light source; 61. a third connecting arm; 62. a third LED lamp; 63. a first polarizing plate; 71. a fourth connecting arm; 72. a second polarizing plate; 8. a second camera; 9. a third polarizing plate.

Detailed Description

The present invention is described in terms of particular embodiments, other advantages and features of the invention will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the invention and that it is not intended to limit the invention to the particular embodiments disclosed. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example 1

A silicon carbide flaw detection device is shown in figures 1-3 and comprises a support frame 1, wherein a support rod is fixedly connected to the upper end of the support frame 1, an imaging device is fixedly connected to the support rod, the imaging device can be a camera or a combination of the camera and a plurality of lenses, and the imaging device used by the invention is a camera 3. In addition, a bearing rod is fixedly connected to the middle of the support frame 1, an objective table 2 is fixedly connected to the bearing rod, the objective table 2 is made of transparent materials, the camera 3 is located right above the objective table 2, a through hole is formed in the objective table 2, and the condition that the objective table 2 is out of the camera 3 can be shot. A first light source 4 for illuminating the stage 2 is provided at a position of the support frame 1 between the camera 3 and the stage 2, and a transmission light source 5 for illuminating the stage 2 is provided at a position of the support frame 1 below the stage 2.

In addition, a polarized light source 6 which shines on the objective table 2 is arranged at the position of the support frame 1 below the transmission light source 5, and a polarization analyzer is arranged at the position of the support frame 1 below the camera 3 and can rotate and be separated from the position right below the camera 3.

When the silicon carbide substrate is detected, a negative film to be detected can be placed on the objective table 2, then the first light source 4 is started to irradiate the negative film on the objective table 2, the negative film on the objective table 2 is shot by the camera 3, and therefore defects such as scratches are formed on the upper surface of the negative film when the shot picture is observed; then, the first light source 4 is turned off and the transmission light source 5 is turned on, when the camera 3 is used for shooting the silicon carbide substrate slice, because the silicon carbide substrate slice is a semitransparent crystal, the light of the transmission light source 5 can be transmitted through the negative film, so that after the picture shot by the camera 3, whether the lower surface of the silicon carbide substrate slice has defects such as scratches or not can be directly seen from the picture; and finally, turning off the transmission light source 5, turning on the polarized light source 6, rotating the polarization analyzer to the lower end of the camera 3, taking a picture by using the camera 3, determining whether the inside of the negative film has defects or not through the picture, if the inside of the silicon carbide substrate does not have defects, taking the picture as a picture with a completely black view, and if the inside of the silicon carbide substrate has defects such as micropipes and the like, some bright spots appear on the taken picture. The silicon carbide substrate slice is clearly and conveniently detected by utilizing the method.

The first light source 4 comprises a first connecting arm 41 fixedly connected to the support frame 1, a first light emitting lamp is fixedly connected to the first connecting arm 41, the first light emitting lamp used in the present invention is a first LED lamp 42, a first mounting frame 43 is fixedly connected to one end of the first connecting arm 41 far away from the support frame 1, the first mounting frame 43 is located under the camera 3, in addition, the first mounting frame 43 is vertically through, and an opening is arranged on one side facing the first LED lamp 42, a first half mirror 44 is fixedly connected to the first mounting frame 43 in an inclined manner, the lower end of the mirror surface of the first half mirror 44 forms an angle of 45 degrees with the surface of the object stage 2, and the upper end of the first half mirror 44 forms an angle of 45 degrees with the cross section of the opening.

When the first LED lamp 42 is turned on, light emitted from the first LED lamp 42 may be reflected by the first half mirror 44 to be irradiated onto the stage 2, and at the same time, since the first mounting frame 43 is vertically penetrated, the camera 3 may photograph a film on the stage 2 through the first half mirror 44.

The transmission light source 5 comprises a second connecting arm 51 fixedly connected to the lower end of the support frame 1, a second light emitting lamp is fixedly connected to the second connecting arm 51, the second light emitting lamp used in the invention is a second LED lamp 52, a second mounting frame 53 is arranged at one end, far away from the support frame 1, of the second connecting arm 51, the second mounting frame 53 is located right below the objective table 2, the second mounting frame 53 is vertically communicated, a hole is formed in one side, facing the second LED lamp 52, of the second mounting frame 53, a second half mirror 54 is fixedly connected to the second half mirror and is inclined in the second mounting frame 53, the lower end of the mirror surface of the second half mirror 54 forms a 45-degree angle with the surface of the objective table 2, and the upper end of the second half mirror 54 forms a 45-degree angle with the cross section of the hole. When the second LED lamp 52 is turned on, light emitted from the second LED lamp 52 is reflected by the second half mirror 54 and irradiated onto the stage 2.

The polarized light source 6 comprises a third connecting arm 61 rotationally connected to the support frame 1, a third light-emitting lamp is fixedly connected to one end, far away from the support frame 1, of the third connecting arm 61, the first light-emitting lamp used in the invention is a first LED lamp 62, the third LED is positioned right below the second mounting frame 53, a first polaroid 63 is also fixedly connected to the end portion of the third connecting arm 61, the first polaroid 63 is fixed to the third connecting arm 61 through a positioning rod, the first polaroid 63 is positioned right above the third LED lamp 62, when the third LED lamp 62 is turned on, emitted light passes through the polaroids and irradiates the objective table 2 through a second half reflector on the second mounting frame 53, and the emitted light is polarized light.

In addition, the polarization tester comprises a fourth connecting arm 71 which is rotatably connected to the support frame 1, a second polarizer 72 is fixedly connected to one end, away from the support frame 1, of the fourth connecting arm 71, and after the fourth connecting arm 71 rotates, the second polarizer 72 can move to a position right below the camera 3, so that when the polarization tester is used for testing, the second polarizer 72 can move to a position right below the camera 3, and the polarized light source 6 is turned on to test the interior of the negative film.

Combine shown in fig. 4, it has supporting pivot 21 to set up a plurality ofly on objective table 2's through-hole edge, wherein supporting pivot 21 is for setting up a plurality of bumps on the edge that passes through, when placing the carborundum substrate piece, can make the carborundum film pressfitting to every bump on, avoid long-term use bring to objective table 2's wearing and tearing produce the mar on the objective table 2, cause the erroneous judgement that the flaw was gathered, the in-process that detects can rotate the position of film relatively and shoot a plurality of photos, with the image blind spot of gathering in front mends the collection, the picture of a complete no blind spot of final synthesis, thereby avoid appearing the blind spot position and not having the condition that detects.

In addition, the supporting pivot 21 can be a plurality of strip-shaped rods arranged on the edge of the through hole, the supporting pivot only needs to support the silicon carbide substrate, and the negative film only needs to relatively move and take a plurality of pictures through the rotation of the strip-shaped rods during detection so as to perform supplementary acquisition on the previously acquired image blind spots, thereby avoiding the situation that the blind spot positions are not detected. Alternatively, fine fiber support may be used to reduce the blind spot area.

Example 2

A silicon carbide flaw detection device is different from the device in embodiment 1 in that, as shown in FIG. 5, the device is not provided with a separate independent polarized light source, and a second camera 8 is arranged at a position of a support frame 1 below an object stage 2, the second camera 8 is fixedly connected to the support frame 1 through a connecting rod, an irradiation end of the second camera 8 is opposite to the central position of the object stage 2, and the second camera 8 is positioned below a transmission light source 5; in addition, a third polarizer 9 is arranged between the transmission light source 5 and the object stage 2, the third polarizer 9 is connected to the support frame 1 through a fixed rod, and the fixed rod can move around the support frame 1 to move the support frame to other positions. In this way, when the lower surface of the silicon carbide substrate is inspected, reflected light irradiated to the back surface of the substrate by the transmission light source 5 and light irradiated by the second camera 8 are used for shooting, the upper surface of the negative is also detected by the first light source 4 and the first camera 3, when the inside of the negative is inspected, light emitted by the transmission light source 5 is irradiated onto the stage through the third polarizing plate 9, and then the inside flaw is detected by shooting by the camera 3.

Alternatively, the third polarizer 9 may be placed between the second camera 8 and the transmission light source 5, and the second polarizer 72 may be placed between the first light source 4 and the stage 2, so that the second camera 8 may be used in conjunction with the first light source 4 to detect the film internal flaws.

According to the invention, through the arrangement of the imaging device 3, the first light source 4, the transmission light source 5, the polarized light source 6 and the polarization tester which are arranged on the support frame 1, when a silicon carbide substrate is detected, the silicon carbide substrate can be placed on the objective table 2, then the first light source 4 and the transmission light source 5 are respectively used for irradiating the silicon carbide substrate on the objective table 2, the imaging device 3 is respectively used for shooting pictures to determine whether the upper surface and the lower surface of the negative have flaws such as scratches, then the polarized light source 6 is used for irradiating the negative, the polarization tester is moved to the lower part of the imaging device 3 for shooting, so that whether the inside of the negative is flawed is detected, whether the silicon carbide substrate has flaws can be relatively directly seen through observing the pictures, the detection is more convenient, and meanwhile, the detection result is more accurate.

Although the invention has been described in detail above with reference to a general description and specific examples, it will be apparent to one skilled in the art that modifications or improvements may be made thereto based on the invention. Accordingly, such modifications and improvements are intended to be within the scope of the invention as claimed.