1. A substrate taking and placing device is characterized by comprising at least one mechanical arm, wherein a plurality of substrate forks are arranged on the mechanical arm, and each substrate fork is provided with a plurality of vacuum chucks and a CDA pipeline connected with the vacuum chucks;

the mechanical arm is further provided with a plurality of pressure electronic gauge heads and a plurality of electromagnetic valves, any pressure electronic gauge head correspondingly measures the vacuum degrees of the plurality of vacuum suckers on any substrate fork, and any electromagnetic valve correspondingly controls the on-off of the CDA pipeline on any substrate fork.

2. The substrate handler of claim 1, wherein the CDA pipeline comprises a main pipeline and a plurality of branch pipelines, and one end of each branch pipeline is communicated with the main pipeline and the other end is communicated with each vacuum chuck.

3. The apparatus of claim 2, wherein the vacuum chuck comprises a chuck nozzle, a bellows sealingly connected to the chuck nozzle, and a connecting rod sealingly connected to the bellows, and the branch pipe is in communication with the vacuum chuck through the connecting rod.

4. The apparatus according to claim 2, wherein one of the sub-pipelines is provided with one of the pressure electronic gauge head and the solenoid valve.

5. A substrate pick-and-place method is characterized by comprising the following steps:

s1, providing at least one mechanical arm, wherein a plurality of substrate forks are arranged on the mechanical arm, each substrate fork is provided with a plurality of vacuum chucks and a CDA pipeline connected with the vacuum chucks, the mechanical arm is also provided with a plurality of pressure electronic gauge heads and a plurality of electromagnetic valves, any pressure electronic gauge head correspondingly measures the vacuum degrees of the vacuum chucks on any substrate fork, and any electromagnetic valve correspondingly controls the on-off of the CDA pipeline on any substrate fork;

s2, opening the electromagnetic valves and sucking the substrate by the vacuum chucks;

s3, respectively measuring the vacuum degrees of the vacuum chucks on any one substrate fork through the pressure electronic gauge heads;

s4, judging whether the number of the vacuum suckers with the vacuum degree reaching the preset range meets the requirement or not;

s401, if the requirement is not met, sucking the liquid again by using the plurality of vacuum chucks, and repeating the steps S3 and S4;

s402, if the requirements are met, controlling the mechanical arm to overturn the substrate.

6. The method as claimed in claim 5, wherein the step S401 further comprises: when the re-suction frequency reaches a certain frequency and still does not meet the requirement, the re-suction is stopped, the manual picking and placing mode is switched, and an alarm signal is sent.

7. The substrate pick and place method of claim 6, wherein the requirements comprise a first condition and a second condition, the first condition being: the number of the vacuum chucks on any one substrate fork, the vacuum degree of which reaches the preset range, is greater than or equal to a first threshold value, and the first threshold value is less than or equal to the total number of the vacuum chucks on any one substrate fork;

the second condition is: the number of the vacuum chucks on all the substrate forks, the vacuum degrees of which reach the preset range, is greater than or equal to a second threshold value, and the second threshold value is less than or equal to the total number of the vacuum chucks on all the substrate forks.

8. The method of claim 7, wherein the first threshold is greater than or equal to a total number of vacuum cups 9/11 on any of the substrate forks, and the second threshold is greater than or equal to a total number of vacuum cups 71/77 on all of the substrate forks.

9. The method of claim 5, wherein the step S402 further comprises: and closing the electromagnetic valve corresponding to the vacuum sucker of which the vacuum degree does not reach the preset range.

10. The method of claim 5, wherein the predetermined range is 0.08 MPa to 0.09 MPa.

Background

In the production process of the display panel, a magnetron sputtering device is generally required to perform a film coating process. In the coating process, a robot arm is usually used to adsorb the glass substrate and then turn the glass substrate from a horizontal state to a vertical state or from the vertical state to the horizontal state. In the adsorption process, because the area of the glass substrate is too large (2940 mm. 3370 mm), vacuum suction abnormity can be generated inevitably (the contact state of the suction disc and the glass substrate is not good in a vacuum state, so that the vacuum degree is insufficient, and the vacuum degree does not reach the alarm).

The existing mechanical arm is provided with 7 substrate forks, each substrate fork is provided with 11 suckers, a single substrate fork is provided with 1 pressure electronic gauge head, when vacuum suction abnormity occurs, technicians arrive at the site for operation, and the conventional operation method is to manually try to perform adsorption again and recover the machine. The prior art can not accurately find the sucker causing the vacuum suction abnormity, and the technical personnel can reach the site and can normally adsorb after manual re-adsorption at the current situation. Therefore, the abnormal vacuum suction causes the machine downtime, wastes a lot of production time, and causes low production efficiency. Therefore, it is necessary to improve this defect.

Disclosure of Invention

The embodiment of the invention provides a substrate taking and placing device, which is used for solving the technical problems of machine downtime and low production efficiency caused by vacuum absorption abnormity of the substrate taking and placing device in the prior art.

The embodiment of the invention provides a substrate taking and placing device, which comprises at least one mechanical arm, wherein a plurality of substrate forks are arranged on the mechanical arm, and each substrate fork is provided with a plurality of vacuum chucks and a CDA pipeline connected with the vacuum chucks; the mechanical arm is further provided with a plurality of pressure electronic gauge heads and a plurality of electromagnetic valves, any pressure electronic gauge head correspondingly measures the vacuum degrees of the plurality of vacuum suckers on any substrate fork, and any electromagnetic valve correspondingly controls the on-off of the CDA pipeline on any substrate fork.

In the substrate pick-and-place apparatus provided in the embodiment of the present invention, the CDA pipeline includes a main pipeline and a plurality of branch pipelines, one end of any branch pipeline is communicated with the main pipeline, and the other end is communicated with any vacuum chuck.

In the substrate pick-and-place apparatus provided in the embodiment of the present invention, the vacuum chuck includes a chuck nozzle, a bellows hermetically connected to the chuck nozzle, and a connecting rod hermetically connected to the bellows, and the branch pipe is communicated with the vacuum chuck through the connecting rod.

In the substrate pick-and-place apparatus provided in the embodiment of the present invention, one of the branch pipes is provided with one pressure electronic gauge head and one electromagnetic valve.

The embodiment of the invention also provides a substrate taking and placing method, which comprises the following steps:

s1, providing at least one mechanical arm, wherein a plurality of substrate forks are arranged on the mechanical arm, each substrate fork is provided with a plurality of vacuum chucks and a CDA pipeline connected with the vacuum chucks, the mechanical arm is also provided with a plurality of pressure electronic gauge heads and a plurality of electromagnetic valves, any pressure electronic gauge head correspondingly measures the vacuum degrees of the vacuum chucks on any substrate fork, and any electromagnetic valve correspondingly controls the on-off of the CDA pipeline on any substrate fork;

s2, opening the electromagnetic valves and sucking the substrate by the vacuum chucks;

s3, respectively measuring the vacuum degrees of the vacuum chucks on any one substrate fork through the pressure electronic gauge heads;

s4, judging whether the number of the vacuum suckers with the vacuum degree reaching the preset range meets the requirement or not;

s401, if the requirement is not met, sucking the liquid again by using the plurality of vacuum chucks, and repeating the steps S3 and S4;

s402, if the requirements are met, controlling the mechanical arm to overturn the substrate.

In the method for taking and placing a substrate provided in the embodiment of the present invention, the step S401 further includes: when the re-suction frequency reaches a certain frequency and still does not meet the requirement, the re-suction is stopped, the manual picking and placing mode is switched, and an alarm signal is sent.

In the substrate pick-and-place method provided by the embodiment of the present invention, the requirement includes a first condition and a second condition, and the first condition is: the number of the vacuum chucks on any one substrate fork, the vacuum degree of which reaches the preset range, is greater than or equal to a first threshold value, and the first threshold value is less than or equal to the total number of the vacuum chucks on any one substrate fork; the second condition is: the number of the vacuum chucks on all the substrate forks, the vacuum degrees of which reach the preset range, is greater than or equal to a second threshold value, and the second threshold value is less than or equal to the total number of the vacuum chucks on all the substrate forks.

In the substrate pick-and-place method according to an embodiment of the present invention, the first threshold is greater than or equal to a total number 9/11 of the vacuum chucks on any one of the substrate forks, and the second threshold is greater than or equal to a total number 71/77 of the vacuum chucks on all the substrate forks.

In the substrate pick-and-place method provided in the embodiment of the present invention, the step S402 further includes: and closing the electromagnetic valve corresponding to the vacuum sucker of which the vacuum degree does not reach the preset range.

In the method for taking and placing a substrate provided by the embodiment of the invention, the predetermined range is 0.08 mpa to 0.09 mpa.

Has the advantages that: the substrate taking and placing device provided by the embodiment of the invention comprises at least one mechanical arm, wherein a plurality of substrate forks are arranged on the mechanical arm, and each substrate fork is provided with a plurality of vacuum chucks and a CDA pipeline connected with the vacuum chucks; the mechanical arm is also provided with a plurality of pressure electronic gauge heads and a plurality of electromagnetic valves, wherein any pressure electronic gauge head correspondingly measures the vacuum degrees of a plurality of vacuum chucks on any substrate fork, and any electromagnetic valve correspondingly controls the on-off of a CDA pipeline on any substrate fork. According to the invention, the electromagnetic valves are arranged, and any one of the electromagnetic valves correspondingly controls the on-off of the CDA pipeline on any one of the substrate forks, when the number of the vacuum suckers with the vacuum degree reaching the preset range meets the requirement, the CDA pipeline corresponding to the vacuum sucker with the vacuum degree not reaching the preset range can be disconnected through the electromagnetic valve, the machine is prevented from alarming to be down, when the number of the vacuum suckers with the vacuum degree reaching the preset range does not meet the requirement, the sucker is sucked again, and when the sucker is sucked again for a certain number of times and still does not meet the requirement, the manual picking and placing mode is switched and an alarm signal is sent, namely, the intelligent processing of the substrate picking and placing device when the mechanical arm has abnormal sucker is realized, the abnormal sucker of the mechanical arm can be effectively improved, and the stability of the substrate picking and placing device is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below.

Fig. 1 is a schematic diagram of a basic structure of a substrate pick-and-place apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of a basic structure of a substrate fork according to an embodiment of the present invention.

Fig. 3 is a schematic diagram of a basic structure of a vacuum chuck according to an embodiment of the present invention.

Fig. 4 is a flowchart of a substrate pick-and-place method according to an embodiment of the invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. In the drawings, the size and thickness of components illustrated in the drawings are not to scale for clarity and ease of understanding and description.

As shown in fig. 1 and fig. 2, a basic structure schematic diagram of a substrate pick-and-place device provided in an embodiment of the present invention and a basic structure schematic diagram of a substrate fork provided in an embodiment of the present invention are shown, where the substrate pick-and-place device includes at least one robot arm 10, a plurality of substrate forks 11 are disposed on the robot arm 10, and each substrate fork 11 is provided with a plurality of vacuum chucks 110 and a CDA (Compressed Dry Air) pipeline 111 connected to the plurality of vacuum chucks 110; the robot arm 10 is further provided with a plurality of pressure electronic gauges 12 and a plurality of electromagnetic valves 13, wherein any one of the pressure electronic gauges 12 correspondingly measures the vacuum degrees of the plurality of vacuum chucks 110 on any one of the substrate forks 11, and any one of the electromagnetic valves 13 correspondingly controls the on/off of the CDA pipeline 111 on any one of the substrate forks 11.

It should be noted that the substrate pick-and-place apparatus provided in the embodiment of the present invention includes at least one robot 10, and fig. 1 illustrates an example including two robots, one of which is used for picking a substrate and is located at the lower right side in fig. 1, and the other of which is used for placing a substrate and is located at the upper left side in fig. 1. When the magnetron sputtering coating process is needed, the upper left mechanical arm adsorbs the substrate, the substrate is turned from a horizontal state to a vertical state, the substrate is placed into magnetron sputtering equipment for coating, and after the coating process is finished, the lower right mechanical arm adsorbs the substrate, the substrate is turned from the vertical state to the horizontal state, and the substrate is transferred to the next process section.

It should be noted that the substrate forks 11 are used for carrying substrates, the vacuum chucks 110 on the substrate forks 11 are used for adsorbing the substrates, preventing the substrates from falling off during the turnover process, the pressure electronic gauge head 12 is used for measuring the vacuum degree between the vacuum chuck 110 and the substrate, wherein, the CDA pipeline 111 on the substrate fork 11 is used for controlling the vacuum degree in the vacuum chuck 110, the electromagnetic valve 13 is used for controlling the on-off of the CDA pipeline 111, when the electromagnetic valve 13 is opened, the CDA pipe 111 is conducted, and at this time, the atmospheric pressure in the vacuum cup 110 is converted into a vacuum state (i.e. a negative pressure state), the substrate can be sucked, when the solenoid valve 13 is closed, the CDA pipe 111 is closed, and the pressure electronic gauge 12 does not measure the vacuum degree of the vacuum chuck 110 on the substrate fork 11 closing the CDA pipe 111.

It can be understood that, in the adsorption process of the substrate, because the area of the substrate is too large, the number of the vacuum chucks 110 correspondingly arranged is large, and abnormal vacuum suction is easily caused, that is, a certain vacuum chuck 110 or certain vacuum chucks 110 are not in contact with the substrate easily, which results in insufficient vacuum degree, and the failure of the machine due to the failure of the alarm of the vacuum degree. However, a certain vacuum chuck 110 is not good in adsorption and cannot bear the substrate, and in the experimental process, researchers find that the substrate can be normally adsorbed as long as the substrate is adsorbed once again, and the substrate taking and placing device in the prior art cannot accurately find the chuck causing the abnormal vacuum absorption, so that the technical problem of low production efficiency caused by the breakdown of a machine due to the abnormal vacuum absorption cannot be solved. In the embodiment of the invention, a plurality of electromagnetic valves 13 are arranged, and any electromagnetic valve 13 correspondingly controls the on-off of the CDA pipeline 111 on any base plate fork 11, when the number of the vacuum chucks 110 with the vacuum degree reaching the preset range meets the requirement, the CDA pipeline 111 corresponding to the vacuum chuck 110 with the vacuum degree not reaching the preset range can be closed through the electromagnetic valve 13, at the moment, the pressure electronic gauge head 12 can not measure the vacuum degree of the vacuum chuck 110 on the base plate fork 11 for closing the CDA pipeline 111 any more, the alarm breakdown of the machine due to the failure of the vacuum degree is avoided, when the number of the vacuum chucks 110 with the vacuum degree reaching the preset range does not meet the requirement, the manual pick-and-place mode is switched and an alarm signal is sent out, namely, the intelligent processing of the substrate pick-and-place device when the mechanical arm 10 has abnormal vacuum suction is realized, the problem of the machine due to the abnormal vacuum suction of the mechanical arm 10 can be rapidly and accurately solved, the stability of the substrate taking and placing device is improved, and the production efficiency is improved.

It should be noted that the predetermined range is 0.08 mpa to 0.09 mpa. The requirement includes a first condition and a second condition, the first condition being: the number of the vacuum chucks 110 on any one of the substrate forks 11, the degree of vacuum of which reaches the preset range, is greater than or equal to a first threshold value, and the first threshold value is less than or equal to the total number of the vacuum chucks 110 on any one of the substrate forks 11; the second condition is: the number of the vacuum chucks 110 of which the vacuum degrees on all the substrate forks 11 reach the preset range is greater than or equal to a second threshold value, and the second threshold value is less than or equal to the total number of the vacuum chucks 110 on all the substrate forks 11. The requirement is only fulfilled if both the first condition and the second condition are fulfilled.

Specifically, the first threshold is greater than or equal to the total number 9/11 of vacuum cups 110 on any one of the substrate forks 11, and the second threshold is greater than or equal to the total number 71/77 of vacuum cups 110 on all of the substrate forks 11. For example, as shown in fig. 2, when 7 substrate forks 11 are provided on one robot arm 10 (a1 indicates a contact area between the robot arm 10 and the substrate fork 11), and 11 vacuum chucks 110 are provided on each substrate fork 11, the first threshold value is greater than or equal to 9 and less than or equal to 11, and the second threshold value is greater than or equal to 71 and less than or equal to 77. That is, the number of the vacuum chucks 110 in which the vacuum degree of any one of the substrate forks 11 reaches the preset range is not less than 9, that is, the number of the vacuum chucks 110 in which the vacuum degree of any one of the substrate forks 11 does not reach the preset range is not more than 2 (that is, the vacuum degrees of 1 to 2 vacuum chucks 110 allowed to appear in a single substrate fork 11 do not reach the preset range, at this time, the corresponding CDA pipeline 111 can be controlled to be closed, the corresponding pressure electronic gauge head 12 stops measuring the vacuum degree, and machine downtime caused by alarm failure of the vacuum degree is avoided). That is, the number of the vacuum chucks 110 having the vacuum degrees reaching the predetermined range on all the substrate forks 11 should not be less than 71, that is, the number of the substrate forks 11 having the vacuum degrees of 1 to 2 vacuum chucks 110 not reaching the predetermined range should be less than or equal to 3 (that is, the number of the substrate forks 11 closing the CDA pipe 111 should not be more than 3).

In one embodiment, the CDA pipeline 111 includes a main pipeline and a plurality of branch pipelines, one end of any branch pipeline is communicated with the main pipeline, and the other end is communicated with any vacuum chuck 110, fig. 2 only shows the installation position of the CDA pipeline 111 in a plan view, the main pipeline is overlapped with the installation position of the CDA pipeline 111, and therefore is not shown, and the branch pipelines are pipelines connecting the main pipeline and a single vacuum chuck 110, are overlapped with the installation position of the vacuum chuck 110, and therefore are not shown.

In one embodiment, one of the pressure electronic gauge heads 12 and one of the electromagnetic valves 13 are arranged on any of the branch pipelines. It can be understood that, when also being provided with pressure electron gauge outfit 12 and solenoid valve 13 on single branch pipeline, can measurationing single vacuum chuck 110's vacuum, when taking place to inhale the vacuum unusual, can be fast accurate location to the position that sets up that takes place to adsorb unusual vacuum chuck 110, thereby solve the problem that the abnormal machine of leading to down of inhaling the vacuum unusual fast, and simultaneously, also can take place to adsorb unusual vacuum chuck 110's branch pipeline's break-make through certain vacuum chuck 110 of taking place to adsorb of solenoid valve 13 independent control, the vacuum of the unusual vacuum chuck 110 of absorption takes place for the regulation and control that can be better. Since the branch line is not shown, the pressure electronic gauge head 12 and the solenoid valve 13 provided in the branch line are also not shown.

Next, referring to fig. 3, which is a schematic diagram of a basic structure of a vacuum chuck according to an embodiment of the present invention, the vacuum chuck 110 includes a chuck nozzle 1101, a bellows 1102 hermetically connected to the chuck nozzle 1101, and a connecting rod 1103 hermetically connected to the bellows 1102, and the branch pipe is communicated with the vacuum chuck 110 through the connecting rod 1103. The vacuum chuck 110 includes an accommodating space 1104 therein for accommodating CDA gas. It should be noted that the suction nozzle 1101 is used for sucking a substrate, and the bellows 1102 has a telescopic property, so that the relative distance between the connection rod 1103 and the suction nozzle 1101 can be adjusted, thereby adjusting the volume of the accommodating space 1104.

Next, referring to fig. 4, a flowchart of a substrate pick-and-place method according to an embodiment of the present invention is shown, where the method includes:

s1, providing at least one mechanical arm, wherein a plurality of substrate forks are arranged on the mechanical arm, each substrate fork is provided with a plurality of vacuum chucks and a CDA pipeline connected with the vacuum chucks, the mechanical arm is also provided with a plurality of pressure electronic gauge heads and a plurality of electromagnetic valves, any pressure electronic gauge head correspondingly measures the vacuum degrees of the vacuum chucks on any substrate fork, and any electromagnetic valve correspondingly controls the on-off of the CDA pipeline on any substrate fork;

s2, opening the electromagnetic valves and sucking the substrate by the vacuum chucks;

s3, respectively measuring the vacuum degrees of the vacuum chucks on any one substrate fork through the pressure electronic gauge heads;

s4, judging whether the number of the vacuum suckers with the vacuum degree reaching the preset range meets the requirement or not;

s401, if the requirement is not met, sucking the liquid again by using the plurality of vacuum chucks, and repeating the steps S3 and S4;

s402, if the requirements are met, controlling the mechanical arm to overturn the substrate.

Wherein, the step S401 further includes: when the re-suction frequency reaches a certain frequency and still does not meet the requirement, the re-suction is stopped, the manual picking and placing mode is switched, and an alarm signal is sent. It should be noted that the certain number of times may be 1 to 3 times, and when the sucking is performed again for 1 to 3 times and the requirement is not met, the manual picking and placing mode may be switched and an alarm signal may be sent.

Wherein, the step S402 further includes: and closing the electromagnetic valve corresponding to the vacuum sucker of which the vacuum degree does not reach the preset range. The corresponding CDA pipeline can be controlled to be closed, the corresponding pressure electronic gauge head stops measuring the vacuum degree, and machine breakdown caused by alarm failure of the vacuum degree can be avoided.

Wherein the predetermined range is 0.08 to 0.09 megapascals.

Wherein the requirement comprises a first condition and a second condition, the first condition being: the number of the vacuum chucks on any one substrate fork, the vacuum degree of which reaches the preset range, is greater than or equal to a first threshold value, and the first threshold value is less than or equal to the total number of the vacuum chucks on any one substrate fork; the second condition is: the number of the vacuum chucks on all the substrate forks, the vacuum degrees of which reach the preset range, is greater than or equal to a second threshold value, and the second threshold value is less than or equal to the total number of the vacuum chucks on all the substrate forks. The requirement is only fulfilled if both the first condition and the second condition are fulfilled.

Wherein the first threshold is greater than or equal to a total number of vacuum cups 9/11 on any of the substrate forks, and the second threshold is greater than or equal to a total number of vacuum cups 71/77 on all of the substrate forks. It is to be understood that when 7 substrate forks are provided on one robot arm and 11 vacuum chucks are provided on each substrate fork, the first threshold value is greater than or equal to 9 and less than or equal to 11, and the second threshold value is greater than or equal to 71 and less than or equal to 77. That is, the number of the vacuum chucks on any one of the substrate forks, the vacuum degree of which reaches the preset range, is not less than 9, that is, the number of the vacuum chucks on any one of the substrate forks, the vacuum degree of which does not reach the preset range, is not more than 2 (that is, the vacuum degrees of 1-2 vacuum chucks allowed to appear on a single substrate fork do not reach the preset range, at this time, the corresponding CDA pipeline can be controlled to be closed, the corresponding pressure electronic meter stops measuring the vacuum degree, and machine downtime caused by alarm of the vacuum degree failure does not occur). That is, the number of the vacuum chucks on all the substrate forks whose vacuum degrees reach the preset range is not less than 71, that is, the number of the substrate forks whose vacuum degrees of 1-2 vacuum chucks do not reach the preset range is less than or equal to 3 (that is, the number of the substrate forks which close the CDA pipeline is not more than 3).

In summary, the substrate picking and placing device provided in the embodiments of the present invention includes at least one robot arm, the robot arm is provided with a plurality of substrate forks, each substrate fork is provided with a plurality of vacuum chucks and a CDA pipeline connected to the plurality of vacuum chucks; the mechanical arm is also provided with a plurality of pressure electronic gauge heads and a plurality of electromagnetic valves, wherein any pressure electronic gauge head correspondingly measures the vacuum degrees of a plurality of vacuum chucks on any substrate fork, and any electromagnetic valve correspondingly controls the on-off of a CDA pipeline on any substrate fork. By arranging a plurality of electromagnetic valves, and correspondingly controlling the on-off of the CDA pipeline on any substrate fork by any electromagnetic valve, when the number of the vacuum chucks with the vacuum degree reaching the preset range meets the requirement, the CDA pipeline corresponding to the vacuum chuck with the vacuum degree not reaching the preset range can be disconnected through the electromagnetic valve, the machine alarm downtime is avoided, when the number of the vacuum suckers with the vacuum degree reaching the preset range does not meet the requirement, re-sucking, and when re-sucking for a certain number of times does not meet the requirement, switching the manual picking and placing mode and sending an alarm signal, the intelligent processing of the substrate taking and placing device when the mechanical arm is abnormal in vacuum suction is realized, the abnormal vacuum suction of the mechanical arm can be effectively improved, the stability of the substrate taking and placing device is improved, and the technical problem that the machine is down and the production efficiency is low due to the fact that the abnormal vacuum suction of the substrate taking and placing device in the prior art is solved.

The substrate pick-and-place device and the substrate pick-and-place method provided by the embodiment of the invention are described in detail above. It should be understood that the exemplary embodiments described herein should be considered merely illustrative for facilitating understanding of the method of the present invention and its core ideas, and not restrictive.