1. A display backboard is characterized by comprising a flexible substrate, a light-emitting layer arranged on the flexible substrate, and a packaging part arranged on the light-emitting layer;

wherein, be provided with flexible skeleton in the encapsulation portion.

2. The display backplane of claim 1, wherein the encapsulation section comprises at least a first encapsulation layer and a second encapsulation layer on the first encapsulation layer, the first encapsulation layer covering the light emitting layer;

the flexible framework is embedded in at least one of the first packaging layer and the second packaging layer, and the flexible framework and the light-emitting layer are arranged in different layers.

3. The display backplane of claim 2, wherein the light emitting layer comprises a plurality of light emitting devices, and wherein orthographic projections of the first and second skeleton layers on the flexible substrate are located between two adjacent light emitting devices.

4. The display backplane of claim 3, wherein the flexible skeleton comprises at least a first skeleton layer and a second skeleton layer, the first skeleton layer comprising a plurality of first skeleton bars arranged along a first direction and extending along a second direction, the second skeleton layer comprising a plurality of second skeleton bars arranged along the second direction and extending along the first direction;

wherein the first direction is different from the second direction.

5. The display backboard according to claim 4, wherein the plurality of first skeleton bars and the plurality of second skeleton bars are arranged in a staggered manner to form a skeleton net with a net structure, and the size of the net opening of the skeleton net is gradually reduced from the center line of the skeleton net to the side area;

the central line of the skeleton net is a point connecting line at the position with the maximum curvature radius when the skeleton net is in a bending state.

6. The display panel according to claim 3, wherein the first direction is a horizontal direction, and the second direction is a vertical direction perpendicular to the first direction;

and the first framework strip and the second framework strip are arranged in different layers.

7. The display backplane according to any one of claims 3 to 6, wherein the first side of the first encapsulation layer is provided with a plurality of first protrusions and first grooves, and the first side of the first encapsulation layer is a side connected to the second encapsulation layer;

a plurality of second bulges and second grooves are arranged on the first side surface of the second packaging layer, and the first side surface of the second packaging layer is a side surface connected with the first packaging layer;

the first protrusion is embedded with the second groove, and the second protrusion is embedded with the first groove.

8. The display backplane of claim 7, wherein the flexible backbone is disposed in the first recess, and the second protrusion is located on a side of the flexible backbone facing away from the first encapsulation layer.

9. A mobile terminal characterized by comprising a terminal body and a display backplane according to any one of claims 1 to 8.

10. A method for manufacturing a display backplane according to any one of claims 1 to 8, comprising:

forming a light emitting layer on a flexible substrate;

forming a first encapsulation layer on the light emitting layer;

forming a flexible skeleton on the first encapsulation layer;

forming a second packaging layer on the flexible framework, so that the first packaging layer and the second packaging layer form a packaging part;

wherein, the flexible framework is embedded in the packaging part.

Background

The flexible electronic product is usually manufactured with related electronic devices on a flexible film, and the related electronic devices are firstly manufactured on the flexible film and then encapsulated with a flexible material to form the flexible device with the flexible film as a substrate.

The flexible display screen is usually packaged by using a flexible material with high transmittance, and a commonly used packaging material at present is silica gel. However, the silicone material has limited bending resistance, and is likely to crack during bending, resulting in abnormal display.

Disclosure of Invention

The application provides a display back plate, a manufacturing method thereof and a mobile terminal, and aims to solve the technical problem that an encapsulating material cracks due to poor bending resistance of the encapsulating material of a current flexible display screen.

In order to solve the technical problem, the technical scheme provided by the application is as follows:

the application provides a display backboard, which comprises a flexible substrate, a light-emitting layer arranged on the flexible substrate, and a packaging part arranged on the light-emitting layer;

wherein, be provided with flexible skeleton in the encapsulation portion.

In the display back plate, the packaging part at least comprises a first packaging layer and a second packaging layer positioned on the first packaging layer, and the first packaging layer covers the light-emitting layer;

the flexible framework is embedded in at least one of the first packaging layer and the second packaging layer, and the flexible framework and the light-emitting layer are arranged in different layers.

In the display back plate, the flexible skeleton at least comprises a first skeleton layer and a second skeleton layer, the first skeleton layer comprises a plurality of first skeleton strips which are arranged along a first direction and extend along a second direction, and the second skeleton layer comprises a plurality of second skeleton strips which are arranged along the second direction and extend along the first direction;

wherein the first direction is different from the second direction.

In the display back plate, the plurality of first skeleton strips and the plurality of second skeleton strips are arranged in a staggered mode to form a skeleton net with a net-shaped structure, and the size of a net opening of the skeleton net is gradually reduced from a central line of the skeleton net to a side edge area;

the central line of the skeleton net is a point connecting line at the position with the maximum curvature radius when the skeleton net is in a bending state.

In the display back plate, the light-emitting layer comprises a plurality of light-emitting devices, and orthographic projections of the first skeleton layer and the second skeleton layer on the flexible substrate are located between two adjacent light-emitting devices.

In the display back panel of the present application, the first direction is a horizontal direction, and the second direction is a vertical direction perpendicular to the first direction;

and the first framework strip and the second framework strip are arranged in different layers.

In the display back plate of the present application, the bending strength of the flexible skeleton is greater than the bending strength of the encapsulation portion.

In the display backplane of the present application, a first side surface of the first encapsulation layer is provided with a plurality of first protrusions and first grooves, and the first side surface of the first encapsulation layer is a side surface connected with the second encapsulation layer;

a plurality of second bulges and second grooves are arranged on the first side surface of the second packaging layer, and the first side surface of the second packaging layer is a side surface connected with the first packaging layer;

the first protrusion is embedded with the second groove, and the second protrusion is embedded with the first groove.

In the display back plate of the application, the flexible framework is arranged in the first groove, and the second protrusion is located on one side, deviating from the first packaging layer, of the flexible framework.

The application also provides a mobile terminal, which comprises a terminal main body and the display back plate.

The application also provides a manufacturing method of the display back plate, which is used for manufacturing the display back plate and comprises the following steps:

forming a light emitting layer on a flexible substrate;

forming a first encapsulation layer on the light emitting layer;

forming a flexible skeleton on the first encapsulation layer;

forming a second packaging layer on the flexible framework, so that the first packaging layer and the second packaging layer form a packaging part;

wherein, the flexible framework is embedded in the packaging part.

Has the advantages that: this application adds flexible casing layer through setting up flexible skeleton in encapsulation portion, when guaranteeing encapsulation layer water oxygen proof characteristic, has improved the anti ability of buckling of encapsulation layer, has promoted flexible electronic product's reliance, is applicable to the flexible electronic product of preparation low camber. Moreover, the packaging part is set to be of at least a double-layer structure, and the flexible framework is embedded in at least one of the first packaging layer and the second packaging layer, so that the flexible framework can be prevented from being in direct contact with the luminous layer, and the problem of poor bonding force caused by material difference between the flexible framework and the luminous layer is reduced. In addition, the framework net is formed by compounding the first framework layer and the second framework layer, so that the bending strength is higher; and the orthographic projections of the first framework layer and the second framework layer on the flexible substrate are positioned between two adjacent light-emitting devices, so that the light-emitting layer can be prevented from being shielded by the flexible framework, the brightness loss of the light-emitting layer is reduced, and the display effect is further improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a first block diagram of a display backplane as described herein;

FIG. 2 is a second block diagram of a display backplane as described herein;

FIG. 3 is a third block diagram of the display backplane described in the present application;

FIG. 4 is a first block diagram of a flexible backbone as described herein;

FIG. 5 is a second block diagram of a flexible backbone as described herein;

FIG. 6 is a third block diagram of a flexible backbone described herein;

FIG. 7 is a schematic plan view of the flexible backbone and the light emitting device of the present application;

FIG. 8 is a schematic diagram of a separation structure of the first encapsulation layer and the second encapsulation layer in the present application;

fig. 9 is a schematic view of a fitting structure of the first encapsulation layer and the second encapsulation layer in the present application;

FIG. 10 is a flow chart of the fabrication of the display backplane described in the present application;

FIG. 11 is a process diagram for fabricating a display backplane as described herein.

Description of reference numerals:

the light emitting device comprises a flexible substrate 100, a light emitting layer 200, a light emitting device 210, an encapsulation portion 300, a first encapsulation layer 310, a first protrusion 311, a first groove 312, a second encapsulation layer 320, a second protrusion 321, a second groove 322, a flexible skeleton 400, a first skeleton strip 411, a second skeleton strip 421, a mesh opening 430, a center line 500 and an array driving layer 600.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention.

The present application provides a display backplane, which is described in detail below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments.

Light Emitting Diodes (LEDs) are semiconductor electronic components that convert electrical energy into Light energy, and are widely used in the fields of lighting, display screens, signal lamps, backlights, toys, etc. because they have the characteristics of small size, long service life, rich and colorful colors, and low energy consumption. Mini LEDs, also known as sub-millimeter LEDs, are typically 80-200 microns in size, are a new generation of LED technology, which has the characteristics of small pitch LEDs such as high efficiency, high reliability, high brightness, and fast response time, and smaller pitch LEDs have lower power consumption and lower cost.

In recent years, flexible electronic products have attracted extensive attention and have been rapidly developed all over the world. In the manufacturing process of at least part of flexible devices in flexible electronic products, a PI film (polyimide film) is often formed on a hard glass substrate, related electronic devices (such as an LED light emitting layer or a mini LED light emitting layer) are manufactured on the PI film, and after the related electronic devices are manufactured, the glass substrate is separated from the PI film to form a flexible device using the PI film as a substrate, so that the flexible electronic product is manufactured.

The mini-LED screen or the mini-LED backlight module of the flexible PI substrate needs to adopt a flexible semiconductor crystal packaging material with high transmittance, the existing commonly used mini-LED packaging material is silica gel, the thickness is generally 100um to 500um, but the bending resistance of the silica gel material is limited, and the phenomenon of cracking easily occurs during bending, so that abnormal display is caused. Based on the technical problems, the following technical scheme is provided in the application.

Referring to fig. 1 to 9, the present application provides a display backplane, which includes a flexible substrate 100, a light emitting layer 200 disposed on the flexible substrate 100, and a packaging portion 300 disposed on the light emitting layer 200; wherein, a flexible framework 400 is arranged in the packaging part 300.

In the present embodiment, the flexible substrate 100 is a PI film (polyimide film), and the light emitting layer 200 is an LED, a mini-LED, a micro-LED, an OLED, or the like. The thickness of the packaging part 300 is 50 micrometers to 500 micrometers, the packaging part 300 is made of silica gel, polyacrylate, epoxy ester and other materials, the flexible framework 400 is made of graphene, polyethylene terephthalate (PET) and other materials, the materials have high bending resistance, and the packaging part is more suitable for flexible packaging.

According to the application, the flexible framework 400 is arranged in the packaging part 300, so that the flexible framework 400 is used as a structural reinforcing rib of the packaging part 300, and the stress applied to the packaging part 300 can be transferred to the flexible framework 400 with stronger bending resistance, so that the bending resistance of the packaging part 300 is enhanced, and the packaging part 300 is not easy to crack; meanwhile, the flexible frame 400 can prevent the micro-crack in the package part 300 from propagating, thereby further reducing crack expansion and display abnormality.

It should be noted that the display backplane may further include an array driving layer 600. The array driving layer 600 is disposed on the flexible substrate 100, and the light emitting layer 200 is disposed on the array driving layer 600. The array driving layer 600 is a thin film transistor layer, which may include a plurality of thin film transistors. The thin film transistor layer may be an etching barrier type, a back channel etching type, a bottom gate thin film transistor type, or a top gate thin film transistor type, and the like, and the present application is not particularly limited.

The technical solution of the present application will now be described with reference to specific embodiments.

In the display backplane of the present application, please refer to fig. 1, where fig. 1 is a first structural diagram of the display backplane, the package portion 300 at least includes a first package layer 310 and a second package layer 320 located on the first package layer 310. For example, in the present embodiment, the encapsulation part 300 is composed of a first encapsulation layer 310 and a second encapsulation layer 320, and the first encapsulation layer 310 covers the light emitting layer 200. In the present application, the package portion 300 includes, but is not limited to, the case where the package portion is composed of the first package layer 310 and the second package layer 320, and in the present application, the package portion 300 may further include a multi-layer package structure such as a third package layer and a fourth package layer. The packaging part 300 formed by compounding the first packaging layer 310 and the second packaging layer 320 has better bending strength, thereby better reducing the cracking condition of the packaging material and improving the display effect.

In this embodiment, the flexible backbone 400 is embedded in at least one of the first encapsulation layer 310 and the second encapsulation layer 320. For example, as shown in fig. 1, the flexible backbone 400 is embedded in the second encapsulation layer 320; alternatively, as shown in fig. 2, the flexible backbone 400 is embedded in the first encapsulation layer 310; alternatively, as shown in fig. 3, the flexible backbone 400 is embedded in both the first packaging layer 310 and the second packaging layer 320. In this embodiment, the flexible frame 400 is embedded in at least one of the first package layer 310 and the second package layer 320, so that a good embedding relationship can be formed between the flexible frame 400 and the first package layer 310 and the second package layer 320, the flexible frame 400 is not easy to slide in the package portion 300, and the bending resistance is better.

In this embodiment, the flexible backbone 400 and the light emitting layer 200 are disposed in different layers, so as to avoid the problem of structural defects such as voids between the flexible backbone 400 and the light emitting layer 200 due to poor bonding force caused by large difference in manufacturing materials between the flexible backbone 400 and the light emitting layer 200.

In the display back plate of the present application, please refer to fig. 4 to 7, fig. 4 is a first structural diagram of the flexible skeleton 400, where the flexible skeleton 400 at least includes a first skeleton layer and a second skeleton layer, the first skeleton layer includes a plurality of first skeleton bars 411 arranged along a first direction X and extending along a second direction Y, and the second skeleton layer includes a plurality of second skeleton bars 421 arranged along the second direction Y and extending along the first direction X; wherein the first direction X is different from the second direction Y.

In this embodiment, an included angle between the first direction X and the second direction Y may be a non-zero and non-180 ° angle within 0 to 180 °. For example, as shown in fig. 4, the first direction X and the second direction Y form an acute angle. The flexible skeleton 400 in this embodiment is composed of at least a first skeleton layer and a second skeleton layer, and the flexible skeleton 400 formed by compounding a plurality of skeleton layers has higher physical mechanical strength, so that a better structure-enhancing effect is achieved on the package portion 300. In addition, in the embodiment, the first skeleton layer and the second skeleton layer are interlaced to form the mesh structure, so that the light source in the light emitting layer 200 can penetrate through the mesh pores without affecting normal display, and the flexible skeleton 400 of the mesh structure has better bending resistance.

In the display back plate of the present application, please refer to fig. 5 and fig. 6, fig. 5 is a second structure diagram of the flexible framework 400 of the present application, and a plurality of the first framework strips 411 and a plurality of the second framework strips 421 are arranged in a criss-cross manner in a horizontal direction and a vertical direction to form a framework net with a net structure.

In this embodiment, please refer to fig. 6, fig. 6 is a third structural diagram of the flexible framework 400 of the present application, in which the size of the mesh opening 430 of the framework mesh gradually decreases from the center line 500 of the framework mesh to the side region; the central line 500 of the skeleton net is a point connecting line at which the curvature radius is maximum when the skeleton net is in a bending state. When the display back plate is applied to the flexible curved surface display screen, the deformation of the internal skeleton net of the flexible curved surface display screen is larger along with the gradual reduction of the bending curvature (namely, the gradual increase of the curvature radius), and the blank area corresponding to the net port 430 with the same size is smaller. Therefore, the size of the mesh opening 430 of the skeleton mesh is gradually reduced from the center line 500 of the skeleton mesh (i.e., the point connecting line at the maximum curvature radius position when the skeleton mesh is in a bending state) to the side edge area, so that the shielding influence of the skeleton mesh on the light emitting effect of the light emitting layer 200 can be reduced or even avoided, the light emitted from the light emitting layer 200 still has good uniformity after passing through the skeleton mesh, and the display effect is improved.

In the display backplane of the present application, please refer to fig. 7, fig. 7 is a schematic plan view of the flexible backbone 400 and the light emitting devices 210 in the present application, the light emitting layer 200 includes a plurality of light emitting devices 210, and the plurality of light emitting devices 210 are arranged on the flexible substrate 100 in an array. The light emitting device 210 may be an LED (light emitting diode), a mini-LED (sub-millimeter light emitting diode), a micro-LED (micro-scale light emitting diode), an OLED (organic light emitting diode), or other optoelectronic devices. In this embodiment, the orthographic projections of the first skeleton layer and the second skeleton layer on the flexible substrate 100 are located between two adjacent light emitting devices 210, that is, the first skeleton layer and the second skeleton layer are distributed in the gaps of the plurality of light emitting devices 210, so that the first skeleton layer and the second skeleton layer do not have the problem of blocking the light emitting of the light emitting layer 200, and the display effect is improved.

In the display back plate of the present application, please refer to fig. 5 to 7, the first direction X is a horizontal direction, the second direction Y is a vertical direction perpendicular to the first direction X, that is, the first frame strips 411 and the second frame strips 421 are vertically staggered, so that the alignment between the first frame strips 411, the second frame strips 421 and the light emitting devices 210 is more convenient and accurate ("alignment" is to arrange the first frame strips 411 and the second frame strips 421, so that the first frame strips 411 and the second frame strips 421 are horizontally staggered and located in the gaps between the two adjacent light emitting devices 210), thereby reducing the alignment difficulty and reducing the process difficulty of the frame mesh.

In this embodiment, the first frame strip 411 and the second frame strip 421 may be disposed in the same layer to enhance the bonding strength between the first frame strip 411 and the second frame strip 421. Or, the first skeleton strip 411 and the second skeleton strip 421 may also be arranged in different layers, so as to reduce the difficulty in compounding the first skeleton strip 411 and the second skeleton strip 421, and reduce the cost.

In the display panel of the present application, the bending strength of the flexible skeleton 400 is greater than the bending strength of the encapsulation portion 300, and the flexible skeleton 400 with higher bending strength can better improve the bending resistance of the encapsulation portion 300, suppress further expansion of microcracks in the encapsulation portion 300, and improve the service life of the encapsulation portion 300.

In the display backplane of the present application, please refer to fig. 8, where fig. 8 is a schematic diagram of a separation structure of the first package layer 310 and the second package layer 320 in the present application, a first side surface of the first package layer 310 is provided with a plurality of first protrusions 311 and first grooves 312, and the first side surface of the first package layer 310 is a side surface connected to the second package layer 320. A plurality of second protrusions 321 and second grooves 322 are disposed on a first side of the second encapsulation layer 320, and the first side of the second encapsulation layer 320 is a side connected to the first encapsulation layer 310. The first protrusion 311 is engaged with the second groove 322, and the second protrusion 321 is engaged with the first groove 312. In this embodiment, the first package layer 310 and the second package layer 320 belonging to different layer structures are arranged to be a clamping structure in which the first protrusion 311 and the second groove 322, and the second protrusion 321 and the first groove 312 are embedded, so that the bonding strength between the first package layer 310 and the second package layer 320 can be enhanced, the first package layer 310 and the second package layer 320 form a good integral structure, and a better and more stable package effect is achieved on the light emitting layer 200 and the flexible framework 400.

In the display backplane of the present application, please refer to fig. 9, fig. 9 is a schematic view of a fitting structure of the first package layer 310 and the second package layer 320 in the present application, the flexible frame 400 is disposed in the first groove 312, and the second protrusion 321 is located on a side of the flexible frame 400 departing from the first package layer 310. In this embodiment, the flexible frame 400 is disposed in the first groove 312, so that the mesh-shaped flexible frame 400 and the plurality of first protrusions 311 on the first encapsulation layer 310 form a nested structure, that is, the first protrusions 311 are embedded in the mesh openings 430 formed by the first frame strips 411 and the second frame strips 421 in an interlaced manner. The flexible backbone 400 is constrained by nesting and is not easily displaced within the enclosure 300, thereby providing a more stable structural reinforcement.

The application further provides a mobile terminal which comprises a terminal main body and the display back plate. It should be noted that, the display back plate described in this application may be used as a backlight module of a liquid crystal display, and may also be directly used as a display.

Referring to fig. 10 and 11, the method for manufacturing a display backplane includes:

s10, please refer to fig. 11(a), first providing a PI film (polyimide film) as the flexible substrate 100;

s20, please refer to fig. 11(b), a thin film transistor layer of an etch-stop type, a back channel etch type, or a bottom gate thin film transistor type, i.e., the array driving layer 600, is fabricated on the flexible substrate 100;

s30, referring to fig. 11(c), a plurality of light emitting devices 210, such as LEDs (light emitting diodes), mini-LEDs (sub-millimeter light emitting diodes), micro-LEDs (micro-scale light emitting diodes), OLEDs (organic light emitting diodes), and other optoelectronic devices, are fabricated on the array driving layer 600 to form a light emitting layer 200;

s40, referring to fig. 11(d), a transparent encapsulating layer made of silica gel, polyacrylate, or epoxy ester, i.e. the first encapsulating layer 310, is formed on the light emitting layer 200;

s50, please refer to fig. 11(e), a flexible frame 400 is fabricated on the first encapsulation layer 310, such that the mesh opening 430 of the flexible frame 400 corresponds to the light emitting device 210;

s60, please refer to fig. 11(f), a transparent encapsulation layer, i.e., a second encapsulation layer 320, made of silicone, polyacrylate, or epoxy, is formed on the flexible framework 400, so that the first encapsulation layer 310 and the second encapsulation layer 320 form an encapsulation portion 300, and the flexible framework 400 is embedded in the encapsulation portion 300.

In the embodiment, the flexible skeleton 400 is arranged in the packaging part 300, so that the bending resistance of the packaging part 300 is enhanced, the packaging part is not easy to crack, and the display abnormity is reduced. In the embodiment, the package portion 300 has at least a two-layer structure, and the flexible frame 400 is embedded in at least one of the first package layer 310 and the second package layer 320, so that the flexible frame 400 can be prevented from directly contacting the light-emitting layer 200, and the problem of poor bonding force between the flexible frame 400 and the light-emitting layer 200 due to the difference in material is reduced. The framework net is formed by compounding the first framework layer and the second framework layer, so that the bending strength is higher; and the orthographic projections of the first skeleton layer and the second skeleton layer on the flexible substrate 100 are positioned between two adjacent light-emitting devices 210, so that the flexible skeleton 400 can be prevented from shielding the light-emitting layer 200, the brightness loss of the light-emitting layer 200 is reduced, and the display effect is further improved. In this embodiment, the plurality of first protrusions 311 and the first grooves 312 are disposed on the side surface of the first package layer 310 contacting the second package layer 320, and the flexible frame 400 is disposed in the first grooves 312, so that the mesh-shaped flexible frame 400 and the plurality of first protrusions 311 on the first package layer 310 can form a nested structure, that is, the first protrusions 311 are embedded into the mesh openings 430 formed by the first frame strips 411 and the second frame strips 421 in an interlaced manner, and the flexible frame 400 is restricted by nesting and is not easy to shift in the package portion 300, thereby playing a role in more stable structure enhancement. Through the arrangement, the anti-bending strength of the packaging part 300 in the display back plate can be well improved, so that the packaging part 300 is not easy to crack, and the display effect is improved when the display back plate is used as a backlight module of a flexible display screen or used in a flexible display panel.

The display back plate, the manufacturing method thereof and the mobile terminal provided by the embodiment of the application are described in detail, a specific example is applied in the description to explain the principle and the implementation of the application, and the description of the embodiment is only used for helping to understand the method and the core idea of the application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.