1. A chip test fixture, comprising:

the EVB plate is provided with a groove in the center;

a set of test interfaces disposed on the EVB board;

the data transmission interface is arranged on the EVB board;

and the group of power interfaces are arranged on the EVB board.

2. The chip test fixture of claim 1, wherein the set of test interfaces comprises:

a first test interface;

the second test interface is arranged opposite to the first test interface;

a third test interface;

the fourth test interface is arranged opposite to the third test interface;

a fifth test interface;

and the sixth test interface is arranged opposite to the fifth test interface.

3. The chip test fixture of claim 2, wherein the set of test interfaces includes an SMA interface.

4. The chip test fixture of claim 1, wherein the EVB board comprises: rogers plate.

5. The chip test fixture of claim 1, wherein the set of power interfaces comprises:

a VCC voltage interface and a GND ground interface.

6. The chip test fixture of claim 5, wherein the set of power interfaces is in the form of: the pin header is in a pin header form.

7. The chip test fixture of claim 1, wherein the data transmission interface comprises: and a USB interface.

8. A chip test fixture assembly, comprising:

the chip testing fixture of any one of claims 1-7;

the sub-clamp is fixed in the groove of the chip test clamp through a bolt and comprises a group of sub-clamp test interfaces, and the group of sub-clamp test interfaces are correspondingly connected with the test interfaces of the chip test clamp.

9. The combination of claim 8, wherein the set of sub-fixture test interfaces are correspondingly connected to the test interfaces of the chip test fixture via spring tabs.

10. The chip test fixture combination of claim 8, wherein the sub-fixture comprises:

a single chip sub-clamp or a chip sub-clamp.

Background

As people enter the information age, wireless communication technology has been rapidly developed. Mobile phones, wireless local area networks, bluetooth, etc. have become an indispensable part of social life and development. Advances in wireless communication technology are not open to the development of radio frequency circuits and microwave technology.

In the rf circuit technology, the debugging of the rf chip and the circuit is a critical item. At present, in the debugging process of the radio frequency chip and the circuit, a test board is usually used to test the performance of the chip. Generally, the interface of a test instrument for chip performance test, such as an S-parameter tester, is usually a standard type such as SMA or BNC. However, the pins of the chip to be tested are not usually universal interfaces such as SMA or BNC. The connection between the chip under test and the test instrument therefore requires an auxiliary fixture. Thus, the S parameter measured by the S parameter tester is the whole S parameter of the clamp, but not the S parameter of the chip. If the parameters of the chip are to be obtained, the parameters of the chip can be obtained only by performing corresponding calculation after at least three clamps are used for performing respective tests.

Disclosure of Invention

In order to simplify the extraction process of the chip test parameters, the application provides a chip test fixture, corresponding parameter files can be obtained through the measurement of three channels of the fixture respectively, and the test parameters of the chip (namely, de-embedding files) can be obtained after the operation and transmission of a single chip microcomputer.

The application provides a chip test fixture includes:

the EVB plate is provided with a groove in the center;

a set of test interfaces disposed on the EVB board;

the data transmission interface is arranged on the EVB board;

and the group of power interfaces are arranged on the EVB board.

According to some embodiments of the application, the set of test interfaces comprises:

a first test interface;

the second test interface is arranged opposite to the first test interface;

a third test interface;

the fourth test interface is arranged opposite to the third test interface;

a fifth test interface;

and the sixth test interface is arranged opposite to the fifth test interface.

According to some embodiments of the present application, the set of test interfaces includes an SMA interface.

According to some embodiments of the present application, the EVB board includes: rogers plate.

According to some embodiments of the application, the set of power interfaces comprises: a VCC voltage interface and a GND ground interface.

According to some embodiments of the application, the set of power interfaces is in the form of: the pin header is in a pin header form.

According to some embodiments of the present application, the data transmission interface comprises: and a USB interface.

The application also provides a chip test fixture combination, which is characterized by comprising:

the above chip test jig;

the sub-clamp is fixed in the groove of the chip test clamp through a bolt and comprises a group of sub-clamp test interfaces, and the group of sub-clamp test interfaces are correspondingly connected with the test interfaces of the chip test clamp.

According to some embodiments of the present application, the set of sub-fixture test interfaces is correspondingly connected to the test interface of the chip test fixture through the spring plate.

According to some embodiments of the present application, the sub-clip comprises: a single chip sub-clamp or a chip sub-clamp.

The application provides a chip test fixture only needs a chip test fixture can obtain to go to inlay the file, compares three traditional anchor clamps, and is more convenient. The sub-clamp can be disassembled and assembled with the chip test clamp through the screw holes, and is convenient to replace and multipurpose. The sub-clamp of the single chip microcomputer can perform formula operation on three groups of parameters obtained through testing in the single chip microcomputer to obtain a final de-embedding file, calculation is not needed after the parameters are respectively exported, and operation steps are simplified.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without exceeding the protection scope of the present application.

FIG. 1 shows a schematic diagram of a chip test fixture according to an example embodiment of the present application;

FIG. 2 shows a schematic view of a sub-fixture configuration according to a first exemplary embodiment of the present application;

FIG. 3 shows a schematic view of a sub-fixture structure according to a second exemplary embodiment of the present application;

FIG. 4 shows a chip test fixture assembly connection schematic according to an example embodiment of the present application;

FIG. 5 shows a schematic diagram of a chip test fixture assembly according to a first exemplary embodiment of the present application;

fig. 6 shows a schematic diagram of a chip test fixture assembly according to a second exemplary embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the application. One skilled in the relevant art will recognize, however, that the subject matter of the present application can be practiced without one or more of the specific details, or with other methods, components, devices, steps, and so forth. In other instances, well-known methods, devices, implementations, or operations have not been shown or described in detail to avoid obscuring aspects of the application.

It will be understood that, although the terms first, second, etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first component discussed below may be termed a second component without departing from the teachings of the present concepts. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Those skilled in the art will appreciate that the drawings are merely schematic representations of exemplary embodiments, which may not be to scale. The blocks or flows in the drawings are not necessarily required to practice the present application and therefore should not be used to limit the scope of the present application.

The inventor finds that in the performance test of the existing test board for the radio frequency chip, if the de-embedding file of the chip is to be obtained, three clamps are required to be used for respectively testing to obtain three groups of parameters, the test efficiency is low, the number of required clamps is large, and the cost is high. Therefore, the application aims to provide the chip testing clamp, and only one chip testing clamp is needed to obtain three groups of parameters so as to obtain the de-embedded file.

The technical solution of the present application will be described in detail below with reference to the accompanying drawings.

Fig. 1 shows a schematic structural diagram of a chip test fixture according to an exemplary embodiment of the present application.

As shown in fig. 1, the chip test fixture 1000 provided by the present application includes an EVB board 100, a set of test interfaces 200, a set of power interfaces 300, and a data transmission interface 400.

The EVB board 100 may be a rectangular piece of rocky material with a recess 110 in the center for placing a test sub-fixture, such as a single chip sub-fixture or a chip sub-fixture. A set of test interfaces 200 are disposed on the EVB board 100. According to an example embodiment of the present application, as shown in fig. 1, the set of test interfaces includes 6 test interfaces, which are a first test interface 211, a second test interface 221, a third test interface 212, a fourth test interface 222, a fifth test interface 213, and a sixth test interface 223, respectively. The first test interface 211, the third test interface 212, and the third test interface 213 are disposed at one side of the EVB board 100. The second test interface 221, the fourth test interface 222, and the sixth test interface 223 are disposed at the other side of the EVB board 100. The second test interface 221 is disposed opposite to the first test interface 211. The fourth test interface 222 is disposed opposite the third test interface 212. The sixth test interface 223 is arranged opposite to the fifth test interface 213. According to some embodiments of the present application, a spring (not shown) may be disposed at each test interface for connecting the interfaces of the sub-fixture. According to some embodiments of the present application, the set of test interfaces 200 may be SMA interfaces.

The set of power interface 300 includes a VCC voltage interface 310 and a GND ground interface 320, which are disposed on one side of the EVB board 100 and used for supplying power to a single chip or a chip during testing. According to some embodiments of the present application, the set of power interfaces 300 may be in the form of pin headers. The data transmission interface 400 is disposed on one side of the EVB board 100, and after the parameter test is completed, the test result can be directly transmitted to the software of the test system through the data transmission interface 400. According to some embodiments of the application, the data transmission interface may be a USB interface.

When the chip is tested, the chip testing clamp 1000 provided by the application is used in cooperation with the sub-clamp as the main clamp, and finally the embedded file of the chip is obtained. The sub-gripper may be a single chip sub-gripper or a chip sub-gripper.

Fig. 2 shows a schematic view of a sub-clip structure according to a first exemplary embodiment of the present application.

According to an example embodiment of the present application, as shown in fig. 2, the one-chip sub-clip 500 includes a first set of interfaces: interface 511, interface 512, and interface 513, and a second set of interfaces: the interface 521, the interface 522 and the interface 523, the two sets of interfaces constitute three testing paths, which are respectively connected to the three sets of testing interfaces of the chip testing jig, for example, by elastic pieces at the interfaces of the chip testing jig. The interface 511 and the interface 521 are connected with a straight port on the back of the single chip microcomputer. The interface 512 and the interface 522 are respectively connected with the open end of the singlechip. The interface 513 and the interface 523 are respectively connected with a ground port inside the single chip microcomputer. The one-chip sub-clip 500 further includes a power interface 531 and a ground interface 532, and a data transmission interface 540.

Fig. 3 shows a schematic view of a sub-clip structure according to a second exemplary embodiment of the present application.

According to an example embodiment of the present application, as shown in fig. 3, the chip sub-clip 600 substantially conforms to the size of the single chip sub-clip, and includes an interface 610, an interface 620, a power interface 631, a ground interface 632, and a data transmission interface 640. The interface 610 is connected to the input end 710 of the chip 700 to be tested, and the interface 620 is connected to the output end 720 of the chip 700 to be tested. The power interface 631 is connected to a power supply, the ground interface 632 is connected to ground, the data transmission interface 640 is used for transmitting test data, and other interfaces are open-circuited in a floating manner. When the chip sub-clamp 600 is combined with the chip testing clamp, the interface 610 and the interface 620 are respectively connected with a group of testing interfaces of the chip testing clamp.

FIG. 4 shows a chip test fixture assembly connection schematic according to an example embodiment of the present application.

The sub-clamp and the chip test clamp can be connected in a metal spring piece and metal contact mode. As shown in fig. 4, taking the combination connection of the single chip sub-fixture 500 and the chip test fixture 1000 as an example, each test port of the chip test fixture 1000 is provided with a metal spring piece in the middle groove area, for example, the test interface 213 is correspondingly provided with a metal spring piece 2131. The back of the single chip sub-clamp 500 has metal contacts for connection, such as 5131 in the figure. When the one-piece clip is pressed downward, the metal contact 5131 and the metal spring piece 2131 are brought into contact with each other. After the metal contact at each interface is contacted with the spring piece, the four corners are fixed by screws, and then the solderless connection can be achieved.

Fig. 5 is a schematic diagram illustrating a chip test fixture assembly according to a first exemplary embodiment of the present application.

When performing a chip performance test, the single chip sub-jig 500 is first fixed at the center of the groove through the bolt hole on the chip test jig to form a first chip test jig assembly, as shown in fig. 5. A set of interfaces 511, 512, 513 of the single chip sub-fixture 500 are connected to the first test interface 211, the third test interface 212, and the third test interface 213 of the chip test fixture, respectively. A group of interfaces 521, 522, 523 of the single chip sub-fixture 500 are respectively connected with the second test interface 221, the fourth test interface 222, and the sixth test interface 223 of the chip test fixture. The power interface 531 and the ground interface 532 of the single chip sub-clip 500 are connected to the VCC voltage interface 310 and the GND ground interface 320 of the chip test clip, respectively. The data transmission interface 540 of the one-chip sub-jig 500 is connected to the data transmission interface 400 of the chip test jig.

In addition, the interface 511 and the interface 521 of the sub-clamp 500 of the single chip microcomputer are connected with a straight port on the back of the single chip microcomputer. The interface 512 and the interface 522 of the sub-clamp 500 of the single chip microcomputer are respectively connected with the open end of the single chip microcomputer. The interface 513 and the interface 523 of the sub-clamp 500 of the single chip microcomputer are respectively connected with the grounding port inside the single chip microcomputer.

The path formed by connecting the first test interface 211 of the chip test fixture, the interface 511 of the sub-fixture 500 of the single chip, the interface 521 of the sub-fixture 500 of the single chip and the third test interface 221 of the chip test fixture is a straight path. The second test interface 212 of the chip test fixture, the interface 512 of the single chip sub-fixture 500, the interface 522 of the single chip sub-fixture 500, and the fourth test interface 222 of the chip test fixture are connected to form an open circuit. The third test interface 213 of the chip test fixture, the interface 513 of the sub-fixture 500 of the single chip, the interface 523 of the sub-fixture 500 of the single chip, and the sixth test interface 223 of the chip test fixture are connected to form a short circuit.

When the test interface of the chip tester is connected to the first test interface 211 and the third test interface 221 of the chip test fixture, the obtained S parameter is a through parameter. When the test interface of the chip tester is connected to the second test interface 212 and the fourth test interface 222 of the chip test fixture, the obtained S parameter is an open circuit. When the test interface of the chip tester is connected to the third test interface 213 and the sixth test interface 223 of the chip test fixture, the obtained S parameter is a short circuit.

After the S parameters of the three paths are respectively tested, the single chip microcomputer records three groups of S parameters. And obtaining a final de-embedding S parameter after formula conversion by using an internal de-embedding formula. According to some embodiments of the present application, the de-embedding S parameter may be output through the data transfer port 400.

Fig. 6 shows a schematic diagram of a chip test fixture assembly according to a second exemplary embodiment of the present application.

After obtaining the de-embedding S parameter by the single chip sub-jig, the single chip sub-jig can be taken out from the chip testing jig and replaced with the chip sub-jig 600, and the chip sub-jig 600 is fixed at the center of the groove through the bolt hole on the chip testing jig, so as to form a second chip testing jig assembly, as shown in fig. 6. The interface 610 of the chip sub-holder 600 is connected to the second test interface 212 of the chip test holder 1000, the interface 620 of the chip sub-holder 600 is connected to the fourth test interface 222 of the chip test holder, and other test interfaces of the chip test holder are suspended. The interface 610 is further connected to an input terminal of the chip to be tested, and the interface 620 is further connected to an output terminal of the chip to be tested. The power interface 631 and the ground interface 632 of the chip sub-clamp 600 are connected to the VCC voltage interface 310 and the GND ground interface 320 of the chip test clamp, respectively. The data transmission interface 640 of the chip sub-holder 600 is connected to the data transmission interface 400 of the chip test holder.

A set of chip S parameters without de-embedding can be obtained by the second chip test fixture combination. Similarly, the chip S parameter without de-embedding may be output through the data transfer port 400.

Thus, by combining the chip test fixture with the one-chip sub-fixture, de-embedding S-parameters are obtained. By combining the chip test fixture with the chip sub-fixture, chip S parameters without de-embedding are obtained. After the de-embedded S parameters and the chip S parameters without de-embedded are operated, the real chip S parameters from the chip input end to the chip output end can be obtained.

The application provides a chip test fixture and chip test fixture combination only needs a chip test fixture can obtain to go to inlay the file, compares three traditional anchor clamps, and is more convenient. The sub-clamp can be disassembled and assembled with the chip test clamp through the screw holes, and is convenient to replace and multipurpose. The sub-clamp of the single chip microcomputer can perform formula operation on three groups of parameters obtained through testing in the single chip microcomputer to obtain a final de-embedding file, calculation is not needed after the parameters are respectively exported, and operation steps are simplified.

The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and implementations of the present application, and the description of the embodiments is only intended to facilitate the understanding of the methods and their core concepts of the present application. Meanwhile, a person skilled in the art should, according to the idea of the present application, change or modify the embodiments and applications of the present application based on the scope of the present application. In view of the above, the description should not be taken as limiting the application.