1. An integrated circuit test apparatus, characterized by: the device comprises a controller, a test box (1), a moving platform (2), a chuck (3), a sealing module and a conveying module; the mobile platform (2) is fixedly connected to the lower end inside the test box (1); the upper end of the moving platform (2) is clamped with a chuck (3); the transmission module comprises a transmission hole (51), a transmission rod (52), a transmission block (53), a rotating rod (54), a connecting rod (55), a sliding block (56) and a sliding groove (57); a conveying hole (51) is formed in the position, corresponding to the chuck (3), on one side of the test box (1); the front end and the rear end of the conveying hole (51) are both connected with a conveying rod (52) in a sliding manner; a conveying block (53) is fixedly connected to the position of the chuck (3) corresponding to the conveying rod (52); the conveying rods (52) are clamped with the conveying blocks (53), and one side, away from the chuck (3), of each conveying rod (52) is hinged with a rotating rod (54); one side of each rotating rod (54) close to the chuck (3) is fixedly connected with a sliding block (56), and a connecting rod (55) is fixedly connected between the two rotating rods (54); and a sliding groove (57) is formed at the position of the lower end of the transmission block (53) corresponding to the sliding block (56).

2. An integrated circuit test apparatus as claimed in claim 1, wherein: the sealing module comprises an electric telescopic rod (41), a sealing plate (42), a visual recognition device (43), a driving block (44), a moving chute (45), a probe head (46) and a probe card (47); electric telescopic rods (41) are fixedly connected in four corners of the upper end of the test box (1); the upper end of the electric telescopic rod (41) is fixedly connected with a sealing plate (42); a visual recognition device (43) is fixedly connected to the center of the lower end of the sealing plate (42), and driving blocks (44) are fixedly connected to the two sides of the lower end of the sealing plate (42); the lower end of the driving block (44) is fixedly connected with a probe head (46); both sides of the upper end of the test box (1) are provided with moving chutes (45); one end of the probe head (46) is connected with the movable sliding chute (45) in a sliding mode, and the other end of the probe head (46) is clamped with a probe card (47).

3. An integrated circuit test apparatus as claimed in claim 1, wherein: the surface of the test box (1) at the upper end of the conveying hole (51) is fixedly connected with elastic dustproof cloth (6); the lower end of the elastic dustproof cloth (6) is fixedly connected with a dustproof block (7); dust-proof grooves (8) are formed in the positions, corresponding to the dust-proof blocks (7), of the rotating rods (54), and the dust-proof blocks (7) are clamped with the dust-proof grooves (8).

4. An integrated circuit test apparatus as claimed in claim 2, wherein: one end of the probe card (47) close to the probe head (46) is provided with a fixing hole (9); the other end of the probe head (46) is connected with a fixed block (10) in a sliding manner; the other end of the fixed block (10) is fixedly connected with a return spring (11), and the other end of the return spring (11) is fixedly connected with a driving block (44).

5. An integrated circuit test apparatus as claimed in claim 2, wherein: the front end and the rear end of the sealing plate (42) are connected with viewing columns (12) in a sliding manner; the lower end of the viewing column (12) is hinged with a magnifying glass (13).

6. An integrated circuit test apparatus as claimed in claim 2, wherein: the laser sensors (14) are fixedly connected to the positions, corresponding to the needle heads of the probe card (47), of the two probe heads (46) in the horizontal direction; the light ports of the two laser sensors (14) are arranged oppositely.

Background

An integrated circuit is a microelectronic device or component. The transistor, the resistor, the capacitor, the inductor and other elements and wires required in a circuit are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and are then packaged in a tube shell to form a micro structure with the required circuit function; unqualified samples are marked in the process of detecting the integrated circuit, so that the waste of packaging cost is avoided.

For example, a chinese patent with application number CN201520817357.9 discloses a probe station, in the sample parameter test, a driving component drives a supporting component to move up and down, so as to adjust the relative positions of a probe on the supporting component and an installation platform, so as to quickly separate or contact the probe from the test point of the sample, and the operation process is convenient and efficient.

Although the technical scheme drives the supporting piece to move up and down through the driving component, the probe is quickly separated from the sample to be detected; but in the detection process, in order to prevent the influence of the particles in the air on the detection process, the detection process is carried out in a clean room with a larger area, so that the problem of higher difficulty in cleaning control is solved; based on this, the present invention provides an integrated circuit testing apparatus to solve the above technical problems in the prior art.

Disclosure of Invention

The invention provides integrated circuit testing equipment, aiming at making up the defects of the prior art and solving the problem that the cleaning control difficulty is higher because the detection process is carried out in a clean room with a larger area in order to prevent the influence of particles in the air on the detection process in the prior art.

The technical scheme adopted by the invention for solving the technical problems is as follows: the invention relates to integrated circuit test equipment which comprises a controller, a test box, a moving platform, a chuck, a sealing module and a conveying module, wherein the controller is connected with the test box; the mobile platform is fixedly connected to the lower end of the interior of the test box; a chuck is clamped at the upper end of the moving platform; the transmission module comprises a transmission hole, a transmission rod, a transmission block, a rotating rod, a connecting rod, a sliding block and a sliding groove; a conveying hole is formed in one side of the test box at a position corresponding to the chuck; the front end and the rear end of the conveying hole are both connected with a conveying rod in a sliding manner; a conveying block is fixedly connected to the position of the chuck corresponding to the conveying rod; the conveying rods are clamped with the conveying blocks, and one side of each conveying rod, which is far away from the chuck, is hinged with a rotating rod; one side of each rotating rod, which is close to the chuck, is fixedly connected with a sliding block, and a connecting rod is fixedly connected between the two rotating rods; a sliding groove is formed in the position, corresponding to the sliding block, of the lower end of the conveying block;

during working, in the existing wafer detection process, in order to prevent the influence of particles in the air on the detection process, the detection process is carried out in a six-grade clean room, but the control and maintenance of a clean room with larger space are more difficult;

therefore, the transmission module is arranged, the connecting rod is lifted upwards to drive the rotating rod to rotate from a vertical state to a horizontal state, so that the sliding block on the rotating rod is connected with the sliding groove in a sliding manner, the connecting rod is pushed towards the chuck, the connecting rod drives the rotating rod and the transmission rod to move, a clamping groove is formed in the position, corresponding to the chuck, on the transmission rod, and the transmission rod is clamped with the transmission block on the chuck; the upper end of the movable platform is clamped with the lower end of the chuck, the movable platform can move in the horizontal direction and the vertical direction, the movable platform moves downwards to be separated from the chuck, the connecting rod is pulled out outwards to drive the chuck to move outwards, and the connecting rod is put down to drive the rotating rod to return to the initial state; taking the wafer out of the storage position, placing the wafer on a chuck, and adsorbing the wafer by the chuck through vacuum; then the connecting rod is lifted, the connecting rod is continuously pushed to drive the chuck to return to the initial position, and the moving platform also moves upwards to the initial position to be clamped with the chuck; the movable platform drives the chuck to move upwards, so that a welding pad area on the wafer is contacted with a needle point of the probe card, the chip is electrified to detect whether the chip can work normally, and the movable platform drives the chuck to move horizontally to adjust the position of the wafer, so that a detection device on the sealing module is contacted with the welding pad areas at different positions to complete a test process;

the invention has the advantages that the transmission module is arranged, so that the test can be carried out in the test box which can reach the cleaning degree of the six-stage clean room, and meanwhile, the test box has smaller cleaning control difficulty than the six-stage clean room, so that the time for the wafer to contact with the outside air after being taken out from the storage position is reduced, the middle insulating layer is prevented from being damaged in the process of the test that the welding pad area on the wafer is stuck with dirt, and the reliability of the integrated circuit test equipment is further improved.

Preferably, the sealing module comprises an electric telescopic rod, a sealing plate, a visual recognition device, a driving block, a moving chute, a probe head and a probe card; electric telescopic rods are fixedly connected in four corners of the upper end of the test box; the upper end of the electric telescopic rod is fixedly connected with a sealing plate; the center position of the lower end of the sealing plate is fixedly connected with a visual recognition device, and both sides of the lower end of the sealing plate are fixedly connected with driving blocks; the lower end of the driving block is fixedly connected with a probe head; both sides of the upper end of the test box are provided with moving chutes; one end of the probe head is connected with the movable sliding chute in a sliding mode, and the other end of the probe head is clamped with a probe card; when the wafer detection device works, in the wafer detection process, if the needle point of the probe card or the welding pad area of the wafer is adhered with impurities, the contact effect of the needle point of the probe card and a chip can be influenced, in order to meet the electrical connection between the probe card and the chip, the probe card is continuously abutted to the chip to achieve an electrical contact state, so that the middle insulating layer of the chip is easily damaged, the stability of the chip is influenced, and the phenomenon of short circuit or open circuit of a lower-layer metal circuit can be generated in serious cases; therefore, through the sealing module, the controller firstly controls the electric telescopic rod to extend to drive the sealing plate to move upwards, and the sealing plate lifts the driving block to drive the probe head and the probe card to move along the moving sliding groove; then observing whether the probe card tip is dirty or not or whether the probe card tip is deformed and bent or not, if the probe card tip is dirty, cleaning paper with the same type is needed to be used for cleaning, and if the probe card tip is deformed and bent, the probe card needs to be replaced; the controller controls the electric telescopic rod to contract to drive the sealing plate to move downwards, so that the test box forms a closed working environment; then, a wafer to be tested is placed on the chuck through the transmission module, the moving platform drives the chuck to move upwards, so that a welding pad area on the wafer is contacted with a needle point of the probe card, the chip is electrified to detect whether the chip can work normally, and the moving platform drives the chuck to move horizontally to adjust the position of the wafer, so that the probe card is contacted with the welding pad areas at different positions to complete the test process; a worker watches the record of the real-time monitoring feedback of the visual recognition device to the testing process on a computer screen in real time; the sealing module is arranged, so that the probe card is detected, wiped and replaced before the wafer is detected, the condition that the middle insulating layer of a chip is damaged due to the fact that dirt in the air is adhered to the needle point of the probe card or the welding pad area of the wafer is prevented, and the reliability of the test of the integrated circuit test equipment is improved.

Preferably, the surface of the test box at the upper end of the conveying hole is fixedly connected with elastic dustproof cloth; the lower end of the elastic dustproof cloth is fixedly connected with a dustproof block; a dustproof groove is formed in the rotating rod at a position corresponding to the dustproof block, and the dustproof block is clamped with the dustproof groove; when the device works, the elastic dustproof cloth is arranged, and after the wafer is placed in the chuck, the dustproof block on the elastic dustproof cloth is inserted into the dustproof groove of the rotating rod, so that the elastic dustproof cloth is stretched to cover the transmission hole, the test box is kept airtight, and the cleanness of the internal environment of the test is further ensured; when the chuck needs to be taken out, the rotating rod is turned to be in a horizontal state, so that the dustproof block can be separated from the dustproof groove under the elastic action of the elastic dustproof cloth; the contact between the probe head and the chip is prevented from being influenced by dirt stuck on the wafer, and the detection safety of the integrated circuit testing equipment is improved.

Preferably, a fixing hole is formed at one end of the probe card close to the probe head; the other end of the probe head is connected with a fixed block in a sliding manner; the other end of the fixed block is fixedly connected with a return spring, and the other end of the return spring is fixedly connected with the driving block; when the probe card is in work, the fixing hole and the fixing block are arranged, when the probe card needs to be detached for cleaning or replaced, one end of the fixing block is manually moved towards the direction of the driving block, so that the fixing block is separated from the fixing hole, the return spring is compressed, and then the probe card is taken down; when the probe card is inserted again, inserting one end of the probe card from the through hole at the lower end of the probe head, when one end of the probe card moves to the upper end of the probe head, the probe card pushes the fixed block to move towards the direction of the driving block, and when the probe card moves to the position corresponding to the fixed block, the fixed block enters the fixed hole; so that the probe head can be conveniently replaced; the fixing block slides along the inverted T-shaped sliding groove on the probe head, so that the fixing block cannot be separated from the probe head, and the probe card cannot move along the through hole due to the stress of the needle point after the fixing block is inserted into the fixing hole; the contact stability between the needle point of the probe head and the chip of the wafer is ensured, and the use convenience of the integrated circuit testing equipment is improved.

Preferably, the front end and the rear end of the sealing plate are connected with viewing columns in a sliding manner; the lower end of the viewing column is hinged with a magnifying lens; when the magnifying glass is used, after the electric telescopic rod extends, the position corresponding to the probe card can be observed by moving the viewing column, the probe card can be observed by using the magnifying glass, the condition that the needle point of the probe card is dirty or the probe card is not deformed can be clearly observed, the contact effect between the probe card and a chip is prevented from being influenced by the dirt on the probe card, and the stability of the test process of the integrated circuit test equipment is further ensured.

Preferably, the two probe heads are fixedly connected with laser sensors at positions corresponding to the probe heads of the probe card horizontally; the light ports of the two laser sensors are arranged oppositely; when the device works, the laser sensor is arranged; before testing, the laser sensor senses the needle point position of the probe card, the laser sensor transmits a detection signal to the controller, the controller processes the signal detected by the laser sensor through a built-in program, when the built-in program receives that the positions sensed by the two laser sensors are not on the same horizontal plane, an alarm program is started, the testing process is suspended, and a worker adjusts the position of the probe card; the probe card prevents the probe card from penetrating the chip bonding pad layer due to the fact that the needle points of the two probe cards are not on the same plane, prevents the needle point of the other probe card from being in poor contact, prevents the contact surface between the probe card and the chip from being not coplanar, influences the contact effect of the probe card and the chip, and further guarantees the safety of an integrated circuit in the test process of integrated circuit test equipment.

The invention has the following beneficial effects:

1. compared with the traditional technical scheme, the integrated circuit testing equipment has the advantages that the conveying module is arranged, so that the test is carried out in the testing box capable of achieving the cleaning degree of the six-stage clean room, meanwhile, the cleaning control difficulty of the testing box is smaller than that of the six-stage clean room, the time of the wafer contacting with the outside air after being taken out from the storage position is reduced, the middle insulating layer is prevented from being damaged in the process of the dirty test of the bonding pad area on the wafer, and the reliability of the integrated circuit testing equipment is further improved.

2. According to the integrated circuit testing equipment, the fixing hole and the fixing block are arranged, one end of the fixing block is manually moved towards the direction of the driving block, so that the fixing block is separated from the fixing hole, the return spring is compressed, and then the probe card is taken down; when the probe card is inserted again, inserting one end of the probe card from the through hole at the lower end of the probe head, when one end of the probe card moves to the upper end of the probe head, the probe card pushes the fixed block to move towards the direction of the driving block, and when the probe card moves to the position corresponding to the fixed block, the fixed block enters the fixed hole; the convenience of the integrated circuit test equipment is improved.

Drawings

The invention will be further explained with reference to the drawings.

FIG. 1 is a perspective view of the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

FIG. 3 is an enlarged view of a portion of FIG. 1 at B;

in the figure: 1. a test box; 2. a mobile platform; 3. a chuck; 41. an electric telescopic rod; 42. a sealing plate; 43. a visual recognition device; 44. driving the block; 45. a moving chute; 46. a probe head; 47. a probe card; 51. a transfer aperture; 52. a transfer rod; 53. a transfer block; 54. rotating the rod; 55. a connecting rod; 56. a slider; 57. a sliding groove; 6. elastic dustproof cloth; 7. a dust-proof block; 8. a dust-proof groove; 9. a fixing hole; 10. a fixed block; 11. a return spring; 12. viewing the column; 13. a magnifying glass; 14. a laser sensor.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

As shown in fig. 1 to 3, an integrated circuit testing apparatus according to the present invention includes a controller, a testing box 1, a moving platform 2, a chuck 3, a sealing module, and a transferring module; the mobile platform 2 is fixedly connected to the lower end inside the test box 1; the upper end of the moving platform 2 is clamped with a chuck 3; the transfer module includes a transfer hole 51, a transfer lever 52, a transfer block 53, a rotation lever 54, a connection lever 55, a slide block 56, and a slide groove 57; a conveying hole 51 is formed in a position, corresponding to the chuck 3, on one side of the test box 1; the front end and the rear end of the conveying hole 51 are both connected with a conveying rod 52 in a sliding manner; a transmission block 53 is fixedly connected to the position of the chuck 3 corresponding to the transmission rod 52; the transmission rods 52 are clamped with the transmission blocks 53, and one side of each transmission rod 52, which is far away from the chuck 3, is hinged with a rotating rod 54; a sliding block 56 is fixedly connected to one side of each rotating rod 54 close to the chuck 3, and a connecting rod 55 is fixedly connected between the two rotating rods 54; a sliding groove 57 is formed at the position of the lower end of the transmission block 53 corresponding to the sliding block 56;

during working, in the existing wafer detection process, in order to prevent the influence of particles in the air on the detection process, the detection process is carried out in a six-grade clean room, but the control and maintenance of a clean room with larger space are more difficult;

therefore, by arranging the transmission module, the connecting rod 55 is lifted upwards to drive the rotating rod 54 to rotate from a vertical state to a horizontal state, so that the sliding block 56 on the rotating rod 54 is in sliding connection with the sliding groove 57, then the connecting rod 55 is pushed towards the chuck 3, the connecting rod 55 drives the rotating rod 54 and the transmission rod 52 to move, a clamping groove is formed in the position, corresponding to the chuck 3, on the transmission rod 52, and the transmission rod 52 is clamped with the transmission block 53 on the chuck 3; the upper end of the movable platform 2 is clamped with the lower end of the chuck 3, the movable platform 2 can move in the horizontal direction and the vertical direction, the movable platform 2 moves downwards to be separated from the chuck 3, the connecting rod 55 is pulled out outwards to drive the chuck 3 to move outwards, and the connecting rod 55 is put down to drive the rotating rod 54 to return to the initial state; taking the wafer out of the storage position, placing the wafer on a chuck 3, and adsorbing the wafer by the chuck 3 through vacuum; then the connecting rod 55 is lifted, the connecting rod 55 is pushed continuously to drive the chuck 3 to return to the initial position, and the movable platform 2 also moves upwards to the initial position to be clamped with the chuck 3; the moving platform 2 drives the chuck 3 to move upwards, so that a welding pad area on the wafer is contacted with a needle point of the probe card 47, then the chip is electrified to detect whether the chip can work normally, and the moving platform 2 drives the chuck 3 to move horizontally to adjust the position of the wafer, so that a detection device on the sealing module is contacted with the welding pad areas at different positions to complete the test process;

the invention has the advantages that the transmission module is arranged, so that the test can be carried out in the test box which can reach the cleaning degree of the six-stage clean room, and meanwhile, the test box has smaller cleaning control difficulty than the six-stage clean room, so that the time for the wafer to contact with the outside air after being taken out from the storage position is reduced, the middle insulating layer is prevented from being damaged in the process of the test that the welding pad area on the wafer is stuck with dirt, and the reliability of the integrated circuit test equipment is further improved.

As an embodiment of the present invention, the sealing module includes an electric telescopic rod 41, a sealing plate 42, a visual recognition device 43, a driving block 44, a moving chute 45, a probe head 46 and a probe card 47; electric telescopic rods 41 are fixedly connected in four corners at the upper end of the test box 1; the upper end of the electric telescopic rod 41 is fixedly connected with a sealing plate 42; a visual recognition device 43 is fixedly connected to the center of the lower end of the sealing plate 42, and driving blocks 44 are fixedly connected to both sides of the lower end of the sealing plate 42; the lower end of the driving block 44 is fixedly connected with a probe head 46; both sides of the upper end of the test box 1 are provided with moving chutes 45; one end of the probe head 46 is connected with the movable chute 45 in a sliding manner, and the other end of the probe head 46 is clamped with a probe card 47; in the working process, if the needle point of the probe card 47 or the pad area of the wafer is adhered with impurities in the wafer detection process, the contact effect of the needle point of the probe card 47 and the chip can be influenced, in order to meet the electrical connection between the probe card 47 and the chip, the probe card 47 continuously supports against the chip to reach an electrical contact state, so that the middle insulating layer of the chip is easily damaged, the stability of the chip is influenced, and the phenomenon of short circuit or open circuit of a lower-layer metal circuit can be generated in serious cases; therefore, according to the invention, through the sealing module, the controller firstly controls the electric telescopic rod 41 to extend to drive the sealing plate 42 to move upwards, and the sealing plate 42 lifts the driving block 44 to drive the probe head 46 and the probe card 47 to move along the moving chute 45; then, observing whether the probe card 47 has dirt on the needle point or whether the probe card 47 has the needle point deformed and bent, if the probe card 47 has the dirt on the needle point, cleaning with cleaning paper with the same type is needed, and if the probe card 47 has the needle point deformed and bent, the probe card 47 needs to be replaced first; the controller controls the electric telescopic rod 41 to contract to drive the sealing plate 42 to move downwards, so that the test box 1 forms a closed working environment; the moving platform 2 drives the chuck 3 to move horizontally to adjust the position of the wafer, so that the probe card 47 is contacted with the welding pad areas at different positions to complete the testing process; the staff watches the record of the real-time monitoring feedback of the visual recognition device 43 to the testing process in real time on the computer screen; because the sealing module is arranged, the probe card 47 is detected, wiped and replaced before the wafer is detected, so that the condition that the middle insulating layer of a chip is damaged due to the fact that dirt in the air is adhered to the needle point of the probe card 47 or the welding pad area of the wafer is prevented, and the reliability of the test of integrated circuit test equipment is improved.

As an embodiment of the invention, the surface of the test box 1 at the upper end of the conveying hole 51 is fixedly connected with an elastic dustproof cloth 6; the lower end of the elastic dustproof cloth 6 is fixedly connected with a dustproof block 7; a dustproof groove 8 is formed in the rotating rod 54 at a position corresponding to the dustproof block 7, and the dustproof block 7 is clamped with the dustproof groove 8; when the device works, the elastic dustproof cloth 6 is arranged, after a wafer is placed in the chuck 3, the dustproof block 7 on the elastic dustproof cloth 6 is inserted into the dustproof groove 8 of the rotating rod 54, so that the elastic dustproof cloth 6 is stretched to cover the transmission hole 51, the test box 1 is kept airtight, and the cleanness of the internal environment of the test is further ensured; when the chuck 3 needs to be taken out, the rotating rod 54 is turned to the horizontal state, so that the dustproof block 7 is separated from the dustproof groove 8 under the elastic action of the elastic dustproof cloth 6; the contact between the probe head 47 and the chip is prevented from being affected by dirt stuck on the wafer, and the detection safety of the integrated circuit testing equipment is improved.

As an embodiment of the present invention, a fixing hole 9 is formed at one end of the probe card 47 close to the probe head 46; the other end of the probe head 46 is connected with a fixed block 10 in a sliding manner; the other end of the fixed block 10 is fixedly connected with a return spring 11, and the other end of the return spring 11 is fixedly connected with a driving block 44; when the probe card 47 needs to be detached for cleaning or replacement, the fixing hole 9 and the fixing block 10 are arranged, one end of the fixing block 10 is manually moved towards the direction of the driving block 44, so that the fixing block 10 is separated from the fixing hole 9, the return spring 11 is compressed, and the probe card 47 is taken down; when the probe card 47 is inserted again, one end of the probe card 47 is inserted into the through hole at the lower end of the probe head 46, when one end of the probe card 47 moves to the upper end of the probe head 46, the probe card 47 pushes the fixed block 10 to move towards the direction of the driving block 44, and when the probe card 47 moves to the position corresponding to the position of the fixed block 10 of the fixed hole 9, the fixed block 10 enters the fixed hole 9; so that by easy replacement of the probe head 47; the fixed block 10 slides along the inverted T-shaped sliding groove on the probe head 46, so that the fixed block 10 cannot be separated from the probe head 46, and the probe card 47 cannot move along the through hole due to the force of the needle point after the fixed block 10 is inserted into the fixing hole 9; the contact stability between the needle point of the probe head 47 and the chip of the wafer is ensured, and the use convenience of the integrated circuit testing equipment is better improved.

As an embodiment of the present invention, the front and rear ends of the sealing plate 42 are slidably connected with the viewing posts 12; the lower end of the viewing column 12 is hinged with a magnifying lens 13; when the integrated circuit testing device works, the magnifying lens 13 is arranged, after the electric telescopic rod 41 extends, the position corresponding to the probe card 47 can be observed by moving the viewing column 12, the magnifying lens 13 is used for observing the probe card 47, the condition that whether the needle point of the probe card 47 is dirty or not or whether the probe card 47 is deformed or not can be observed more clearly, the condition that the contact effect between the probe card 47 and a chip is influenced by the dirt on the probe card 47 is avoided, and the stability of the testing process of the integrated circuit testing device is further ensured.

As an embodiment of the present invention, a laser sensor 14 is fixedly connected to a position where two probe heads 46 horizontally correspond to a probe head of a probe card 47; the light ports of the two laser sensors 14 are arranged oppositely; when the device works, the laser sensor 14 is arranged; before testing, the laser sensor 14 senses the needle point position of the probe card 47, the laser sensor 14 transmits a detection signal to the controller, the controller processes the signal detected by the laser sensor 14 through a built-in program, when the built-in program receives that the positions sensed by the two laser sensors 14 are not on the same horizontal plane, an alarm program is started, the testing process is suspended, and a worker adjusts the position of the probe card 47; the probe card 47 is prevented from penetrating the chip bonding pad layer due to the fact that the needle points of the two probe cards 47 are not on the same plane, and the needle point of the other probe card 47 is prevented from being in poor contact, so that the contact surface between the probe card 47 and the chip is prevented from being non-coplanar, the contact effect between the probe card 47 and the chip is prevented from being influenced, and the safety of an integrated circuit in the test process of the integrated circuit test equipment is further guaranteed.

The specific working process is as follows:

in the existing wafer detection process, in order to prevent the influence of particles in the air on the detection process, the detection process is carried out in a six-grade clean room, but the control and maintenance of a clean room with larger space are more difficult; therefore, by arranging the transmission module, the connecting rod 55 is lifted upwards to drive the rotating rod 54 to rotate from a vertical state to a horizontal state, so that the sliding block 56 on the rotating rod 54 is in sliding connection with the sliding groove 57, then the connecting rod 55 is pushed towards the chuck 3, the connecting rod 55 drives the rotating rod 54 and the transmission rod 52 to move, a clamping groove is formed in the position, corresponding to the chuck 3, on the transmission rod 52, and the transmission rod 52 is clamped with the transmission block 53 on the chuck 3; the upper end of the movable platform 2 is clamped with the lower end of the chuck 3, the movable platform 2 can move in the horizontal direction and the vertical direction, the movable platform 2 moves downwards to be separated from the chuck 3, the connecting rod 55 is pulled out outwards to drive the chuck 3 to move outwards, and the connecting rod 55 is put down to drive the rotating rod 54 to return to the initial state; taking the wafer out of the storage position, placing the wafer on a chuck 3, and adsorbing the wafer by the chuck 3 through vacuum; then the connecting rod 55 is lifted, the connecting rod 55 is pushed continuously to drive the chuck 3 to return to the initial position, and the movable platform 2 also moves upwards to the initial position to be clamped with the chuck 3; the moving platform 2 drives the chuck 3 to move upwards, so that a welding pad area on the wafer is contacted with a needle point of the probe card 47, then the chip is electrified to detect whether the chip can work normally, and the moving platform 2 drives the chuck 3 to move horizontally to adjust the position of the wafer, so that a detection device on the sealing module is contacted with the welding pad areas at different positions to complete the test process; because the conveying module is arranged, the test is carried out in the test box which can reach the cleaning degree of the six-stage clean room, and meanwhile, the test box has smaller cleaning control difficulty than the six-stage clean room, so that the time for the wafer to contact with the outside air after being taken out from the storage position is reduced, the middle insulating layer is prevented from being damaged in the process of the test that the welding pad area on the wafer is stuck with dirt, and the reliability of the integrated circuit test equipment is further improved; in the wafer detection process, if the needle point of the probe card 47 or the pad area of the wafer is adhered with impurities, the contact effect of the needle point of the probe card 47 and the chip can be affected, so that the electrical connection between the probe card 47 and the chip is met, the probe card 47 continuously abuts against the chip to achieve an electrical contact state, the middle insulating layer of the chip is easily damaged, the stability of the chip is affected, and a short circuit or an open circuit phenomenon of a lower-layer metal circuit can be generated in serious cases; therefore, according to the invention, through the sealing module, the controller firstly controls the electric telescopic rod 41 to extend to drive the sealing plate 42 to move upwards, and the sealing plate 42 lifts the driving block 44 to drive the probe head 46 and the probe card 47 to move along the moving chute 45; then, observing whether the probe card 47 has dirt on the needle point or whether the probe card 47 has the needle point deformed and bent, if the probe card 47 has the dirt on the needle point, cleaning with cleaning paper with the same type is needed, and if the probe card 47 has the needle point deformed and bent, the probe card 47 needs to be replaced first; the controller controls the electric telescopic rod 41 to contract to drive the sealing plate 42 to move downwards, so that the test box 1 forms a closed working environment; then, a wafer to be tested is placed on the chuck 3 through the transmission module, the moving platform 2 drives the chuck 3 to move upwards, so that a welding pad area on the wafer is contacted with a needle point of the probe card 47, then, whether the chip can work normally is detected through electrifying, the moving platform 2 drives the chuck 3 to move horizontally to adjust the position of the wafer, so that the probe card 47 is contacted with the welding pad areas at different positions to finish the test process; the staff watches the record of the real-time monitoring feedback of the visual recognition device 43 to the testing process in real time on the computer screen; because the sealing module is arranged, the probe card 47 is detected, wiped and replaced before the wafer is detected, so that the condition that the middle insulating layer of a chip is damaged due to the fact that dirt in the air is adhered to the needle point of the probe card 47 or the welding pad area of the wafer is prevented, and the reliability of the test of integrated circuit test equipment is improved; because the elastic dustproof cloth 6 is arranged, after the wafer is placed in the chuck 3, the dustproof block 7 on the elastic dustproof cloth 6 is inserted into the dustproof groove 8 of the rotating rod 54, so that the elastic dustproof cloth 6 is stretched to cover the transmission hole 51, the test box 1 keeps airtightness, and the cleanness of the internal environment of the test is further ensured; when the chuck 3 needs to be taken out, the rotating rod 54 is turned to the horizontal state, so that the dustproof block 7 is separated from the dustproof groove 8 under the elastic action of the elastic dustproof cloth 6; the contact between the probe head 47 and the chip is prevented from being influenced by dirt stuck on the wafer, and the detection safety of the integrated circuit testing equipment is improved; because the fixing hole 9 and the fixing block 10 are arranged, when the probe card 47 needs to be detached for cleaning or replacement, one end of the fixing block 10 is manually moved towards the direction of the driving block 44, so that the fixing block 10 is separated from the fixing hole 9, the return spring 11 is compressed, and then the probe card 47 is taken down; when the probe card 47 is inserted again, one end of the probe card 47 is inserted into the through hole at the lower end of the probe head 46, when one end of the probe card 47 moves to the upper end of the probe head 46, the probe card 47 pushes the fixed block 10 to move towards the direction of the driving block 44, and when the probe card 47 moves to the position corresponding to the position of the fixed block 10 of the fixed hole 9, the fixed block 10 enters the fixed hole 9; so that by easy replacement of the probe head 47; the fixed block 10 slides along the inverted T-shaped sliding groove on the probe head 46, so that the fixed block 10 cannot be separated from the probe head 46, and the probe card 47 cannot move along the through hole due to the force of the needle point after the fixed block 10 is inserted into the fixing hole 9; the contact stability between the needle point of the probe head 47 and the chip of the wafer is ensured, and the use convenience of the integrated circuit testing equipment is improved; because the magnifying glass 13 is arranged, after the electric telescopic rod 41 is extended, the probe card 47 can be observed by moving the viewing column 12 to the position corresponding to the probe card 47 and using the magnifying glass 13, the condition that the needle point of the probe card 47 is dirty or the probe card 47 is deformed can be observed more clearly, the condition that the contact effect between the probe card 47 and a chip is influenced by the dirt on the probe card 47 is avoided, and the stability of the test process of the integrated circuit test equipment is further ensured; and because the invention is through setting up the laser sensor 14; before testing, the laser sensor 14 senses the needle point position of the probe card 47, the laser sensor 14 transmits a detection signal to the controller, the controller processes the signal detected by the laser sensor 14 through a built-in program, when the built-in program receives that the positions sensed by the two laser sensors 14 are not on the same horizontal plane, an alarm program is started, the testing process is suspended, and a worker adjusts the position of the probe card 47; the probe card 47 is prevented from penetrating the chip bonding pad layer due to the fact that the needle points of the two probe cards 47 are not on the same plane, and the needle point of the other probe card 47 is prevented from being in poor contact, so that the contact surface between the probe card 47 and the chip is prevented from being non-coplanar, the contact effect between the probe card 47 and the chip is prevented from being influenced, and the safety of an integrated circuit in the test process of the integrated circuit test equipment is further guaranteed.

The front, the back, the left, the right, the upper and the lower are based on the observation angle of the person, the side of the device facing the observer is defined as the front, the left side of the observer is defined as the left, and so on.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience in describing the present invention and for simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the scope of the present invention.

The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.