1. Electronic component is high low temperature detection device on line, including the test socket, the test base of test socket includes the base main part, set up mounting hole or groove in the base main part, its characterized in that: the base main part is made of a first heat conduction material, the base main part is provided with a heating device located outside the mounting hole or the groove and medium pipelines arranged around the mounting hole or the groove, the medium pipelines are made of a second heat conduction material, the heat conduction coefficients of the second heat conduction material and the first heat conduction material are not lower than 300W/m.K, and the inlet end of each medium pipeline is connected with a cooling medium supply pipeline.

2. The on-line high and low temperature detection device for electronic components of claim 1, wherein: the first heat conduction material is red copper alloy.

3. The on-line high and low temperature detection device for electronic components of claim 1, wherein: the heating devices are distributed on the outer side of the medium pipeline and the heights of the heating devices are equivalent.

4. The on-line high and low temperature detection device for electronic components of claim 1, wherein: the second heat conduction material is silver-copper alloy.

5. The on-line high and low temperature detection device for electronic components of claim 1, wherein: the medium pipeline comprises two capillary tubes, the inlet ends of the two capillary tubes are positioned on the same side surface of the base main body, and the outlet ends of the two capillary tubes are positioned on the other side surface of the base main body.

6. The on-line high and low temperature detection device for electronic components of claim 1, wherein: the medium pipeline is fixed on the base main body through heat conducting glue.

7. The on-line high and low temperature detection device for electronic components of claim 6, wherein: graphite particles are mixed in the heat-conducting glue.

8. The on-line high and low temperature detection device for electronic components of claim 1, wherein: the base main body is provided with a temperature detection device with the sensitivity of +/-0.5 ︒ C.

9. The on-line high and low temperature detection device for electronic components of claim 1, wherein: and the outlet of the cooling pipeline is connected with a nitrogen recovery pipeline.

10. The on-line high and low temperature detection device for electronic components according to any one of claims 1 to 9, wherein: the base main body is arranged in an openable and closable vacuum bin, and the vacuum bin is connected with a vacuum pumping system.

11. High low temperature detects socket, including test base and test lid, be provided with mounting hole or groove in the base main part of test base, its characterized in that: the base main part is made of a first heat conduction material, the base main part is provided with a heating device located on the outer side of the mounting hole or the groove and medium pipelines arranged around the mounting hole or the groove, the medium pipelines are made of a second heat conduction material, and the heat conduction coefficients of the first heat conduction material and the second heat conduction material are not lower than 300W/m.K.

12. The high and low temperature detection socket according to claim 11, wherein: the base main body is provided with a connecting groove for installing the heating device and a mounting groove for installing the medium pipeline.

13. The high and low temperature detection socket according to claim 11, wherein: the first heat conduction material is red copper alloy; the second heat conduction material is silver-copper alloy.

14. The high and low temperature detection socket according to claim 11, wherein: the medium pipeline is fixed in the mounting groove through heat-conducting glue mixed with graphite particles.

15. The high and low temperature detection socket according to claim 11, wherein: the base main body is provided with a thermocouple with the sensitivity of +/-0.5 ︒ C.

16. The chip high and low temperature detection method is characterized by comprising the following steps: the method comprises the following steps:

s1, providing an electronic component on-line high and low temperature detection device as claimed in any one of claims 1 to 10;

s2, placing the chip on the test base, and closing the test gland of the test socket;

s3, performing high and low temperature impact test of the chip or heating the chip to a target high temperature for high temperature resistance test or reducing the chip to a target low temperature for low temperature resistance test while or before or after performing the functional integrity test of the chip;

and S4, after the test is finished, opening the test gland of the test socket and taking out the chip.

17. The chip high and low temperature detection method according to claim 16, wherein: before low-temperature impact detection is carried out, the vacuum cabin is vacuumized.

Background

However, as a large-scale product, the large-scale automatic test is the only solution, and generally, the large-scale automatic test includes a pin functional integrity test, a leakage current test, some dc (direct current) tests, a functional test (functional test), a Trim test, and some other tests according to the chip type, for example, AD/DA has some special test types.

The purpose of chip testing is to find out a trouble-free chip and save cost as much as possible, so that defect types which are easy to detect or are relatively common are detected first, generally speaking, functional integrity test is performed first, and whether the connectivity of each pin is normal is checked. Functional integrity tests may be tested by known test sockets,

for testing chip modules, high and low temperature detection is always a requirement for chip detection in the industry, and the prior art mainly relates to the following requirements: -65 ℃ to +135 ℃ (± 1 ︒ C);

at present, most of chip high-low temperature detection mainly adopts an 'atmosphere type' technology, namely, a cold and hot atmosphere is formed around the chip, and the principle of heating or refrigerating is adopted, so that the temperature around the chip reaches the set requirement and is conducted onto the chip, and the chip reaches the set temperature range.

At present, the 'atmosphere' technology is adopted to realize heating, but the cooling of products and the impact test of high and low temperatures are limited by various technologies, and the technology of 'cold air blowing' is mainly adopted in the industry at present, namely, set 'cold air' is blown to the periphery of the products to enable the products to reach the set cooling temperature, and the test is carried out under the condition that the temperature is: the temperature that cold wind set for hardly reaches, and the temperature control scope is hardly controlled, and the radiating efficiency is very poor, and the demand time is longer, mainly used laboratory detection and can not be used for the on-line measuring of product.

Disclosure of Invention

The invention aims to solve the problems in the prior art and provide an electronic element online high-low temperature detection device, a high-low temperature test socket and a chip high-low temperature test method.

The purpose of the invention is realized by the following technical scheme:

electronic component is high low temperature detection device on line, including the test socket, the test base of test socket includes the base main part, set up mounting hole or groove in the base main part, the base main part is made for first heat conduction material, be provided with in the base main part and be located the heating device in mounting hole or groove outside and enclose and establish mounting hole or groove medium pipeline all around, the medium pipeline is the second heat conduction material, the coefficient of heat conductivity of second heat conduction material and first heat conduction material is all not less than 300W/m.K, cooling medium supply pipeline is connected to the entry end of medium pipeline, the delivery pipe is connected to the exit end of medium pipeline.

Preferably, in the electronic component online high-low temperature detection device, the first heat conduction material is a red copper alloy.

Preferably, in the online high and low temperature detection device for electronic components, the heating device is distributed outside the medium pipeline and has the same height.

Preferably, in the electronic component online high-low temperature detection device, the second heat conduction material is a silver-copper alloy.

Preferably, in the on-line high and low temperature detection device for electronic components, the medium conduit includes two capillary tubes, the inlet ends of the two capillary tubes are located on the same side of the base body, and the outlet ends of the two capillary tubes are located on the other side of the base body.

Preferably, in the electronic component online high-low temperature detection device, the medium pipe is fixed to the base main body by a heat-conducting adhesive mixed with graphite particles.

Preferably, in the electronic component on-line high/low temperature detection device, the base main body is provided with a temperature detection device having a sensitivity of ± 0.5 ︒ C.

Preferably, in the online high and low temperature detection device for electronic components, the discharge pipe is connected with a nitrogen recovery pipeline.

Preferably, in the online high and low temperature detection device for electronic components, the base main body is arranged in an openable and closable vacuum chamber, and the vacuum chamber is connected with a vacuum pumping system.

High low temperature detects socket, including test base and test lid, be provided with mounting hole or groove in the base main part of test base, the base main part is made for first heat conduction material, be provided with in the base main part and be located the heating device in mounting hole or the groove outside and enclose and establish mounting hole or groove medium pipeline all around, the medium pipeline is the second heat conduction material, the coefficient of heat conductivity of first heat conduction material and second heat conduction material is not less than 300W/m.K.

Preferably, in the high and low temperature detection socket, the base main body is provided with a connecting groove for installing the heating device, the base main body is provided with an installation groove for installing the medium pipeline, and the installation groove extends from the bottom surface to the top surface of the base main body and is close to the top surface of the base main body.

Preferably, in the high and low temperature detection socket, the first heat conduction material is a red copper alloy; the second heat conduction material is silver-copper alloy.

Preferably, in the high and low temperature detection socket, the medium pipeline is fixed in the mounting groove by a heat-conducting adhesive mixed with graphite particles.

Preferably, in the high and low temperature detection socket, a thermocouple with a sensitivity of ± 0.5 ︒ C is provided on the base main body.

Preferably, the chip high and low temperature detection method comprises the following steps:

s1, providing the online high and low temperature detection device for any electronic element;

s2, placing the chip on the test base, and closing the test gland of the test socket;

s3, performing high and low temperature impact test of the chip or heating the chip to a target high temperature for high temperature resistance test or reducing the chip to a target low temperature for low temperature resistance test while or before or after performing the functional integrity test of the chip; (ii) a

And S4, after the test is finished, opening the test gland of the test socket and taking out the chip.

Preferably, in the chip high and low temperature detection method, before the low temperature impact detection, the vacuum chamber is vacuumized.

The technical scheme of the invention has the advantages that:

this scheme is through directly integrating heating structure and cooling tube on test socket, and be connected cooling tube and coolant supply system, the efficiency problem of high temperature to microthermal radiating efficiency has been solved from the internal circulation system that can directly adopt the cooling liquid nitrogen, further combine the design to base main part and cooling tube material heat conductivity, heat-conduction with higher speed, the realization of the quick conversion of temperature has effectively been guaranteed, high microthermal quick impact has been formed, be favorable to improving efficiency of software testing, and can load in the on-line measuring system completely, realize the functional integrity test of electronic component under high low temperature environment, guarantee test structure's reliability and accuracy.

The shell of test socket is regarded as to this scheme chooseed for use red copper, and the cooling tube of liquid nitrogen mixed liquid is regarded as to the capillary silver-copper alloy, and the graphite heat-conducting glue is regarded as the heat transfer medium between cooling tube and red copper base main part, can effectively utilize the characteristic of material high thermal conductivity, has realized high-efficient, quick heat-conduction, guarantees to realize in 5-15 s' short time from high temperature to the impact process of ultra-low temperature, is favorable to improving efficiency of software testing.

This scheme adopts two cooling tube's structure, can guarantee the synchronism and the high efficiency that coolant carried, cools off electronic component simultaneously from both sides, avoids base main part and electronic component to produce great temperature difference and causes the damage, is favorable to guaranteeing stability and the security of test, increase of service life.

According to the scheme, the error of the temperature detection element with high precision can be effectively reduced, the control accuracy of the test temperature is guaranteed, the test requirement of the set temperature is met, the difficulty of temperature control is reduced, and the reliability and the service life of the test are guaranteed.

The whole test socket is arranged in the vacuum bin and connected with the vacuumizing system, so that the test socket can be in a vacuum environment during low-temperature impact test, the problem that the test socket and an electronic element are frosted due to low temperature is avoided, and the use stability of the test socket and the integrity of the electronic element are guaranteed.

Drawings

FIG. 1 is a perspective view of a test socket of the present invention;

FIG. 2 is a cross-sectional view of a test socket of the present invention;

FIG. 3 is a rear view of the test socket of the present invention;

FIG. 4 is a bottom view of the test socket of the present invention employing a mounting slot;

FIG. 5 is a bottom view of the test socket of the present invention employing two mounting slots;

FIG. 6 is a perspective view of an on-line high and low temperature detection device for electronic components of the present invention;

FIG. 7 is a top view of the on-line high and low temperature detection device for electronic components of the present invention;

fig. 8 is an enlarged view of the area a in fig. 7.

Detailed Description

Objects, advantages and features of the present invention will be illustrated and explained by the following non-limiting description of preferred embodiments. The embodiments are merely exemplary for applying the technical solutions of the present invention, and any technical solution formed by replacing or converting the equivalent thereof falls within the scope of the present invention claimed.

In the description of the schemes, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the embodiment, the operator is used as a reference, and the direction close to the operator is a proximal end, and the direction away from the operator is a distal end.

The electronic component on-line high and low temperature detection apparatus disclosed in the present invention is described below with reference to the accompanying drawings, in this embodiment, a test for a chip is taken as an example, as shown in fig. 1, the test apparatus includes a test socket 100, the test socket 1 can at least perform connectivity detection for each pin of the chip, the test socket 100 generally includes a hinged and openable test base 110 and a test cover 120, and the specific structures of the hinged and openable test base 110 and the test cover 120 can refer to the structures shown in application numbers 201220192127.4, 201310404709.3, 201220192114.7, and so on. Of course, in other embodiments, the structure of the socket may be adapted according to different testing requirements, such as the socket structures shown in application numbers 201410443449.5, 00137628.4, 201820288832.1, and the like.

The scheme innovatively integrates the heating structure and the cooling structure into the test base 110 of the existing test socket, and can realize heat conduction rapidly and efficiently through selection of base main body materials and cooling pipeline materials, so that the problem of heat dissipation efficiency from high temperature to low temperature is solved, rapid temperature conversion is realized, rapid impact of high and low temperature is formed, and the heating structure and the cooling structure can be completely loaded into an online detection system.

Specifically, as shown in fig. 1 and fig. 2, the test base 110 includes a base main body 111, a hole or a groove is formed in a center position of the base main body 111 for mounting a workpiece during a subsequent test, more preferably, a center hole 112 is formed in the base main body 111, a floating block 113 is disposed in the center hole 112, a positioning groove 114 is formed on the floating block 113 for placing an element to be tested, a set of through holes are formed at a bottom of the positioning groove for a test probe (not shown in the figure) to pass through, a probe assembly (not marked in the figure) fixed on the base main body 111 is disposed below the floating block 113, other structures of the test base 110 are known technologies, and details are not described herein.

As shown in fig. 2 and 3, in order to facilitate the installation of the heating device 200, two connecting slots 115 are provided on the base body 111 at two sides of the central hole 112, the axes of the two connecting slots 115 are parallel and slightly lower than the floating block 113, and the connecting slot 115 is located at the middle height of the base body 111, the connecting slot 115 extends linearly inward from the side of the base body 111 near the distal side edge of the central hole 112, the heating device 200 can be installed in the connecting slot 115 by interference fit, screw connection or adhesive bonding, and the heating device 200 is preferably a high-power heating resistor rod, and the heating device 200 can heat the base body 111, so as to heat the elements on the base body 111 by heat conduction, thereby realizing high-temperature testing. Of course, in other embodiments, the connecting slot 115 may be a hole.

Further, in order to realize rapid cooling of the base main body 111 for performing a low temperature impact test, as shown in fig. 1, a cooling duct 300 for conveying a cooling medium is further disposed in the base main body 111, specifically, as shown in fig. 1 to fig. 3, a mounting groove 116 for mounting the cooling duct 300 is formed on the base main body 111, two ends of the mounting groove 116 are located on the side surface of the base main body 111, the mounting groove 116 extends upward from the bottom surface of the base main body 111, and the depth of the mounting groove 116 is slightly smaller than the thickness of the base main body 111, more specifically, the top of the mounting groove 116 is equal to the bottom height of the floating block 113 in the central hole, so that the cooling duct 300 is as close to an element as possible, and the cooling rate is increased.

In order to cover different positions of the base main body 111 as much as possible to accelerate the rapid cooling of the whole base main body 111, the mounting groove 116 extends in a specific shape, and the specific shape is as follows:

in one embodiment, as shown in fig. 4, the mounting groove 116 is a single groove, and the inlet and outlet thereof are located at the same side of the base body 111, and the mounting groove 116 is a labyrinth or intestine extension. Of course, the mounting slots 116 may be distributed in other ways to cover the base body as much as possible.

In another embodiment, as shown in fig. 5, the two installation grooves 116 are symmetrically arranged, and the two installation grooves 116 extend in a labyrinth shape or an intestine shape. The inlet and outlet of each of the mounting grooves 116 are located at opposite sides of the base main body 111. Each of the mounting grooves 116 includes a first U-shaped portion 1161, an opening of the first U-shaped portion faces to the left side and two ends of the first U-shaped portion are respectively connected to a first linear extending portion 1162 and a second linear extending portion 1163 distributed in a zigzag shape, the second linear extending portion 1163 is located on the left side of the central hole and two ends of the second linear extending portion 1163 extend to the upper side and the lower side of the central hole 112, the first U-shaped portion, the first linear extending portion 1162 and the second linear extending portion 1163 are located between the connecting groove 115 and the central hole 112, that is, the connecting groove 115 is located on the outer side (left side) of the first U-shaped portion, the first linear extending portion 1162 and the second linear extending portion 1163. The other end of the second linear extending portion 1163 is connected to one end of the second U-shaped portion 1164, the opening of the second U-shaped portion 1164 is also directed to the left side, the other end of the second U-shaped portion 1164 is connected to the third U-shaped portion 1165, the opening of the third U-shaped portion 1165 faces upward, and the other end of the third U-shaped portion 1165 is connected to the third linear extending portion 1166.

As shown in fig. 1 to fig. 4, the number and the extension shape of the cooling pipes 300 are consistent with the number and the extension of the mounting grooves 116, and preferably two, and the cooling pipes 300 are preferably capillary tubes with a diameter not exceeding 3mm, which can better meet the assembly requirement of the small-sized test socket.

As shown in fig. 6 and 7, one end of the cooling pipe 300 is connected to the cooling medium supply line 400, and the other end of the cooling pipe 300 is connected to the discharge pipe 500 (of course, the discharge pipe 500 is not necessary and may be omitted). The cooling medium supply pipeline 400 generally includes a cooling medium storage source, a pipeline, a valve body, a flow meter, a pressure valve, etc., which are specifically known in the art and will not be described herein. The cooling medium supplied by the cooling medium supply pipeline 400 is preferably liquid nitrogen, during low-temperature test, the liquid nitrogen supplied by the cooling medium supply pipeline 400 enters into two cooling pipelines to evaporate and absorb heat of the base body and the elements on the base body, and vaporized nitrogen is discharged from the discharge pipe 500. And according to different low temperature requirements, a certain medium can be added into the liquid nitrogen to adjust the temperature of the supplied liquid nitrogen. Of course, in other embodiments, the cooling medium may be liquid helium, liquid argon, or other cooling gas or liquid capable of reaching the target cooling temperature. The drain 500 may extend to the outside of the room to avoid interference with the test environment.

Since the heating and cooling method is directly performed on the base body 110, the heat conduction efficiency of the material itself will greatly affect the heating and cooling efficiency, and therefore, in order to achieve the corresponding cooling rate, the base body 110 is made of the first heat dissipation material, the cooling duct 300 is made of the second heat dissipation material, and the heat conduction coefficients of the first heat dissipation material and the second heat dissipation material are not lower than 300W/m.k, and more preferably not lower than 350W/m.k.

Specifically, the first heat dissipation material is red copper, the second heat dissipation material is silver alloy, more specifically silver-copper alloy, and red copper and silver-copper alloy are selected because red copper itself has sufficient strength and heat conductivity, and after silver is added into copper, the cooling pipeline 300 can be ensured to have sufficient hardness while maintaining heat conductivity, and can better withstand the impact of rapid and wide-range temperature change, so as to ensure the structural stability, and meanwhile, the materials can effectively ensure that the element is reduced from high temperature to low temperature of a target within 5-15 s.

Further, in order to ensure the sufficient contact between the cooling duct 300 and the wall of the mounting groove 116 to accelerate heat conduction, the shape of the cooling duct 300 and the mounting groove 116 are matched, for example, when the cooling duct 300 is a circular pipe, the top of the mounting groove 116 is a corresponding circular arc; when the cooling pipe 300 is a square pipe, the mounting groove 116 is a rectangular groove having a diameter equivalent to that of the cooling pipe 300.

The cooling duct 300 can be disposed in the mounting groove 116 by clamping, but it is difficult to ensure the stability of the fixing of the cooling duct 300, so in a preferred embodiment, the cooling duct 300 is fixed in the mounting groove 116 by a heat-conducting adhesive, and the fitting degree of the cooling duct 300 and the contour of the mounting groove 116 can be reduced. In order to realize heat transfer more quickly, the heat conducting glue is filled with graphite particles, and due to the addition of the graphite particles, the heat conducting efficiency of the heat conducting glue can be further improved, so that the heat conduction is accelerated. Meanwhile, the floating block is preferably made of a material with good heat-conducting performance and insulation, and can be made of engineering plastics such as heat-conducting silicon rubber and PEEK. In the test, it is necessary to make the test temperature to have sufficient accuracy, and therefore, it is necessary to perform the temperature detection more accurately, and thus, as shown in fig. 1, 3 and 4, a temperature detection device 600 having a sensitivity of ± 0.5 ︒ C is provided on the base main body 111, and the temperature detection device 600 is preferably a thermocouple, so that it is possible to ensure that the temperature error is controlled within a range of ± 1 ︒ C.

In addition, the discharge pipe 500 is connected to a nitrogen recovery pipeline (not shown), which may be configured as shown in application No. 2016211284340, but may be configured in other ways, so as to better improve the utilization rate of liquid nitrogen.

Further, in the practical use process, it is found that, during the low-temperature cooling impact test, the frosting condition of the test socket and the elements thereon is likely to occur due to the low temperature, so as shown in fig. 6 to 8, the test socket is disposed in an openable and closable vacuum chamber 700, and the vacuum chamber 700 is connected to the vacuum pumping system 800. The vacuum chamber 700 comprises a square box body 710, one side of the box body 710 is hinged with a box cover 720, a lock catch 730 is arranged on the side of the box body 710, and a lock block 740 corresponding to the lock catch 730 is arranged on the box cover 720. Of course, the closed state of the box cover 720 and the box body 730 can be realized by other structures, for example, an electromagnetic lock or other lock structures. As shown in fig. 6 and 8, the base body is disposed in the box 710, and the cooling medium supply pipe 400 and the discharge pipe 500 are connected to the cooling pipe of the base body through external pipes 900 and 1000 disposed in the box 710, respectively.

When the electronic component online high-low temperature detection device is used for detecting the high and low temperatures of the chip, the method at least comprises the following steps: and simultaneously with or before or after the chip functional integrity test, performing a high-low temperature impact test on the chip or performing a high-temperature resistance test on the chip or performing a low-temperature resistance test on the chip.

In particular, the method comprises the following steps of,

and S1, providing the electronic component online high and low temperature detection device of the embodiment.

S2, opening the lid 720 and the test cover 120, placing the chip on the test base, and closing the test cover 120 and the lid 720 of the test socket.

And S3, starting a heating device to heat at the same time or before or after the functional integrity test (including but not limited to connectivity test) of the chip is carried out, and carrying out a high-temperature test when the set high temperature is reached after the temperature is tested by the temperature detection device. After the high-temperature test is completed, a vacuumizing system is opened to vacuumize the vacuum bin, then the cooling medium is conveyed into the two cooling pipelines through the cooling medium supply pipeline to carry out low-temperature impact detection, when the temperature detected by the temperature detection device reaches a set low temperature, the conveying of the cooling medium is reduced or the cooling medium supply pipeline is turned off, and the low temperature is maintained for a period of time until the test is completed.

Of course, in another embodiment, the chip may be heated to a target high temperature without low temperature impact or cooled to a target low temperature without high temperature test, for example, when the connectivity test of the chip pins in a high temperature state needs to be tested, the chip may be heated to the target high temperature first, and then the pin connectivity test is performed. For another example, when the leakage test is performed under low temperature conditions, the chip may be first lowered to a target low temperature, and then the leakage test may be performed.

And S4, after the test is finished, opening the test gland of the test socket and taking out the chip.

A new chip is placed again and the test process is repeated.

The invention has various embodiments, and all technical solutions formed by adopting equivalent transformation or equivalent transformation are within the protection scope of the invention.