1. An LED display that facilitates repair, comprising:

the display device comprises a display back plate, wherein a planarization layer is arranged in the display back plate, and a first electrode and a second electrode are arranged on the upper surface of the planarization layer;

the positive electrode and the negative electrode of the light-emitting diode chip are respectively bonded with the first extension electrode and the second extension electrode; wherein the first and second extension electrodes are connected to the first and second electrodes, respectively;

the groove is arranged at the orthographic projection of the light-emitting diode chip on the planarization layer, and the opening area of the groove is larger than the side area of the first side face of the light-emitting diode chip opposite to the groove; thermoplastic materials are arranged in the groove, the first extension electrode and the second extension electrode are arranged on the surface of the planarization layer and on two sides of the groove, and the thermoplastic materials are connected with the first extension electrode and the second extension electrode.

2. The LED display of claim 1, wherein the display backplane further comprises: the circuit layer is arranged on the substrate, and the planarization layer is arranged on the circuit layer.

3. The LED display facilitating repair of claim 2, wherein a melting point of a material of the first and second extension electrodes is lower than a melting point of a material of the first and second electrodes.

4. The LED display facilitating repair of claim 3, wherein an area of the circuit layer that is orthographic to the recess is a circuit-free area.

5. The repair-facilitating LED display of claim 3, wherein the thermoplastic material comprises: polyolefins, cellulosics, polyether polyesters or heteroaromatic polymers.

6. The LED display facilitating repair of any of claims 1 to 5, wherein the bottom end of the planarization layer is provided with a signal line contact and a gate line contact, the signal line contact is connected to the first electrode, and the gate line contact is connected to the second electrode.

7. The LED display facilitating repair of claim 6, wherein the planarization layer defines a first via and a second via, the first via and the second via being filled with a conductive material, the signal line contact being electrically connected to the first electrode through the conductive material in the first via, and the gate line contact being electrically connected to the second electrode through the conductive material in the second via.

8. A repair method for repairing the LED display facilitating repair as set forth in any one of claims 1 to 7, comprising:

when the LED chip on the display back plate is detected to be damaged, the thermoplastic material in the groove and the first extension electrode and the second extension electrode which are connected with the thermoplastic material are heated by laser; after the first extension electrode and the second extension electrode are melted and the thermoplastic material is liquefied, the light-emitting diode chip falls into the groove;

and binding a new light-emitting diode chip above the groove, wherein the positive electrode and the negative electrode of the new light-emitting diode chip are bonded with the first electrode and the second electrode on the display backboard.

9. The repair method of claim 8, wherein the display backplane comprises a substrate and a circuit layer, the circuit layer is disposed on the substrate, the planarization layer is disposed on the circuit layer, and the heating the thermoplastic material in the groove and the first and second extension electrodes connected to the thermoplastic material with the laser comprises:

and irradiating laser to enable the laser to sequentially penetrate through the substrate and the circuit layer and to be injected into the groove so as to heat the thermoplastic material in the groove and the first extension electrode and the second extension electrode which are connected with the thermoplastic material.

10. The repair method of claim 8, wherein prior to heating the thermoplastic material within the groove and the first and second extended electrodes coupled to the thermoplastic material, the method further comprises:

determining a repair position to be repaired on the display back plate, wherein at least one light emitting diode chip is bound in the repair position;

and setting a mask plate to the area except the repair position on the display back plate.

Background

The Micro light-emitting diode (Micro LED), namely the light-emitting diode Micro and matrixing technology, has the advantages of good stability, long service life and operation temperature, simultaneously has the advantages of low power consumption, color saturation, high reaction speed, strong contrast and the like of the LED, and has great application prospect.

The display screen made of the micro light-emitting diode is the mainstream development direction of display equipment in the future; in the existing process, after the light emitting diode chips are transferred to the display backboard, each light emitting diode chip on the display backboard needs to be detected, and when the light emitting diode chips with damage or poor contact are found, the light emitting diode chips need to be replaced; in the existing repair and replacement process, the damaged light emitting diode chip needs to be picked up from the display back plate, and then the good light emitting diode chip is bonded at the corresponding position again; the process is complicated and not beneficial to the rapid production of the product.

Disclosure of Invention

In order to overcome the above-mentioned drawbacks, the present invention provides an LED display and a repair and replacement method thereof, which facilitate quick replacement of LED chips.

The purpose of the invention is realized by the following technical scheme:

the invention relates to an LED display convenient to repair, which comprises:

the display device comprises a display back plate, wherein a planarization layer is arranged in the display back plate, and a first electrode and a second electrode are arranged on the upper surface of the planarization layer;

the light emitting diode chip comprises a positive electrode and a negative electrode, wherein the positive electrode and the negative electrode of the light emitting diode chip are respectively bonded with a first extension electrode and a second extension electrode, and the first extension electrode and the second extension electrode are respectively connected with the first electrode and the second electrode;

the groove is arranged at the orthographic projection of the light-emitting diode chip on the planarization layer, and the opening area of the groove is larger than the side area of the first side face of the light-emitting diode chip opposite to the groove; thermoplastic materials are arranged in the groove, the first extension electrode and the second extension electrode are arranged on the surface of the planarization layer and on two sides of the groove, and the thermoplastic materials are connected with the first extension electrode and the second extension electrode.

In the present invention, the display back plate further comprises: the circuit layer is arranged on the substrate, and the planarization layer is arranged on the circuit layer.

In the present invention, the melting point of the material of the first and second extension electrodes is lower than the melting point of the material of the first and second electrodes.

In the invention, the area of the circuit layer, which is orthographic projected to the groove, is a circuit-free area.

In the present invention, the thermoplastic material comprises: polyolefins, cellulosics, polyether polyesters or heteroaromatic polymers.

In the invention, a signal line contact point and a gate line contact point are arranged at the bottom end of the planarization layer, the signal line contact point is connected with the first electrode, and the gate line contact point is connected with the second electrode.

In the invention, the planarization layer is provided with a first through hole and a second through hole, conductive materials are filled in the first through hole and the second through hole, the signal line contact point is electrically connected with the first electrode through the conductive materials in the first through hole, and the gate line contact point is electrically connected with the second electrode through the conductive materials in the second through hole.

The present invention is a repair method for repairing the LED display which facilitates repair as described above, comprising:

when the LED chip on the display back plate is detected to be damaged, the thermoplastic material in the groove and the first extension electrode and the second extension electrode which are connected with the thermoplastic material are heated by laser; after the first extension electrode and the second extension electrode are melted and the thermoplastic material is liquefied, the light-emitting diode chip falls into the groove;

and binding a new light-emitting diode chip above the groove, wherein the positive electrode and the negative electrode of the new light-emitting diode chip are bonded with the first electrode and the second electrode on the display backboard.

In the present invention, the display back plate includes a substrate and a circuit layer, the circuit layer is disposed on the substrate, the planarization layer is disposed on the circuit layer, and the heating of the thermoplastic material in the groove and the first and second extension electrodes connected to the thermoplastic material by using laser includes:

and irradiating laser to enable the laser to sequentially penetrate through the substrate and the circuit layer and to be injected into the groove so as to heat the thermoplastic material in the groove and the first extension electrode and the second extension electrode which are connected with the thermoplastic material.

In the present invention, before heating the thermoplastic material in the groove and the first and second extension electrodes connected to the thermoplastic material, the method further includes:

determining a repair position to be repaired on the display back plate, wherein at least one light emitting diode chip is bound in the repair position;

and setting a mask plate to the area except the repair position on the display back plate.

In the LED display, the diode chip is arranged on the groove through the extension electrode and the thermoplastic material, so that when the diode chip is detected to be replaced in the production process, the extension electrode is melted through laser and the thermoplastic material is liquefied, the diode chip directly falls into the groove, and a new diode chip can be bonded in situ without picking up the diode chip from the display back plate; the production efficiency is greatly improved, and the rapid production of products is facilitated.

Drawings

For the purpose of easy explanation, the present invention will be described in detail with reference to the following preferred embodiments and the accompanying drawings.

FIG. 1 is a schematic diagram of an LED display 1 for easy repair according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of the structure of an LED display embodiment 2 for easy repair according to the present invention;

FIG. 3 is a schematic flowchart of the working process of embodiment 3 of the repairing method for LED display according to the present invention;

FIG. 4 is a schematic flowchart of an embodiment 4 of the repair method for an LED display according to the present invention;

fig. 5 is a schematic diagram of the operation principle of step S203 in embodiment 4 of the present invention;

fig. 6 is a schematic diagram illustrating an operation principle of step S204 in embodiment 4 of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the description of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Example 1

An LED display for facilitating repair according to the present invention is described in detail below with reference to fig. 1, which includes:

the display back plane 100, the substrate 101, the circuit layer 102 and the planarization layer 103 disposed from bottom to top in the display back plane 100, wherein the substrate 101 may include a transparent glass material, such as: silicon dioxide (SiO 2). The substrate 101 may also comprise a transparent plastic material, such as: organic materials such as polyether sulfone (PES), Polyacrylate (PAR), polyether imide (PEI), polyethylene terephthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide, Polycarbonate (PC), cellulose Triacetate (TAC), or cellulose propionate (CAP); the circuit layer 102 includes a driving circuit for driving the LED chip, such as: thin film transistors TFT, gate lines, signal lines, and the like; the planarization layer 103 covers the circuit layer 102, and can eliminate the step difference on the circuit layer 102 to planarize it. The planarization layer 103 may include organic materials such as: polymethyl methacrylate (PMMA) or Polystyrene (PS), a polymer derivative having a phenol group, a propylene-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, or any combination thereof.

A first electrode 104 and a second electrode 105 are arranged on the upper surface of the planarization layer 103, a signal line contact 106 and a gate line contact are arranged at the bottom end of the planarization layer 103, a through hole 108 is arranged between the first electrode 104 and the second electrode 105 and between the signal line contact 106 and the gate line contact 107, a conductive material is filled in the through hole 108, the signal line contact 106 is connected with the first electrode 104 through the conductive material, and the gate line contact 107 is connected with the second electrode 105 through the conductive material; the conductive material, the signal line contact 106, and the gate line contact 107 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu), or the like. And the first electrode 104 and the second electrode 105 are disposed on the same horizontal plane, which facilitates the production of the display back plate 100.

A light emitting diode chip 200 is arranged above the planarization layer 103, positive and negative electrodes of the light emitting diode chip 200 are electrically connected with a first extension electrode 109 and a second extension electrode 110 respectively, the first extension electrode 109 is connected with the first electrode 104, and the second extension electrode 110 is connected with the second electrode 105; the melting point of the material of the first and second extension electrodes 109 and 110 is lower than that of the material of the first and second electrodes 104 and 105, wherein the first and second extension electrodes 109 and 110 are made of a metal/alloy material with a lower melting point, such as: lead (Al), tin (Sn), zinc (Zn), and the like; the first electrode 104 and the second electrode 105 are made of metal/alloy materials with higher melting points, such as: copper (Cu), iron (Fe), chromium (Cr), and the like.

Optionally, the first extension electrode 109 is a horizontal extension of the first electrode 104, and the second extension electrode 110 is a horizontal extension of the second electrode 105. And, the two horizontal extension parts are oppositely extended. For example, the first extension electrode 109 and the second extension electrode 110 extend toward the center point of the first electrode 104 and the second electrode 105, which is the origin.

In another embodiment, a connection mode of connecting the first extension electrode 109 with the second electrode 105 and connecting the second extension electrode 110 with the first electrode 104 may be adopted. At this time, the first extension electrode 109 is a horizontal extension of the second electrode 105, and the second extension electrode 110 is a horizontal extension of the first electrode 104. And, the two horizontal extension parts are oppositely extended. For example, the first extension electrode 109 and the second extension electrode 110 extend toward the center point of the first electrode 104 and the second electrode 105, which is the origin.

Optionally, the first extension electrode 109 is the same length as the second extension electrode 110.

A groove 112 is formed in the planarization layer 103, the groove 112 is disposed at an orthographic projection of the led chip 200 on the planarization layer 103, and an opening area of the groove 112 is larger than a side area of a first side surface of the led chip 200 opposite to the groove 112; wherein, the width W and the height H of the bottom surface of the groove 112 are both greater than the width W and the height H of the led chip 200, so that the groove 112 can completely accommodate the led chip 200, and the thermoplastic material 111 is disposed in the groove 112, wherein the thermoplastic material 111 includes: polyolefins, cellulosics, polyether polyesters and heteroaromatic polymers; and the polyolefin comprises: vinyl, olefin, styrene, acrylate, fluoroalkene, and the like. The first extension electrode 109 and the second extension electrode 110 are disposed on the surface of the planarization layer 103 and on two sides of the groove 112, and the thermoplastic material 111 is connected to the first extension electrode 109 and the second extension electrode 110. And the orthographic projection area of the circuit layer 102 below the groove 112 is a circuit-free area, and no electronic device is arranged in the circuit-free area, so that the device is prevented from being damaged during laser irradiation.

Example 2

An LED display for facilitating repair according to the present invention is described in detail below with reference to another embodiment, which is shown in fig. 2 and includes:

the display back plane 100, the substrate 101, the circuit layer 102 and the planarization layer 103 disposed from bottom to top in the display back plane 100, wherein the substrate 101 may include a transparent glass material, such as: silicon dioxide (SiO 2). The substrate 101 may also comprise a transparent plastic material, such as: organic materials such as polyether sulfone (PES), Polyacrylate (PAR), polyether imide (PEI), polyethylene terephthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide, Polycarbonate (PC), cellulose Triacetate (TAC), or cellulose propionate (CAP); the circuit layer 102 includes a driving circuit for driving the LED chip, such as: thin film transistors TFT, gate lines, signal lines, and the like; the planarization layer 103 covers the circuit layer 102, and can eliminate the step difference on the circuit layer 102 to planarize it. The planarization layer 103 may include organic materials such as: polymethyl methacrylate (PMMA) or Polystyrene (PS), a polymer derivative having a phenol group, a propylene-based polymer, an imide-based polymer, an aryl ether-based polymer, an amide-based polymer, a fluorine-based polymer, a p-xylene-based polymer, a vinyl alcohol-based polymer, or any combination thereof.

A first electrode 104 and a second electrode 105 are arranged on the upper surface of the planarization layer 103, a signal line contact 106 and a gate line contact 107 are arranged at the bottom end of the planarization layer 103, a through hole 108 is arranged between the first electrode 104 and the second electrode 105 and between the signal line contact 106 and the gate line contact 107, a conductive material is filled in the through hole 108, the signal line contact 106 is connected with the first electrode 104 through the conductive material, and the gate line contact 107 is connected with the second electrode 105 through the conductive material; the conductive material, the signal line contact 106, and the gate line contact 107 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu), or the like. In addition, the first electrode 104 and the second electrode 105 are disposed at different horizontal heights, that is, the height H1 from the bottom end of the planarization layer 103 of the first electrode 104 is not equal to the height H2 from the bottom end of the planarization layer 103 of the second electrode 105, and the electrode positions of the vertically repaired led chip 200 are designed correspondingly, so that the led chip 200 is aligned with the first electrode 104 and the second electrode 105, in this embodiment, the first electrode 104 and the second electrode 105 are disposed at different horizontal heights, which is not only beneficial to the position clamping of the vertically repaired led chip 200, but also can prevent the first electrode 104 and the second electrode 105 in the vertically repaired led chip 200 from being reversed.

A light emitting diode chip 200 is arranged above the planarization layer 103, positive and negative electrodes of the light emitting diode chip 200 are electrically connected with a first extension electrode 109 and a second extension electrode 110 respectively, the first extension electrode 109 is connected with the first electrode 104, and the second extension electrode 110 is connected with the second electrode 105; the melting point of the material of the first and second extension electrodes 109 and 110 is lower than that of the material of the first and second electrodes 104 and 105, wherein the first and second extension electrodes 109 and 110 are made of a metal/alloy material with a lower melting point, such as: lead (Al), tin (Sn), zinc (Zn), and the like; the first electrode 104 and the second electrode 105 are made of metal/alloy materials with higher melting points, such as: copper (Cu), iron (Fe), chromium (Cr), and the like.

Optionally, the first extension electrode 109 is a horizontal extension of the first electrode 104, and the second extension electrode 110 is a horizontal extension of the second electrode 105. And, the two horizontal extension parts are oppositely extended. For example, the first extension electrode 109 and the second extension electrode 110 extend toward the center point of the first electrode 104 and the second electrode 105, which is the origin.

In another embodiment, a connection mode of connecting the first extension electrode 109 with the second electrode 105 and connecting the second extension electrode 110 with the first electrode 104 may be adopted. At this time, the first extension electrode 109 is a horizontal extension of the second electrode 105, and the second extension electrode 110 is a horizontal extension of the first electrode 104. And, the two horizontal extension parts are oppositely extended. For example, the first extension electrode 109 and the second extension electrode 110 extend toward the center point of the first electrode 104 and the second electrode 105, which is the origin.

Optionally, the first extension electrode 109 is the same length as the second extension electrode 110.

A groove 112 is formed in the planarization layer 103, the groove 112 is disposed at an orthographic projection of the led chip 200 on the planarization layer 103, and an opening area of the groove 112 is larger than a side area of a first side surface of the led chip 200 opposite to the groove 112; wherein, the width W and the height H of the bottom surface of the groove 112 are both greater than the width W and the height H of the led chip 200, so that the groove 112 can completely accommodate the led chip 200, and the thermoplastic material 111 is disposed in the groove 112, wherein the thermoplastic material 111 includes: polyolefins, cellulosics, polyether polyesters and heteroaromatic polymers; and the polyolefin comprises: vinyl, olefin, styrene, acrylate, fluoroalkene, and the like. The first extension electrode 109 and the second extension electrode 110 are disposed on the surface of the planarization layer 103 and on two sides of the groove 112, and the thermoplastic material 111 is connected to the first extension electrode 109 and the second extension electrode 110. And the orthographic projection area of the circuit layer 102 below the groove 112 is a circuit-free area, and no electronic device is arranged in the circuit-free area, so that the device is prevented from being damaged during laser irradiation.

Example 3

An embodiment of the method for repairing an LED display according to the present invention is described in detail below, with reference to fig. 3, which includes:

s101, heating the extension electrode and the thermoplastic material by laser.

The display back plate comprises a substrate and a circuit layer, wherein the circuit layer is arranged on the substrate, the planarization layer is arranged on the circuit layer, and when the damage of the light emitting diode chip 200 on the display back plate 100 is detected, laser is irradiated to enable the laser to sequentially penetrate through the substrate 101 and the circuit layer 102 in the display back plate 100 and enter the groove 112, so that the thermoplastic material 111 in the groove 112 and the first extension electrode 109 and the second extension electrode 110 connected with the thermoplastic material 111 are heated.

S102, the light emitting diode chip falls into the groove.

After the laser heating, since the melting points of the first extension electrode 109 and the second extension electrode 110 are low, the first extension electrode 109 and the second extension electrode 110 are melted and the thermoplastic material 111 is liquefied, and the first extension electrode 109, the second extension electrode 110 and the thermoplastic material 111 form a molten slurry, the light emitting diode chip 200 falls into the groove 112 together with the molten slurry under the self gravity. Since the first extension electrode 109 and the second extension electrode 110 are made of metal/alloy material having a lower melting point, for example: lead (Al), tin (Sn), zinc (Zn), and the like; the first electrode 104 and the second electrode 105 are made of metal/alloy materials with higher melting points, such as: copper (Cu), iron (Fe), chromium (Cr), and the like; therefore, after the first and second extension electrodes 109 and 110 are melted, the first and second electrodes 104 and 105 remain in the original state. Since the width W and the height H of the bottom surface of the groove 112 are both greater than the width W and the height H of the led chip 200, the groove 112 can completely accommodate the led chip 200.

And S103, mounting and bonding a new light emitting diode chip.

Since the LED chip 200 to be replaced falls into the groove 112, which results in a vacancy in the mounting position of the original LED chip 200, a new LED chip 200 can be placed above the groove 112, and the new LED chip 200 is bonded to the first electrode 104 and the second electrode 105 on the display backplate 100, so as to obtain the repaired LED display.

Example 4

An embodiment of the method for repairing an LED display according to the present invention is described below with reference to fig. 4 to 6, which includes:

s201, covering a non-positioned area with a mask plate.

When detecting that the light emitting diode chip 200 on the display back plate 100 is damaged, determining a repair position to be repaired on the display back plate 100, wherein at least one light emitting diode chip is bound in the repair position; and arranging a mask plate 300 to the area of the display backboard except the repair position to prevent laser from irradiating other areas of the display backboard 100 to damage the electronic device.

S202, heating the extension electrode and the thermoplastic material by laser.

The laser passes through the gap between the mask plates 300, and since the display backplate includes a substrate and a circuit layer disposed on the substrate, and the planarization layer is disposed on the circuit layer, the laser passing through the gap between the mask plates 300 passes through the substrate 101 and the circuit layer 102 in the display backplate 100 in sequence, and enters the groove 112, and heats the thermoplastic material 111 in the groove 112, and the first extension electrode 109 and the second extension electrode 110 connected to the thermoplastic material 111.

S203, the light emitting diode chip falls into the groove.

After the laser heating, since the melting points of the first extension electrode 109 and the second extension electrode 110 are low, the first extension electrode 109 and the second extension electrode 110 are melted and the thermoplastic material 111 is liquefied, and the first extension electrode 109, the second extension electrode 110 and the thermoplastic material 111 form a molten slurry, the light emitting diode chip 200 falls into the groove 112 together with the molten slurry under the self gravity. Since the first extension electrode 109 and the second extension electrode 110 are made of metal/alloy material having a lower melting point, for example: lead (Al), tin (Sn), zinc (Zn), and the like; the first electrode 104 and the second electrode 105 are made of metal/alloy materials with higher melting points, such as: copper (Cu), iron (Fe), chromium (Cr), and the like; therefore, after the first and second extension electrodes 109 and 110 are melted, the first and second electrodes 104 and 105 remain in the original state. Since the width W and the height H of the bottom surface of the groove 112 are both greater than the width W and the height H of the led chip 200, the groove 112 can completely accommodate the led chip 200.

And S204, mounting and bonding a new light emitting diode chip.

Since the LED chip 200 to be replaced falls into the groove 112, which results in a gap in the mounting position of the original LED chip 200, a new LED chip 400 can be placed above the groove 112, and the new LED chip 400 is bonded to the first electrode 104 and the second electrode 105 on the display backplane 100, so as to obtain the repaired LED display.

In the description of the present specification, reference to the description of the terms "one embodiment", "some embodiments", "an illustrative embodiment", "an example", "a specific example", or "some examples", etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.