1. A preparation method of a full-covered metal layer on a ceramic surface is characterized by comprising the following steps:

s1: grinding the surface of the ceramic to form an initial roughened surface, placing the ceramic into acid liquid after primary grinding, and performing secondary chemical roughening treatment;

s2: cleaning the surface of the ceramic, putting the ceramic into an alkaline solution for neutralization, washing the ceramic by water liquid, and cleaning the ceramic again by combining an ultra-wind wave cleaning mode and a cleaning fan;

s3: preparing a resin coating;

s4: uniformly spraying the resin coating on the surface of the insulating ceramic, and curing;

s5: putting the solidified ceramic into a vacuum container, and plating a copper film layer on the surface of the ceramic through vacuum degree to further improve the conductivity of the surface of the ceramic;

s6: plating treatment is carried out on the surface of the ceramic through electroplating, and an alloy film layer is formed outside the copper film layer through electroplating.

2. The method for preparing the fully covered metal layer on the ceramic surface according to claim 1, wherein the method comprises the following steps: the acidic liquid of S1 can be one or more of hydrofluoric acid and concentrated phosphoric acid.

3. The method for preparing the fully covered metal layer on the ceramic surface according to claim 1, wherein the method comprises the following steps: the resin coating layer: the conductive coating is formed by combining resin, conductive particles, an organic solvent, a hardening agent and solid fillers.

4. The method for preparing the fully covered metal layer on the ceramic surface according to claim 3, wherein the method comprises the following steps: the resin coating comprises the following components in parts by weight: 5-20% of resin, 30-50% of conductive particles, 5-15% of hardener and 15-25% of organic solvent.

5. The method for preparing the fully covered metal layer on the ceramic surface according to claim 3, wherein the method comprises the following steps: the resin can be one or more of polyethylene, polypropylene, polyvinyl chloride, polystyrene, ABS resin, polyester, polycarbonate and polyurethane.

6. The method for preparing the fully covered metal layer on the ceramic surface according to claim 3, wherein the method comprises the following steps: the conductive particles can be one or more of carbon nanotubes, graphene, graphite and metal particles.

7. The method for preparing the fully covered metal layer on the ceramic surface according to claim 3, wherein the method comprises the following steps: the hardener can be one or more of ethylenediamine, diethylenetriamine, triethylene tetramine, tetraethylene pentamine, polyethylene polyamine, isophorone diamine, diamino dicyclohexyl methane, methyl cyclopentane diamine and diamine methyl cyclohexane diamine.

8. The method for preparing the fully covered metal layer on the ceramic surface according to claim 3, wherein the method comprises the following steps: the organic solvent can be one or more of styrene, perchloroethylene, trichloroethylene, ethylene glycol ether and triethanolamine.

9. The method for preparing the fully covered metal layer on the ceramic surface according to claim 1, wherein the method comprises the following steps: the curing temperature in the step S4 is 50-100 ℃, the thickness of the copper film layer in the step S5 is 0.3-0.5mm, the thickness of the alloy film layer in the step S6 is 0.1-0.3mm, and the alloy film layer can be made of iron-chromium-nickel alloy.

Background

Modern ceramic materials have been developed from traditional silicate materials to composite materials which involve force, heat, electricity, sound, light and combinations thereof, and which have ceramic properties and metallic properties by metallizing the surface of the ceramic material, and their use and research have also become more and more important.

The existing ceramic surface coating and ceramic surface are mostly coated on the ceramic only through simple vacuum degree, the adhesion between the ceramic surface coating and the ceramic surface is poor, and the coating is easy to fall off.

Disclosure of Invention

The invention aims to provide a preparation method of a full-covered metal layer on a ceramic surface, which aims to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: a method for preparing a full-covered metal layer on a ceramic surface comprises the following steps:

s1: grinding the surface of the ceramic to form an initial roughened surface, placing the ceramic into acid liquid after primary grinding, and performing secondary chemical roughening treatment;

s2: cleaning the surface of the ceramic, putting the ceramic into an alkaline solution for neutralization, washing the ceramic by water liquid, and cleaning the ceramic again by combining an ultra-wind wave cleaning mode and a cleaning fan;

s3: preparing a resin coating;

s4: uniformly spraying the resin coating on the surface of the insulating ceramic, and curing;

s5: putting the solidified ceramic into a vacuum container, and plating a copper film layer on the surface of the ceramic through vacuum degree to further improve the conductivity of the surface of the ceramic;

s6: plating treatment is carried out on the surface of the ceramic through electroplating, and an alloy film layer is formed outside the copper film layer through electroplating.

Preferably, the acidic liquid of S1 may be one or more of hydrofluoric acid and concentrated phosphoric acid.

Preferably, the resin coating: the conductive coating is formed by combining resin, conductive particles, an organic solvent, a hardening agent and solid fillers.

Preferably, the resin coating comprises the following components in parts by weight: 5-20% of resin, 30-50% of conductive particles, 5-15% of hardener and 15-25% of organic solvent.

Preferably, the resin can be one or more of polyethylene, polypropylene, polyvinyl chloride, polystyrene, ABS resin, polyester, polycarbonate and polyurethane.

Preferably, the conductive particles may be one or more of carbon nanotubes, graphene, graphite, and metal particles.

Preferably, the hardener can be one or more of ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, polyethylene polyamine, isophorone diamine, diaminodicyclohexylmethane, methylcyclopentadiene, and diamine methylcyclohexanediamine.

Preferably, the organic solvent may be one or more of styrene, perchloroethylene, trichloroethylene, ethylene glycol ether and triethanolamine.

Preferably, the curing temperature in the step S4 is 50 to 100 ℃, the thickness of the copper film layer in the step S5 is 0.3 to 0.5mm, the thickness of the alloy film layer in the step S6 is 0.1 to 0.3mm, and the alloy film layer may be made of iron-chromium-nickel alloy.

The invention has the technical effects and advantages that: this ceramic surface all standing metal level preparation method, form initial coarsing face through polishing at ceramic surface and carry out two steps of operations such as chemical coarsing processing to ceramic surface through acid liquid, can guarantee that the pottery has the uneven surface of pot and hole, and then guarantee that follow-up coating or coating add man-hour coating or coating have fine attachment point, avoid coating or coating drop when adding man-hour, through scribbling resin coating to ceramic surface, resin coating can conveniently supply the conducting layer to adhere to in the course of the work, and then further improve ceramic surface's electric conductivity, and then make things convenient for operations such as follow-up electroplating vacuum plating, conveniently carry out multilayer coating to ceramic surface and handle. The preparation method of the fully-covered metal layer on the ceramic surface has reasonable design, can ensure that the ceramic has a dimpled and uneven surface during work, ensures that a good attachment point exists, facilitates subsequent plating treatment, and is suitable for popularization and use.

Detailed Description

The technical solutions in the embodiments of the present invention are clearly and completely described, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The invention provides a preparation method of a full-covered metal layer on a ceramic surface, which comprises the following steps:

s1: grinding the surface of the ceramic to form an initial roughened surface, placing the ceramic into an acidic liquid after primary grinding, and performing secondary chemical roughening treatment (the ceramic can be ensured to have a dimpled and uneven surface, so that the coating or coating has good attachment points when subsequent coating or coating is processed, and the coating or coating is prevented from falling off when the coating or coating is processed);

s2: cleaning the surface of the ceramic, putting the ceramic into an alkaline solution for neutralization, washing the ceramic by water liquid, and cleaning the ceramic again by combining an ultra-wind wave cleaning mode and a cleaning fan;

s3: preparing a resin coating;

s4: uniformly spraying the resin coating on the surface of the insulating ceramic, and curing;

s5: putting the solidified ceramic into a vacuum container, plating a copper film layer on the surface of the ceramic through vacuum degree, and further improving the conductivity of the surface of the ceramic (the copper film layer can be carried out in a vacuum plating mode, and the vacuum plating can adopt one or more of vacuum evaporation plating, sputtering plating and ion plating);

s6: plating treatment is carried out on the surface of the ceramic through electroplating, and an alloy film layer is formed outside the copper film layer through electroplating.

Specifically, the acidic liquid of S1 may be one or more of hydrofluoric acid and concentrated phosphoric acid.

Specifically, the resin coating layer: by resin, conductive particles, organic solvent, hardener, solid filler combination form (resin coating can conveniently supply the conducting layer to adhere to in the course of the work, and then further improve ceramic surface's electric conductivity, and then make things convenient for operations such as follow-up electroplating vacuum plating, conveniently carry out multilayer coating film to ceramic surface and handle, conductive particles's setting can improve ceramic surface's coefficient of conductivity, and the granule can provide a coarse fine confession adnexed point of attachment simultaneously, cladding material operations such as convenient follow-up electroplating).

Specifically, the resin coating comprises the following components in parts by weight: 5-20% of resin, 30-50% of conductive particles, 5-15% of hardener and 15-25% of organic solvent.

Specifically, the resin may be one or more of polyethylene, polypropylene, polyvinyl chloride, polystyrene, ABS resin, polyester, polycarbonate, and polyurethane.

Specifically, the conductive particles may be one or more of carbon nanotubes, graphene, graphite, and metal particles.

Specifically, the hardener may be one or more of ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, polyethylene polyamine, isophorone diamine, diaminodicyclohexylmethane, methylcyclopentadiene, and diamine methylcyclohexanediamine.

Specifically, the organic solvent may be one or more of styrene, perchloroethylene, trichloroethylene, ethylene glycol ether and triethanolamine.

Specifically, the curing temperature in S4 is 50-100 ℃, the thickness of the copper film layer in S5 is 0.3-0.5mm, the thickness of the alloy film layer in S6 is 0.1-0.3mm, and the alloy film layer may be fe-cr-ni alloy.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.