1. The utility model provides a full-automatic balance machine of chip, includes PLC, its characterized in that still includes:

the screening mechanism is used for enabling the front surfaces of the chips to face upwards and be sequentially arranged;

the industrial camera is used for photographing the front images of the chips arranged by the screening mechanism and transmitting image signals to the PLC;

the PLC controls the alignment mechanism to drive the chip to horizontally rotate so as to enable the chip to rotate to a required position;

the tray placing mechanism is used for placing a tray on a station;

the chip manipulator is used for grabbing the chip from the screening mechanism and transferring the chip to the aligning mechanism for aligning, grabbing the chip on the station of the aligning mechanism and moving the chip into the material tray on the material tray placing mechanism, the material tray placing mechanism drives the material tray to horizontally move, and the chip manipulator is matched with the chip manipulator to place the chip in sequence.

2. The full-automatic chip tray arranging machine according to claim 1, characterized in that: screening mechanism, industrial camera and alignment mechanism constitute feed mechanism jointly, feed mechanism has two sets ofly, and is located the both sides of chip manipulator respectively.

3. The full-automatic chip tray arranging machine according to claim 1, characterized in that: screening mechanism includes vibration dish and sharp feeder, the discharge end of vibration dish communicates with the pan feeding end of sharp feeder.

4. The full-automatic chip tray arranging machine according to claim 1, characterized in that: the aligning mechanism comprises a first motor and a rotating platform, and the first motor drives the rotating platform to rotate.

5. The full-automatic chip tray arranging machine according to claim 1, characterized in that: the tray swinging mechanism comprises a first X-axis mechanism, a first Y-axis mechanism and a first tray seat, the first X-axis mechanism drives the first Y-axis mechanism to move back and forth along the X-axis direction, the first Y-axis mechanism drives the first tray seat to move back and forth along the Y-axis direction, and the tray is positioned on the first tray seat.

6. The full-automatic chip tray arranging machine according to claim 1, characterized in that: chip manipulator includes second X axle slide rail, second slider, second Z axle slide rail, swing mechanism, arm and sucking disc, second X axle slide rail sets up along X axle direction, the second slider slides and sets up on second X axle slide rail, second Z axle slide rail is slided along Z axle direction and is established on the second slider, swing mechanism drive second Z axle slide rail is at the plane parallel with X axle, Z axle swing back and forth, the arm is fixed on second Z axle slide rail, the sucking disc is fixed to be set up at the lower extreme of arm.

7. The full-automatic chip tray arranging machine according to any one of claims 1 to 6, characterized in that: the material tray feeding mechanism comprises a third motor, a third screw rod assembly and a third material tray seat, the third motor drives the third screw rod assembly to further drive the third material tray seat to move back and forth along the Z-axis direction, and the third material tray seat is located on one side of the material tray swinging mechanism.

8. The full-automatic chip tray arranging machine according to claim 7, characterized in that: the material tray discharging mechanism comprises a fourth motor, a fourth screw rod assembly and a fourth material tray seat, the fourth motor drives the fourth screw rod assembly to drive the fourth material tray seat to move back and forth along the Z-axis direction, and the third material tray seat and the fourth material tray seat are respectively located on two sides of the material tray swinging mechanism.

9. The full-automatic chip tray arranging machine according to claim 8, characterized in that: the material tray mechanical arm is located above the material tray swinging mechanism and comprises a fifth X-axis mechanism, a fifth Z-axis mechanism and a clamping jaw mechanism, the fifth X-axis mechanism drives the fifth Z-axis mechanism to move back and forth along the X-axis direction, and the fifth Z-axis mechanism drives the clamping jaw mechanism to move back and forth along the Z-axis direction.

10. The full-automatic chip tray arranging machine according to claim 9, characterized in that: the clamping jaw mechanisms are divided into two groups.

Background

The chip is used as a semiconductor element and is generally used in various electronic products, the chip generally has a small volume, the back surface of the chip is made of plastic, a rectangular metal block is embedded in the front surface of the chip, and a chamfer is arranged at one corner of the metal block, as shown in fig. 3, the chamfer is the front surface of the chip to be placed in the application file, and the right upper corner of the metal block of the chip is provided with the chamfer; during processing, chips are required to be sequentially placed on a material tray in sequence, and chamfers on metal blocks of the chips are required to face the same direction; generally screen through artifical identification chip direction among the prior art, cooperate semi-automatic sabot equipment to carry out the balance operation simultaneously, its defect lies in that the cost of labor is higher, and the operating efficiency is low.

Disclosure of Invention

The invention aims to realize full-automatic operation of screening, aligning and dishing on chips, reduce labor cost and improve working efficiency.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

the utility model provides a full-automatic balance machine of chip, includes PLC, still includes:

the screening mechanism is used for enabling the front surfaces of the chips to face upwards and be sequentially arranged;

the industrial camera is used for photographing the front images of the chips arranged by the screening mechanism and transmitting image signals to the PLC;

the PLC controls the alignment mechanism to drive the chip to horizontally rotate so as to enable the chip to rotate to a required position;

the tray placing mechanism is used for placing a tray on a station;

the chip manipulator is used for grabbing the chip from the screening mechanism and transferring the chip to the aligning mechanism for aligning, grabbing the chip on the station of the aligning mechanism and moving the chip into the material tray on the material tray placing mechanism, the material tray placing mechanism drives the material tray to horizontally move, and the chip manipulator is matched with the chip manipulator to place the chip in sequence.

Further, screening mechanism, industrial camera and alignment mechanism constitute feed mechanism jointly, feed mechanism has two sets ofly, and is located the both sides of chip manipulator respectively.

Further, screening mechanism includes vibration dish and sharp feeder, the discharge end of vibration dish and the pan feeding end intercommunication of sharp feeder.

Further, the aligning mechanism comprises a first motor and a rotating platform, and the first motor drives the rotating platform to rotate.

Furthermore, the swing disc mechanism comprises a first X-axis mechanism, a first Y-axis mechanism and a first material disc seat, the first X-axis mechanism drives the first Y-axis mechanism to move back and forth along the X-axis direction, the first Y-axis mechanism drives the first material disc seat to move back and forth along the Y-axis direction, and the material disc is located on the first material disc seat.

Further, the chip manipulator comprises a second X-axis slide rail, a second slide block, a second Z-axis slide rail, a swinging mechanism, a mechanical arm and a sucker, wherein the second X-axis slide rail is arranged along the X-axis direction, the second slide block is arranged on the second X-axis slide rail in a sliding manner, the second Z-axis slide rail is arranged on the second slide block in a sliding manner along the Z-axis direction, the swinging mechanism drives the second Z-axis slide rail to swing back and forth in a plane parallel to the X-axis and the Z-axis, the mechanical arm is fixed on the second Z-axis slide rail, and the sucker is fixedly arranged at the lower end of the mechanical arm.

The material tray feeding mechanism comprises a third motor, a third lead screw assembly and a third material tray seat, the third motor drives the third lead screw assembly to further drive the third material tray seat to move back and forth along the Z-axis direction, and the third material tray seat is located on one side of the material tray swinging mechanism.

Further, still include charging tray unloading mechanism, charging tray unloading mechanism includes fourth motor, fourth lead screw subassembly and fourth charging tray seat, fourth motor drive fourth lead screw subassembly and then drive fourth charging tray seat and reciprocate along the Z axle direction, third charging tray seat and fourth charging tray seat are located the both sides of set mechanism respectively.

The material tray manipulator comprises a fifth X-axis mechanism, a fifth Z-axis mechanism and a clamping jaw mechanism, the fifth X-axis mechanism drives the fifth Z-axis mechanism to move back and forth along the X-axis direction, and the fifth Z-axis mechanism drives the clamping jaw mechanism to move back and forth along the Z-axis direction.

Further, there are two sets of gripper mechanisms.

The invention has the beneficial effects that: the invention screens the chips by the screening mechanism, so that the chips are arranged in sequence with the front faces facing upwards, the industrial camera takes pictures of the front faces of the chips arranged by the screening mechanism and transmits image signals to the PLC, the PLC analyzes and processes the image signals, the chips are grabbed and transferred from the screening mechanism to the aligning mechanism by the chip manipulator, the aligning mechanism is correspondingly controlled by the PLC to drive the chips to horizontally rotate so that the chips rotate to the required direction, the chips on the stations of the aligning mechanism are grabbed and moved to the material trays on the swinging plate mechanism by the chip manipulator, each chip is loaded in the material trays, the swinging plate mechanism drives the material trays to move in sequence to prepare for loading the next chip, thereby realizing the automatic operation of screening, aligning and loading the chips, compared with the operation mode of manually identifying the chip direction to screen in the traditional technology and matching with semi-automatic loading equipment, the invention obviously reduces the labor cost and greatly improves the operation efficiency.

Drawings

FIG. 1 is a perspective view of the overall construction of the present invention;

FIG. 2 is a rear elevational view of the overall construction of the present invention;

FIG. 3 is a schematic front view of a chip according to the background of the invention;

FIG. 4 is a schematic diagram of the screening mechanism, industrial camera, alignment mechanism and chip handler of the present invention;

FIG. 5 is a schematic structural view of the screening mechanism and the aligning mechanism of the present invention;

FIG. 6 is a schematic structural view of a chip robot of the present invention;

FIG. 7 is a rear view of the construction of the chip handler of the present invention;

FIG. 8 is a schematic structural view of the wobble plate mechanism of the present invention;

FIG. 9 is a schematic structural diagram of a tray feeding mechanism, a tray manipulator, a tray discharging mechanism and a balance mechanism of the invention;

FIG. 10 is a schematic structural view of the tray robot of the present invention;

FIG. 11 is a schematic structural view of the tray loading mechanism of the present invention;

FIG. 12 is a schematic structural diagram of a tray blanking mechanism of the present invention;

the reference signs are:

a screening mechanism 1, a vibration disc 11, a discharge hopper 12, a linear feeder 13,

the industrial camera 2 is used for taking pictures,

an alignment mechanism 3, a first motor 31, a rotary table 32,

the balance mechanism 4, the first X-axis mechanism 41, the first Y-axis mechanism 42, the first tray holder 43,

a chip manipulator 5, a second X-axis slide rail 51, a second slide block 52, a second Z-axis slide rail 53, a swing mechanism 54, a swing motor 541, a fixed plate 542, an arc-shaped groove 543, a slide block 544, a mechanical arm 55, a suction cup 56,

a tray feeding mechanism 6, a third motor 61, a third tray seat 62,

a tray blanking mechanism 7, a fourth motor 71, a fourth tray seat 72,

a tray manipulator 8, a fifth X-axis mechanism 81, a fifth Z-axis mechanism 82, a clamping jaw mechanism 83, a material baffle plate 84,

and a tray 9.

Detailed Description

The present invention is further described with reference to the drawings, and it should be particularly noted that the directions of the upper, lower, front, rear, left, right, etc. described in the present application document are all based on the directions shown in fig. 1, and the directions of the X axis, the Y axis, and the Z axis described in the present application document are all based on the directions marked in fig. 1, where the X axis, the Y axis, and the Z axis are perpendicular to each other, and the Z axis is the perpendicular direction.

The full-automatic chip tray placing machine shown in fig. 1 to 12 comprises a PLC, a screening mechanism 1, an industrial camera 2, an alignment mechanism 3, a tray placing mechanism 4, a chip manipulator 5, a tray feeding mechanism 6, a tray discharging mechanism 7 and a tray manipulator 8.

Referring to fig. 4 and 5, the screening mechanism 1 is used to arrange the chips in sequence with the front surfaces facing upward; screening mechanism 1 includes vibration dish 11, hopper 12 and sharp feeder 13 down, and hopper 12 is located vibration dish 11 tops down, and in people poured the chip into hopper 12 down, the chip in hopper 12 falls into vibration dish 11 under the action of gravity in, and the discharge end of vibration dish 11 and the pan feeding end intercommunication of sharp feeder 13, concrete structure are: a spiral channel is arranged in the vibration disc 11, a detection optical fiber is fixedly arranged on the side wall of the spiral channel and is in signal connection with the PLC, when a chip passes through the detection optical fiber, the detection optical fiber transmits the signal to the PLC for analysis according to different signals reflected by plastic and metal, and then whether the plastic surface of the chip faces upwards or the metal surface of the chip faces upwards is distinguished; the mouth of blowing has still been seted up to spiral track's lateral wall, and the mouth of blowing is located the side of detecting optic fibre, and the mouth of blowing passes through trachea and solenoid valve intercommunication, and when judging that the chip is that the plastic face is up, PLC control solenoid valve and air supply intercommunication blow out gas through the mouth of blowing, blow in the chip and carry out vibration arrangement again in the vibration dish 11 to guarantee that the chip that gets into sharp feeder 13 is whole openly up, that is also the metal face is up.

The upper end of the linear feeder 13 is provided with a linear feeding channel surrounded by the enclosing plates, and the width of the feeding channel can be adjusted by adjusting the distance between the enclosing plates on two sides of the feeding channel, so that the linear feeder is suitable for chips with different sizes.

The industrial camera 2 is used for photographing the front images of the chips arranged by the screening mechanism 1, and photographing the first chip on the linear feeder 13 at a time, wherein the first chip is the first chip on one end of the linear feeder 13 far away from the vibrating disc 11; the industrial camera 2 transmits an image signal to the PLC.

The PLC controls the aligning mechanism 3 to drive the chip to horizontally rotate, so that the chip rotates to a required position; the aligning mechanism 3 comprises a first motor 31 and a rotating platform 32, a first groove for placing a chip is formed in the upper end of the rotating platform 32, the first motor 31 drives the rotating platform 32 to rotate, after a chip manipulator 5 grabs and transfers the chip from a linear feeder 13 to the first groove on the rotating platform 32, a PLC analyzes and processes the chip according to an image signal provided by an industrial camera 2, the first motor 31 is correspondingly driven to rotate by a certain angle, and the first motor 31 drives the rotating platform 32 to rotate, so that a chamfer on a metal sheet of the chip faces to a required direction.

Referring to fig. 4 and 8, a material tray 9 is placed on a station of the plate swinging mechanism 4; the upper end of the tray 9 is provided with a plurality of chip grooves for placing chips, and the chip grooves are arranged in an equidistant array.

The balance mechanism 4 comprises a first X-axis mechanism 41, a first Y-axis mechanism 42 and a first material tray seat 43, the first X-axis mechanism 41 drives the first Y-axis mechanism 42 to move back and forth along the X-axis direction, and the specific structure is as follows: the first X-axis mechanism 41 includes a first X-axis motor and a first X-axis lead screw assembly, the first X-axis motor drives the first X-axis lead screw assembly to work, and the first X-axis lead screw assembly drives the first Y-axis mechanism 42 to move back and forth along the X-axis direction;

the first Y-axis mechanism 42 drives the first tray seat 43 to move back and forth along the Y-axis direction, and the specific structure is as follows: the first Y-axis mechanism 42 includes a first Y-axis motor and a first Y-axis screw assembly, the first Y-axis motor drives the first Y-axis screw assembly to work, and the first Y-axis screw assembly drives the first material tray base 43 to move back and forth along the Y-axis direction;

charging tray 9 is located first charging tray seat 43, and charging tray 9 card is difficult for rocking on first charging tray seat 43, and first X axle mechanism 41 and first Y axle mechanism 42 are respectively at the epaxial biax linkage of X axle and Y, drive first charging tray seat 43 and remove.

The chip manipulator 5 is used for grabbing the chip from the screening mechanism 1 and transferring to the aligning mechanism 3 for aligning, and simultaneously grabbing the chip on the station of the aligning mechanism 3 and moving the chip into the material tray 9 on the material tray placing mechanism 4, and when the chip manipulator 5 finishes placing a chip, the material tray placing mechanism 4 drives the material tray 9 to horizontally move, and the chip manipulator 5 is matched to place the chip in sequence to prepare for loading the next chip.

Referring to fig. 4, 6 and 7, the chip handler 5 includes a second X-axis slide rail 51, a second slider 52, a second Z-axis slide rail 53, a swing mechanism 54, a robot arm 55 and a suction cup 56, the second X-axis slide rail 51 is disposed along the X-axis direction, the second slider 52 is slidably disposed on the second X-axis slide rail 51, the second Z-axis slide rail 53 is slidably disposed on the second slider 52 along the Z-axis direction, the swing mechanism 54 drives the second Z-axis slide rail 53 to swing back and forth in a plane parallel to the X-axis and the Z-axis, the robot arm 55 is fixed on the second Z-axis slide rail 53, and when the swing mechanism 54 drives the second Z-axis slide rail 53 to swing, the second Z-axis slide rail 53 moves along the second slider 52 in the Z-axis, while the second Z-axis slide rail 53 moves along the second X-axis slide rail 51 by the second slide rail, therefore, the second Z-axis slide rail 53 can move simultaneously in the Z-axis and X-axis directions, which is beneficial to work with the swing mechanism 54.

The swing mechanism 54 includes a swing motor 541, a fixed plate 542, a swing link and a sliding block 544, a semicircular arc groove 543 is formed in the fixed plate 542, the sliding block 544 is slidably disposed in the arc groove 543, the upper end of the second Z-axis slide rail 53 is fixedly connected to the sliding block 544, one end of the swing link is fixedly connected to a driving shaft of the swing motor 541, the other end of the swing link is fixedly connected to the sliding block 544, an output shaft of the swing motor 541 is perpendicular to the fixed plate 542 and located at a center of the arc groove 543, when the swing motor 541 rotates, the swing link drives the sliding block 544 to slide back and forth in the arc groove 543, and further drives the second Z-axis slide rail 53 to move along a track of the arc groove 543, so as to realize the reciprocating movement of the mechanical arm 55.

Referring to fig. 1, fig. 2 and fig. 4 again, the screening mechanism 1, the industrial camera 2 and the alignment mechanism 3 together form two sets of feeding mechanisms, the two sets of feeding mechanisms are respectively located at two sides of the chip manipulator 5, and when the chip manipulator 5 works, the chips are alternately transferred on the two sets of feeding mechanisms, so that the operations of screening, aligning and dishing up the chips are improved twice, and the working efficiency is greatly improved.

Referring to fig. 4 and 6, four suction cups 56 are provided, four suction cups 56 are arranged at equal intervals and are all fixedly arranged at the lower end of the mechanical arm 55, two groups of alignment mechanisms 3 are positioned between two groups of linear feeders 13, and the first feeder seat 43 is positioned between two groups of alignment mechanisms 3; the distance between the linear feeder 13 and the aligning mechanism 3 and the distance between the aligning mechanism 3 and the first tray seat 43 are equal to the distance between the two sets of suction cups 56, so that the suction cups 56 can suck the chips from the linear feeder 13 and move the chips to the aligning mechanism 3 or suck the chips from the aligning mechanism 3 and move the chips to the trays 9 on the first tray seat 43.

Referring to fig. 11, the tray feeding mechanism 6 includes a third motor 61, a third screw assembly and a third tray seat 62, the third motor 61 drives the third screw assembly to further drive the third tray seat 62 to move back and forth along the Z-axis direction, the third tray seat 62 is located on one side of the tray placing mechanism 4, and a stack of trays 9 are stacked on the third tray 9.

Referring to fig. 12, the tray blanking mechanism 7 includes a fourth motor 71, a fourth screw assembly and a fourth tray seat 72, the fourth motor 71 drives the fourth screw assembly to further drive the fourth tray seat 72 to move back and forth along the Z-axis direction, and the third tray seat 62 and the fourth tray seat 72 are respectively located at two sides of the tray placing mechanism 4.

Referring to fig. 9 and 10, the tray manipulator 8 is located above the tray placing mechanism 4, and the tray manipulator 8 is configured to grab and move the tray 9 on the third tray seat 62 onto the first tray seat 43, and grab and move the tray 9 on the first tray seat 43 onto the fourth tray seat 72.

The tray manipulator 8 comprises a fifth X-axis mechanism 81, a fifth Z-axis mechanism 82 and a clamping jaw mechanism 83, the fifth X-axis mechanism 81 drives the fifth Z-axis mechanism 82 to move back and forth along the X-axis direction, and the specific structure is as follows: the fifth X-axis mechanism 81 includes a fifth motor, a fifth screw rod assembly and a fifth sliding plate, the fifth motor drives the fifth screw rod assembly to work, and the fifth screw rod assembly drives the fifth sliding plate to move back and forth along the X-axis direction;

the fifth Z-axis mechanism 82 drives the clamping jaw mechanism 83 to move back and forth along the Z-axis direction, the fifth Z-axis mechanism 82 comprises a linear cylinder, guide pillars, guide sleeves and a movable plate, the shell and the guide sleeves of the linear cylinder are fixed on the fifth sliding plate, the movable plate is located below the fifth sliding plate, the guide pillars penetrate through the guide sleeves, the lower ends of the guide pillars are fixedly connected with the movable plate, telescopic rods of the linear cylinder are fixedly connected with the movable plate, the clamping jaw mechanisms 83 are two groups, the clamping jaw mechanisms 83 are clamping jaw cylinders, the two groups of clamping jaw cylinders are fixedly arranged on the movable plate, a material blocking plate 84 is fixedly arranged in the middle of each clamping jaw cylinder, and when the clamping jaw cylinders clamp two sides of a material tray 9 filled with chips, the material blocking plate 84 can.

The fifth X-axis mechanism 81 and the fifth Z-axis mechanism 82 are in linkage fit with each other on the X-axis and the Z-axis, and drive the two sets of clamping jaw cylinders to grab and move the material tray 9 on the third material tray seat 62 onto the first material tray seat 43, and grab and move the material tray 9 on the first material tray seat 43 onto the fourth material tray seat 72.

The working principle of the invention is as follows: 1. the vibration disc 11 vibrates, so that chips in the vibration disc 11 enter the linear feeder 13 through the spiral channel, the chips on the spiral channel are judged to be in the groove direction through the detection optical fiber, the PLC controls the electromagnetic valve to be communicated with an air source, air is blown out through the air blowing port, the chips with the reverse sides facing upwards are blown into the vibration disc 11 to be subjected to vibration rearrangement again, and therefore the chips entering the linear feeder 13 are all enabled to be in the mode that the front sides face upwards;

2. the industrial camera 2 shoots front images of the chips arranged by the screening mechanism 1, transmits image signals to the PLC for analysis and processing, the chip manipulator 5 grabs the chips from the screening mechanism 1 and transfers the chips to the aligning mechanism 3, and the aligning mechanism 3 is correspondingly controlled by the PLC to drive the chips to horizontally rotate so that the chamfers of the metal blocks on the front surfaces of the chips face to the required position;

3. the chip manipulator 5 grabs and transfers the chip from the screening mechanism 1 to the aligning mechanism 3, and simultaneously grabs and moves the chip on the station of the aligning mechanism 3 to the material tray 9 on the material tray placing mechanism 4;

4. the first X-axis mechanism 41 and the first Y-axis mechanism 42 are in double-axis linkage on the X axis and the Y axis respectively to drive the first material tray seat 43 to move and further drive the material tray 9 to move horizontally, and the chips are placed in sequence by matching with the chip manipulator 5 to prepare for loading the next chip;

5. after the material tray 9 on the first material tray seat 43 is filled with chips, the material tray is driven to the lower part of the material tray mechanical arm 8 under the double-shaft linkage of the first X-shaft mechanism 41 and the first Y-shaft mechanism 42, the fifth X-shaft mechanism 81 and the fifth Z-shaft mechanism 82 are in double-shaft linkage fit on the X shaft and the Z shaft, the two groups of clamping jaw cylinders are driven to grab and move the material tray 9 on the third material tray seat 62 onto the first material tray seat 43, and meanwhile, the material tray 9 on the first material tray seat 43 is grabbed and moved onto the fourth material tray seat 72, so that the blanking is realized.

The above description is not intended to limit the technical scope of the present invention, and any modification, equivalent change and modification of the above embodiments according to the technical spirit of the present invention are still within the technical scope of the present invention.