1. A test board for testing an electronic wire between boards, the electronic wire between boards including a plurality of electronic wires, comprising:

the testing circuit comprises a first power supply end, a second power supply end, a plurality of testing resistor pairs which are arranged between the first power supply end and the second power supply end and connected in series, and a detection assembly, wherein each testing resistor pair comprises a first testing resistor close to the first power supply end and a second testing resistor close to the second power supply end, and the detection assembly is arranged corresponding to the second testing resistor of the testing resistor pair close to the second power supply end; and

a plurality of test terminal pairs, each of which includes a first test terminal disposed on a side of the first test resistor close to the first power supply terminal and a second test terminal disposed on a side of the first test resistor close to the second power supply terminal, the first test terminal being connected to one end of one of the inter-board electronic wires, the second test terminal being connected to the other end of the one of the electronic wires; wherein the content of the first and second substances,

the test circuit responds to the electric signals loaded by the first power end and the second power end to form a test loop for detecting the inter-board electronic wire, and the detection assembly outputs a detection signal of the inter-board electronic wire.

2. The test board according to claim 1, wherein the first test resistors and the second test resistors have different resistances, and the sum of the resistances of at least two of the first test resistors and/or the second test resistors is different.

3. The test board according to claim 1, wherein the resistance values of the first test resistors are different from each other, and the sum of the resistance values of at least two of the first test resistors is different from each other, or the sum of the resistance values of at least two of the first test resistors and the second test resistor is different from each other.

4. A test plate according to claim 2 or 3, further comprising a processor, a look-up table and a display, wherein,

the comparison table comprises detection states traversing faults of all electronic wires in the inter-board electronic wires and corresponding fault detection signals;

the processor is used for inquiring the comparison table according to the detection signal, matching the fault detection signal according to the detection signal to determine the detection state of the inter-board electronic wire and outputting the detection signal to the display;

and the display is used for displaying the detection state according to the detection signal.

5. The test plate of claim 2 or 3, further comprising a processor and a display, wherein,

the processor is used for determining the detection state of the inter-board electronic wire according to the detection signal and a preset fault analysis formula and outputting the detection signal to the display;

and the display is used for displaying the detection state according to the detection signal.

6. The test plate according to claim 1,

the detection assembly includes a first detector that measures a voltage of a second test resistor of the pair of test resistors proximate the second power supply terminal;

and/or

The detection assembly includes a second detector that measures current of a second test resistor of the pair of test resistors proximate the second power supply terminal.

7. The test plate according to claim 6,

the first detector is a voltmeter which is connected in parallel with a second testing resistor of the testing resistor pair close to the second power supply end;

and/or

The second detector is an ammeter arranged in series with the second testing resistor of the testing resistor pair close to the second power supply end.

8. The test board according to claim 1, wherein the test circuit is disposed corresponding to each of the inter-board electronic wires, and a first pitch between the pair of test terminals is equal to a second pitch between each of the inter-board electronic wires.

9. A method of testing electronic wires between boards using a test board according to any one of claims 1 to 8, comprising:

respectively connecting a plurality of test terminal pairs of a test circuit of a test board into each electronic wire of the electronic wires between the boards;

applying an electrical signal to a first power terminal and a second power terminal of the test circuit to form a test loop that detects the electron lines between the plates;

and the detection assembly of the test circuit outputs a detection signal of the electronic wire between the boards.

10. The test method according to claim 9,

the test board further comprises a processor, a comparison table and a display, the comparison table comprises detection states traversing faults of all electronic wires among the electronic wires between boards and corresponding fault detection signals, and after a detection assembly of the test circuit outputs the detection signals of the electronic wires between boards, the test method further comprises the following steps:

the processor inquires the comparison table according to the detection signal to match the fault detection signal, determines the detection state of the inter-board electronic wire and outputs the detection signal to the display;

the display displays the detection state according to the detection signal;

or

The test board further comprises a processor and a display, and after the detection component of the test circuit outputs a detection signal of the electronic wire between the boards, the test method further comprises the following steps:

the processor determines the detection state of the inter-board electronic wire according to the detection signal and a preset fault analysis formula and outputs the detection signal to the display;

and the display displays the detection state according to the detection signal.

Background

The manufacturing industry and the electronic industry usually achieve the purpose of connecting two circuit boards by inserting electronic wires into a connector in a circuit, and how to conveniently detect whether the electronic wires connecting pins of the two circuit boards are normal becomes a problem to be solved urgently in order to ensure the normal work of the circuit boards.

Disclosure of Invention

In order to solve at least one of the above problems, a first embodiment of the present invention provides a test board for detecting an electronic wire between boards, the electronic wire between boards including a plurality of electronic wires, including:

the testing circuit comprises a first power supply end, a second power supply end, a plurality of testing resistor pairs which are arranged between the first power supply end and the second power supply end and connected in series, and a detection assembly, wherein each testing resistor pair comprises a first testing resistor close to the first power supply end and a second testing resistor close to the second power supply end, and the detection assembly is arranged corresponding to the second testing resistor of the testing resistor pair close to the second power supply end; and

a plurality of test terminal pairs, each of which includes a first test terminal disposed on a side of the first test resistor close to the first power supply terminal and a second test terminal disposed on a side of the first test resistor close to the second power supply terminal, the first test terminal being connected to one end of one of the inter-board electronic wires, the second test terminal being connected to the other end of the one of the electronic wires; wherein the content of the first and second substances,

the test circuit responds to the electric signals loaded by the first power end and the second power end to form a test loop for detecting the inter-board electronic wire, and the detection assembly outputs a detection signal of the inter-board electronic wire.

In a specific embodiment, the resistance values of each of the first test resistors and each of the second test resistors are different, and the sum of the resistance values of at least two of the first test resistors and/or the second test resistors is different.

In a specific embodiment, the resistance values of the first testing resistors are different, and the sum of the resistance values of at least two of the first testing resistors is different, or the sum of the resistance values of at least two of the first testing resistors and the second testing resistor is different.

In one embodiment, the test plate further comprises a processor, a look-up table, and a display, wherein,

the comparison table comprises detection states traversing faults of all electronic wires in the inter-board electronic wires and corresponding fault detection signals;

the processor is used for inquiring the comparison table according to the detection signal, matching the fault detection signal according to the detection signal to determine the detection state of the inter-board electronic wire and outputting the detection signal to the display;

and the display is used for displaying the detection state according to the detection signal.

In one embodiment, the test board further comprises a processor and a display, wherein,

the processor is used for determining the detection state of the inter-board electronic wire according to the detection signal and a preset fault analysis formula and outputting the detection signal to the display;

and the display is used for displaying the detection state according to the detection signal.

In a specific embodiment, said detecting assembly comprises a first detector for measuring a voltage of a second test resistor of said pair of test resistors proximate to said second power supply terminal;

and/or

The detection assembly includes a second detector that measures current of a second test resistor of the pair of test resistors proximate the second power supply terminal.

In one particular embodiment of the present invention,

the first detector is a voltmeter which is connected in parallel with a second testing resistor of the testing resistor pair close to the second power supply end;

and/or

The second detector is an ammeter arranged in series with the second testing resistor of the testing resistor pair close to the second power supply end.

In one embodiment, the test circuit is disposed corresponding to each of the inter-board electronic wires, and a first pitch between the pair of test terminals is equal to a second pitch between the electronic wires of the inter-board electronic wires.

A second embodiment of the present invention provides a method for testing an electronic wire between boards using the test board according to any one of the first embodiments, comprising:

respectively connecting a plurality of test terminal pairs of a test circuit of a test board into each electronic wire of the electronic wires between the boards;

applying an electrical signal to a first power terminal and a second power terminal of the test circuit to form a test loop that detects the electron lines between the plates;

and the detection assembly of the test circuit outputs a detection signal of the electronic wire between the boards.

In a specific embodiment, the test board further includes a processor, a comparison table and a display, the comparison table includes a detection status and a corresponding fault detection signal for traversing each electronic wire fault in the electronic wires between boards, and after the detection component of the test circuit outputs the detection signal of the electronic wire between boards, the test method further includes:

the processor inquires the comparison table according to the detection signal to match the fault detection signal, determines the detection state of the inter-board electronic wire and outputs the detection signal to the display;

the display displays the detection state according to the detection signal;

or

The test board further comprises a processor and a display, and after the detection component of the test circuit outputs a detection signal of the electronic wire between the boards, the test method further comprises the following steps:

the processor determines the detection state of the inter-board electronic wire according to the detection signal and a preset fault analysis formula and outputs the detection signal to the display;

and the display displays the detection state according to the detection signal.

The invention has the following beneficial effects:

the invention is directed against the existing problem at present, formulate a test board and test method to detect inter-board electronic wire, form the test circuit in order to detect inter-board electronic wire through the test circuit set up on the test board, specifically, insert both ends of the inter-board electronic wire through the first test terminal and second test terminal of the test circuit separately, the test circuit forms the test circuit according to the electric signal loaded in first power end and second power end, judge whether each electronic wire of the inter-board electronic wire has short circuit, open circuit problem according to the detection signal that the detection assembly outputs; therefore, the connection quality of each electronic wire of the electronic wires between the boards can be conveniently and quickly judged according to the detection signal, the detection time is effectively shortened, the detection efficiency is improved, the automatic and intelligent tests are realized, the possibility is provided for the minimization of the test equipment, and the method has wide application prospect.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 shows a schematic view of an electron beam between plates according to an embodiment of the present invention;

FIG. 2 shows a schematic diagram of a test circuit of one embodiment of the present invention;

FIG. 3 is a schematic diagram of an inter-board electrical line access test circuit according to an embodiment of the present invention;

FIG. 4 illustrates an embodiment of the present invention against a representation intent;

FIG. 5 shows a schematic diagram of one embodiment of the present invention testing a circuit access to a first detector;

FIG. 6 is a schematic diagram illustrating an open circuit fault occurring in a test circuit according to one embodiment of the present invention;

FIG. 7 is a schematic diagram illustrating a test circuit short circuit fault according to one embodiment of the present invention;

FIG. 8 is a schematic diagram illustrating a test circuit according to another embodiment of the present invention in the event of a short circuit fault;

FIG. 9 shows a flow chart of a testing method according to an embodiment of the invention.

Detailed Description

In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.

As shown in fig. 1, a schematic diagram of inter-board electronic wires is shown, each electronic wire is used to connect corresponding pins of two circuit boards, and there are two main methods for testing the electronic wires between the boards at present, the first method is a manual measurement by a technician who uses two probes of an instrument device such as a multimeter or an oscilloscope to test the corresponding pins at two ends respectively, and the on-off of the electronic wires is determined by a method of testing the resistance between the pins at two ends through a built-in buzzer of the multimeter, or by a waveform of the oscilloscope, but this method has a problem of low efficiency, only one electronic wire can be detected at a time, and the error rate is high, especially when the number of the pins is too large and the pin pitch is too small, the corresponding relationship is easily confused by human operation, and the test result; the second method is to output positive values point by point in sequence by using a conduction tester through an internal control circuit of the tester, check the output of each point simultaneously, judge the on-off of the circuit according to each positive/negative value output by the tester, and check the number of times N ═ N [ [ (N ═ N [ ]²+n)/2]N, wherein n is the number of detection points of the electron beam. However, the method needs too many detection points, has long operation time and larger volume of the existing instrument, and is not suitable for circuits with board card connectors in the television industry.

In view of the above, an embodiment of the present invention provides a test board for detecting inter-board electronic wires, for testing the inter-board electronic wires shown in fig. 1, specifically, the inter-board electronic wires include a plurality of electronic wires, the test board includes: the testing circuit comprises a first power supply end, a second power supply end, a plurality of testing resistor pairs which are arranged between the first power supply end and the second power supply end and connected in series, and a detection assembly, wherein each testing resistor pair comprises a first testing resistor close to the first power supply end and a second testing resistor close to the second power supply end, and the detection assembly is arranged corresponding to the second testing resistor of the testing resistor pair close to the second power supply end; and

a plurality of test terminal pairs, each of which includes a first test terminal disposed on a side of the first test resistor close to the first power supply terminal and a second test terminal disposed on a side of the first test resistor close to the second power supply terminal, the first test terminal being connected to one end of one of the inter-board electronic wires, the second test terminal being connected to the other end of the one of the electronic wires; wherein

The test circuit responds to the electric signals loaded by the first power end and the second power end to form a test loop for detecting the inter-board electronic wire, and the detection assembly outputs a detection signal of the inter-board electronic wire.

In this embodiment, as shown in fig. 1, P10, P11, P12 …, P1n are first test pin terminals where each inter-board electron wire is connected to a first circuit board, and P20, P21, P22 …, P2n are second test pin terminals where each inter-board electron wire is connected to a second circuit board, that is, a first terminal of one inter-board electron wire is connected to a first test pin terminal, and a second terminal of the electron wire is connected to a second test pin terminal, so as to realize electrical connection between corresponding test pin terminals of two circuit boards.

The test board includes a test circuit as shown in fig. 2, where the test circuit includes a first power end VCC terminal, a second power end GND terminal, and a plurality of test resistor pairs arranged between the first power end and the second power end in series connection, each test resistor pair includes a first test resistor close to the first power end VCC terminal and a second test resistor close to the second power end GND terminal, for example, R0 and Rn0 in fig. 2 are a pair of test resistor pairs, where R0 is the first test resistor close to the first power end, and Rn0 is the second test resistor close to the second power end; similarly, R1 and Rn1 are a pair of test resistors, where R1 is a first test resistor and Rn1 is a second test resistor; rn and Ra are a pair of test resistors, wherein Rn is a first test resistor, Ra is a second test resistor, and the detection component is arranged corresponding to the second test resistor of the test resistor pair close to the second power supply end, namely the detection component is arranged corresponding to Ra and used for testing the current value or the voltage value of Ra.

Meanwhile, the test circuit includes a plurality of test terminal pairs, each of which includes a first test terminal disposed at a side of the first test resistor close to the first power terminal VCC terminal and a second test terminal disposed at a side of the first test resistor close to the second power terminal GND terminal, for example, P10 and P20 in fig. 2 are a pair of test terminals, where P10 is the first test terminal at a side of the first test resistor close to the first power terminal VCC terminal and P20 is the second test terminal at a side of the first test resistor close to the second power terminal GND terminal; similarly, P11 and P21 are a pair of test terminals, where P11 is the first test terminal and P21 is the second test terminal; p1n and P2n are a pair of test terminals, where P1n is a first test terminal and P2n is a second test terminal.

The number of the test resistor pairs corresponds to the number of the test terminal pairs, which are n pairs, and the specific number is not limited, and those skilled in the art can set an appropriate number according to the number of the actual electronic wires between the boards to be tested, which is not described herein again.

The first test terminal is connected to one end of one of the inter-board electronic wires, the second test terminal is connected to the other end of the electronic wire, in a specific embodiment, the first test terminal P10 in fig. 2 is connected to the first end P10 of the first one of the inter-board electronic wires shown in fig. 1, and the second test terminal P20 in fig. 2 is connected to the second end P20 of the first one of the inter-board electronic wires shown in fig. 1; similarly, in fig. 2, the first test terminal P11 is connected to the first end P11 of the second one of the inter-board electronic wires shown in fig. 1, and the second test terminal P21 is connected to the second end P21 of the second one of the inter-board electronic wires shown in fig. 1; by analogy, when the number of the electronic wires between the boards is less than or equal to the number of the test terminal pairs of the test circuit, each electronic wire of the electronic wires between the boards is connected into the test circuit, so that the test circuit connected with the electronic wires between the boards as shown in fig. 3 is formed; or when the number of the electronic wires between the boards is larger than the test terminal pairs of the test circuit, each test terminal of the test circuit is connected with the electronic wires between the boards.

The testing circuit responds to the electric signals loaded by the first power end and the second power end to form a testing loop consisting of the first power end, the first testing terminal, the inter-board electronic wire, the second testing terminal, the second testing resistor, the inter-board electronic wire, the first testing terminal and the second testing resistor, and the second testing resistor and the second power end, the testing loop is used for detecting each electronic wire of the inter-board electronic wires, the detecting component outputs a detecting signal of the inter-board electronic wires, and whether the short circuit or the open circuit exists in each electronic wire of the inter-board electronic wires can be judged according to the detecting signal output by the detecting component.

In an optional embodiment, the first test resistor and each of the second test resistors have different resistance values, and the sum of the resistance values of at least two of the first test resistors is different, or the sum of the resistance values of at least two of the second test resistors is different, or the sum of the resistance values of at least two of the first test resistors and the second test resistor is different.

Specifically, for example, the resistance values of n +1 first test resistors among the first test resistors R0, R1, R2, R3, and R4.. Rn are different, the resistance values of n +1 second test resistors among the second test resistors Rn0, Rn1, Rn2, Rn3, Rn4.. Rn-1, and Ra are different, and R0+ R1 is not equal to R0+ R2, not equal to R2+ R3, not equal to R0+ R2+ R4, not equal to R0+ R1+ Rn0, that is, the sum of the resistance values of at least two first test resistors is different; similarly, Rn0+ Rn1 is not equal to Rn1+ Rn2 nor equal to Rn0+ Rn1+ Rn2+ Rn4, that is, the sum of resistance values of at least two second test resistors is different; similarly, Rn0+ Rn1 is also not equal to Rn1+ Rn2+ R3+ R4, i.e. the sum of resistance values of at least two of the first test resistor and the second test resistor is different.

Because the resistance of each first test resistance and each second test resistance is different, and the combination of any number of first test resistances, or the combination of any number of second test resistances, or the resistance sum of the combination of any number of first test resistances and second test resistances is different, thereby which electronic wire is in problem can be specifically judged according to the voltage value or the current value of the second test resistance Ra, namely, the electronic wire in fault is directly positioned according to the detection signal, thereby the connection quality of each electronic wire of the electronic wires between boards is conveniently and rapidly judged, and the detection accuracy is improved.

Considering that the second testing resistor is inevitably present in the testing loop, in a preferred embodiment, the resistance values of the first testing resistors are different, the resistance values of the second testing resistors may be the same or different, and the sum of the resistance values of at least two first testing resistors is different, or the sum of the resistance values of at least two first testing resistors and the sum of the resistance values of at least two second testing resistors is different. Specifically, for example, the resistance values of n +1 first test resistors are different among the first test resistors R0, R1, R2, R3, and R4.. Rn, and R0+ R1 is not equal to R1+ R3, not equal to R2+ R4, not equal to R1+ R2+ R4, not equal to R0+ R1+ Rn0, and not equal to Rn1+ Rn2+ R3+ R4.

Because the resistance is inequality between each first test resistance, and the resistance sum of the combination of arbitrary quantity first test resistance is all different, or the resistance sum of the combination of arbitrary quantity first test resistance and second test resistance is all different to can specifically judge which electron line goes wrong according to the magnitude of voltage or the current value of second test resistance Ra, according to the electron line of detection signal direct positioning to the trouble promptly, effectively improved and detected the rate of accuracy.

In an alternative embodiment, as shown in fig. 5, the sensing assembly includes a first sensor for measuring a voltage across a second test resistor of the pair of test resistors proximate the second power supply terminal.

In another alternative embodiment, the sensing assembly includes a second detector that measures the current of a second test resistor of the pair of test resistors proximate the second power supply terminal.

It is worth noting that in an alternative embodiment, the detection assembly may comprise both a first detector measuring the voltage of Ra and a second detector measuring the current of Ra.

Further, the first detector is a voltmeter, the second detector is an ammeter, and a person skilled in the art may set the first detector and the second detector according to actual conditions, may set only the first detector or the second detector, or both, as long as the voltage, or the current, or the voltage and the current of the second test resistor of the test resistor pair close to the second power source end can be measured.

In an alternative embodiment, the test plate further comprises a processor, a look-up table and a display, wherein

The comparison table, as shown in fig. 4, includes detection states of faults of the electronic wires and corresponding fault detection signals in the electronic wires between boards;

the processor is used for inquiring the comparison table according to the detection signal, matching the fault detection signal according to the detection signal to determine the detection state of each electronic wire of the electronic wires between the boards and outputting the detection signal to the display;

and the display is used for displaying the detection state according to the detection signal.

In a specific embodiment, the inter-board electronic wires are not faulty, the fault detection signal Ua is a, Ia is B, the processor queries the lookup table, and when the fault is not faulty, Ua is a, and Ia is B, so that the processor can determine that all the electronic wires of the inter-board electronic wires are normally connected at the moment and output the detection signal corresponding to the detection result to the display, and the display displays that the fault is not faulty after receiving the detection signal.

In an embodiment, when the inter-board electronic wires are faulty, the fault detection signal Ua is C, and Ia is D, the processor queries the lookup table, and finds that when the electronic wires connected to both ends of R0 are faulty, that is, when P10 and P20 are disconnected, the test loop is connected to the first test resistor R1, Ua is C, and Ia is D, so that the processor can determine that the fault occurs in the first electronic wire of the inter-board electronic wires as shown in fig. 6, and output the detection signal to the display according to the detection state of the inter-board electronic wires, and the display receives the detection signal and then displays the disconnection between P10 and P20.

In an embodiment, when an electronic wire between boards fails, where the fault detection signal Ua is E and Ia is F, the processor queries the lookup table, and finds that one of two adjacent electronic wires is short-circuited, as shown in fig. 7, for example, when P11 and P12 are short-circuited and there is no other fault, Ua is E and Ia is F, so that the processor can determine that the fault occurs in the second electronic wire or the third electronic wire of the electronic wires between boards as shown in fig. 7, and output a detection signal to the display according to the detection state of the electronic wire between boards, and after receiving the detection signal, the display displays the short circuit between P11 and P12, and the specific faulty electronic wire needs to be further tested to locate the faulty electronic wire.

In an embodiment, when an electronic wire between boards fails, where the fault detection signal Ua is G and Ia is H, the processor queries the lookup table, and finds that one of two adjacent electronic wires is short-circuited, as shown in fig. 8, for example, when P21 and P22 are short-circuited and there is no other fault, Ua is G and Ia is H, so that the processor can determine that the fault occurs in the second electronic wire or the third electronic wire of the electronic wires between boards as shown in fig. 8, and output a detection signal to the display according to the detection state of the electronic wire between boards, and after receiving the detection signal, the display displays the short circuit between P21 and P22, and the specific faulty electronic wire needs to be further tested to locate the faulty electronic wire.

It should be noted that the principle and process of the rest of the lookup tables provided in this embodiment are similar to those of the above-mentioned complete lookup table, and the above description may be referred to for relevant parts, which are not described herein again.

In another alternative embodiment, the test board further comprises a processor and a display, wherein

The processor is used for determining the detection state of the inter-board electronic wire according to the detection signal and a preset fault analysis formula and outputting the detection signal to the display;

and the display is used for displaying the detection state according to the detection signal.

In one embodiment, when the inter-board electronic wire is not failed, a test loop of the first power end, the first test terminal, the inter-board electronic wire, the second test terminal, the second test resistor, the second test terminal, the inter-board electronic wire, the first test terminal, the second test resistor is formed, and then Ua is the test loop of the second test resistor, the second power end

Ia is

And taking the formula as the condition that no fault occurs in the fault analysis formula to determine the detection state of the electronic wire between the plates.

In a specific embodiment, when the fault detection signal Ua is a and Ia is B, the processor calculates and determines that each of the inter-board electronic wires is not faulty according to a preset fault analysis formula, and outputs a detection signal to the display according to a detection state of the inter-board electronic wire at that time, and after the display receives the detection signal, the display displays that each of the inter-board electronic wires is not faulty and is in a normal state.

In one embodiment, when the one-way open circuit fault occurs in the inter-board electronic wire, a test loop of the first power supply end …, the first test terminal, the first test resistor, the second test terminal, the second test resistor, the second test terminal, the inter-board electronic wire, the first test terminal, the second test resistor, and the second power supply end is formed, then Ua is

Ia is:

and determining the detection state of the electronic wire between the boards by taking the formula as the condition of the single-circuit open circuit fault in the fault analysis formula.

In a specific embodiment, when the fault detection signal Ua is C and Ia is D, the processor calculates and determines that a fault exists in each electronic wire of the inter-board electronic wires according to a preset fault analysis formula, and the fault detection signal Ua is C and Ia is D are used to directly position the specific position of the electronic wire with a single open-circuit fault, so that the detection of the inter-board electronic wires is conveniently, quickly and efficiently completed. Specifically, when the fault detection signal Ua is C and Ia is D, the processor calculates and determines that the electronic wire connected to the two ends R0 of the inter-board electronic wire is faulty according to a preset fault analysis formula, that is, when the P10 and the P20 are disconnected,

in this case Ua is

Ia is:

accordingly, the processor can determine that the first one of the inter-board electronic wires has a disconnection fault, i.e., the fault shown in fig. 6, and output a detection signal to the display according to the detection state of the inter-board electronic wire at that time, and the display receives the detection signal and then displays that the first one of the inter-board electronic wires has a disconnection, i.e., the electronic wires corresponding to P10 and P20 have a disconnection.

In one embodiment, there is also a case where an open circuit fault occurs in a plurality of electronic wires among the electronic wires between the boards, and a test loop is formed by the first power terminal-the first test terminal … -the first test resistor-the second test terminal-the second test resistor-the second test terminal-the first test resistor-the first test terminal-the second test resistor, and then Ua is:

ia is:

wherein Rx and Ra are the resistance values of the first test resistor passed by the disconnection of the electronic wire between the boards.

And determining the detection state of the electronic wire between the boards by taking the formula as the condition of the multipath open circuit fault in the fault analysis formula.

In one embodiment, when the short-circuit fault occurs between the first test terminals in the electronic wire between boards, a test loop of the first power terminal … -the second test terminal-the electronic wire between boards-the first test terminal-the second test resistor-the second test terminal-the electronic wire between boards-the second test resistor-the second test terminal-the second power terminal is formed, then Ua is:

ia is:

wherein Rz is the resistance of the second test resistor which is not passed by the electron beam in the electron beam between the boards due to the short circuit fault between the first test terminals.

The above formula is used as a preset fault analysis formula when the short circuit between the first test terminals is in fault, and the detection state of the electronic wire between the boards can be determined according to the detection signal and the preset fault analysis formula.

In a specific embodiment, when an inter-board electronic wire fails, the fault detection signal Ua is E, and Ia is F, the processor calculates according to a preset fault analysis formula and determines that only the electronic wires corresponding to P11 and P12 have a short-circuit problem, and when there is no other fault, Ua is:

ia is:

accordingly, the processor can determine that the second or third electronic wire of the inter-board electronic wires has a short circuit problem, that is, a fault as shown in fig. 7 occurs, and output a detection signal to the display according to the detection state of the inter-board electronic wire at that time, and after receiving the detection signal, the display displays that the second or third electronic wire of the inter-board electronic wires has a short circuit, that is, the electronic wires corresponding to P11 and P12 have a short circuit.

In one embodiment, there is also a case where a short-circuit fault occurs between the second test terminals in the electronic wires between the boards, and a test loop is formed between the first power terminal and … the first test terminal, the electronic wires between the boards, the second test terminal, the electronic wires between the boards, the first test terminal, and the second test resistor, where Ua is:

ia is:

wherein, Re is the resistance value of the second test resistor which is not passed by the short circuit fault between the second test terminals of the electronic wires between the boards.

And determining the detection state of the electronic wire between the boards by taking the formula as the condition of short circuit fault between the second test terminals in the fault analysis formula.

According to the above embodiment, in a specific embodiment, when the fault detection signal Ua is G and Ia is H, the processor directly locates that P21 and P22 are short-circuited according to a preset fault analysis formula, and when there is no other fault, Ua is:

ia is:

the processor can judge that the second electronic wire or the third electronic wire among the electronic wires between the boards has a short circuit problem, namely a fault shown in fig. 8 occurs, and output a detection signal to the display according to the detection state of the electronic wire between the boards at the moment, and after the display receives the detection signal, the display displays that the second electronic wire or the third electronic wire of the electronic wires between the boards has a short circuit, namely the electronic wires corresponding to P21 and P22 have a short circuit.

It should be noted that the preset fault analysis formula provided in this embodiment further includes other fault analysis formulas, and the principle and the process of the fault analysis are similar to those described above, and reference may be made to the above description for relevant parts, which are not described herein again.

According to the above fault analysis formula, the same Ua and the value of Ia can be detected no matter which of the two adjacent lines is short-circuited by the first test terminal or the second test terminal, so that the short circuit can be detected by the two adjacent lines, the short circuit can be quickly positioned by the comparison table or the preset fault analysis formula, and the specific fault electronic line needs to be further tested to position the fault electronic line, compared with the prior art, the detection efficiency can be effectively improved by the embodiment.

In order to better connect the inter-board electronic wires shown in fig. 1 with the test circuit shown in fig. 2, the test circuit is provided corresponding to each of the inter-board electronic wires, and a first pitch between the pair of test terminals is equal to a second pitch between the electronic wires of the inter-board electronic wires.

Specifically, as shown in fig. 2, the test circuit of the test board is arranged in an "S" shape or an inverted "S" shape, since the pitch between the test terminal pairs of the test circuit is equal to the pitch between the electronic wires of the electronic wires between the boards. In the testing process, the testing terminals of the testing board can be directly connected into each electronic wire of the electronic wires between the boards, so that the testing time is reduced, the stability of the testing circuit in the testing process is ensured, and the testing efficiency of the testing board is improved.

The test board for detecting the inter-board electronic wires provided by the embodiment forms a test loop through the test circuit arranged on the test board so as to detect the inter-board electronic wires, and judges whether the short circuit and the open circuit exist in each electronic wire of the inter-board electronic wires according to the detection signal output by the detection assembly, so that the connection quality of each electronic wire of the inter-board electronic wires is conveniently and quickly judged, the detection time is effectively reduced, the detection efficiency is improved, the automatic and intelligent test is realized, the possibility is provided for the minimization of test equipment, and the test board has wide application prospect.

Corresponding to the test board for detecting the electronic wire between the boards provided in the above embodiments, as shown in fig. 9, an embodiment of the present application further provides a method for testing the electronic wire between the boards by using the test board, including:

respectively connecting a plurality of test terminal pairs of a test circuit of a test board into each electronic wire of the electronic wires between the boards;

applying an electrical signal to a first power terminal and a second power terminal of the test circuit to form a test loop that detects the electron lines between the plates;

and the detection assembly of the test circuit outputs a detection signal of the electronic wire between the boards.

In this embodiment, the testing circuit disposed on the testing board forms a testing loop to detect the inter-board electronic wires, and determines whether the inter-board electronic wires have short circuit or open circuit according to the testing signal output by the testing component, so that the connection quality of the inter-board electronic wires can be conveniently and quickly determined according to the testing signal, the testing time is effectively reduced, and the testing efficiency is improved. The detailed description of the embodiments is the same as the previous embodiments and is not repeated herein.

In an optional embodiment, the test board further includes a processor, a comparison table and a display, the comparison table includes a detection status and a corresponding fault detection signal for traversing each electronic wire fault in the electronic wires between boards, and after the detection component of the test circuit outputs the detection signal of the electronic wire between boards, the test method further includes:

the processor inquires the comparison table according to the detection signal to match the fault detection signal, determines the detection state of the inter-board electronic wire and outputs the detection signal to the display;

and the display displays the detection state according to the detection signal.

In this embodiment, through the comparison table that sets up, can further accelerate the testing process of inter-board electron line to through the display failure condition of directly perceivedly showing, effectively promote the detection efficiency of inter-board electron line, and further improve the fault repair performance of inter-board electron line. The detailed description of the embodiments is the same as the previous embodiments and is not repeated herein.

In another optional embodiment, the test board further comprises a processor and a display, and after the detection component of the test circuit outputs a detection signal of the electronic wire between the boards, the test method further comprises:

the processor determines the detection state of the inter-board electronic wire according to the detection signal and a preset fault analysis formula and outputs the detection signal to the display;

and the display displays the detection state according to the detection signal.

In this embodiment, the detection process of the inter-board electronic wire can be further accelerated by the preset fault analysis formula, and the fault condition is visually displayed by the display, so that the detection efficiency of the inter-board electronic wire is effectively improved, and the fault repair performance of the inter-board electronic wire is further improved. The detailed description of the embodiments is the same as the previous embodiments and is not repeated herein. According to the testing method for the electronic wires between the boards, the testing circuit arranged on the testing board is used for forming the testing loop to detect the electronic wires between the boards, and whether the short circuit and the open circuit of each electronic wire of the electronic wires between the boards exist is judged according to the detection signal output by the detection component, so that the connection quality of each electronic wire of the electronic wires between the boards is conveniently and quickly judged, the detection time is effectively shortened, the detection efficiency is improved, the automatic and intelligent testing is realized, the possibility is provided for the minimization of the testing equipment, and the testing method has a wide application prospect.

It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.