1. A TEC-based optoelectronic device test platform comprising:

the top of the radiating fin is provided with a fixed groove, and the bottom of the radiating fin is provided with a plurality of groups of radiating fins;

the TEC unit is embedded in the fixing groove;

the heat conducting plate is used as a testing plane for bearing the optoelectronic device to be tested; and

and the magnetic fixing strip can be configured by dynamic combination to constrain the optoelectronic device to be tested.

2. The test platform of claim 1, said TEC cells comprising TEC chips and PCB control boards.

3. The test platform of claim 2, said securing slots comprising a PCB securing slot and a TEC plate securing slot.

4. The test platform of claim 2, wherein the TEC plates are configured in pairs, and the positive and negative leads are fixed by the guide slots and then connected to the PCB control board.

5. The test platform of claim 1, wherein the PCB control board is provided with a power supply terminal, and the power supply terminal is connected with the TEC chip through a positive lead and a negative lead and used for supplying power to the TEC chip.

6. The testing platform as claimed in claim 1, wherein a heat dissipation fan is further disposed in the heat dissipation fins at the bottom of the heat dissipation plate for accelerating the heat dissipation of the heat dissipation plate.

7. The test platform of claim 1, said thermally conductive plate being provided with a magnetic coating in an edge region thereof.

8. The test platform of claim 7, wherein a dashed line is disposed along an inner side of the magnetic coating, and an area surrounded by the dashed line is a test area.

9. The test platform of claim 1, said magnetic retaining strips being provided with angled slots, vertical slots, and engagement notches to facilitate dynamic assembly between different magnetic retaining strips.

10. The test platform according to claim 1, wherein a heat conducting silicone grease is filled between the heat emitting end face of the TEC plate and the heat sink.

Background

In recent years, the technology of optoelectronic devices has been rapidly developed under the push of the explosive development of the communication industry. The testing of the optoelectronic device is taken as a standard procedure for the performance of the device, the importance of the testing is increasingly prominent, and during testing, on one hand, the testing precision is greatly influenced by the stability of the working state of the optoelectronic device, and meanwhile, the testing precision is also greatly influenced by the temperature of the testing environment; on the other hand, in the test process, the test efficiency is low due to damage of the device and interruption of optical fiber connection caused by improper fixation of the optoelectronic device.

Therefore, in order to meet the increasing demand for communication data, how to improve the testing efficiency and precision of the optoelectronic device becomes a technical issue to be solved.

Disclosure of Invention

Technical problem to be solved

Based on the problems, the disclosure provides a test platform for a photoelectronic device based on a TEC (thermoelectric cooler), so as to relieve the problem that the test precision is greatly influenced by the stability of the working state of the photoelectronic device during the test of the photoelectronic device in the prior art, and meanwhile, the test precision is greatly influenced by the temperature of the test environment; the technical problems of low testing efficiency and the like caused by device damage and optical fiber connection interruption due to improper fixation of the photoelectronic device in the testing process are easily caused.

(II) technical scheme

The present disclosure provides a photoelectronic device test platform based on TEC, comprising: the top of the radiating fin is provided with a fixed groove, and the bottom of the radiating fin is provided with a plurality of groups of radiating fins; the TEC unit is embedded in the fixing groove; the heat conducting plate is used as a testing plane for bearing the optoelectronic device to be tested; and the magnetic fixing strip can be configured by dynamic combination to restrain the optoelectronic device to be tested.

According to the embodiment of the disclosure, the TEC unit comprises a TEC sheet and a PCB control board.

According to the embodiment of the present disclosure, the fixing groove includes a PCB fixing groove and a TEC plate fixing groove.

According to the embodiment of the disclosure, the TEC pieces are configured in pairs, and the anode lead and the cathode lead of the TEC pieces are fixed by the guide grooves and then connected with the PCB control board.

According to the embodiment of the disclosure, the PCB control board is provided with a power supply terminal, and the power supply terminal is connected with the TEC sheet through a positive electrode lead and a negative electrode lead and used for supplying power to the TEC sheet.

According to the embodiment of the disclosure, a heat dissipation fan is further arranged in the heat dissipation fins at the bottom of the heat dissipation fin and used for accelerating the heat dissipation of the heat dissipation fin.

According to the embodiment of the disclosure, the edge area of the heat conducting plate is provided with a magnetic plating layer.

According to the embodiment of the disclosure, the inner side of the magnetic coating is provided with a dotted line identification line, and the area surrounded by the dotted line identification line is a test area.

According to the embodiment of the disclosure, the magnetic fixing strips are provided with the inclined grooves, the vertical grooves and the connecting notches, so that dynamic combination setting among different magnetic fixing strips is facilitated.

According to the embodiment of the disclosure, heat-conducting silicone grease is filled between the heating end face of the TEC sheet and the heat radiating sheet.

(III) advantageous effects

According to the technical scheme, the test platform for the optoelectronic device based on the TEC has at least one or part of the following beneficial effects:

(1) the temperature of the test platform can be detected and controlled in real time;

(2) the device fixing scheme can be dynamically configured according to different types of the optoelectronic devices to be tested;

(3) the test efficiency and the test precision of the device can be improved.

Drawings

Fig. 1 is a schematic perspective view of a test platform for an optoelectronic device based on a TEC according to an embodiment of the present disclosure.

Fig. 2 is a schematic perspective view of a TEC-based optoelectronic device testing platform according to an embodiment of the present disclosure, when a heat dissipation plate and a magnetic fixing strip are not assembled.

Fig. 3 is a schematic perspective view of a bottom of a TEC-based optoelectronic device test platform according to an embodiment of the present disclosure.

Fig. 4 is a schematic perspective view of a heat sink in a TEC-based optoelectronic device test platform according to an embodiment of the present disclosure.

Fig. 5 is a schematic perspective view of a heat conducting plate in a TEC-based optoelectronic device testing platform according to an embodiment of the present disclosure.

Fig. 6 is a schematic perspective view of a magnetic fixing strip of a TEC-based optoelectronic device test platform according to an embodiment of the present disclosure and a schematic free dynamic combination configuration of the magnetic fixing strip.

[ description of main reference numerals in the drawings ] of the embodiments of the present disclosure

1-a heat sink;

2-heat conducting plate;

3-magnetic fixing strips;

4-the optoelectronic device to be tested;

5-a power supply terminal;

6-PCB control panel;

7-TEC plate;

8-wire and its fixation groove;

9-radiating fins;

10-a heat dissipation fan;

11-PCB fixation grooves;

12-TEC fixing grooves;

13-magnetic plating;

14-test area identification line;

15-test area;

16-magnetic fixed strip chute;

17-magnetic fixing strip engaging notches;

18-magnetic fixing bar vertical slot.

Detailed Description

The disclosure provides a test platform for a photoelectronic device based on a TEC (thermoelectric cooler), which mainly comprises a cooling fin, a TEC sheet and a control system thereof, and a fixing strip which can be dynamically combined and configured on a heat conducting plate. A heat radiation fan is arranged in the bottom of the heat radiation fin, and a fixing groove for a PCB and a TEC sheet is formed in the top of the heat radiation fin; the TEC pieces are arranged in pairs, and a positive lead and a negative lead of the TEC pieces are fixed by the guide grooves and connected with a power supply terminal on the PCB; the fixing strip which can be dynamically combined and configured can be fixed by magnetism between the plating layers at the edge of the test plane. The switch of the heat dissipation fan, the rotating speed and the working state of the TEC sheet are all controlled by the PCB. By monitoring the temperature of the platform thermistor, the working states of the TEC sheet and the heat dissipation fan can be dynamically adjusted in real time. Through the technical scheme in the application, the temperature of the test platform can be detected and controlled in real time, and the fixing scheme can be dynamically configured according to different types of the optoelectronic devices to be tested, so that the test efficiency and the test precision of the devices are improved.

For the purpose of promoting a better understanding of the objects, aspects and advantages of the present disclosure, reference is made to the following detailed description taken in conjunction with the accompanying drawings.

In an embodiment of the present disclosure, a test platform for an optoelectronic device based on a TEC is provided, which is shown in fig. 1 to 6, and includes:

the top of the radiating fin 1 is provided with a fixing groove;

the TEC unit is embedded in the fixing groove;

the heat conducting plate 2 is used as a testing plane for bearing the optoelectronic device 4 to be tested; and a magnetic fixing strip 3 which can be configured by dynamic combination to constrain the optoelectronic device to be tested.

In the embodiment of the present disclosure, as shown in fig. 2 and 4, the TEC unit includes a TEC plate 7 and a PCB control plate 6. The fixing groove includes a PCB fixing groove 11, and a TEC plate fixing groove 12.

In the embodiment of the present disclosure, as shown in fig. 3, a plurality of groups of heat dissipation fins 9 are disposed at the bottom of the heat dissipation plate 1, and a heat dissipation fan 10 is further disposed at the bottom of the heat dissipation plate 1 for accelerating heat dissipation of the heat dissipation plate.

According to the embodiment of the present disclosure, as shown in fig. 2, the TEC plates are arranged in pairs, and the positive lead and the negative lead are fixed by the guide groove 8.

According to the embodiment of the disclosure, as shown in fig. 2, the PCB control board is provided with a power supply terminal 5, and the power supply terminal is connected to the TEC plate through a positive electrode lead and a negative electrode lead and is configured to supply power to the TEC plate. Fig. 2 shows a right-angle guide fixing groove for the positive electrode lead and the negative electrode lead, but the test platform is not limited to this structure, and a U-shaped plastic clamp may be used to directly fix the leads.

According to the embodiment of the present disclosure, as shown in fig. 5, a magnetic plating layer 13 is disposed on an edge region of the heat conducting plate 2, a dashed identification line 14 is disposed along an inner side of the magnetic plating layer 13, and a region surrounded by the dashed identification line 14 is a test region 15.

According to the embodiment of the present disclosure, as shown in fig. 1 and 6, the magnetic fixing strip 3 is provided with the inclined groove 16, the vertical groove 18 and the engaging notch 17, which facilitates the dynamic combination arrangement between the magnetic fixing strips 3 without copper. The chute, the vertical groove and the connection notches of the magnetic fixing strip can be in a non-uniform distribution mode, namely the number distribution users of the chute, the vertical groove and the connection notches can be self-defined according to actual requirements. And the chute of the magnetic fixing strip can adopt different angles, namely, the angle of the chute can be customized by a user according to actual requirements, so that the degree of freedom of dynamic configuration is increased conveniently.

According to the embodiment of the disclosure, the number of the magnetic fixing strips is not limited, and a plurality of magnetic fixing strips can be selected for dynamic configuration according to actual requirements.

According to the embodiment of the disclosure, the length of the magnetic fixing strip is not less than that of the shortest side of the heat-conducting plate.

According to the embodiment of the disclosure, heat-conducting silicone grease is filled between the heating end face of the TEC sheet and the heat radiating sheet.

According to the embodiment of the disclosure, the whole test platform adopts the heat dissipation fan and the TEC sheet at the same time, so that the precision of temperature control is greatly improved, and the response time is shortened.

So far, the embodiments of the present disclosure have been described in detail with reference to the accompanying drawings. It is to be noted that, in the attached drawings or in the description, the implementation modes not shown or described are all the modes known by the ordinary skilled person in the field of technology, and are not described in detail. Further, the above definitions of the various elements and methods are not limited to the various specific structures, shapes or arrangements of parts mentioned in the examples, which may be easily modified or substituted by those of ordinary skill in the art.

From the above description, those skilled in the art should clearly recognize that the test platform for TEC-based optoelectronic device of the present disclosure.

In summary, the present disclosure provides a test platform for a TEC-based optoelectronic device, which utilizes a temperature control system and a dynamically configurable magnetic fixing strip to detect and control the temperature of the test platform in real time, and dynamically configure a fixing scheme according to different types of optoelectronic devices to be tested, thereby improving the test efficiency and precision of the device.

It should also be noted that directional terms, such as "upper", "lower", "front", "rear", "left", "right", and the like, used in the embodiments are only directions referring to the drawings, and are not intended to limit the scope of the present disclosure. Throughout the drawings, like elements are represented by like or similar reference numerals. Conventional structures or constructions will be omitted when they may obscure the understanding of the present disclosure.

And the shapes and sizes of the respective components in the drawings do not reflect actual sizes and proportions, but merely illustrate the contents of the embodiments of the present disclosure. Furthermore, in the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.

Furthermore, the word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.

The use of ordinal numbers such as "first," "second," "third," etc., in the specification and claims to modify a corresponding element does not by itself connote any ordinal number of the element or any ordering of one element from another or the order of manufacture, and the use of the ordinal numbers is only used to distinguish one element having a certain name from another element having a same name.

In addition, unless steps are specifically described or must occur in sequence, the order of the steps is not limited to that listed above and may be changed or rearranged as desired by the desired design. The embodiments described above may be mixed and matched with each other or with other embodiments based on design and reliability considerations, i.e., technical features in different embodiments may be freely combined to form further embodiments.

Those skilled in the art will appreciate that the modules in the device in an embodiment may be adaptively changed and disposed in one or more devices different from the embodiment. The modules or units or components of the embodiments may be combined into one module or unit or component, and furthermore they may be divided into a plurality of sub-modules or sub-units or sub-components. All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or elements of any method or apparatus so disclosed, may be combined in any combination, except combinations where at least some of such features and/or processes or elements are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. Also in the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware.

The above-mentioned embodiments are intended to illustrate the objects, aspects and advantages of the present disclosure in further detail, and it should be understood that the above-mentioned embodiments are only illustrative of the present disclosure and are not intended to limit the present disclosure, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present disclosure should be included in the scope of the present disclosure.