1. A MEMS inertial sensor, comprising:

a support structure;

an inertial structure comprising at least one first inertial mass;

a first resilient structure mechanically coupled to the first inertial mass and the support structure such that: the first inertial mass is movable relative to the support structure in a direction parallel to a first direction when the support structure is subjected to a first acceleration parallel to the first direction; and

a first stop structure fixed relative to the support structure and comprising at least a first primary first shaft stop element and a first secondary first shaft stop element,

wherein the first primary first shaft stop element is configured such that: the first inertial mass abuts against the first primary first axis stop element and is subsequently rotated about a first rotation axis defined by the first primary first axis stop element if the first acceleration exceeds a first threshold value, and

wherein the first secondary first shaft stop element is configured such that: the rotation of the first inertial mass is terminated when the first inertial mass abuts the first secondary first axis stop element if the first acceleration exceeds a second threshold higher than the first threshold.

2. The MEMS inertial sensor of claim 1, wherein the inertial structure further comprises a second inertial mass, the MEMS inertial sensor further comprising:

a second resilient structure resiliently coupled to the second inertial mass and the support structure and configured such that: the second inertial mass is movable with respect to the support structure in a direction parallel to a second direction when the support structure is subjected to a second acceleration parallel to the second direction,

wherein the first resilient structure is mechanically interposed between the first inertial mass and the second inertial mass and is configured such that: the first inertial mass and the second inertial mass translate in a fixed manner in a direction parallel to the second direction when the support structure is subjected to the second acceleration, and

wherein the second elastic structure is configured such that: the second inertial mass remains substantially fixed relative to the support structure when the support structure is subjected to the first acceleration.

3. The MEMS inertial structure of claim 2, further comprising a second stop structure fixed relative to the support structure and comprising at least one first primary second axis stop element and one first secondary second axis stop element,

wherein the first primary and secondary shaft stop element is configured such that: if the second acceleration exceeds a third threshold value, the second inertial mass abuts against the first primary second shaft stop element and then rotates, in a fixed manner with the first inertial mass, about a second axis of rotation defined by the first second shaft stop element, and

wherein the first secondary shaft stop element is configured such that: if the second acceleration exceeds a fourth threshold value, which is higher than the third threshold value, the rotation of the first inertial mass and the second inertial mass terminates in a fixed manner when the second inertial mass abuts against the first secondary shaft stop element.

4. The MEMS inertial sensor of claim 3, wherein the first stop structure further comprises a second primary first axis stop element and a second secondary second axis stop element,

wherein the second primary first axis stop element is configured such that: when the support structure is subjected to a third acceleration having a direction opposite to the first acceleration and above a fifth threshold value, the first inertial mass abuts against the second main first axis stop element and then rotates about a third rotation axis defined by the second main first axis stop element, and

wherein the second secondary first axis stop element is configured such that: if the third acceleration exceeds a sixth threshold value, which is higher than the fifth threshold value, the rotation of the first inertial mass about the third axis of rotation is terminated when the first inertial mass abuts against the second secondary first axis stop element.

5. The MEMS inertial sensor of claim 4, wherein the second stopper structure further comprises a second primary second shaft stopper element and a second secondary second shaft stopper element,

wherein the second primary and secondary shaft stop element is configured such that: when the support structure is subjected to a fourth acceleration having a direction opposite to the second acceleration and higher than a seventh threshold value, the second inertial mass abuts against the second primary second axis stop element and then rotates, in a fixed manner with the first inertial mass, about a fourth rotation axis defined by the second primary second axis stop element, and

wherein the second secondary shaft stop element is configured such that: if the fourth acceleration exceeds an eighth threshold value, which is higher than the seventh threshold value, the rotation of the first inertial mass and the second inertial mass terminates in a fixed manner when the second inertial mass abuts against the second secondary second shaft stop element.

6. The MEMS inertial sensor of claim 5, wherein the first inertial mass is penetrated by a primary opening,

wherein the second inertial mass and the first elastic structure extend within the main opening, an

Wherein the first spring structure comprises a pair of spring elements which are symmetrical in a rest state with respect to a first plane of symmetry parallel to the second direction, each spring element of the pair being fixed to the first inertial mass and to the second inertial mass, the second inertial mass being interposed between the spring elements of the pair.

7. The MEMS inertial sensor of claim 6, wherein the second inertial mass is crossed by a first secondary opening and a second secondary opening,

wherein the support structure comprises a first anchoring region and a second anchoring region, which are symmetrical with respect to a second plane of symmetry parallel to the first direction and partially extend inside the first secondary opening and the second secondary opening, respectively, and

wherein the second spring structure comprises a respective first spring element and a respective second spring element which are symmetrical in the rest state with respect to the second plane of symmetry and which extend in the first secondary opening and the second secondary opening, respectively, the first spring element of the second spring structure being fixed to the first anchoring region and the second inertial mass, the second spring element of the second spring structure being fixed to the second anchoring region and the second inertial mass.

8. The MEMS inertial sensor according to claim 7, wherein the first and second primary first axis stop elements extend outside the first inertial mass and each stop element comprises a corresponding protruding area facing the first inertial mass, the protruding area of the first primary first axis stop element defining the first rotation axis, the protruding area of the second primary first axis stop element defining the third rotation axis.

9. The MEMS inertial sensor according to claim 8, wherein the first and second primary second shaft stop elements extend partially within the first and second secondary openings, respectively, and are arranged symmetrically with respect to a central portion of the second inertial mass in a rest state, the first and second primary second shaft stop elements having a protruding shape, respectively, and defining the second and fourth rotation axes.

10. The MEMS inertial sensor of claim 9, wherein the first and second primary shaft stop elements are fixed to the first and second anchor regions, respectively.

11. The MEMS inertial sensor according to claim 9, wherein the first and second secondary first axis stop elements and the first and second secondary second axis stop elements are arranged outside the first inertial mass.

12. A MEMS inertial sensor, comprising:

a support structure;

an inertial structure comprising a first inertial mass and a second inertial mass;

a first resilient structure mechanically coupled to the first inertial mass and the support structure such that: the first inertial mass is movable relative to the support structure in a direction parallel to a first direction when the support structure is subjected to a first acceleration parallel to the first direction;

a second resilient structure resiliently coupled to the second inertial mass and the support structure and configured such that: the second inertial mass is movable with respect to the support structure in a direction parallel to a second direction when the support structure is subjected to a second acceleration parallel to the second direction;

a first stop structure fixed relative to the support structure and comprising at least a first primary first shaft stop element and a first secondary first shaft stop element;

a spindle electrode fixed relative to the support structure and capacitively coupled to the first inertial mass to form a corresponding spindle capacitor, a capacitance of the spindle capacitor being indicative of the first acceleration; and

a cross-axis electrode fixed relative to the support structure and capacitively coupled to the second inertial mass to form a corresponding cross-axis capacitor, a capacitance of the cross-axis capacitor being indicative of the second acceleration.

13. The MEMS inertial structure of claim 12, wherein:

the first primary first shaft stop element is configured such that: the first inertial mass abutting against the first primary first axis stop element and subsequently rotating about a first rotation axis defined by the first primary first axis stop element if the first acceleration exceeds a first threshold value,

the first secondary first shaft stop element is configured such that: if the first acceleration exceeds a second threshold value, which is higher than the first threshold value, rotation of the first inertial mass terminates when the first inertial mass abuts the first secondary first axis stop element,

the first elastic structure is mechanically interposed between the first inertial mass and the second inertial mass and is configured such that: the first inertial mass and the second inertial mass translate in a fixed manner in a direction parallel to the second direction when the support structure is subjected to the second acceleration, and

the second elastic structure is configured such that: the second inertial mass remains substantially fixed relative to the support structure when the support structure is subjected to the first acceleration.

14. The MEMS inertial structure of claim 13, further comprising a second stop structure fixed relative to the support structure and comprising at least one first primary second axis stop element and a first secondary second axis stop element,

wherein the first primary and secondary shaft stop element is configured such that: if the second acceleration exceeds a third threshold value, the second inertial mass abuts against the first primary second shaft stop element and then rotates, in a fixed manner with the first inertial mass, about a second axis of rotation defined by the first second shaft stop element, and

wherein the first secondary shaft stop element is configured such that: if the second acceleration exceeds a fourth threshold value, which is higher than the third threshold value, the rotation of the first inertial mass and the second inertial mass terminates in a fixed manner when the second inertial mass abuts against the first secondary shaft stop element.

15. The MEMS inertial structure of claim 14, wherein the first stop structure further comprises a second primary first axis stop element and a second secondary second axis stop element,

wherein the second primary first axis stop element is configured such that: when the support structure is subjected to a third acceleration having a direction opposite to the first acceleration and above a fifth threshold value, the first inertial mass abuts against the second main first axis stop element and then rotates about a third rotation axis defined by the second main first axis stop element, and

wherein the second secondary first axis stop element is configured such that: if the third acceleration exceeds a sixth threshold value, which is higher than the fifth threshold value, the rotation of the first inertial mass about the third axis of rotation is terminated when the first inertial mass abuts against the second secondary first axis stop element.

16. An electronic device, comprising:

a MEMS inertial sensor, comprising:

a support structure;

an inertial structure comprising at least one first inertial mass;

a first resilient structure mechanically coupled to the first inertial mass and the support structure such that the first inertial mass is movable relative to the support structure in a direction parallel to a first direction when the support structure is subjected to a first acceleration parallel to the first direction; and

a first stop structure fixed relative to the support structure and comprising at least a first primary first shaft stop element and a first secondary first shaft stop element,

wherein the first primary first shaft stop element is configured such that: the first inertial mass abuts against the first primary first axis stop element and is subsequently rotated about a first rotation axis defined by the first primary first axis stop element if the first acceleration exceeds a first threshold value, and

wherein the first secondary first shaft stop element is configured such that: if the first acceleration exceeds a second threshold value higher than the first threshold value, terminating the rotation of the first inertial mass when the first inertial mass abuts the first secondary first axis stop element;

an ASIC coupled to the MEMS inertial sensor; and

a processing unit coupled to the ASIC.

17. The electronic device defined in claim 16 wherein the inertial structure further comprises a second inertial mass, the MEMS inertial sensor further comprising:

a second resilient structure resiliently coupled to the second inertial mass and the support structure and configured such that: the second inertial mass is movable with respect to the support structure in a direction parallel to a second direction when the support structure is subjected to a second acceleration parallel to the second direction,

wherein the first resilient structure is mechanically interposed between the first inertial mass and the second inertial mass and is configured such that: the first inertial mass and the second inertial mass translate in a fixed manner in a direction parallel to the second direction when the support structure is subjected to the second acceleration, and

wherein the second elastic structure is configured such that: the second inertial mass remains substantially fixed relative to the support structure when the support structure is subjected to the first acceleration.

18. The electronic device of claim 17, wherein the MEMS inertial sensor further comprises a second stop structure fixed relative to the support structure and including at least one first primary second shaft stop element and a first secondary second shaft stop element,

wherein the first primary and secondary shaft stop element is configured such that: if the second acceleration exceeds a third threshold value, the second inertial mass abuts against the first primary second shaft stop element and then rotates, in a fixed manner with the first inertial mass, about a second axis of rotation defined by the first second shaft stop element, and

wherein the first secondary shaft stop element is configured such that: if the second acceleration exceeds a fourth threshold value, which is higher than the third threshold value, the rotation of the first inertial mass and the second inertial mass terminates in a fixed manner when the second inertial mass abuts against the first secondary shaft stop element.

19. The electronic device of claim 18, wherein the first detent structure further comprises a second primary first axis detent element and a second secondary second axis detent element,

wherein the second primary first axis stop element is configured such that: when the support structure is subjected to a third acceleration having a direction opposite to the first acceleration and above a fifth threshold value, the first inertial mass abuts against the second main first axis stop element and then rotates about a third rotation axis defined by the second main first axis stop element, and

wherein the second secondary first axis stop element is configured such that: if the third acceleration exceeds a sixth threshold value, which is higher than the fifth threshold value, the rotation of the first inertial mass about the third axis of rotation is terminated when the first inertial mass abuts against the second secondary first axis stop element.

20. The electronic device of claim 19, wherein the second detent structure further comprises a second primary second shaft detent element and a second secondary second shaft detent element,

wherein the second primary and secondary shaft stop element is configured such that: when the support structure is subjected to a fourth acceleration having a direction opposite to the second acceleration and higher than a seventh threshold value, the second inertial mass abuts against the second primary second axis stop element and then rotates, in a fixed manner with the first inertial mass, about a fourth rotation axis defined by the second primary second axis stop element, and

wherein the second secondary shaft stop element is configured such that: if the fourth acceleration exceeds an eighth threshold value, which is higher than the seventh threshold value, the rotation of the first inertial mass and the second inertial mass terminates in a fixed manner when the second inertial mass abuts against the second secondary second shaft stop element.

Background

As is known, a MEMS inertial sensor comprises, for example, an accelerometer of the MEMS type, in turn comprising a suspended inertial mass, lying in a main plane of extension. Usually, the inertial mass is carried to move along a direction (axis of induction) parallel to the main plane of extension, due to the effect of external accelerations.

For example, fig. 1A and 1B show a known capacitive MEMS accelerometer 1 under two different operating conditions. Furthermore, fig. 1A and 1B show a cartesian reference system XYZ, the plane XY of which coincides with the main extension plane described above.

The MEMS accelerometer 1 comprises an inertial mass 3 of semiconductor material (e.g. silicon), the inertial mass 3 having a planar shape and extending over a substrate not shown in fig. 1A and 1B. For example, the inertial mass 3 has a shape of a quadrangular (e.g., rectangular) frame in a top view, and has a through-type opening 9. In other words, the inertial mass 3 has externally the shape of a parallelepiped; furthermore, the opening 9 also has the shape of a parallelepiped.

A first electrode 13 and a second electrode 15, both of which are made of semiconductor material (e.g. silicon), extend in the opening 9 and are anchored to the underlying substrate by means of respective anchoring portions 13A, 15A. In particular, the first electrode 13 and the second electrode 15 have an elongated quadrangular (e.g., rectangular) shape in top view, mainly extending along the axis X.

In particular, the inertial mass 3 has first and second inner surfaces 3A, 3B, which laterally define the opening 9 and face the first and second electrodes 13, 15, respectively. The first inner surface 3A and the second inner surface 3B are planar and extend in a direction parallel to the plane XZ.

The MEMS accelerometer 1 has a sensing axis S parallel to the axis Y. Furthermore, the inertial mass 3 has a mass centre O, which is set at a point d in the rest state₀To (3).

In more detail, in the rest state of the MEMS accelerometer 1, the first inner surface 3A and the second inner surface 3B are arranged at a first distance d from the first electrode 13 and the second electrode 15, respectively₁And a second distance d₂To (3). In the rest state of the MEMS accelerometer 1, the first surface 3A and the second surface 3B and the first surfaceThe electrode 13 and the second electrode 15 are capacitively coupled to each other and formed to have a capacitance C₁、C₂Corresponding to the plates of the capacitor.

The inertial mass 3 is crossed through its entire thickness (in a direction parallel to the axis Z) by a plurality of holes 17, these holes 17 enabling the release of the inertial mass 3 during the manufacturing process.

The inertial mass 3 is coupled to the constraint element 5 by means of a spring element 7, the constraint element 5 being fixed with respect to the base, the spring element 7 being configured to respond to an external acceleration a having a component directed parallel to the axis Y_extSo that the inertial mass 3 is displaced (in particular translated) along the sensing axis S. In the example of embodiment shown, the constraining element 5 is arranged outside the inertial mass 3 and is coupled to the above-mentioned frame-shaped first outer wall 3C of the inertial mass 3.

The MEMS accelerometer 1 further comprises a stop element 19, the stop element 19 being formed for example by a fixed area extending from the base at a distance from the inertial mass 3. In particular, in the example of embodiment shown, the stop element 19 is arranged outside the inertial mass 3 and faces, at a distance, a second outer wall 3D of the inertial mass 3, the second outer wall 3D being opposite the first outer wall 3C. In the rest state of the MEMS accelerometer 1 shown in fig. 1A, the stop element 19 is arranged at a stop distance D from the second outer wall 3D of the inertial mass 3_sTo (3).

In use, the inertial mass 3 and the first and second electrodes 13, 15 are biased to respective bias voltages. For example, a voltage of about 1V exists between the inertial mass 3 and each of the first and second electrodes 13, 15.

Due to the bias, the inertial mass 3 is subjected to a total electrostatic force F_elTotal electrostatic force F_elBy a first electrostatic force F_el1And a second electrostatic force F_el2The sum is given. In particular, a first electrostatic force F_el1Acting between the first electrode 13 and the first inner surface 3A, a second electrostatic force F_el2Acting between the second electrode 15 and the second inner surface 3B.

The MEMS accelerometer 1 is designed so that it is at restIn this state, the first distance d between the inertial mass 3 and the first and second electrodes 13, 15₁And a second distance d₂Identical to each other, a first capacitor C₁And a second capacitor C₂The same applies. Thus, the first electrostatic force F_el1And a second electrostatic force F_el2Same, and total electrostatic force F_elIs zero. Thus, in the rest state, the spring element 7 is not deformed.

In use, the above-mentioned external acceleration a acting on the MEMS accelerometer 1 is assumed_extOriented along the sensing axis S (e.g. downwards in the plane of the drawing), the inertial mass 3 is subjected to an external acceleration a_extTranslation occurs in the opposite direction along the sense axis S as shown in fig. 1B. Thus, the distance d₁、d₂(accordingly, the capacitance C₁、C₂) A change occurs. In particular, the first distance d₁Decreased by a second distance d₂Increasing; in addition, a first capacitor C₁Increased and the second capacitance C₂And decreases. These changes in capacitance represent external acceleration a_extBy detecting the value of C, thus₁And C₂To measure external acceleration a_ext. For example, the MEMS accelerometer 1 may be coupled to an ASIC (application specific integrated circuit) providing a corresponding read interface and configured according to a first capacitance C₁And a second capacitor C₂Is generated in response to the external acceleration a_extA proportional signal.

When the inertial mass 3 passes by a distance equal to the stop distance d_sAgainst the stop element 19 after that, the translation of the inertial mass 3 is interrupted. In this case, the center of mass O of the inertial mass 3 is in the translated position d_TThe position being relative to point d₀Translation in a direction parallel to the axis of induction S equal to the stopping distance d_sThe amount of (c). Thus, the distance between the first electrode 13 and the first inner surface 3A is equal to d₁-d_sAnd the distance between the second electrode 15 and the second inner surface 3B is equal to d₂+d_s。

In particular, when the inertial mass 3 abuts against the stop element 19, it is subjected to the overall value given by equation (1)Electrostatic force F_el：

Wherein ε is the dielectric constant, A_elIs the area of the first and second electrodes 13, 15 (and therefore also the area of the portion of the inertial mass 3 facing their surfaces 3A, 3B), av is the voltage between the plates of the capacitors C1, C2.

Furthermore, when the inertial mass 3 abuts against the stop element 19, a static friction force F_aActing thereon, the static friction force F_aTending to keep it against the stop element 19.

Upon external acceleration a_extTerminate (i.e., a)_ext0), the elastic restoring force F exerted by the spring element 7_mTending to return the inertial mass 3 to the rest position shown in figure 1A, in particular an elastic return force F_mActing along the sensing axis S in a direction opposite to the displacement direction of the inertial mass 3.

Elastic restoring force F_mGiven by equation (2):

F_m＝-k·d_s (2)

to overcome static friction force F_aAnd to return the inertial mass 3 to the rest position, enabling the detection of further accelerations, the spring element 7 being designed so that the elastic restoring force F is such that_mCapable of compensating for static friction force F_aAnd the total electrostatic force F set in the step shown in FIG. 1B_el. In other words, we wish to

F_m>α(F_el+F_a(t＝0)) (3)

Wherein F_a(t＝0)Is the inherent static friction (i.e. the static friction estimated before the MEMS accelerometer 1 is first used) and a is a safety factor.

However, static friction force F_aIs complex. In fact, the static friction force F_aDepending on a number of moles associated with geometry, materials, manufacturing processes and operating conditionsThe aspect of erasability, but also variable in time.

Further, the safety factor α in equation (3) cannot be set arbitrarily, but is in consideration of a trade-off between required performance and manufacturing cost. In fact, it depends on the structural and electromechanical parameters of the MEMS accelerometer 1 (such as the constant k of the spring element 7, the stopping distance D between the second outer wall 3D of the inertial mass 3 and the stopping element 19_sAnd the area A of the electrodes 13, 15_el). However, current structural requirements (such as bandwidth, packaging, noise and full scale requirements) are not free to choose the above structural parameters, and therefore it is not possible to always maximize the safety factor α. In particular, the stopping distance d_sIs subject to constraints deriving from the need to have a linear response of the MEMS accelerometer 1 and from the shape and arrangement of the opening 9 and the first and second electrodes 13, 15.

Disclosure of Invention

In various embodiments, the present disclosure provides a MEMS inertial sensor that will at least

Partially overcoming the disadvantages of the prior art.

In accordance with one or more embodiments of the present disclosure, a MEMS inertial sensor is provided that includes a support structure, an inertial structure including at least one first inertial mass, a first resilient structure, and a first stopper structure. The first resilient structure is mechanically coupled to the first inertial mass and the support structure such that: the first inertial mass is movable relative to the support structure in a direction parallel to the first direction when the support structure is subjected to a first acceleration parallel to the first direction. The first stop structure is fixed relative to the support structure and includes at least one first primary and secondary first shaft stop element. The first primary first axis stop element is configured such that, if the first acceleration exceeds a first threshold value, the first inertial mass abuts against the first primary first axis stop element and subsequently rotates about a first rotation axis defined by the first primary first axis stop element. The first secondary first axis stop element is configured such that if the first acceleration exceeds a second threshold value, which is higher than the first threshold value, rotation of the first inertial mass is terminated when the first inertial mass abuts the first secondary first axis stop element.

In at least one embodiment, a MEMS inertial sensor is provided that includes a support structure, an inertial structure including at least one first inertial mass, a first resilient structure, a second resilient structure, and a first stopper structure. The first resilient structure is mechanically coupled to the first inertial mass and the support structure such that: the first inertial mass is movable relative to the support structure in a direction parallel to the first direction when the support structure is subjected to a first acceleration parallel to the first direction. The second resilient structure is resiliently coupled to the second inertial mass and the support structure and is configured such that the second inertial mass is movable relative to the support structure in a direction parallel to the second direction when the support structure is subjected to a second acceleration parallel to said second direction. The spindle electrode is fixed relative to the support structure and capacitively coupled to the first inertial mass to form a corresponding spindle capacitor, a capacitance of the spindle capacitor indicative of the first acceleration. The cross-axis electrodes are fixed relative to the support structure and capacitively coupled to the second inertial mass to form corresponding cross-axis capacitors, the capacitance of which is indicative of the second acceleration. The first stop structure is fixed relative to the support structure and includes at least one first primary and secondary first shaft stop element.

In at least one embodiment, an electronic device is provided that includes a MEMS inertial sensor, an ASIC coupled to the MEMS inertial sensor, and a processing unit coupled to the ASIC. The MEMS inertial sensor includes a support structure, an inertial structure including at least one first inertial mass, a first resilient structure, and a first stopper structure. The first resilient structure is mechanically coupled to the first inertial mass and the support structure such that: the first inertial mass is movable relative to the support structure in a direction parallel to the first direction when the support structure is subjected to a first acceleration parallel to the first direction. The first stop structure is fixed relative to the support structure and includes at least one first primary and secondary first shaft stop element. The first primary first axis stop element is configured such that, if the first acceleration exceeds a first threshold value, the first inertial mass abuts against the first primary first axis stop element and subsequently rotates about a first rotation axis defined by the first primary first axis stop element. The first secondary first axis stop element is configured such that if the first acceleration exceeds a second threshold value higher than the first threshold value, rotation of the first inertial mass is terminated when the first inertial mass abuts the first secondary first axis stop element.

Drawings

For a better understanding of the present disclosure, embodiments thereof will now be described, by way of non-limiting example only, with reference to the accompanying drawings, in which:

fig. 1A and 1B are schematic top views of a MEMS inertial sensor of known type, in a rest position and in the presence of external accelerations, respectively;

FIG. 2 is a schematic top view of the MEMS inertial sensor at rest;

fig. 3 to 5 are schematic top views of the MEMS inertial sensor shown in fig. 2 at successive times when the MEMS inertial sensor is subjected to external acceleration;

FIG. 6 is a schematic top view of another embodiment of the MEMS inertial sensor at rest;

FIG. 7 shows an enlarged view of a portion of FIG. 6;

FIGS. 8 and 9 are schematic top views of the embodiment shown in FIGS. 6-7 when subjected to a first acceleration;

FIGS. 10 and 11 are schematic top views of the embodiment shown in FIGS. 6-7 when subjected to a second acceleration; and

fig. 12 shows a block diagram of an electronic device containing a MEMS inertial sensor.

Detailed Description

Fig. 2 shows a MEMS inertial sensor, in particular a capacitive MEMS accelerometer 30, now described with reference to the differences of the MEMS accelerometer 1 shown in fig. 1A and 1B. Elements already present in the MEMS accelerometer 1 will be designated by the same reference signs unless otherwise specified.

Instead of the stop element 19, the MEMS accelerometer 30 comprises a first stop structure 109, which first stop structure 109 comprises a main stop element 110 and a first secondary stop element 119A and a second secondary stop element 119B, said first secondary stop element 119A and second secondary stop element 119B being made of a semiconductor material and being integral with an underlying substrate (not shown).

In a first approximation, in top view, the primary stop element 110 is wedge-shaped with its apex directed towards the second outer wall 3D of the inertial mass 3. In particular, the primary stop element 110 is defined by an apex edge 110V, which apex edge 110V is parallel to the axis Z and lies in a plane parallel to a plane ZY containing the sensing axis S, hereinafter referred to as the symmetry plane SP.

In the rest condition, the vertex edge 110V is parallel to the second outer wall 3D of the inertial mass 3, and is spaced from the second outer wall 3D of the inertial mass 3 by a distance equal to the first stop distance D_s1The distance is smaller than the first distance d₁And a second distance d₂In rest conditions, between the inertial mass 3 and the first and second electrodes 13 and 15, respectively.

Without implying any loss of generality, the first secondary stop element 119A and the second secondary stop element 119B have the same shape as each other and are symmetrical with respect to the symmetry plane SP. For example, each of the first secondary stop element 119A and the second secondary stop element 119B is L-shaped in top view, with the concavity facing the second outer wall 3D of the inertial mass 3.

In more detail, each L-shape of the first secondary stop element 119A and of the second secondary stop element 119B comprises a respective portion having a parallelepiped shape, which extends in a direction parallel to the second outer wall 3D of the inertial mass 3 and is defined by a respective lateral wall (respectively by P in the case of the first secondary stop element 119A)_ADesignated, and in the case of the second stop element 119B by P_BDesignated) which is directed towards a corresponding portion of the second outer wall 3D of the inertial mass 3 and parallel to the plane ZX. In the rest state, the side walls of the first secondary stop element 119A and of the second secondary stop element 119BP_A、P_BBy more than the first stop distance d_s1Second stopping distance d_s2Separated from the second outer wall 3D of the inertial mass 3.

Similar to the MEMS accelerometer 1 already mentioned, the MEMS accelerometer 30 is also designed to detect external accelerations parallel to the sensing axis S and therefore parallel to the axis Y.

In use, the same external acceleration a as described in FIG. 1B is assumed to occur_extThus for simplicity, assume an external acceleration a_extWithout any component along X or along Z, the situation described below occurs.

Inertial mass 3 at external acceleration a_extIn the opposite direction parallel to the sensing axis S and thus in the direction of the first stop 109. When the inertial mass 3 abuts (i.e. impacts) against the vertex edge 110V of the primary stop element 110 (as in the case shown in fig. 3), i.e. the inertial mass 3 undergoes a displacement along the sensing axis S equal to the first stop distance d_s1Thereafter, the translation is stopped. Prior to this time, the operation of MEMS accelerometer 30 is similar to the operation of MEMS accelerometer 1 shown in fig. 1A and 1B.

When the inertial mass 3 strikes the vertex edge 110V, the spring element 7 undergoes a first deformation. Furthermore, the inertial mass 3 is still far from the first secondary stop element 119A and the second secondary stop element 119B, since, as previously mentioned, the second stop distance d_s2Is greater than the first stop distance d_s1. Under these conditions, the considerations with respect to fig. 1B also apply, except with reference to the first stopping distance d_s1Rather than the stopping distance d_s。

After the inertial mass 3 strikes the vertex edge 110V, an external acceleration a is assumed_extSo that the above-mentioned impact is not sufficient to stop the movement of the inertial mass 3, the following occurs.

In detail, as shown in fig. 4, the inertial mass 3 starts to rotate about a rotation axis coinciding with the vertex edge 110V, the vertex edge 110V serving as an instantaneous rotation center. According to an inevitable lack of symmetry of the system formed by the spring element 7, the inertial mass 3 and the vertex edge 110V, which variesSink, rotation occurs in either a clockwise or counterclockwise direction. Alternatively (not shown), the spring element 7 may be configured so that it is capable of translating not only along the sensing axis S of the inertial mass 3, but at the same time inducing a simultaneous translation on the inertial mass 3 in a direction parallel to the axis Y, with a negligible amount of translation with respect to the sensing axis S, but sufficient to impose a direction of subsequent rotation of the inertial mass 3. In addition, the external acceleration a_extWith a non-zero component parallel to the axis X, this component is also identical when determining the direction of rotation. In any case, the direction of rotation of the inertial mass 3 is independent of the purpose of operation of the MEMS accelerometer 30. By way of example only, it is assumed in fig. 4 that the rotation occurs in a clockwise direction.

If the external acceleration a_extHigh enough that the rotation of the inertial mass 3 does not stop until the inertial mass 3 abuts against the side wall PB of the second stop element 119B, as shown in fig. 5. Under these conditions, the spring element 7 undergoes a second deformation different from the first one described previously. If rotated in the anticlockwise direction, the inertial mass 3 will, on the contrary, abut against the side wall P of the first stop element 119A_AAnd (5) stopping.

In more detail, and without implying any loss of generality, at the side wall P of the second stop element 119B_BAnd the side EX (parallel to the axis Z) of the second outer wall 3D of the outer mass 3. Furthermore, the shape and mutual arrangement of the opening 9 and of the first and second electrodes 13, 15 during the translation and the subsequent rotation, are such that the inertial mass 3 is kept at a distance from the first and second electrodes 13, 15; that is, the inertial mass 3 does not hit the first electrode 13 and the second electrode 15.

In fact, the arrangement of the main stop element 110, more precisely the first stop distance d_s1Determining a full scale value; i.e. it determines an external acceleration a parallel to axis Y that can be correctly detected by MEMS accelerometer 30_extThe maximum value of the component of (a). In this respect, as previously mentioned, the external acceleration a_extThe measurement of (B) may be performed in the same manner as described with reference to fig. 1A and 1B.

In parallelExternal acceleration a on axis Y_extThe rotation of the inertial mass 3 described above occurs in the vicinity of the vertex edge 110V in the case where the value of the component of (a) exceeds the full-scale value.

Arrangement of the first secondary stop element 119A and the second secondary stop element 119B, more precisely, the second stop distance d_s2Determining the maximum deformation that the spring element 7 may be subjected to and therefore the external acceleration a parallel to the axis Y before the protective intervention provided by the first and second stop elements 119A and 119B_extCan assume a maximum value. Furthermore, given the same full scale, the above-described deformation is such that, in the condition indicated in fig. 5, the spring element 7 stores a greater elastic potential energy than it would have stored in the absence of the main stop element 110. In the latter case, the movement of the inertial mass 3 will stop, the second outer wall 3D of the inertial mass 3 abutting against the side walls P of the first secondary stop element 119A and of the second secondary stop element 119B_A、P_B。

Therefore, when the external acceleration a_extAt the end, the elastic return force F is such as to oppose what would occur without the main stop element 110_mAn increase occurs. Therefore, the possibility of the occurrence of the static friction phenomenon between the inertial mass 3 and the first stopper structure 109 is reduced, and therefore the possibility that the inertial mass 3 cannot return to the position occupied in the stationary state is reduced.

Furthermore, with reference to the limit value to indicate the minimum of the component of the external acceleration aext parallel to the axis Y, so that the inertial mass 3 abuts against one of the first secondary stop element 119A and the second secondary stop element 119B, the following occurs. If external acceleration a parallel to axis Y_extAbove the full-scale value but below the limit value, the probability of stiction occurring is reduced, the elastic restoring force increases as the contact surface between the inertial mass 3 and the main stop element 110 is greatly reduced (to a first approximation, given only by the vertex edge 110V), and as the inertial mass 3 rotates, this causes an increase in the elastic potential energy stored by the spring element 7.

Fig. 6 shows another embodiment. In particular, figure 6 shows a MEMS accelerometer 100 having two axes of sensitivity.

In particular, the MEMS accelerometer 100 comprises a first inertial mass 103 and a second inertial mass 104, the first inertial mass 103 and the second inertial mass 104 having a planar structure with a main dimension parallel to the plane XY and a negligible thickness along the axis Z. The first inertial mass 103 and the second inertial mass 104 extend on a substrate that is not visible in fig. 6. The base and the first and second inertial mass 103, 104 are made of a semiconductor material (e.g. silicon).

The first inertial mass 103 laterally defines a main opening 139, the second inertial mass 104 extending within the main opening 139, the second inertial mass 104 thus being laterally surrounded by the first inertial mass 103. Without implying any loss of generality, in a top view, the main opening 139 has a symmetrical shape with respect to a first plane of symmetry SP1 parallel to the plane XZ and with respect to a second plane of symmetry SP2 parallel to the plane ZY.

The second inertial mass 104 occupies an outer portion of the main opening 139 and laterally defines a first secondary opening 120 and a second secondary opening 121, which are portions of the main opening 139 and have, in top view, the same and symmetrical shape as the second plane of symmetry SP 2.

More specifically, the second inertial mass 104 comprises a respective central body 105 laterally delimiting a first secondary opening 120 and a second secondary opening 121, and a first vertical arm 122 and a second vertical arm 124, said arms having the shape of a parallelepiped, elongated in a direction parallel to the axis Y. Furthermore, the first vertical arm 122 and the second vertical arm 124 are identical to each other and symmetrical with respect to the first plane of symmetry SP1 and extend on opposite sides of the central body 105, they being integral with the central body 105. In particular, first vertical arm 122 and second vertical arm 124 extend from central body 105 toward first inertial mass 103. More specifically, each of the first and second vertical arms 122 and 124 has a proximal end fixed to the central body 105 and a distal end to be mentioned below.

MEMS accelerometer 100 also includes a first anchor region 125 and a second anchor region 126, first anchor region 125 and second anchor region 126 extending within first secondary opening 120 and second secondary opening 121, respectively, and secured to the underlying substrate, which are integral with the underlying substrate. Thus, the first anchoring region 125 and the second anchoring region 126 are formed of semiconductor material and have the same and symmetrical shape with respect to the second plane of symmetry SP2 (for example, a parallelepiped elongated in a direction parallel to the axis X). Furthermore, referring to the central region 105 to indicate that a portion of the intermediate body 105 is interposed between the first secondary opening 120 and the second secondary opening 121, each of the first anchoring region 125 and the second anchoring region 126 has a first end facing the central region 105 and a second end facing in the opposite direction, as described in greater detail below. The proximal ends of the first and second vertical arms 122, 124 are fixed to the central region 105 of the central body 105.

MEMS accelerometer 100 further comprises a first horizontal arm 132 and a second horizontal arm 134, first horizontal arm 132 and second horizontal arm 134 having the shape of a parallelepiped, elongated in a direction parallel to axis X, overlying the substrate at a distance, and identical to each other and symmetrical with respect to a second plane of symmetry SP 2. Furthermore, a first horizontal arm 132 and a second horizontal arm 134 extend within the first secondary opening 120 and the second secondary opening 121, respectively.

More specifically, first horizontal arm 132 and second horizontal arm 134 are formed of a semiconductor material and are integral with first anchoring region 125 and second anchoring region 126, respectively. More specifically, each of first horizontal arm 132 and second horizontal arm 134 has a respective first end and a respective second end. First ends of first and second horizontal arms 132 and 134 are secured to second ends of first and second anchor regions 125 and 126, respectively.

MEMS accelerometer 100 further comprises a first spring element 142 and a second spring element 144, first spring element 142 and second spring element 144 being of the folded type, serpentine in top view, and compliant (compliant) in a direction parallel to axis X. Furthermore, the first spring element 142 and the second spring element 144 have a negligible thickness in a direction parallel to the axis Z. Furthermore, the first spring element 142 and the second spring element 144 are identical to each other and symmetrical with respect to the second plane of symmetry SP 2.

In detail, the first spring element 142 and the second spring element 144 extend inside the first secondary opening 120 and the second secondary opening 121, respectively, so that the first horizontal arm 132 is interposed between the first anchoring area 125 and the first spring element 142, while the second horizontal arm 134 is interposed between the second fixing area 126 and the second spring element 144.

In more detail, the first spring element 142 has a first end and a second end fixed to the second end of the first horizontal arm 132 and the first point of the second inertial mass 104, respectively. The second spring elements 144 have respective first ends and respective second ends fixed to the second ends of the second horizontal arms 134 and to a second point of the second inertial mass 104, respectively. The first point and the second point of the second inertial mass 104 are symmetrical with respect to the second plane of symmetry SP 2. Furthermore, the first and second points of the second inertial mass 104 are aligned along the extension direction of the first and second horizontal arms 132, 134.

MEMS accelerometer 100 further comprises a third spring element 152 and a fourth spring element 154, which are of the folded type, have a serpentine shape in top view, and are compliant in a direction parallel to axis Y. Moreover, the third spring element 152 and the fourth spring element 154 have a negligible thickness in a direction parallel to the axis Z. Furthermore, the third spring element 152 and the fourth spring element 154 are identical to each other and symmetrical with respect to the first plane of symmetry SP 1.

In detail, the third spring element 152 and the fourth spring element 154 are arranged in the main opening 139 between the first inertial mass 103 and the second inertial mass 104.

In more detail, third spring element 152 has a respective first end and a respective second end that are respectively fixed to the distal end of first vertical arm 122 and to a first point of first inertial mass 103. Fourth spring element 154 has a respective first end and a respective second end that are secured to the distal end of second vertical arm 124 and a second point of first inertial mass 103, respectively. The first point and the second point of the first inertial mass 103 are symmetric with respect to the first symmetric plane SP 1; further, the first and second points of first inertial mass 103 are aligned in the direction of elongation of first and second vertical arms 122, 124.

In more detail, the first inertial mass 103 externally has a parallelepiped shape, except for the presence of first and second central grooves RC1 and RC2 and first, second, third and fourth corner grooves RA1, RA2, RA3 and RA 4.

The first and second central recesses RC1 and RC2 have a parallelepiped shape identical to each other and symmetrical with respect to the first symmetry plane SP1, and are also aligned along the extending direction of the first and second vertical arms 122 and 124. In addition, first and second central grooves RC1, RC2 are laterally defined by first and second outer side walls P1, P2, respectively, first and second outer side walls P1, P2 being parallel to plane ZX in the rest condition.

The first, second, third and fourth angular grooves RA1, RA2, RA3 and RA4 form respective indentations disposed along the sides of the first inertial mass 103.

In particular, each of the first, second, third and fourth corner grooves RA1, RA2, RA3, RA4 is defined by a respective pair of walls comprising: a corresponding horizontal peripheral wall, which is parallel to the plane XZ in the rest condition and is designated by the same reference symbol, to which an angular division symbol (prime symbol) is added; and a corresponding vertical peripheral wall, parallel to the plane YZ in the rest state, and designated by the same reference symbol to which the second angular division symbol is added. In each of the first corner groove RA1, the second corner groove RA2, the third corner groove RA3, and the fourth corner groove RA4, the corresponding horizontal peripheral wall and the corresponding vertical peripheral wall are connected to each other at a right angle.

MEMS accelerometer 100 further includes first and second outer main stop elements 162, 164 and first, second, third and fourth stop elements 170, 172, 174, 176, which are made of a semiconductor material, extend outside first inertial mass 103, and are fixed to the underlying substrate to form a unitary body.

Each of the first and second outer main stop elements 162, 164 and of the first 170, second 172, third 174 and fourth 176 stop elements has a respective body (designated by the corresponding reference signs with the addition of an angular division sign), for example, they have the shape of a parallelepiped and their bottom is fixed to the base.

The first and second outer main stop elements 162, 164 are identical to each other and symmetrical with respect to the first symmetry plane SP 1. Furthermore, each of the first and second outer main stop elements 162, 164 comprises a respective protruding region (designated by the corresponding reference symbol with the addition of the letter V), which is spaced from the corresponding body, towards the first inertia mass block 103.

The bodies 162 ', 164' of the first and second outer main stop elements 162, 164 extend at least partially within the first and second central grooves RC1, RC2, respectively. The protruding areas 162V, 164V of the first and second outer main stop elements 162, 164 extend within the first and second central grooves RC1, RC2, respectively, such that the protruding area 162V of the first outer main stop element 162 extends between the corresponding body 162 'and the first inertia block 103, while the protruding area 164V of the second outer main stop element 164 extends between the corresponding body 164' and the first inertia block 103.

In more detail, the protruding region 162V of the first outer main stop element 162 is fixed to the base at the bottom and extends at a distance from the main body 162' towards the first outer side wall P1 of the first central groove RC1 it faces. Specifically, in the rest state, the protruding region 162V of the first outer main stop element 162 is separated from the first outer side wall P1 by a distance dY 1. The protruding region 164V of the second outer main stop element 164 is fixed to the base at the bottom and extends from the main body 164' at a distance towards the second outer side wall P2 of the second central groove RC2 which it faces. To a first approximation, in the rest condition, the protruding zone 164V of the second outer main stop element 164 is separated from the second outer lateral wall P2 by the aforementioned distance dY 1.

Without implying any loss of generality, the protruding regions 162V, 164V of the first and second outer main stop elements 162, 164 have a ramp shape approximately resembling a half-cylinder having an axis parallel to the Z-axis and having a diameter (in top view) in contact with the corresponding body 162 ', 164'.

The first 170, second 172, third 174 and fourth 176 stop member bodies 170 ', 162 ', 174 ', 176 extend at least partially within the first RA1, second RA2, third RA3 and fourth RA4 grooves, respectively. Furthermore, each of the first 170, second 172, third 174 and fourth 176 secondary stop elements comprises a respective first protruding region (designated by a corresponding reference symbol with the addition of the letter V) and a respective second protruding region (designated by a corresponding reference symbol with the addition of the letter H). The first and second projecting regions 170V to 176V and 170H to 176H of the first, second, third and fourth stop elements 170, 172, 174 and 176 respectively extend within the first, second, third and fourth corner grooves RA1, RA2, RA3 and RA4, respectively.

Without implying any loss of generality, both first 170V to 176V and second 170H to 176H protruding regions have a beveled shape approximating a half-cylinder having an axis parallel to the Z-axis and a diameter (in top view) in contact with the corresponding body 170 'to 176'.

In more detail, the first projecting regions 170V, 172V, 174V, 176V extend, starting from the bodies 170 ', 172 ', 174 ', 176 of the first 170, second 172, third 174 and fourth 176 stop elements, respectively, in the direction of the horizontal peripheral walls RA ', RA2 ', RA3 ', RA4 ' of the first 1, second 2, third RA3 and fourth RA4 grooves, respectively, and in the rest state they are separated by the same distance dY2, respectively, which is greater than the distance dY 1.

The second projecting regions 170H, 172H, 174H, 176H extend, starting from the bodies 170 ', 172 ', 174 ', 176 of the first 170, second 172, third 174 and fourth 176 stop elements, respectively, in the direction of the vertical peripheral walls RA ", RA 2", RA3 ", RA 4" of the first RA1, second RA2, third RA3 and fourth RA4, respectively, which, in the rest state, are separated by the same distance dX2, respectively.

Without implying any loss of generality, and to a first approximation, the first 170 and second 172 secondary stop elements are identical to each other and symmetrical with respect to the first plane of symmetry SP1, as are the third 174 and fourth 176 stop elements. Furthermore, the first 170 and fourth 176 stop elements are identical to one another and symmetrical with respect to the second plane of symmetry SP2, as are the second 172 and third 174 stop elements.

As shown in more detail in fig. 7, MEMS accelerometer 100 further includes first and second internal main stop elements 180, 182 formed of a semiconductor material.

In detail, as previously described, the central region 105 of the second inertial mass 104 extends between the first secondary opening 120 and the second secondary opening 121. Further, the central region 105 is laterally defined by a first wall PC1 and a second wall PC2 (hereinafter referred to as a first inner wall PC1 and a second inner wall PC 2). In the rest state, the first inner wall PC1 and the second inner wall PC2 are parallel to the plane YZ and symmetrical with respect to the second symmetrical plane SP 2.

As already said, the first internal main stop element 180 and the second internal main stop element 182 are fixed to the underlying substrate. Furthermore, the first internal main stop element 180 extends transversely from the first end of the first anchoring zone 125 in the direction of the first internal wall PC1, the first internal main stop element 180 being separated from the first internal wall PC1 by a distance dX1 in the rest state, the distance dX1 being smaller than the distance dX 2. The second inner main stop element 182 extends transversely from the first end of the second anchoring region 126 in the direction of the second inner wall PC2, and in the rest state it is separated from the second inner wall PC2 by a distance dX 1.

Without implying any loss of generality, the first internal main stop element 180 and the second internal main stop element 182 are identical to each other and symmetrical with respect to the second plane of symmetry SP 2. Furthermore, the first internal main stop element 180 and the second internal main stop element 182 have a beveled shape, approximately similar to having an axis parallel to the axis Z, and having a semi-cylindrical shape with a diameter (in a top view) in contact with the corresponding body 125, 126.

Furthermore, there are a plurality of first additional openings 200 within the second inertial mass 104, having the same shape as each other and passing through the central body 105 of the second inertial mass 104 so as to face the underlying substrate. By way of example only, in the embodiment shown in fig. 7, there are eight first additional openings 200, divided into two groups of four, and having, for example, the shape of a parallelepiped elongated (in the rest condition) in a direction parallel to the axis Y. These two groups have a symmetrical arrangement with respect to the second plane of symmetry SP 2; furthermore, in each group, the corresponding four first additional openings 200 are arranged in two pairs, each pair comprising two first additional openings 200 aligned in a direction parallel to the axis X, the two pairs of the group being identical to each other and symmetrical with respect to the first plane of symmetry SP 1.

Furthermore, within the first inertial mass 103 there are a plurality of second additional openings 202, having the same shape as each other and passing through the first inertial mass 103 so as to face the underlying substrate. By way of example only, in the embodiment shown in fig. 7, there are twelve second additional openings 202, divided into two groups of six, and having, for example, the shape of a parallelepiped elongated (in the rest state) in a direction parallel to the axis X. These two groups have a symmetrical arrangement with respect to the first plane of symmetry SP 1; furthermore, in each group, the corresponding six second additional openings 202 are arranged in pairs of three, each pair comprising three second additional openings 200 aligned in a direction parallel to axis Y, the two triads of the group being identical to each other and symmetrical with respect to the second plane of symmetry SP 2.

In each first additional opening 200 and each second additional opening 202 there is a corresponding first electrode (designated respectively by 213 in the case of the first additional opening 200 and by 223 in the case of the second additional opening 202) and a corresponding second electrode (designated respectively by 215 in the case of the first additional opening 200 and by 225 in the case of the first additional opening 202), which are formed of a semiconductor material (for example silicon) and are anchored to the underlying substrate.

Further, in each first additional opening 200, the corresponding first electrode 213 and the corresponding second electrode 215 form a first variable capacitor C having the first inner surface 200A and the second inner surface 200B of the first additional opening 200, respectively, in a manner similar to that described with reference to fig. 1A to 5_X1And a second variable capacitor C_X2. In the rest state, the first inner surface 200A and the second inner surface 200B are parallel to the plane ZY.

Likewise, in each second additional opening 202, the corresponding first electrode 223 and the corresponding second electrode 225 form, in a manner similar to that described with reference to fig. 1A to 5, a corresponding first variable capacitor C having the first inner surface 202A and the second inner surface 202B of the second additional opening 202, respectively_Y1And a corresponding second variable capacitor C_Y2. In the rest condition, the first inner surface 202A and the second inner surface 202B are parallel to the plane ZX.

In use, the external acceleration a to which the substrate is subjected is assumed_extParallel to the axis X and in the opposite direction to the axis X shown in fig. 6, the following occurs.

The second inertial mass 104 translates to the right (in the plane of fig. 6) together with the first inertial mass 103, because the third 152 and fourth 154 spring elements are rigid in a direction parallel to the axis X, the first 142 and second 144 spring elements are deformed therewith, the first 142 spring element is extended and the second 144 spring element is compressed.

Assuming an external acceleration a_extIs sufficiently high (i.e. exceeds a first threshold value), the translation continues until the first inner wall PC1 of the second inertial mass 104 abuts against the first inner portionA primary stop member 180, as shown in fig. 8.

The first inner main stop element 180 serves as a rotational center of the whole formed by the first and second inertial mass 103, 103 and the third and fourth spring elements 152, 154, which rotate in a fixed manner to each other. With respect to the direction of rotation, the considerations associated with FIG. 4 apply; for example, in the following, it is assumed that the rotation occurs in a clockwise direction. Furthermore, if the external acceleration a_extExceeds a second threshold value, which is higher than the first threshold value, the rotation is terminated when the second inertial mass 104 abuts against at least one of the first 170, second 172, third 174 and fourth 176 stop elements, as shown in fig. 9. In particular, in fig. 9, it is assumed that MEMS accelerometer 100 is dimensioned such that vertical peripheral wall RA1 "abuts against second protruding region 170H. The first inertia mass 103 is in any case kept at a distance from the first outer main stop element 162 and the second outer main stop element 164.

As discussed with reference to fig. 4 and 5, the above rotation causes an increase in elastic potential energy stored in the first and second spring elements 142 and 144, thereby causing an elastic restoring force F_mIncreasing and thereby reducing the likelihood of stiction phenomena occurring between first inertial mass 103 and first secondary stop element 170.

Similar considerations apply to the case (not shown) where the external acceleration a_extThe direction coincides with the axis X, except that it is parallel to the axis X. In this case, if the external acceleration a_extExceeds the corresponding first threshold value, the first inertial mass 103 and the second inertial mass 104 rotate in a fixed manner around the second inner main stop element 182. In addition, the external acceleration a_extAnd assuming, for example, rotation in a counter-clockwise direction, the first inertial mass 103 abuts against the second protruding region 176H.

On the contrary, when the external acceleration a_extParallel to the axis Y and in the opposite direction to the axis Y shown in fig. 6, the following occurs.

The second inertial mass 104 remains stationary with respect to the base, since the first spring element 142 and the second spring element 144 are rigid in a direction parallel to the axis Y. In contrast, first inertial mass 103 translates upwards (in the plane of fig. 6) because third spring element 152 and fourth spring element 154 are compliant in a direction parallel to axis Y. In particular, translation of the first inertial mass 103 causes deformation of the third spring element 152 and deformation of the fourth spring element 154, the third spring element 152 being extended and the fourth spring element 154 being compressed.

External acceleration a_extOn the assumption that the modulus of (i.e. exceeds the corresponding first threshold value), the translation is continued until first outer side wall P1 abuts against protruding region 162V of first outer main stop element 162, protruding region 162V serving as the centre of rotation of first inertial mass 103, as shown in fig. 10. Regarding the direction of rotation, the considerations related to fig. 4 apply. For example, in the following, it is assumed that the rotation occurs in a counterclockwise direction. Furthermore, if the external acceleration a_extIs above the corresponding second threshold value (above the corresponding first threshold value), rotation is terminated when the first inertial mass 103 abuts against at least one of the first 170, second 172, third 174 and fourth 176 stop elements. In this regard, in fig. 11, it is assumed that MEMS accelerometer 100 is sized such that horizontal peripheral wall RA 1' abuts against first protruding region 170V.

The above-described rotation of only the first inertial mass 103 causes an increase in the elastic potential energy stored in the third and fourth spring elements 152 and 154, thereby causing an elastic restoring force F_mIncreasing and thereby reducing the likelihood of stiction between the first inertia mass 103 and any one of the first, second, third, and fourth stop members 170.

Similar considerations apply to the case (not shown) where the external acceleration a_extThe direction coincides with the axis Y, except for being parallel to the axis Y. In this case, if the external acceleration a_extExceeds a corresponding first threshold value,the first inertial mass 103 rotates around the protruding area 164V of the second outer main stop element 162. Furthermore, if the external acceleration a_extExceeds the corresponding second threshold value and, assuming that rotation occurs, for example, in a clockwise direction, rotation stops when first inertial mass 103 abuts against first protruding region 172V.

In practice, the first and second outer main stop elements 162, 164 and the first, second, third and fourth secondary stop elements 170, 172, 174, 176 form a first stop arrangement with respect to the axis Y. Likewise, the first 180 and second 182 inner main stop elements and the first 170, second 172, third 174 and fourth 176 stop elements form a second stop arrangement with respect to the axis X. Furthermore, in the present embodiment, the first stopper structure and the second stopper structure share the first stopper element 170, the second stopper element 172, the third stopper element 174, and the fourth stopper element 176. In this respect, in general, embodiments are possible in which the first inertial mass 103 stops against a second stop element different from that described. In general, the secondary stop elements with which the first inertial mass 103 effectively abuts depend not only on the direction of acceleration and the direction of subsequent rotation, but also on the shape and arrangement of the first 170, second 172, third 174 and fourth 176 stop elements, as well as the positioning of the axis of rotation and the shape of the first inertial mass 103, which can be varied with respect to what is described.

Irrespective of the implementation details regarding stopping rotation, the external acceleration a_extCan be carried out in a manner similar to that described with reference to fig. 1A and 1B, and is therefore based on the presence of the first variable capacitor C in the first additional opening 200_XAnd a second variable capacitor C_X2The capacitance along the external acceleration a_extVaries in the presence of a non-zero component of X; and on the basis of the presence of the first variable capacitor C in the second additional opening 202_Y1And a second variable capacitor C_Y1、C_Y2The capacitance of which is accelerated along the outsideDegree a_extVaries in the presence of a non-zero component of Y. The sensing axes of MEMS accelerometer 100 are parallel to axis X and axis Y, respectively, and lie in first and second planes of symmetry SP1 and SP2, respectively.

Figure 12 shows an electronic device 340 comprising the MEMS accelerometer 100.

The MEMS accelerometer 100 is connected to an ASIC 343 providing a corresponding read interface; ASIC 343 may be provided in the same die that MEMS accelerometer 100 is fabricated. In a further embodiment (not shown), ASIC 343 is fabricated in a separate die and is housed in the same package as MEMS accelerometer 100.

The electronic apparatus 340 is, for example, a portable mobile communication device such as a mobile phone, a PDA (personal digital assistant), a portable computer, a digital audio player with voice recording capability, a camcorder, or a controller for a video game; in particular, the electronic device 340 is generally capable of processing, storing, and/or transmitting and receiving signals and information.

The electronic device 340 further comprises a microprocessor 344, the microprocessor 344 receiving acceleration signals generated by the ASIC 343 based on detections made by the MEMS accelerometer 100 and a keyboard and screen equipped input/output interface 345 connected to the microprocessor 344. Further, the electronic device 340 comprises a speaker 347 for generating sound on an audio output (not shown) and an internal memory 348 connected to the microprocessor 344.

The present MEMS inertial sensor has different advantages. In particular, the MEMS inertial sensor of the present disclosure can reduce the likelihood of stiction phenomena occurring without causing an increase in the overall size of the device or reducing the full range of the device.

Finally, it is apparent that modifications and variations may be made to the MEMS inertial sensor described and illustrated herein without thereby departing from the scope of the present disclosure.

For example, the present MEMS inertial sensor may be used as a gyroscope, inclinometer, or vibrometer.

The shape of the protruding areas defining the rotation axis may be different from what is described. More generally, as previously mentioned, the shape and arrangement of the external and internal main stop elements may differ from what is described; also, the shape and arrangement of the secondary stop elements may be different from that described.

The various embodiments described above can be combined to provide further embodiments. These and other changes can be made to the embodiments in light of the above-detailed description. In general, in the following claims, the terms used should not be construed to limit the claims to the specific embodiments disclosed in the specification and the claims, but should be construed to include all possible embodiments along with the full scope of equivalents to which such claims are entitled. Accordingly, the claims are not limited by the disclosure.