1. A square ceramic capacitive pressure sensor, comprising: the three-hole square ceramic chip comprises a three-hole square ceramic base, a glass sealing layer, a square ceramic elastic membrane, a signal conditioning chip and a resistor capacitor; the surface of the top end of the three-hole square ceramic base is printed with a metal circuit and a bonding pad, and the signal conditioning chip and the resistor capacitor are attached to the top ends of the metal circuit and the bonding pad; the surface printing of three hole square ceramic base bottom has three hole square ceramic base metal electrodes, three hole square ceramic base below is provided with square ceramic elastic diaphragm, just three hole square ceramic base with pass through between square ceramic elastic diaphragm glass sealing layer sealing connection.

2. The square ceramic capacitive pressure sensor according to claim 1, wherein a through hole is vertically formed in the three-hole square base, an upper and a lower filling hole conducting metal electrodes are arranged in the through hole, one end of each of the upper and the lower filling hole conducting metal electrodes is connected with the metal electrode of the three-hole square ceramic base, and the other end of each of the upper and the lower filling hole conducting metal electrodes is connected with the metal circuit and the bonding pad.

3. The square ceramic capacitive pressure sensor according to claim 2, wherein a cavity is provided between the three-hole square ceramic base and the square ceramic elastic diaphragm.

4. The square ceramic capacitive pressure sensor according to claim 1, wherein the square ceramic elastic diaphragm is printed with a square ceramic diaphragm metal electrode on top.

5. The square ceramic capacitive pressure sensor of claim 4 wherein the glass seal layer is disposed between the three-hole square ceramic base metal electrode and the square ceramic diaphragm metal electrode.

6. The square ceramic capacitive pressure sensor of claim 1, wherein the metal circuit and the bonding pad are sintered from a metal paste.

Background

Modern measurement techniques involve numerous non-electrical quantities, such as mechanical quantities like weight, force and moment, acceleration, pressure, flow, etc.; thermal quantities such as temperature, heat, etc., and chemical quantities such as gas, liquid composition, concentration, etc. These physical quantities are difficult and inconvenient to directly measure, and need to be converted into electrical signals which are easy to measure, transmit and process by a conversion device, namely sensors, which are various, and pressure sensors are the most mature technology, are the first sensors in terms of market sales, have an annual growth rate of more than 20 percent, and have wide application prospect.

In recent years, the pressure sensing technology in China is developing vigorously, the application field is expanding rapidly, as the technology related to the pressure sensor technology is wide, along with the intelligent development trend in the fields of automobiles, industry and internet of things, the pressure sensor is growing rapidly, and the ceramic capacitive pressure sensor has the advantages of corrosion resistance, abrasion resistance, impact resistance, good thermal stability, high measurement accuracy, wide range of measurement, no pollution and the like, and is widely applied to the pressure, hydraulic, flow and liquid level maintenance of equipment of key systems such as pneumatic monitoring, light-load hydraulic pressure, brake pressure, engine oil pressure, transmission devices, air brakes of trucks/trailers, high-performance pressure transmitters for industrial control and the like.

However, most of the existing ceramic capacitive pressure sensors are combined by a plurality of components, the integration level is low, the ceramic capacitive pressure sensors relate to too many material and processing fields, the cost is high, the assembly is complex, the production period is long, and the requirements of rapid development and low cost cannot be met.

Therefore, how to provide a square ceramic capacitive pressure sensor is a problem that needs to be solved by those skilled in the art.

Disclosure of Invention

In view of this, the invention provides a square ceramic capacitive pressure sensor, which combines a ceramic pressure sensing element and a signal conditioning chip together, so that a single ceramic component can convert a pressure signal into a voltage signal, the structure is simplified, the anti-interference capability is better, and the square structure reduces the material waste in the production process.

In order to achieve the purpose, the invention adopts the following technical scheme:

a square ceramic capacitive pressure sensor comprising: the three-hole square ceramic chip comprises a three-hole square ceramic base, a glass sealing layer, a square ceramic elastic membrane, a signal conditioning chip and a resistor capacitor; the surface of the top end of the three-hole square ceramic base is printed with a metal circuit and a bonding pad, and the signal conditioning chip and the resistor capacitor are attached to the top ends of the metal circuit and the bonding pad; the surface printing of three hole square ceramic base bottom has three hole square ceramic base metal electrodes, three hole square ceramic base below is provided with square ceramic elastic diaphragm, just three hole square ceramic base with pass through between square ceramic elastic diaphragm glass sealing layer sealing connection.

Preferably, a through hole penetrating through the three-hole square base is formed in the vertical direction, an upper filling hole and a lower filling hole are formed in the through hole, one end of the upper filling hole and the lower filling hole are connected with the three-hole square ceramic base metal electrode, and the other end of the upper filling hole and the lower filling hole are connected with the metal circuit and the bonding pad.

Preferably, a cavity is arranged between the three-hole square ceramic base and the square ceramic elastic diaphragm.

Preferably, a square ceramic membrane metal electrode is printed on the top end of the square ceramic elastic membrane.

Preferably, the glass sealing layer is disposed between the three-hole square ceramic base metal electrode and the square ceramic diaphragm metal electrode.

Preferably, the metal circuit and the bonding pad are formed by sintering metal slurry.

The invention has the beneficial effects that:

the invention provides a square ceramic capacitive pressure sensor, which utilizes ceramic materials and thick film printing technology to fuse a ceramic pressure sensing element and a signal conditioning chip together, realizes that a single ceramic component can convert a pressure signal into a voltage signal, has a simplified structure and better anti-interference capability, reduces material waste in the production process due to the square structure, has a smaller size, avoids the defects of complex assembly and poor reliability of two different material components, is more suitable for batch production, and realizes cost reduction.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is a schematic diagram of the present invention.

FIG. 2 is a schematic structural diagram of a three-hole square ceramic susceptor according to the present invention.

FIG. 3 is a schematic structural diagram of the glass sealing layer according to the present invention.

FIG. 4 is a schematic structural diagram of a square ceramic elastic diaphragm according to the present invention.

FIG. 5 is a schematic structural diagram of a metal electrode of a square ceramic elastic diaphragm according to the present invention.

FIG. 6 is a schematic structural diagram of a three-hole square ceramic base metal electrode according to the present invention.

Fig. 7 is a schematic structural diagram of the upper and lower filled-hole via metal electrodes according to the present invention.

FIG. 8 is a schematic diagram of a metal circuit and a bonding pad according to the present invention.

Wherein, in the figure,

1-three-hole square ceramic base; 2-glass sealing layer; 3-square ceramic elastic membrane; 4-square ceramic membrane metal electrode; 5-three-hole square ceramic base metal electrode; 6-a cavity; 7-filling holes on the upper layer and the lower layer to conduct the metal electrodes; 8-signal conditioning chip; 9-resistance capacitance; 10-metal circuitry and pads; 11-a metallic electrical layer; 12-through holes.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-8, the present invention provides a square ceramic capacitive pressure sensor, comprising: the three-hole square ceramic device comprises a three-hole square ceramic base 1, a glass sealing layer 2, a square ceramic elastic membrane 3, a signal conditioning chip 8 and a resistor capacitor 9; wherein, the top surface of the three-hole square ceramic base 1 is printed with a metal circuit and a bonding pad 10, and the signal conditioning chip 8 and the resistance capacitor 9 are pasted on the top of the metal circuit and the bonding pad 10; the surface printing of 1 bottom of the square ceramic base of three holes has three square ceramic base metal electrodes 5, and 1 below of the square ceramic base of three holes is provided with square ceramic elastic diaphragm 3, and square ceramic elastic diaphragm 3 can take place elastic deformation under the atress circumstances, and passes through glass sealing layer 2 sealing connection between 1 of the square ceramic base of three holes and square ceramic elastic diaphragm 3, has guaranteed the leakproofness between 1 of the square ceramic base of three holes and square ceramic elastic diaphragm 3.

A through hole 12 is arranged in the vertical direction of the three-hole square base, an upper filling hole and a lower filling hole are arranged in the through hole 12, the upper filling hole and the lower filling hole are communicated with the metal electrode 7, one end of the upper filling hole and the lower filling hole are communicated with the metal electrode 5 of the three-hole square ceramic base, and the other end of the upper filling hole and the lower filling hole are communicated with the metal circuit and the bonding pad 10. The wall of the through hole 12 is coated with a metal electric layer 11 for conduction, and the connection between the upper and lower filling hole conduction metal electrodes 7 and the three-hole square ceramic base metal electrode 5 and the connection between the upper and lower filling hole conduction metal electrodes 7 and the metal circuit and the bonding pad 10 are realized through the metal electric layer 11. The metallic electrical layer 11 may also be replaced by a pore-filling metal paste.

In another embodiment, a cavity 6 is arranged between the three-hole square ceramic base 1 and the square ceramic elastic diaphragm 3.

In another embodiment, a square ceramic membrane metal electrode 4 is printed on top of the square ceramic elastic membrane 3. The arrangement of the glass sealing layer 2 can keep the space between the three-hole square ceramic base metal electrode and the square ceramic diaphragm metal electrode.

In another embodiment, a glass sealing layer 2 is disposed between a three-hole square ceramic base metal electrode 5 and a square ceramic diaphragm metal electrode 4.

In another embodiment, the metal circuit and the pad 10 are sintered from a metal paste.

The invention provides a square ceramic capacitive pressure sensor, which utilizes ceramic materials and thick film printing technology to fuse a ceramic pressure sensing element and a signal conditioning chip together, realizes that a single ceramic component can convert a pressure signal into a voltage signal, has a simplified structure and better anti-interference capability, reduces material waste in the production process due to the square structure, has a smaller size, avoids the defects of complex assembly and poor reliability of two different material components, is more suitable for batch production, and realizes cost reduction.

The invention firstly utilizes thick film printing technology to print three-hole square ceramic base metal electrodes 5 on a three-hole square ceramic base 1, print a square ceramic membrane metal electrode 4 on a square ceramic elastic membrane 3, then carry out drying and sintering, then print an upper and lower layer conduction hole filling metal electrode 7 on the three-hole square ceramic base metal electrode 5 on the lower surface of a three-hole square ceramic base 11, carry out drying and sintering, then print a metal circuit and a bonding pad 10 on the upper surface of the three-hole square ceramic base 1, carry out drying and sintering, print a glass sealing layer 2 on the three-hole square ceramic base metal electrode 5 after sintering, then carry out presintering to enable a glass sealing layer 2 to have certain strength, then oppositely combine the three-hole square ceramic base metal electrode 5 and the square ceramic membrane metal electrode 4 together, and (2) clamping by using a special tool to sinter, so that the three-hole square ceramic base 1 and the square ceramic elastic membrane 3 are sealed together through the glass sealing layer 2 to form a cavity 6, and finally, attaching the signal conditioning chip 8 and the resistance capacitor 9 to the metal circuit and the bonding pad 10 of the three-hole square ceramic base 1 to complete the production of the square ceramic pressure sensor.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.