1. A method for producing a novel LED luminaire, comprising the steps of:

1) manufacturing a lampshade semi-finished product: injecting optical PC granules into a mold at high temperature and high pressure through an injection molding machine, and obtaining a semi-finished product of the lampshade, wherein the inner walls of two sides of the semi-finished product are symmetrically provided with sliding grooves, the outer walls of two sides of the semi-finished product are communicated and provided with cavities, and four corners of the semi-finished product are provided with bulges after cooling and molding;

2) cleaning and polishing: cleaning the semi-finished product of the lampshade by using an ultrasonic cleaning machine and carrying out particle polishing to prepare the lampshade;

3) patch welding: testing the anode and the cathode of the LED lamp beads by using a constant current source, and sampling to detect the quality of the LED lamp beads; adhering the LED on the substrate by an SMD chip mounter, and welding the LED by a reflow welding machine to obtain the lamp panel, wherein the temperature of the highest temperature zone is 230 ℃ and 260 ℃, and the time is 2-5 seconds;

4) and (5) detecting the lamp panel: carrying out power-on test on the lamp panel after reflow soldering, observing the light-emitting state of the LED, whether the brightness and the color of the LED are consistent, whether the LED flickers by mistake or not and whether a cold solder exists or not, and marking and repairing a fault point;

5) cleaning the lamp panel: and brushing the lamp panel with a cleaning agent to remove residues on the panel so as to keep the circuit board clean.

6) Input and output wire connection: connecting wires according to needs, determining the current direction, requiring that each wire passes through a bonding pad, wherein the length of the wires on the two sides of the bonding pad left on the surface is as short as possible, the wires cannot be broken or loosened when the wires are lightly pulled, and the wires of all parts can enable the LED lamp to normally emit light;

7) manufacturing a sliding heat dissipation plate: optical PC particles are molded by an injection molding machine to prepare a sliding heat dissipation plate;

8) assembling a lampshade: clamping the sliding heat dissipation plate in a chute on the inner wall of the lampshade, then placing the nickel-titanium alloy in the cavity, and respectively bonding two ends of the nickel-titanium alloy with the upper wall of the cavity and the upper wall of the sliding heat dissipation plate through hot melting;

9) and (3) integral assembly: and assembling the lamp panel and the lamp holder, and the lampshade and the lamp holder together through the bolts in sequence to obtain the novel LED lamp.

2. The method according to claim 1, wherein the substrate in step 3) is an aluminum substrate, and the lamp panel in step 5) is cleaned and then coated with heat-conducting silica gel.

3. The method according to claim 1, wherein the lampshade comprises a lampshade body, sliding grooves and cavities, the lampshade body is a rectangular cavity with one side open, the cavities are symmetrically arranged on two sides of the lampshade body, the cavities are evenly arranged on the side wall of the lampshade body, the cavities are communicated with the lampshade body, the sliding grooves are symmetrically arranged on the inner side wall of the lampshade body, the side walls of two sides of the lampshade body are symmetrically provided with heat dissipation holes arranged in a matrix, and the heat dissipation holes are arranged between the sliding grooves.

4. The method according to claim 1, wherein the sliding heat dissipation plate is slidably engaged with the sliding groove, the sliding heat dissipation plate is symmetrically disposed on two sides of the inner wall of the lampshade body, the sliding heat dissipation plate is provided with dislocation holes arranged in a matrix arrangement, the dislocation holes are equal to the diameters of the heat dissipation holes, the length between two adjacent rows of dislocation holes is equal to the length between two adjacent rows of dislocation holes, and the length between two adjacent rows of dislocation holes is greater than or equal to the diameters of the heat dissipation holes.

5. The method for producing the novel LED lamp according to claim 1, wherein the nickel-titanium alloy is arranged between the upper wall of the sliding heat dissipation plate and the upper wall in the cavity, the nickel-titanium alloy is arranged in the cavity, and the original shape of the nickel-titanium alloy is in a Z-shaped bending arrangement.

Background

The production process of the traditional LED lamp comprises the steps of firstly carrying out aging treatment on an LED lamp main body, then fixing the LED lamp main body on a special jig, injecting glue manually or by means of equipment, mounting a light-transmitting surface cover after glue leveling, pressing a wall body of the light-transmitting surface cover on a glue injection groove of the LED lamp main body, then waiting for glue curing, and carrying out aging and electrical property detection on a finished product after curing is finished.

Disclosure of Invention

In order to solve the existing problems, the invention provides the method for producing the novel LED lamp, which realizes the technical effect of automatically adjusting the heat dissipation holes according to the heat generated by the LED lamp during working through the unique shape memory function of the nickel-titanium alloy, has simple structure and good heat dissipation effect, can ensure good tightness of the lampshade body when heat dissipation is not needed, effectively prevents dust, has simple and easily-accessible whole production steps and operation, is low in cost and is convenient for mass production.

The technical scheme adopted by the invention is as follows: a method for producing a new LED luminaire comprising the steps of:

1) manufacturing a lampshade semi-finished product: injecting optical PC granules into a mold at high temperature and high pressure through an injection molding machine, and obtaining a semi-finished product of the lampshade, wherein the inner walls of two sides of the semi-finished product are symmetrically provided with sliding grooves, the outer walls of two sides of the semi-finished product are communicated and provided with cavities, and four corners of the semi-finished product are provided with bulges after cooling and molding;

2) cleaning and polishing: cleaning the semi-finished product of the lampshade by using an ultrasonic cleaning machine and carrying out particle polishing to prepare the lampshade;

3) patch welding: testing the anode and the cathode of the LED lamp beads by using a constant current source, and sampling to detect the quality of the LED lamp beads; adhering the LED on the substrate by an SMD chip mounter, and welding the LED by a reflow welding machine to obtain the lamp panel, wherein the temperature of the highest temperature zone is 230 ℃ and 260 ℃, and the time is 2-5 seconds;

4) and (5) detecting the lamp panel: carrying out power-on test on the lamp panel after reflow soldering, observing the light-emitting state of the LED, whether the brightness and the color of the LED are consistent, whether the LED flickers by mistake or not and whether a cold solder exists or not, and marking and repairing a fault point;

5) cleaning the lamp panel: and brushing the lamp panel with a cleaning agent to remove residues on the panel so as to keep the circuit board clean.

6) Input and output wire connection: connecting wires according to needs, determining the current direction, requiring that each wire passes through a bonding pad, wherein the length of the wires on the two sides of the bonding pad left on the surface is as short as possible, the wires cannot be broken or loosened when the wires are lightly pulled, and the wires of all parts can enable the LED lamp to normally emit light;

7) manufacturing a sliding heat dissipation plate: optical PC particles are molded by an injection molding machine to prepare a sliding heat dissipation plate;

8) assembling a lampshade: clamping the sliding heat dissipation plate in a chute on the inner wall of the lampshade, then placing the nickel-titanium alloy in the cavity, and respectively bonding two ends of the nickel-titanium alloy with the upper wall of the cavity and the upper wall of the sliding heat dissipation plate through hot melting;

9) and (3) integral assembly: and assembling the lamp panel and the lamp holder, and the lampshade and the lamp holder together through the bolts in sequence to obtain the novel LED lamp.

Further, the substrate in the step 3) is an aluminum substrate, and the lamp panel in the step 5) is cleaned and then coated with heat-conducting silica gel on the back surface.

Further, the lamp shade includes lamp shade body, spout and cavity, the lamp shade body is one side open-ended rectangle cavity setting, lamp shade body both sides are located to the cavity symmetry, equidistant align to grid of cavity locates on the lamp shade body lateral wall, cavity and lamp shade body intercommunication, the spout symmetry is located on the lamp shade body inside wall, and lamp shade body both sides lateral wall symmetry is equipped with the louvre that is the matrix arrangement setting, and the louvre is located between the spout, and the inside lamp plate heat dissipation of lamps and lanterns is convenient for to the louvre.

Further, in the spout was located in the slip joint of sliding heat dissipation board, the lamp shade body inner wall both sides were located to the sliding heat dissipation board symmetry, be equipped with the dislocation hole that is the matrix arrangement setting on the sliding heat dissipation board, the dislocation hole equals with the louvre diameter, length between two adjacent rows of dislocation holes equals the length between two adjacent rows of dislocation holes, length between two adjacent rows of dislocation holes is greater than or equal to the diameter of louvre, when dislocation hole and louvre dislocation set, the sliding heat dissipation board does not have the dislocation hole part and can be with the louvre shutoff, avoids the dust to get into the lamp shade originally internally.

Further, nickel titanium alloy locates between sliding heat panel upper wall and the cavity inner wall, and nickel titanium alloy locates in the cavity, nickel titanium alloy's original shape is the Z shape and bends the setting, when the temperature that lamps and lanterns during operation produced is less than the specific temperature that nickel titanium alloy resumes deformation, nickel titanium alloy is the easy deformation state, and nickel titanium alloy is stretched under sliding heat panel's action of gravity this moment, sliding heat panel's louvre and dislocation hole are the dislocation set, when the temperature that lamps and lanterns during operation produced is higher than the specific temperature that nickel titanium alloy resumes deformation, nickel titanium alloy resumes original Z shape of bending fast, thereby nickel titanium alloy length reduces, thereby nickel titanium alloy drives sliding heat panel and shifts up along the spout and make the dislocation hole shift up and align with the louvre gradually, conveniently dispels the heat.

By adopting the scheme, the invention has the following beneficial effects: the method for producing the novel LED lamp is simple to operate, mass production of the LED lamp is facilitated, the technical effect that the heat dissipation holes are automatically adjusted according to heat generated when the lamp works is achieved through the unique shape memory function of the nickel-titanium alloy, the structure is simple, the heat dissipation effect is good, good sealing performance of the lampshade body can be guaranteed when heat dissipation is not needed, and dust prevention is achieved effectively.

Drawings

FIG. 1 is a front view of a novel LED lamp for use in a method of producing a novel LED lamp of the present invention;

FIG. 2 is a perspective view of a new LED lamp used in a method of producing the new LED lamp of the present invention;

fig. 3 is a cross-sectional view of a novel LED luminaire of a method for producing the novel LED luminaire of the present invention.

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings: 1. lamp shade, 2, lamp plate, 3, lamp stand, 4, lamp shade body, 5, spout, 6, cavity, 7, louvre, 8, slip heating panel, 9, dislocation hole, 10, nickel titanium alloy, 11, arch, 12, bolt.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

A method for producing a new LED luminaire comprising the steps of:

1) manufacturing a lampshade semi-finished product: injecting optical PC granules into a mold at high temperature and high pressure by an injection molding machine, and cooling and molding to obtain a semi-finished product of the lampshade 1, wherein the inner walls of two sides of the semi-finished product are symmetrically provided with sliding grooves 5, the outer walls of two sides of the semi-finished product are communicated with each other and provided with cavities 6, and four corners of the semi-finished product are provided with protrusions 11;

2) cleaning and polishing: cleaning the semi-finished product of the lampshade 1 by using an ultrasonic cleaning machine and carrying out particle polishing to prepare the lampshade 1;

3) patch welding: testing the anode and the cathode of the LED lamp beads by using a constant current source, and sampling to detect the quality of the LED lamp beads; adhering the LED on the substrate by an SMD chip mounter, and welding the LED by a reflow welding machine to obtain the lamp panel 2, wherein the temperature of the highest temperature zone is 230-260 ℃ and the time is 2-5 seconds;

4) and (5) detecting the lamp panel 2: carrying out power-on test on the lamp panel 2 after reflow soldering, observing the light-emitting state of the LED, whether the brightness and color of the LED are consistent, whether the LED flickers by mistake or not and whether a cold solder exists or not, and marking and repairing a fault point;

5) and (5) cleaning the lamp panel 2: and brushing the lamp panel 2 with a cleaning agent to remove residues on the panel, so that the circuit board is kept clean.

6) Input and output wire connection: connecting wires according to needs, determining the current direction, requiring that each wire passes through a bonding pad, wherein the length of the wires on the two sides of the bonding pad left on the surface is as short as possible, the wires cannot be broken or loosened when the wires are lightly pulled, and the wires of all parts can enable the LED lamp to normally emit light;

7) manufacturing the sliding heat dissipation plate 8: optical PC particles are molded by an injection molding machine to prepare a sliding heat dissipation plate 8;

8) assembling the lampshade 1: clamping the sliding heat dissipation plate 8 in the chute 5 on the inner wall of the lampshade 1, then placing the nickel-titanium alloy 10 in the cavity 6, and respectively carrying out hot melting bonding on two ends of the nickel-titanium alloy 10 and the upper wall of the cavity 6 and the upper wall of the sliding heat dissipation plate 8;

9) and (3) integral assembly: and assembling the lamp panel 2 and the lamp holder 3, and the lampshade 1 and the lamp holder 3 together sequentially through the bolts 12 to obtain the novel LED lamp.

The base plate in the step 3) is an aluminum base plate, and the lamp panel 2 in the step 5) is cleaned and then coated with heat-conducting silica gel on the back surface.

As shown in fig. 1-3, the lampshade 1 includes a lampshade body 4, chutes 5 and cavities 6, the lampshade body 4 is a rectangular cavity with one side open, the cavities 6 are symmetrically arranged on both sides of the lampshade body 4, the cavities 6 are arranged on the side walls of the lampshade body 4 at equal intervals, the cavities 6 are communicated with the lampshade body 4, the chutes 5 are symmetrically arranged on the inner side walls of the lampshade body 4, heat dissipation holes 7 arranged in a matrix arrangement are symmetrically arranged on the side walls of both sides of the lampshade body 4, and the heat dissipation holes 7 are arranged between the chutes 5.

In sliding heat dissipation plate 8 slip joint was located spout 5, 4 inner wall both sides of lamp shade body were located to sliding heat dissipation plate 8 symmetry, be equipped with the dislocation hole 9 that is the matrix arrangement setting on sliding heat dissipation plate 8, dislocation hole 9 equals with louvre 7 diameter, and length between two adjacent rows of dislocation holes 9 equals length between two adjacent rows of dislocation holes 9, and length between two adjacent rows of dislocation holes 9 is greater than or equal to louvre 7's diameter.

The nickel-titanium alloy 10 is arranged between the upper wall of the sliding heat dissipation plate 8 and the inner upper wall of the cavity 6, the nickel-titanium alloy 10 is arranged in the cavity 6, and the original shape of the nickel-titanium alloy 10 is Z-shaped.

According to the novel LED lamp produced by the method, the nickel-titanium alloy 10 can adjust the position of the dislocation hole 9 according to the heat generated by the LED lamp during working, so that the ventilation of the heat dissipation holes 7 is adjusted, in an initial state, the temperature of the nickel-titanium alloy 10 is lower than the specific temperature at which the nickel-titanium alloy 10 recovers to deform, the nickel-titanium alloy 10 is in an easily deformable state, the nickel-titanium alloy 10 is stretched and unfolded under the action of gravity of the sliding heat dissipation plate 8, the dislocation hole 9 and the heat dissipation holes 7 are arranged in a dislocation way, when the heat generated by the LED lamp during working is higher than the specific temperature at which the nickel-titanium alloy 10 recovers to deform, the nickel-titanium alloy 10 rapidly recovers to the original Z-shaped bending shape, so that the length of the nickel-titanium alloy 10 is reduced, the nickel-titanium alloy 10 drives the sliding heat dissipation plate 8 to move upwards along the sliding chute 5, so that the dislocation hole 9 gradually moves upwards to align with the heat dissipation holes 7, the heat dissipation is convenient, and the heat is dissipated by the heat-conducting silica gel on the back of the lamp panel 2, when the temperature that lamp plate 2 work produced reduces to being less than nickel titanium alloy 10 and recovering the specific temperature of deformation, nickel titanium alloy 10 is the easy deformation state, and nickel titanium alloy 10 is stretched under sliding heat dissipation plate 8's action of gravity and resets this moment, dislocation hole 9 and 7 dislocation sets of louvre, and sliding heat dissipation plate 8 does not have dislocation hole 9 part and can be with 7 shutoff of louvre, avoids the dust to get into lamp shade body 4, guarantees the good leakproofness of lamp shade 1.

The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by the present specification, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.