1. The utility model provides a solve cutting device that ultra-thin crystalline grain back bursts and lacks, includes bottom plate (1), its characterized in that: a lower positioning plate (2) is fixedly connected on the upper end surface of the bottom plate (1), a positioning groove (23) is arranged on the upper end surface of the lower positioning plate (2), an upper positioning plate (3) is arranged above the lower positioning plate (2), a positioning device (21) is arranged between the upper positioning plate (3) and the lower positioning plate (2), the positioning device (21) comprises a group of positioning holes (11) arranged on the upper end surface of the lower positioning plate (2) and a group of positioning columns (12) arranged on the lower end surface of the upper positioning plate (3), the positioning column (12) is matched with the positioning hole (11) in a clamping way, a locking device (22) is arranged between the upper positioning plate (3) and the bottom plate (1), a group of upper cutter grooves (4) are formed in the upper positioning plate (3), a group of lower cutter grooves (5) are formed in the lower positioning plate (2), and the positions of the upper cutter grooves (4) and the lower cutter grooves (5) are overlapped.

2. The cutting device for solving the problem of the back chipping of the ultra-thin die as claimed in claim 1, wherein: the locking device (22) is fixedly connected with the connecting seat (14) on the side wall of the upper positioning plate (3), the bottom plate (1) is fixedly connected with the connecting column (16), the connecting column (16) penetrates through a through hole (15) in the connecting seat (14), and the top of the connecting column (16) is in threaded connection with a locking nut (18).

3. The cutting device for solving the problem of the back face chipping of the ultra-thin die as claimed in claim 2, wherein: the top of the connecting column (16) is provided with a screw rod (17), and the locking nut (18) is in threaded connection with the screw rod (17).

4. The cutting device for solving the problem of the back face chipping of the ultra-thin die as claimed in claim 3, wherein: the utility model discloses a bolt, including spliced pole (16), screw rod (17), spliced pole (16) and screw rod (17) juncture are provided with the step, the joint has gasket (19) on the step, the cover is equipped with spring (20) on spliced pole (16), the upper and lower both ends of spring (20) are contradicted respectively and are connected on the up end of the lower terminal surface of gasket (19) and connecting seat (14).

5. The cutting device for solving the problem of the back face chipping of the ultra-thin die as claimed in claim 4, wherein: a group of clearance grooves (6) are formed in the bottom plate (1), and the clearance grooves (6) are formed below the lower cutter groove (5).

6. The cutting device for solving the problem of the back face chipping of the ultra-thin die as claimed in claim 5, wherein: an outwardly opened knife guiding opening (7) is arranged at the upper end opening of the upper knife groove (4), and an outwardly opened chip removing opening (8) is arranged at the lower end opening of the lower knife groove (5).

7. The cutting device for solving the problem of the back face chipping of the ultra-thin die as claimed in claim 6, wherein: the lower end face of the upper positioning plate (3) and the upper end face of the lower positioning plate (2) are respectively provided with a group of mounting grooves (10), and buffer strips (9) are bonded in the mounting grooves (10).

8. The cutting device for solving the problem of the back chipping of the ultra-thin die as claimed in claim 7, wherein: the bottom of the positioning column (12) is provided with a circular truncated cone-shaped column top (13).

Background

Wafer dicing, i.e., cutting, is an essential process in the semiconductor chip manufacturing process flow, and belongs to a subsequent process in wafer manufacturing. And cutting the whole wafer with the chips into single chips according to the sizes of the chips, which is called wafer scribing. The earliest wafers were diced by dicing systems, and this approach now occupies a significant portion of the world's chip dicing market, particularly in the non-integrated circuit wafer dicing field. Although methods of laser scribing and photolithographic scribing have been developed, the diamond saw blade grinding wheel scribing method is a common wafer scribing method at present. At present, the back face of the existing ultra-thin crystal grain cutting device is easy to break up, and therefore, a novel cutting device for solving the problem of back face breakage of the ultra-thin crystal grain is urgently needed to overcome the defects.

Disclosure of Invention

The present invention is directed to a cutting device for solving the problem of the backside defect of the ultra-thin die, so as to solve the above-mentioned problems.

In order to achieve the purpose, the invention provides the following technical scheme:

the utility model provides a solve ultra-thin crystalline grain back and collapse cutting device who lacks, includes the bottom plate, fixedly connected with locating plate down on the bottom plate up end, be provided with the constant head tank down on the locating plate up end, the locating plate top is provided with the top board down, be provided with positioner between top board and the bottom board, positioner includes a set of locating hole and a set of reference column that sets up on the terminal surface under the top board of setting on locating plate down, reference column and locating hole joint cooperation, be provided with locking device between top board and the bottom plate, be provided with a set of sword groove on the top board, be provided with a set of sword groove down on the locating plate down, go up sword groove and lower sword groove position coincidence.

Preferably, the locking device is fixedly connected with a connecting seat on the side wall of the upper positioning plate, a connecting column is fixedly connected on the bottom plate and penetrates through a through hole in the connecting seat, and a locking nut is in threaded connection with the top of the connecting column.

Preferably, the top of the connecting column is provided with a screw, and the locking nut is in threaded connection with the screw.

Preferably, the juncture of the connecting column and the screw rod is provided with a step, the step is clamped with a gasket, the connecting column is sleeved with a spring, and the upper end and the lower end of the spring are respectively connected to the lower end face of the gasket and the upper end face of the connecting seat in a butting manner.

Preferably, a group of clearance grooves are formed in the bottom plate, and the clearance grooves are formed below the lower cutter groove.

Preferably, an outwardly-opened knife guiding edge is arranged at the upper end opening of the upper knife groove, and an outwardly-opened chip removing opening is arranged at the lower end opening of the lower knife groove.

Preferably, a group of mounting grooves are formed in the lower end face of the upper positioning plate and the upper end face of the lower positioning plate respectively, and buffer strips are bonded in the mounting grooves.

Preferably, the bottom of the positioning column is provided with a circular truncated cone-shaped column top.

Compared with the prior art, the invention has the beneficial effects that: according to the invention, because the lower positioning plate and the upper positioning plate are supported at two sides of the wafer notch, the risk of the notch back face collapse is greatly reduced. The springs are used to maintain pressure equalization throughout the upper plate. The cutting-in of the diamond grinding wheel is facilitated by the cutting-in port, and the chip discharging port is convenient for chip discharging. The buffering strip prevents the upper positioning plate and the lower positioning plate from crushing the wafer. The invention has reasonable design and convenient use, and effectively solves the problem of back collapse of the ultrathin crystal grains.

Drawings

FIG. 1 is a schematic view of a cutting apparatus for solving the problem of backside chipping of an ultra-thin die;

fig. 2 is a partially enlarged view of fig. 1 at K.

In the figure: 1-bottom plate, 2-lower positioning plate, 3-upper positioning plate, 4-upper cutter groove, 5-lower cutter groove, 6-clearance groove, 7-guide cutter edge, 8-chip removal opening, 9-buffer strip, 10-mounting groove, 11-positioning hole, 12-positioning column, 13-column top, 14-connecting seat, 15-through hole, 16-connecting column, 17-screw rod, 18-locking nut, 19-gasket, 20-spring, 21-positioning device, 22-locking device, 23-positioning groove and 24-wafer.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution:

the utility model provides a solve ultra-thin crystalline grain back and collapse cutting device who lacks, includes bottom plate 1, fixedly connected with lower locating plate 2 on the 1 up end of bottom plate, be provided with constant head tank 23 on the 2 up end of lower locating plate, 2 tops of lower locating plate are provided with top board 3, be provided with positioner 21 between top board 3 and the lower locating plate 2, positioner 21 includes a set of locating hole 11 and a set of reference column 12 that sets up on the 3 lower terminal surface of top board of locating hole on 2 up end of lower locating plate that sets up, reference column 12 and 11 joint cooperation of locating hole, be provided with locking device 22 between top board 3 and the bottom plate 1, be provided with a set of upper knife groove 4 on the top board 3, be provided with a set of lower knife groove 5 on the lower locating plate 2, upper knife groove 4 and lower knife groove 5 position coincidence.

Before cutting, the wafer 24 is placed in the positioning groove 23, and then the upper positioning plate 3 is positioned above the lower positioning plate 2 by the positioning device 21 and locked by the locking device 22. The diamond saw blade is cut into along the upper cutter groove 4 and the lower cutter groove 5, and the support of the lower positioning plate 2 and the upper positioning plate 3 is arranged on the two sides of the notch of the wafer 24, so that the risk of the notch back breakage is greatly reduced.

Preferably, the locking device 22 is fixedly connected to the connecting seat 14 on the side wall of the upper positioning plate 3, the bottom plate 1 is fixedly connected to the connecting column 16, the connecting column 16 is inserted into the through hole 15 on the connecting seat 14, and the top of the connecting column 16 is in threaded connection with the locking nut 18.

Nut 18 is used to compress connecting socket 14.

Preferably, a screw rod 17 is arranged on the top of the connecting column 16, and the locking nut 18 is screwed on the screw rod 17.

Preferably, a step is arranged at the junction of the connecting column 16 and the screw 17, a gasket 19 is clamped on the step, a spring 20 is sleeved on the connecting column 16, and the upper end and the lower end of the spring 20 are respectively connected to the lower end face of the gasket 19 and the upper end face of the connecting seat 14 in an abutting mode.

The spring 20 serves to maintain pressure equalization throughout the upper plate 3.

Preferably, a group of clearance grooves 6 are arranged on the bottom plate 1, and the clearance grooves 6 are arranged below the lower knife groove 5.

The clearance groove 6 plays a clearance role.

Preferably, an outwardly-opened guide blade 7 is arranged at the upper end opening of the upper blade groove 4, and an outwardly-opened chip removal port 8 is arranged at the lower end opening of the lower blade groove 5.

The cutting-in of the diamond grinding wheel is facilitated by the cutting-in guiding opening 7, and the chip discharging opening 8 is convenient for chip discharging.

Preferably, a set of mounting grooves 10 are respectively arranged on the lower end surface of the upper positioning plate 3 and the upper end surface of the lower positioning plate 2, and a buffer strip 9 is bonded in each mounting groove 10.

The buffer strips 9 prevent the upper positioning plate 3 and the lower positioning plate 2 from crushing the wafer 24.

Preferably, a truncated cone-shaped pillar top 13 is arranged at the bottom of the positioning pillar 12.

The truncated cone-shaped column top 13 facilitates the positioning column 12 to be clamped in the positioning hole 11.

The working principle of the invention is as follows: before cutting, the wafer 24 is placed in the positioning groove 23, and then the upper positioning plate 3 is positioned above the lower positioning plate 2 by the positioning device 21 and locked by the locking device 22. The diamond saw blade is cut into along the upper cutter groove 4 and the lower cutter groove 5, and the support of the lower positioning plate 2 and the upper positioning plate 3 is arranged on the two sides of the notch of the wafer 24, so that the risk of the notch back breakage is greatly reduced. Nut 18 is used to compress connecting socket 14. The spring 20 serves to maintain pressure equalization throughout the upper plate 3. The clearance groove 6 plays a clearance role. The cutting-in of the diamond grinding wheel is facilitated by the cutting-in guiding opening 7, and the chip discharging opening 8 is convenient for chip discharging. The buffer strips 9 prevent the upper positioning plate 3 and the lower positioning plate 2 from crushing the wafer 24. The truncated cone-shaped column top 13 facilitates the positioning column 12 to be clamped in the positioning hole 11.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.