1. A pump for driving a flow of a non-conductive liquid, comprising:

a circuit board, which is provided with a circuit unit positioned at the inner side or/and the outer side, the circuit board is provided with an insulating substrate, the insulating substrate is provided with a plurality of through holes, each through hole is sealed by a conductive material, and the circuit unit is electrically connected with the conductive material;

the outer cover is combined with the circuit board, a liquid flow space is arranged between the inner part of the outer cover and the inner side of the circuit board, and a liquid injection port and a liquid discharge port are communicated with the liquid flow space; and

and the flow guide fan is positioned in the liquid flow space and is provided with a driving assembly, the driving assembly is electrically connected with the circuit unit, and the driving assembly drives an impeller to rotate.

2. The pump of claim 1, wherein the circuit unit has an external circuit located at an outer side, second ends of the through holes are electrically connected to the second connection holes of the external circuit, and an electrical connector is electrically connected between the driving element and the second connection holes of the external circuit.

3. The pump of claim 2, wherein the electrical connector is electrically connected to an electrical port of the driving assembly and extends through the through hole.

4. The pump of claim 1, wherein the circuit unit has an internal circuit inside, and the first ends of the plurality of through holes are electrically connected to the plurality of first connection holes of the internal circuit.

5. The pump of claim 4, wherein the internal circuit is electrically connected to an electrical port of the drive assembly through a conductive member.

6. The pump of claim 1, wherein the circuit unit has an internal circuit on an inner side and an external circuit on an outer side, the internal circuit being electrically connected to the external circuit.

7. The pump of claim 6, wherein each via is filled with the conductive material, a first end of each via is electrically connected to the first holes of the internal circuit, a second end of each via is electrically connected to the second holes of the external circuit, and the internal circuit is electrically connected to the external circuit through the first holes, the vias, and the second holes.

8. The pump of claim 7, wherein the internal circuit is electrically connected to an electrical port of the drive assembly through a conductive member.

9. The pump of claim 4 or 6, wherein the housing is solder bonded to the circuit board.

10. The pump of claim 1, wherein the conductive material is filled by electroplating or solder to seal the plurality of vias.

11. The pump of claim 1, wherein the fan has a frame, the frame has a substrate bonded to the inner side of the circuit board, a shaft is connected to the substrate, the driving assembly has a wiring board located at the outer periphery of the shaft, an electrical port is located on the wiring board, and the circuit unit is electrically connected to the electrical port.

12. The pump of claim 1, wherein the fan has a frame, the frame has a coupling portion located inside the circuit board, the driving assembly has a stator coil set and a driving circuit located on the circuit board, the stator coil set is located on the periphery of the coupling portion, and the circuit unit electrically connects the stator coil set and the driving circuit.

13. The pump of claim 1, wherein the circuit unit comprises an internal circuit and an external circuit, the insulating substrate is connected to an upper copper layer and a lower copper layer, the upper copper layer and the lower copper layer each have a hollow portion, the internal circuit is located in the hollow portion of the upper copper layer, and the external circuit is located in the hollow portion of the lower copper layer.

14. The pump of claim 1, wherein the circuit unit has an external circuit having a plurality of contact ports.

15. The pump of claim 14, wherein a plurality of contact ports are located at corners or at a peripheral edge of the circuit board.

16. The pump of claim 14, wherein the plurality of contact ports are formed in a gold finger pattern.

17. A liquid-cooled heat dissipation system, comprising:

a pump as claimed in any one of claims 1 to 16;

a heat absorbing unit;

a heat dissipating unit;

a non-conductive liquid; and

and the pipe group is connected in series with the pump, the heat absorption unit and the heat dissipation unit so as to enable the non-conductive liquid to flow circularly when the pump operates.

Background

Please refer to fig. 1, which is a conventional pump 9, the conventional pump 9 has a housing 91, the housing 91 has a liquid injection port 911 and a liquid discharge port 912, the liquid injection port 911 and the liquid discharge port 912 are connected to a liquid flow space 913 in the housing 91, a guiding fan 92 is located in the liquid flow space 913, the guiding fan 92 has a fan frame 921, the fan frame 921 has a liquid inlet 921a and a liquid outlet 921b, the liquid inlet 921a is connected to the liquid injection port 911, the liquid outlet 921b is connected to the liquid discharge port 912, the guiding fan 92 further has a driving component 922 and an impeller 923, and the driving component 922 and the impeller 923 are located in the fan frame 921. When the existing pump 9 is in operation, the driving assembly 922 drives the impeller 923 to rotate, so that the working liquid can flow into the fan frame 921 through the liquid inlet 921a, then flow out of the liquid outlet 921b, and finally leave the casing 91 through the liquid outlet 912 of the casing 91.

However, in the conventional pump 9, since the pump 9 relies on electric power to drive the impeller 923 to rotate, an outlet hole is usually formed in the housing 91, a plug ring is disposed in the outlet hole to prevent liquid leakage, and a connection of the driving assembly 922 passes through the plug ring and is connected to an external power source; however, the plug ring is generally difficult to form a complete seal with the outlet hole due to tolerance, if no leakage protection is provided at the outlet hole, it is still easy to cause liquid leakage to the outside of the housing 91, and if the plug ring is not fixed and is displaced relative to the outlet hole, the connection is prone to be pulled or pressed to cause poor contact or breakage; especially, for the micro pump 9, it is difficult to assemble the plug ring and the wiring at the exact position of the wire hole in a narrow space, which causes inconvenience in assembly operation, and the leak-proof space is smaller, which makes it difficult to perform leak-proof work in a limited space, thereby affecting the driving efficiency of the pump 9.

In view of the above, there is a need for improvement of the existing pump.

Disclosure of Invention

To solve the above problems, an objective of the present invention is to provide a liquid-cooled heat dissipation system and a pump thereof, which can prevent the working liquid from leaking.

It is another object of the present invention to provide a liquid-cooled heat dissipation system and a pump thereof, which can reduce the thickness of the whole pump.

Another objective of the present invention is to provide a liquid-cooled heat dissipation system and a pump thereof, which can improve the convenience of wiring.

Another objective of the present invention is to provide a liquid-cooled heat dissipation system and a pump thereof, which can improve the assembly convenience.

All directions or similar expressions such as "front", "back", "left", "right", "top", "bottom", "inner", "outer", "side", etc. are mainly used with reference to the directions of the drawings, and are only used for assisting the explanation and understanding of the embodiments of the present invention, and are not used to limit the present invention.

The use of the terms a or an for the elements and components described throughout this disclosure are for convenience only and provide a general sense of the scope of the invention; in the present invention, it is to be understood that one or at least one is included, and a single concept also includes a plurality unless it is obvious that other meanings are included.

The terms "combined", "combined" and "assembled" as used herein include the form of the components being connected and separated without destroying the components, or the components being connected and separated without destroying the components, which can be selected by those skilled in the art according to the materials and assembling requirements of the components to be connected.

The pump of the present invention is used for driving the non-conductive liquid to flow, and comprises: a circuit board, which is provided with a circuit unit positioned at the inner side or/and the outer side, the circuit board is provided with an insulating substrate, the insulating substrate is provided with a plurality of through holes, each through hole is sealed by a conductive material, and the circuit unit is electrically connected with the conductive material; a housing, which is combined with the circuit board, a liquid flow space is arranged between the interior of the housing and the inner side of the circuit board, and a liquid injection port and a liquid discharge port are communicated with the liquid flow space; and the flow guide fan is positioned in the liquid flow space and is provided with a driving assembly, the driving assembly is electrically connected with the circuit unit, and the driving assembly drives an impeller to rotate.

The liquid cooling type heat dissipation system of the present invention comprises: a pump as described above; a heat absorption unit; a heat dissipation unit; a non-conductive liquid; and a pipe assembly, which is connected in series with the pump, the heat absorption unit and the heat dissipation unit, so as to make the non-conductive liquid flow circularly when the pump is in operation.

Therefore, the liquid cooling heat dissipation system and the pump thereof of the invention can be suitable for the liquid cooling heat dissipation systems with various pressurization requirements, each through hole of the circuit board is sealed by a conductive material, and the circuit unit is electrically connected with the conductive material, so that the driving component can receive an external power supply without arranging a wire outlet on the outer cover, thereby avoiding the occurrence of the leakage of non-conductive liquid in the liquid flow space, and having the effects of reducing the manufacturing cost, improving the whole driving efficiency and the like.

The circuit unit may have an external circuit located outside, the second ends of the through holes are electrically connected to the second connection holes of the external circuit, and an electrical connector may be electrically connected between the driving assembly and the second connection holes of the external circuit. Therefore, the circuit unit can only have the external circuit positioned at the outer side of the circuit board, and has the effect of reducing the manufacturing cost.

Wherein, the electric connector can be electrically connected with an electric port part of the driving component and penetrates through the through hole. Therefore, the driving assembly can be electrically connected with an external circuit of the circuit board, and the effect of improving the assembly convenience is achieved.

The circuit unit may have an internal circuit inside, and the first ends of the through holes are electrically connected to the first connection holes of the internal circuit. Therefore, the circuit unit can only have the internal circuit positioned at the inner side of the circuit board, and has the effect of reducing the manufacturing cost.

The internal circuit can be electrically connected with an electric port part of the driving component through a conductive piece. Therefore, the driving assembly can be electrically connected with the internal circuit of the circuit board, and the effect of improving the assembly convenience is achieved.

The circuit unit may have an internal circuit located inside and an external circuit located outside, and the internal circuit is electrically connected to the external circuit. Therefore, the assembly device has the effect of improving the assembly convenience.

The conductive material is filled in each through hole, the first ends of the through holes can be electrically connected with the first connecting holes of the internal circuit, the second ends of the through holes can be electrically connected with the second connecting holes of the external circuit, and the internal circuit is electrically connected with the external circuit through the first connecting holes, the through holes and the second connecting holes. Thus, the function of preventing the non-conductive liquid from leaking out of the plurality of through holes is achieved.

Wherein, the internal circuit can be electrically connected to the electrical port portion through a conductive member. Therefore, the driving assembly can be electrically connected with the internal circuit of the circuit board, and the effect of improving the assembly convenience is achieved.

Wherein, the outer cover can be welded and combined with the circuit board. Therefore, the outer cover and the circuit board can be firmly combined, and the effect of improving the structural strength of the outer cover and the circuit board is achieved.

The conductive material can seal the through holes by electroplating filling or soldering. Therefore, the conductive material is easy to obtain and has the effect of reducing the manufacturing cost.

The fan frame can have a substrate combined with the inner side of the circuit board, a shaft connecting part is connected with the substrate, the driving component has a wiring board positioned at the periphery of the shaft connecting part, an electric port part is positioned on the wiring board, and the circuit unit is electrically connected with the electric port part. Therefore, the structure is simple and convenient to assemble, and has the effect of improving the assembly convenience.

The flow guiding fan can be provided with a fan frame, the fan frame is provided with a shaft connecting part located on the inner side of the circuit board, the driving assembly can be provided with a stator coil group and a driving circuit located on the circuit board, the stator coil group is located on the periphery of the shaft connecting part, and the circuit unit is electrically connected with the stator coil group and the driving circuit. Therefore, the axial height of the flow guide fan can be reduced, and the thickness of the whole pump can be reduced.

The circuit unit can be provided with an internal circuit and an external circuit, the insulating substrate can be connected with an upper copper layer and a lower copper layer, the upper copper layer and the lower copper layer can be respectively provided with a hollow part, the internal circuit is located in the hollow part of the upper copper layer, and the external circuit is located in the hollow part of the lower copper layer. Therefore, the internal circuit and the external circuit can be prevented from forming short circuit.

The circuit unit may have an external circuit, and the external circuit may have a plurality of contact ports. Therefore, the plurality of contact ports can be connected with wires, power supplies, input and output signals and the like, and the effect of improving the wiring convenience is achieved.

The plurality of contact ports may be located at corners or at peripheral edges of the circuit board. Therefore, the plurality of contact ports can be used as welding points for welding combination, and the effect of improving the manufacturing and assembling convenience is achieved.

Wherein, the plurality of contact ports can be formed in a gold finger shape. Therefore, the utility model has the effect of improving the use convenience.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

FIG. 1: an assembled cross-sectional view of a conventional pump;

FIG. 2: an exploded perspective view of the pump of the first embodiment of the present invention;

FIG. 3: a partially exploded perspective view of a circuit board of the pump of the first embodiment of the present invention;

FIG. 4: a top view of the pump of the first embodiment of the present invention;

FIG. 5: a cross-sectional view taken along line A-A of FIG. 4;

FIG. 6a: a partial enlarged view shown as B in fig. 5;

FIG. 6b: the pump of the first embodiment of the present invention is a cross-sectional view of a circuit board with a lead wire soldered to the inner side of the circuit board;

FIG. 6c: the pump of the first embodiment of the present invention is a cross-sectional view of clamping the radial extension portion and the circuit board by a fixing member;

FIG. 7: the invention comprises an architecture diagram of the liquid cooling heat dissipation system of the pump of the first embodiment;

FIG. 8: the combined cross section of the pump of the second embodiment of the invention;

FIG. 9: the combined cross section of the pump of the third embodiment of the present invention;

FIG. 10: the combined cross section of the pump of the fourth embodiment of the invention;

FIG. 11: an exploded perspective view of a pump according to a fifth embodiment of the present invention.

Description of the reference numerals

[ invention ] to provide

1: circuit board

1a insulating substrate

1b upper copper layer

1c lower copper layer

101 inner side

102 outer side of

11 internal circuit

111 first connecting hole

12 external circuit

12a contact port

121: second connecting hole

13 through the hole

131 the first end

132 second end

14 hollow part

15 conductive member

16 positioning groove

2, outer cover

20 inside

21 top plate

22 annular wall

23 radial extension

23a bonding surface

24: liquid injection port

25 liquid discharge port

26: catheter

3: flow guiding fan

31 frame of fan

311 base plate

312 axial connection part

313, an upper cover

314 side wall

315 liquid inlet

316 liquid outlet

317: outlet channel

32 drive assembly

321 wiring board

322 stator coil group

323 a drive circuit

324 electric port part

33: impeller

331: hub

332, the blade

333 magnetic part

4 heat absorption unit

5 heat dissipation unit

6: pipe fitting set

6a pipe fitting

6b pipe fitting

6c pipe fitting

C is a conductive material

H is heat source

J conductive material

L circuit unit

Corner part of N

P is the pump

S: fluid flow space

U is a conductive through hole

W is a lead wire

R is electric connector

X fixing piece

Y-buffer insulating part

[ Prior Art ] A method for producing a semiconductor device

9: pump

91 casing

911 liquid filling opening

912 liquid discharge port

913 liquid flow space

92 flow guiding fan

921 frame of fan

921a liquid inlet

921b liquid outlet

922 drive assembly

923 an impeller.

Detailed Description

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below:

referring to fig. 2, a pump P according to a first embodiment of the present invention includes a circuit board 1, a housing 2, and a fan 3, wherein the housing 2 is combined with the circuit board 1, and the fan 3 is located in a space formed by the housing 2 and the circuit board 1. The pump P can be used to drive a non-conductive liquid (e.g., a liquid with good fluidity but no conductivity, such as an electronic engineering liquid) to flow, and the dielectric strength of the non-conductive liquid is not less than 30 kV/mm.

Referring to fig. 2 and 3, the circuit board 1 may be, for example, a glass fiber circuit board, an aluminum substrate circuit board, an iron substrate circuit board, or a ceramic substrate circuit board, the form of the circuit board 1 is not limited in the present invention, and in the present embodiment, the circuit board 1 is a double-sided copper-clad printed circuit board FR-4. The circuit board 1 has an insulating substrate 1a, the insulating substrate 1a may be made of epoxy resin or glass fiber, and the insulating substrate 1a may be connected to an upper copper layer 1b and a lower copper layer 1c, respectively, such that the circuit board 1 may be connected to the upper copper layer 1b, the insulating substrate 1a and the lower copper layer 1c from top to bottom in sequence as shown in fig. 2.

In detail, the circuit board 1 has a circuit unit L, which may have an internal circuit 11 at the inner side 101 and an external circuit 12 at the outer side 102; in this embodiment, the internal circuit 11 can be located on the upper copper layer 1b, and the external circuit 12 can be located on the lower copper layer 1 c. Wherein, the insulating substrate 1a has a plurality of through holes 13, each through hole 13 can be filled with conductive medium (such as through hole liquid or electroplated conductive film on the inner wall of each through hole 13), then, a conductive material C is filled to seal the first end 131 and the second end 132 of the through holes 13, the first end 131 of the through holes 13 is electrically connected to the first holes 111 of the internal circuit 11, the second end 132 of the through holes 13 is electrically connected to the second holes 121 of the external circuit 12, so that the through holes 13 of the insulating substrate 1a, the first holes 111 of the upper copper layer 1b and the second holes 121 of the lower copper layer 1C can form a whole electrically connected conductive hole, the internal circuit 11 can be electrically connected to the external circuit 12 through the plurality of first connection holes 111, the plurality of through holes 13 and the plurality of second connection holes 121, so that the internal circuit 11 is electrically connected to the external circuit 12; meaning that a printed circuit board is used as the circuit board 1 for the pump P of the invention. Preferably, the conductive material C may be filled by electroplating or solder to seal the plurality of through holes 13.

Referring to fig. 3 and 5, it is particularly described that the external circuit 12 can be connected to a wire W, the external circuit 12 can have a plurality of contact ports 12a, and the plurality of contact ports 12a can be connected to wires, power, input/output signals, etc. to provide power or signals required for the operation of the pump P; in addition, the plurality of contact ports 12a can also be formed in the shape of gold fingers (i.e., metal terminals, also called pins, of the circuit board). In addition, the upper copper layer 1b and the lower copper layer 1c may have a hollow portion 14 respectively, the internal circuit 11 may be located in the hollow portion 14 of the upper copper layer 1b, and the external circuit 12 may be located in the hollow portion 14 of the lower copper layer 1 c; thus, the internal circuit 11 and the external circuit 12 can be prevented from being short-circuited with each other. Also, the circuit board 1 may have a conductive member 15, and the conductive member 15 may be located on the upper copper layer 1b and electrically connected to the internal circuit 11.

Referring to fig. 2 and 5, the outer cover 2 may be a rectangular housing with an open lower end, that is, the outer cover 2 may have a top plate 21, a ring wall 22 is connected to a circumferential edge of the top plate 21, a radial extension 23 of the outer cover 2 is connected to the ring wall 22, and the radial extension 23 may have a connection surface 23a facing the circuit board 1; thus, the circuit board 1 can be connected to the connecting surface 23a of the radial extension 23 to close the opening formed at the bottom end of the annular wall 22, so that a fluid flow space S is formed between the inner portion 20 of the outer cover 2 and the inner side 101 of the circuit board 1. The radial extension portion 23 and the circuit board 1 may be clamped together by a fixing member X as shown in fig. 6C, and the fixing member X may be a C-shaped member formed by plastic or metal material, so that the fixing member X may be clamped around or on two opposite sides of a joint of the radial extension portion 23 and the circuit board 1; preferably, when the fixing member X is made of a metal material, a buffer insulating member Y may be further disposed between the radial extending portion 23, the circuit board 1 and the fixing member X to improve the bonding tightness. Preferably, the housing 2 can be welded to the circuit board 1, for example, by laser welding, argon arc welding or soldering; in this embodiment, the bonding surface 23a of the radial extension 23 can be selectively bonded to the upper copper layer 1b of the circuit board 1 by laser welding (e.g., through-soldering) to improve the bonding strength and the structural strength.

The housing 2 may have a liquid inlet 24 and a liquid outlet 25, the liquid inlet 24 and the liquid outlet 25 communicate the liquid flow space S with the outside, the liquid inlet 24 is used for the non-conductive liquid to flow in, and the liquid outlet 25 is used for the non-conductive liquid to flow out. The liquid injection port 24 and the liquid discharge port 25 can be selectively arranged at the same end of the annular wall 22; preferably, as shown in the figure, the liquid injection port 24 and the liquid discharge port 25 can be formed by ports connecting two conduits 26 of the annular wall 22, and the two conduits 26 can be integrally connected with the annular wall 22 or can be assembled and combined with the annular wall 22 in a liquid-tight manner.

Referring to fig. 2, 4 and 5, the guiding fan 3 is located in the liquid flow space S, the guiding fan 3 may have a fan frame 31, the fan frame 31 may have a substrate 311 and a shaft portion 312, the substrate 311 may be made of an insulating material, and the substrate 311 may be located on the inner side 101 of the circuit board 1 (i.e., located on the upper copper layer 1b of the circuit board 1); in this embodiment, the upper copper layer 1b on the substrate 311 may be etched and removed, and then the substrate 311 is bonded to the insulating substrate 1a, and the shaft portion 312 is connected to the substrate 311. The fan frame 31 may have an upper cover 313 and a side wall 314, the side wall 314 is connected to the circumferential edge of the upper cover 313, the side wall 314 is located at the periphery of the shaft connecting portion 312, the fan frame 31 may further have a liquid inlet 315 and a liquid outlet 316, the liquid inlet 315 is located in the upper cover 313, the liquid outlet 316 is located in the side wall 314, the liquid inlet 315 and the liquid outlet 316 may be communicated with the liquid flow space S, the liquid inlet 315 allows the non-conductive liquid to flow in, and the liquid outlet 316 allows the non-conductive liquid to drain.

Referring to fig. 5, the fan 3 has a driving component 32, and the driving component 32 is located in the fan frame 31. In detail, the driving assembly 32 may have a wiring board 321 and a stator coil set 322, the wiring board 321 is located at the periphery of the shaft connecting portion 312, the wiring board 321 is located on the substrate 311, the stator coil set 322 is preferably wired on the wiring board 321 to reduce the axial height, the driving assembly 32 may have a driving circuit 323, the driving circuit 323 is located on the wiring board 321; thus, the components disposed in the fan frame 31 can be assembled in advance, and when assembling the pump P, the fan frame 31 is assembled to the predetermined position of the circuit board 1 by aligning.

Referring to fig. 5 and fig. 6a, an electrical port portion 324 of the driving component 32 can be located on the wiring board 321, the electrical port portion 324 can face the circuit board 1, the internal circuit 11 of the circuit board 1 can be electrically connected to the electrical port portion 324 through the conductive member 15, so that the internal circuit 11 is electrically connected to the electrical port portion 324, and the driving component 32 is further electrically connected to the internal circuit 11 of the circuit board 1; in the present embodiment, the conductive member 15 is illustrated as a conductive elastic sheet, but in other embodiments, the conductive member 15 may also be a conductive wire, a conductive pin or a socket to electrically connect the driving component 32 and the internal circuit 11, which is not limited in the present invention. In addition, since the working fluid flowing through the fluid space S is a non-conductive fluid when the pump P is operating, the driving assembly 32 can be selected without waterproof treatment, which not only does not cause short circuit, but also reduces the manufacturing cost.

Referring to fig. 4 and 5, the flow guiding fan 3 has an impeller 33, and the impeller 33 is driven by the driving assembly 32 to rotate, so that the non-conductive liquid can flow into the fan frame 31 from the liquid inlet 315 and then flow out from the liquid outlet 316. The impeller 33 may have a hub 331 and a plurality of blades 332, the plurality of blades 332 are connected to the outer periphery of the hub 331, and a magnetic member 333 of the impeller 33 is connected to the hub 331 and is opposite to the stator coil set 322. After the driving assembly 32 is powered on, the magnetic field generated by the stator coil set 322 is magnetically repulsive to the magnetic member 333, so as to push the hub 331 to drive the plurality of blades 332 to rotate synchronously, so that the non-conductive liquid can flow into the fan frame 31 through the liquid inlet 315 and then flow out from the liquid outlet 316.

Referring to fig. 5 and 6a, according to the above structure, since the pump P depends on the electric power to drive the impeller 33 to rotate, the driving component 32 must receive an external power source or a control signal, since the internal circuit 11 can be electrically connected to the external circuit 12 through the conductive material C in each through hole 13, and the external circuit 12 can be connected to the external power source or the control signal by welding the wire W, the external power source or the control signal can supply power to the driving component 32 through the external circuit 12 and the internal circuit 11 to provide the power source and the control signal required by the operation of the pump P; as shown in fig. 6b, a conductive via U may be selectively formed on the circuit board 1, and the wire W is soldered to the inner side 101 of the circuit board 1, wherein the conductive via U may be filled with a conductive material J, so that the wire W can be electrically connected to the external circuit 12, and the wire W is further prevented from being easily squeezed due to being directly connected to the lower copper layer 1 c. Therefore, the outer cover 2 does not need to be provided with a wire outlet hole for a wire to extend to the outside as in the prior art, and when the circuit board 1 and the outer cover 2 are assembled, the circuit board 1 and the outer cover 2 can be tightly combined, so that the situation that non-conductive liquid in the liquid flow space S leaks outside can be avoided.

In addition, since the conductive material C is filled to seal the plurality of through holes 13, the non-conductive liquid can be prevented from leaking out of the plurality of through holes 13.

Referring to fig. 7, it is shown that a preferred embodiment of the liquid-cooled heat dissipation system of the present invention includes the aforementioned pump P, a heat absorption unit 4, a heat dissipation unit 5, and a tube assembly 6, where the tube assembly 6 connects the pump P, the heat absorption unit 4, and the heat dissipation unit 5.

Referring to fig. 2 and 7, in detail, the tube assembly 6 can be inserted through the liquid injection port 24 of the housing 2, the tube assembly 6 can communicate the pump P and the heat absorption unit 4 through a tube 6a, and the heat absorption unit 4 can be attached to a heat source H of an electronic device, for example; the tube assembly 6 can further include a tube 6b connecting the pump P and the heat dissipation unit 5, and a tube 6c connecting the heat absorption unit 4 and the heat dissipation unit 5; the pump P and the tube set 6 have a non-conductive liquid therein. Therefore, the non-conductive liquid in the tube assembly 6 and located at the heat absorption unit 4 can absorb heat energy to raise the temperature, and is guided to the heat dissipation unit 5 through the operation of the pump P, so as to be cooled when passing through the heat dissipation unit 5, and is guided to the heat absorption unit 4 again after being cooled; the circulation is continuously carried out, so that the heat source H can be effectively cooled.

The invention does not limit the types of the heat absorption unit 4 and the heat dissipation unit 5, and does not limit the circulating direction of the non-conductive liquid; that is, the heated non-conductive liquid may flow through the pump P and then be guided to the heat dissipation unit 5 (clockwise circulation as shown in fig. 7), or reversely circulate, so that the cooled non-conductive liquid flows through the pump P and then is guided to the heat absorption unit 4.

Referring to fig. 4 and 7, according to the above structure, when the liquid-cooled heat dissipation system with the pump P of the present embodiment operates, the heat energy can be absorbed by the non-conductive liquid at the heat absorption unit 4, so as to raise the temperature of the non-conductive liquid. When the pump P is operated, the liquid flow space S can be made to form a negative pressure by discharging the non-conductive liquid originally in the liquid flow space S, so as to introduce the high-temperature non-conductive liquid from the heat absorbing unit 4; the high-temperature non-conductive liquid flows into the liquid injection port 24 of the outer cover 2, flows into the fan frame 31 through the liquid inlet 315 of the guide fan 3, is pressurized by the impeller 33, flows out of the liquid outlet 316 of the guide fan 3, and finally leaves the liquid flow space S through the liquid outlet 25 of the outer cover 2 and is guided to the heat dissipation unit 5. The high-temperature non-conductive liquid can be cooled when passing through the heat dissipation unit 5, and is guided to the heat absorption unit 4 again after being cooled; the circulation is continued, so that the heat source H at the heat absorption unit 4 can be effectively cooled.

Referring to fig. 8, which shows a second embodiment of the pump P of the present invention, the circuit board 1 may have a positioning slot 16, the positioning slot 16 faces the top plate 21 of the housing 2, and the axial connection portion 312 may be located in the positioning slot 16, so that the axial connection portion 312 may protrude from the inner side 101 of the circuit board 1, which may further help to reduce the axial height of the fan 3. When the shaft connection portion 312 is combined with the circuit board 1, if the upper copper layer 1b is distributed around the shaft connection portion 312, the shaft connection portion 312 may be combined with the circuit board 1 by solder bonding, adhesion or tight fitting; if the upper copper layer 1b is not disposed around the shaft connection portion 312, the shaft connection portion 312 may be bonded or tightly fitted to the circuit board 1, and preferably, the shaft connection portion 312 may be bonded to the upper copper layer 1b or the lower copper layer 1c of the circuit board 1 by solder bonding, so as to improve the bonding tightness. In addition, the driving circuit 323 is located on the circuit board 1, the driving circuit 323 can also be formed by the upper copper layer 1b, the driving circuit 323 can be electrically connected to the stator coil set 322, and the stator coil set 322 is electrically connected to the internal circuit 11 of the circuit board 1, so that the driving component 32 can be electrically connected to the internal circuit 11, thereby providing another configuration, the circuit board 1 can also be used as a wiring board 321 (labeled in fig. 5) of the driving component 32, and has the functions of both the circuit board 1 and the driving circuit 323.

Referring to fig. 9, which shows a third embodiment of the pump P of the present invention, the circuit unit L is only located on the inner side 101 of the circuit board 1, i.e., the insulating substrate 1a can be connected with only the upper copper layer 1b, and the internal circuit 11 of the circuit unit L can be located on the upper copper layer 1 b. In detail, the first ends 131 of the plurality of through holes 13 may be electrically connected using conductive materials such as conductive wires, sockets, or pins; in this embodiment, it is described that the wire W is electrically connected to the first ends 131 of the through holes 13, the wire W can be electrically connected to the first connecting hole 111 of the internal circuit 11, and the internal circuit 11 can be electrically connected to the electrical port portion 324 of the driving component 32 through the conductive member 15, so that the internal circuit 11 can be electrically connected to the electrical port portion 324, and the driving component 32 is electrically connected to the internal circuit 11; in the present embodiment, the conductive member 15 is illustrated as a conductive elastic sheet, but in other embodiments, the conductive member 15 may also be a conductive wire, a conductive pin or a socket to electrically connect the driving component 32 and the internal circuit 11, which is not limited by the invention. Then, the conducting wire W is passed through the second ends 132 of the through holes 13 and then connected to the external power source or the control signal. Thus, the circuit unit L can have only the internal circuit 11 on the inner side 101 of the circuit board 1, which can further reduce the manufacturing cost.

Referring to fig. 10, which shows a fourth embodiment of the pump P of the present invention, the circuit unit L is only located on the outer side 102 of the circuit board 1, i.e., the insulating substrate 1a can be connected to only the lower copper layer 1c, the external circuit 12 of the circuit unit L can be located on the lower copper layer 1c, and a connector R is used to electrically connect the driving assembly 32 and the external circuit 12. In detail, the electrical connector R may be a conductive material such as a conductive wire, a socket or a wiping pin, and in this embodiment, the electrical connector R is illustrated as a conductive wire. The electrical connector R can be electrically connected to the electrical port 324 of the driving component 32, and after passing through the outlet channel 317 of the fan frame 31 and the through hole 13, electrically connected to the second ends 132 of the through holes 13, so that the electrical connector R can be electrically connected to the second connection holes 121 of the external circuit 12, and the driving component 32 can be electrically connected to the external circuit 12; thus, the wire W is electrically connected to the external circuit 12 of the circuit unit L, so that the wire W can be connected to the external power source or the control signal, and in other embodiments, a plurality of contact ports 12a (shown in fig. 3) of the external circuit 12 can be in a gold finger shape and directly electrically connected to the external power source or the control signal. Thus, the circuit unit L can only have the external circuit 12 located on the outer side 102 of the circuit board 1, which can further reduce the manufacturing cost.

Referring to fig. 11, which shows a fifth embodiment of the pump P of the present invention, the plurality of contact ports 12a of the external circuit 12 may be located at corners N of the circuit board 1, or may be located at the peripheral edge of the circuit board 1; in the present embodiment, a plurality of contact ports 12a are respectively located at four corners of the circuit board 1; therefore, the plurality of contact ports can be used as welding points for welding combination, and the convenience of manufacturing and assembling can be improved.

In summary, the pump and the liquid cooling heat dissipation system thereof of the present invention can be applied to various liquid cooling heat dissipation systems with pressure requirements, and each through hole of the circuit board is sealed by a conductive material, and the circuit unit is electrically connected to the conductive material, so that the driving component can receive external power without forming a wire outlet on the housing, thereby preventing the occurrence of leakage of the non-conductive liquid in the liquid flow space, and having the effects of reducing the manufacturing cost and improving the overall driving efficiency.