Tire gauge part manufacturing process

文档序号:871 发布日期:2021-09-17 浏览:40次 中文

1. A manufacturing process of tire gauge parts is characterized in that the tire gauge parts are manufactured by a mechanical processing method, and after grinding, cleaning, oil removing and rust removing are carried out on the surfaces of grooves of the tire gauge parts, fine grinding, polishing, ultrasonic cleaning and drying are carried out; cutting the indium composite microcrystal convex point texture layer into a round shape with the force not more than 10N, wherein the diameter of the round shape is 1-2 mm smaller than that of the groove of the part, and spreading the round indium composite microcrystal convex point texture layer on the bottom surface of the inner circle of the groove of the part smoothly and uniformly without wrinkles by the force not more than 1N; cutting the indium composite microcrystal convex point texture layer into a rectangle by using a force not more than 10N, wherein the length of the rectangle is 0.5-1 mm smaller than the circumferential length of a groove of a part, and the width of the rectangle is 2-3 mm smaller than the depth of the groove of the part, the rectangular indium composite microcrystal convex point texture layer is flatly and uniformly spread on the inner circle side surface of the groove of the part without wrinkles by using a force not more than 1N, no overlapped layer exists, glue is applied to the upper part of the indium composite microcrystal convex point texture layer, the glue amount of each part is less than 1mg, and the glue is fixed at the position of 3-8 parts; the indium composite microcrystal bump structure layer is a composite material layer containing more than 60 percent (Wt%) of indium, more than 8 percent (Wt%) of iron and more than 70 percent (Wt%) of indium and iron, a plurality of bump microcrystals are arranged on the surface of the composite material layer, the height of each bump microcrystal is more than 100nm and less than 500 mu m, the top of each bump microcrystal, which is more than 100nm and less than 500 mu m, is spherical or approximately spherical, the content of indium is more than 60 percent (Wt%) and the content of iron is more than 8 percent (Wt%) and the content of indium and iron is more than 70 percent (Wt%), and the bump microcrystals and the composite material layer are integrated; in the process of assembling the indium composite microcrystal convex point texture layer, the convex point microcrystal faces the groove; and removing the indium composite microcrystal convex point texture layer attached to each small hole to manufacture the tire pressure gauge part.

2. The tire gauge part manufacturing process according to claim 1, wherein the shape and size of the bump crystallites are variable.

Background

A surface acoustic wave is an elastic wave that propagates along a solid surface, with energy concentrated primarily in one to two wavelength ranges below the solid surface. Under the same frequency, the wavelength of the surface acoustic wave is only one hundred thousand of that of the electromagnetic wave, so that the surface acoustic wave device is more beneficial to miniaturization design. The surface acoustic wave device is an elastic wave propagating on the surface of a piezoelectric material and does not involve the migration of electrons inside the material. Therefore, the surface acoustic wave device is not easily subjected to electromagnetic interference. The wireless and passive characteristics of the tire pressure sensor can overcome the defect that the existing direct tire pressure sensor needs a battery, and has unique application trend under extreme severe environments such as inflammable and explosive environments and the like. The tire pressure meter based on the surface acoustic wave technology is widely applied to the field of industrial transport vehicles, so that the safety of drivers and technicians can be improved, and the vehicle downtime can be reduced; when the tire pressure control device is applied to racing cars, the safety of racing drivers is improved, the tire pressure is accurately controlled, the rolling resistance is reduced, and the running performance of the racing cars is optimized.

The surface acoustic wave device of the tire pressure meter is easy to generate heat effect and fretting fatigue in a long-term working process. On the surface of a part contacted with the surface acoustic wave device, if the surface acoustic wave device has the advantages of reducing the heat effect and the fretting fatigue, the working reliability of the surface acoustic wave device and the tire pressure meter can be greatly improved.

According to the results of literature search and patent search, at present, no relevant literature report exists in China that an indium composite microcrystalline bump texture layer containing more than 60 percent (Wt%) of indium and more than 70 percent (Wt%) of indium and iron is applied to a relevant manufacturing process for manufacturing tire pressure gauge parts.

Disclosure of Invention

The invention provides a tire gauge part manufacturing process which is realized by the following technical scheme that the tire gauge part manufacturing process comprises the steps of manufacturing the tire gauge part by a mechanical processing method, grinding, cleaning, deoiling and derusting the surfaces of grooves of the tire gauge part, and then carrying out fine grinding, polishing, ultrasonic cleaning and drying; cutting the indium composite microcrystal convex point texture layer into a round shape with the force not more than 10N, wherein the diameter of the round shape is 1-2 mm smaller than that of the groove of the part, and spreading the round indium composite microcrystal convex point texture layer on the bottom surface of the inner circle of the groove of the part smoothly and uniformly without wrinkles by the force not more than 1N; cutting the indium composite microcrystal convex point texture layer into a rectangle by using a force not more than 10N, wherein the length of the rectangle is 0.5-1 mm smaller than the circumferential length of a groove of a part, and the width of the rectangle is 2-3 mm smaller than the depth of the groove of the part, the rectangular indium composite microcrystal convex point texture layer is flatly and uniformly spread on the inner circle side surface of the groove of the part without wrinkles by using a force not more than 1N, no overlapped layer exists, glue is applied to the upper part of the indium composite microcrystal convex point texture layer, the glue amount of each part is less than 1mg, and the glue is fixed at the position of 3-8 parts; the indium composite microcrystal bump structure layer is a composite material layer containing more than 60 percent (Wt%) of indium, more than 8 percent (Wt%) of iron and more than 70 percent (Wt%) of indium and iron, a plurality of bump microcrystals are arranged on the surface of the composite material layer, the height of each bump microcrystal is more than 100nm and less than 500 mu m, the top of each bump microcrystal, which is more than 100nm and less than 500 mu m, is spherical or approximately spherical, the content of indium is more than 60 percent (Wt%) and the content of iron is more than 8 percent (Wt%) and the content of indium and iron is more than 70 percent (Wt%), and the bump microcrystals and the composite material layer are integrated; in the process of assembling the indium composite microcrystal convex point texture layer, the convex point microcrystal faces the groove; and removing the indium composite microcrystal convex point texture layer attached to each small hole to prepare the tire pressure meter part.

The shape and size of the bump crystallites may vary.

The inventor of the invention has found through intensive research for many years that the surface acoustic wave device of the tire gauge based on the surface acoustic wave technology is easy to generate heat effect and fretting fatigue in the long-term working process. On the part surface that the surface acoustic wave device contacted, form indium iron bump compound micrite, have fabulous thermal conductivity and have mechanical properties such as better elastoplasticity, it can reduce the heat effect and reduce the fretting fatigue to have simultaneously, can greatly promote the operational reliability of surface acoustic wave device, promote the reliability of surface acoustic wave device and tire gauge, consequently, research can reduce the heat effect and reduce the tire gauge part manufacturing process of fretting fatigue, it has important using value and practical meaning to promote the tire gauge development based on the surface acoustic wave technique.

Compared with the prior art, the related technology of the tire pressure gauge part manufacturing process is greatly improved: the patent of "CN 102918182A (published as 20130206)", "indium-iron composite spherical microcrystal composite layer (ZL 201410481181.4)", "indium-iron composite spherical microcrystal composite layer surface texture (ZL 201410481180.2)", "indium-iron reticular spherical composite microcrystal composite layer (ZL 201410481176.3)", and "indium-iron reticular spherical composite microcrystal composite layer surface texture (ZL 201410481178.2)", the composition components are obviously different, and the corresponding crystal property arrangement techniques are also obviously different. The granted patents of 'chip packaging structure and assembly method thereof' (CN 112820703A) ',' preparation method of chip packaging structure and chip packaging structure '(CN 202110407132.6)', 'focal plane array detector and preparation method thereof (CN 201711240437.2)', and 'resetting method of indium salient points of reading circuit of infrared detector (CN 201911142900.9)', are obviously different from the components of the indium-iron composite salient point microcrystal of the invention, the components of the microcrystal are obviously different, and the composition, structure and performance of the microcrystal are obviously different. Granted patents, "an indium bump device structure and its preparation method (CN 201610316689.8)", "an indium bump-based fluxless reflow process method (CN 201010515444.0)", and "an infrared detector readout circuit indium bump preparation method (CN 201910929868.2)", the microcrystal of the above 3 technologies contains no iron, and is obviously different from the components of the present invention, the microcrystal components are obviously different, and the microcrystal composition, structure and performance are obviously different. The influence of texture on the shear strength of indium bumps [ J ] is reported in the study of infrared and millimeter waves, 2004,23 (3): 225 + 228 "," LIUYU-Dong, ZHANG Gang, ZHUJi-Man, et al, Microstruture study of magnetic-sputtered index using EBSP method [ J ]. Rare Metal (Liu Dong, Zhang Steel, Zhu Chun, etc.. EBSP tissue study on magnetron sputtering site. Rare metals), 2002, 18(4): 226-229. "," Liu Dong, Jian Gu, Ma Ju Sheng. substrate influence study on indium bump texture [ J ] Rare Metal materials and engineering, 2003,32 (8): 596-. Therefore, the related art of the present invention has a significant improvement.

The invention relates to a tire gauge part manufacturing process, which is developed for effectively reducing the heat effect of a surface acoustic wave device of a tire gauge and reducing fretting fatigue.

The invention has the advantages of excellent heat radiation performance, capability of effectively reducing the thermal stress of the surface acoustic wave device and the tire pressure meter, improvement on the reliability of the surface acoustic wave device and the tire pressure meter, capability of effectively reducing the fretting fatigue and fretting wear of the surface acoustic wave device and the tire pressure meter, convenient use, simple structure, strong applicability, proper application cost and suitability for batch production.

Drawings

Fig. 1 is a schematic structural diagram of a tire gauge part manufacturing process according to embodiment 1 of the present invention.

Fig. 2 is a scanning electron microscope photograph of an indium composite microcrystalline bump texture layer of a tire gauge part manufacturing process sample according to embodiment 1 of the present invention.

In the attached figure, a 1-part, a 2-indium composite microcrystal convex point texture layer, a 3-indium composite microcrystal convex point texture layer,

4-coating with glue.

Detailed Description

The invention will be further explained with reference to the drawings.

Example 1

Fig. 1 is a schematic structural diagram of a tire gauge component in embodiment 1 of the present invention, and fig. 2 is a scanning electron microscope photograph of an indium composite microcrystalline bump textured layer in embodiment 1 of the present invention; in the attached drawing, 1 is a part, 2 is an indium composite microcrystal convex point texture layer, 3 is an indium composite microcrystal convex point texture layer, and 4 is coated with glue.

The manufacturing process of the tire gauge part is characterized in that: manufacturing parts by a mechanical processing method, and after grinding, cleaning, deoiling and derusting are carried out on the surfaces of the grooves of the tire pressure gauge parts, fine grinding, polishing, ultrasonic cleaning and drying are carried out; cutting the indium composite microcrystal convex point texture layer into a round shape with the force not more than 10N, wherein the diameter of the round shape is 1-2 mm smaller than that of the groove of the part, and spreading the round indium composite microcrystal convex point texture layer on the bottom surface of the inner circle of the groove of the part smoothly and uniformly without wrinkles by the force not more than 1N; cutting the indium composite microcrystal convex point texture layer into a rectangle by using a force not more than 10N, wherein the length of the rectangle is 0.5-1 mm smaller than the circumferential length of a groove of a part, and the width of the rectangle is 2-3 mm smaller than the depth of the groove of the part, the rectangular indium composite microcrystal convex point texture layer is flatly and uniformly spread on the inner circle side surface of the groove of the part without wrinkles by using a force not more than 1N, no overlapped layer exists, glue is applied to the upper part of the indium composite microcrystal convex point texture layer, the glue amount of each part is less than 1mg, and the glue is fixed at the position of 3-8 parts; the indium composite microcrystal bump structure layer is a composite material layer containing more than 60 percent (Wt%) of indium, more than 8 percent (Wt%) of iron and more than 70 percent (Wt%) of indium and iron, a plurality of bump microcrystals are arranged on the surface of the composite material layer, the height of each bump microcrystal is more than 100nm and less than 500 mu m, the top of each bump microcrystal, which is more than 100nm and less than 500 mu m, is spherical or approximately spherical, the content of indium is more than 60 percent (Wt%) and the content of iron is more than 8 percent (Wt%) and the content of indium and iron is more than 70 percent (Wt%), and the bump microcrystals and the composite material layer are integrated; in the process of assembling the indium composite microcrystal convex point texture layer, the convex point microcrystal faces the groove; and removing the indium composite microcrystal convex point texture layer attached to each small hole to prepare the tire pressure meter part.

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