1. A PID sensor SOC chip is characterized by comprising a driving circuit, a wireless transmission air interface, an MCU processor, a power management unit and a terminal which are arranged in an integrated mode, wherein the driving circuit, the wireless transmission air interface, the power management unit and the terminal are all connected to the MCU processor;

the driving circuit comprises an MCU processor, a driving circuit and an integrated amplifier, a digital-to-analog converter, an analog-to-digital converter, a physical layer interface and an adapter, wherein the adapter is connected to the MCU processor through the physical layer interface;

the terminal comprises a vacuum ultraviolet lamp bead, an excitation polar plate, a collection polar plate, a renewable energy interface and a rechargeable battery, the driving circuit comprises a lamp bead driving circuit and a polar plate driving circuit, the vacuum ultraviolet lamp bead is connected with the lamp bead driving circuit, and the excitation polar plate and the collection polar plate are connected with the polar plate driving circuit;

the method also comprises the working steps of the SOC chip of the PID sensor: firstly, a vacuum ultraviolet lamp bead is used for emitting vacuum ultraviolet light with photon energy larger than 10.6eV under the excitation of an alternating current or direct current electric field, the vacuum ultraviolet light irradiates air containing VOCs, so that VOCs molecules are ionized, charged ions are absorbed by an excitation polar plate and a bipolar plate of a collecting polar plate under the action of the direct current electric field, the potential on the polar plate is changed and current flows out, an amplifier is used for converting signals into larger electric signals, a high-precision analog-to-digital converter is used for converting analog signals into digital signals, the VOCs content of the signals is converted into positive correlation potential or current signals, and the positive correlation potential or current signals are converted into time-series digital signals; the digital signals of the time sequence are transmitted to the microprocessor, the processor processes the data, and the processed data are packaged and transmitted out through a wireless transmission air interface.

2. The PID sensor SOC chip of claim 1, wherein: and the lamp bead driving circuit and the polar plate driving circuit of the driving circuit are both electrically connected to the MCU processor.

3. The PID sensor SOC chip of claim 1, wherein: the MCU processor is set as a low-power-consumption microprocessor, and the processing process of the MCU processor on the digital signals of the time sequence comprises storage and filtering.

4. The PID sensor SOC chip of claim 1, wherein: the communication interface of the wireless transmission air interface is set as a low-power-consumption wide area network wireless communication baseband, a radio frequency transceiver and a corresponding antenna in the chip, the microprocessor transmits data to the gateway through the wireless communication interface, and the gateway transmits the data to the server according to an internet protocol.

5. The PID sensor SOC chip of claim 1, wherein: the renewable energy source power supply and the rechargeable battery are electrically connected to the power supply management unit, and the renewable energy source interface is electrically connected to the rechargeable battery.

6. The PID sensor SOC chip of claim 5, wherein: the power management unit is used for performing voltage conversion on an off-chip renewable energy power source or a traditional power source, converting the voltage into a voltage for normal operation of an internal circuit, and supplying the voltage to each unit.

7. The PID sensor SOC chip of claim 6, wherein: the renewable energy source interface charges the rechargeable battery, and the rechargeable battery is used for ensuring continuous and uninterrupted operation of the terminal equipment.

8. The PID sensor SOC chip of claim 1, wherein: the design mode of the PID sensor SOC chip adopts a SiP packaging mode to design the chip.

Background

VOC (volatile organic compounds) monitoring has an important role in atmospheric environment monitoring again, the pollution of toxic VOC of some production occasions can cause serious injury to human bodies, the VOC content is an important index for air quality assessment, especially under the current situation that current ozone pollutes seriously, the significance of controlling VOCs to ozone treatment is outstanding, the traditional large-scale detection machine is expensive, the arrangement is not flexible enough, and the data collection is not convenient enough. The PID (photo-ion gas sensor) has the advantages of high precision and low cost in VOCs measurement; the PID sensor on the market only outputs VOC total amount monitoring signals in the air to the outside of the sensor in an analog signal mode, and the sensor cannot complete the functions of signal processing, signal digital conversion, wireless communication and the like, and the design thought of the PID sensor still stays in the 20 th century for 60 years.

The basic principle of the PID sensor is that vacuum ultraviolet light with photon energy larger than 10.6eV is emitted by a vacuum ultraviolet lamp bead under the excitation of an alternating current or direct current electric field and is irradiated into air containing VOCs, so that VOCs molecules are ionized, charged ions are absorbed by a bipolar plate under the action of the direct current electric field, the potential on the polar plate is changed and current flows out, the signal is converted into a larger electric signal by using a small signal amplification technology in a circuit technology, the conversion from an analog signal to a digital signal is carried out on a high-precision ADC (analog to digital converter), the VOCs content of the signal is converted into a positive correlation potential or current signal, and the positive correlation potential or current signal is converted into a time-series digital signal. This signal is transmitted to a microprocessor which stores, filters, etc. the data. And then the processed data is packaged and transmitted out through a communication interface.

The PID is a photoion gas sensor, and with the development of integrated circuits and the rapid advance of the national integrated circuit technology in these years, the national has the capability of designing the core circuit of the PID sensor into a powerful SOC; however, in the prior art, circuits of the system SOC part are all functionally discrete, and discrete devices are required for system construction. Some devices even need to cooperate, so that the system design is complex, the supply chain is too long, and the miniaturization of the terminal device is not facilitated, so that the problem existing in the prior art is solved by providing the PID sensor SOC chip.

Disclosure of Invention

The present invention is directed to a PID sensor SOC chip to solve the above problems in the prior art.

In order to achieve the purpose, the invention adopts the following technical scheme: a PID sensor SOC chip comprises a drive circuit, a wireless transmission air interface, an MCU processor, a power management unit and a terminal which are arranged in an integrated mode, wherein the drive circuit, the wireless transmission air interface, the power management unit and the terminal are all connected to the MCU processor;

the driving circuit comprises an MCU processor, a driving circuit and an integrated amplifier, a digital-to-analog converter, an analog-to-digital converter, a physical layer interface and an adapter, wherein the adapter is connected to the MCU processor through the physical layer interface;

the terminal comprises a vacuum ultraviolet lamp bead, an excitation polar plate, a collection polar plate, a renewable energy interface and a rechargeable battery, the driving circuit comprises a lamp bead driving circuit and a polar plate driving circuit, the vacuum ultraviolet lamp bead is connected with the lamp bead driving circuit, and the excitation polar plate and the collection polar plate are connected with the polar plate driving circuit;

the method also comprises the working steps of the SOC chip of the PID sensor: firstly, a vacuum ultraviolet lamp bead is used for emitting vacuum ultraviolet light with photon energy larger than 10.6eV under the excitation of an alternating current or direct current electric field, the vacuum ultraviolet light irradiates air containing VOCs, so that VOCs molecules are ionized, charged ions are absorbed by an excitation polar plate and a bipolar plate of a collecting polar plate under the action of the direct current electric field, the potential on the polar plate is changed and current flows out, an amplifier is used for converting signals into larger electric signals, a high-precision analog-to-digital converter is used for converting analog signals into digital signals, the VOCs content of the signals is converted into positive correlation potential or current signals, and the positive correlation potential or current signals are converted into time-series digital signals; the digital signals of the time sequence are transmitted to the microprocessor, the processor processes the data, and the processed data are packaged and transmitted out through a wireless transmission air interface.

Preferably, the lamp bead driving circuit and the polar plate driving circuit of the driving circuit are both electrically connected to the MCU processor.

Preferably, the MCU processor is a low power consumption microprocessor, and the processing of the digital signals of the time series by the MCU processor includes storing and filtering.

Preferably, the communication interface of the wireless transmission air interface is set as a low-power consumption wide area network wireless communication baseband, a radio frequency transceiver and a corresponding antenna in the chip, the microprocessor transmits data to the gateway through the wireless communication interface, and the gateway transmits the data to the server according to an internet protocol.

Preferably, the renewable energy source and the rechargeable battery are electrically connected to the power management unit, and the renewable energy source interface is electrically connected to the rechargeable battery.

Preferably, the power management unit is configured to perform voltage conversion on an off-chip renewable energy power source or a conventional power source, convert the voltage into a voltage at which an internal circuit normally operates, and supply the voltage to each unit.

Preferably, the energy collected by the renewable energy interface comprises wind energy, solar energy, geothermal energy and hydroenergy, the renewable energy interface charges a rechargeable battery, and the rechargeable battery is used for ensuring continuous and uninterrupted operation of the terminal equipment.

Preferably, the design mode of the PID sensor SOC chip is a SiP package mode for chip design.

The invention has the technical effects and advantages that: compared with the prior art, the SOC chip of the PID sensor provided by the invention has the following advantages:

1. the integrated level is high, can compress VOCs on-line monitoring's supply chain, simplifies terminal equipment's design to only needing a chip to add lamp pearl, structure, antenna, battery to and renewable energy equipment. The circuits of the conventional system SOC part are all discrete in function, discrete devices are needed for system construction, and some devices even need different equipment for cooperation, so that the system design is complex and the supply chain is too long;

2. the miniaturization of the terminal equipment is facilitated;

3. at present, no sensor integrates a low-power wireless transmission air interface unit in precedent. The patent provides a direct wireless transmission mode, which can support the world that VOCs are monitored on line and connected with everything in the future;

4. the SOC design has cost advantages and great advantages in online monitoring of large numbers of arrangements of VOCs, and the patent is not limited to the limitation of the microsystems described in the patent to SOC chips on single process and single crystal silicon substrates, including but not limited to single packaged chips designed using SiP packaging technology, chiplet, etc.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

FIG. 1 is a schematic block diagram of a PID sensor SOC chip of the invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The specific embodiments described herein are merely illustrative of the invention and do not delimit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The present invention provides an embodiment as shown in fig. 1:

a PID sensor SOC chip comprises a drive circuit, a wireless transmission air interface, an MCU processor, a power management unit and a terminal which are arranged in an integrated mode, wherein the drive circuit, the wireless transmission air interface, the power management unit and the terminal are all connected to the MCU processor;

the driving circuit comprises an MCU processor, a driving circuit and an integrated amplifier, a digital-to-analog converter, an analog-to-digital converter, a physical layer interface and an adapter, wherein the adapter is connected to the MCU processor through the physical layer interface;

the terminal comprises a vacuum ultraviolet lamp bead, an excitation polar plate, a collection polar plate, a renewable energy interface and a rechargeable battery, the driving circuit comprises a lamp bead driving circuit and a polar plate driving circuit, the vacuum ultraviolet lamp bead is connected with the lamp bead driving circuit, and the excitation polar plate and the collection polar plate are connected with the polar plate driving circuit;

the method also comprises the working steps of the SOC chip of the PID sensor: firstly, a vacuum ultraviolet lamp bead is used for emitting vacuum ultraviolet light with photon energy larger than 10.6eV under the excitation of an alternating current or direct current electric field, the vacuum ultraviolet light irradiates air containing VOCs, so that VOCs molecules are ionized, charged ions are absorbed by an excitation polar plate and a bipolar plate of a collecting polar plate under the action of the direct current electric field, the potential on the polar plate is changed and current flows out, an amplifier is used for converting signals into larger electric signals, a high-precision analog-to-digital converter is used for converting analog signals into digital signals, the VOCs content of the signals is converted into positive correlation potential or current signals, and the positive correlation potential or current signals are converted into time-series digital signals; the digital signals of the time sequence are transmitted to the microprocessor, the processor processes the data, and the processed data are packaged and transmitted out through a wireless transmission air interface.

The communication interface is a low-power consumption wide area network wireless communication baseband and radio frequency transceiver inside the chip and a corresponding antenna. The microprocessor transmits the data to the gateway via the wireless communication interface, and the gateway transmits the data to the server according to the internet protocol.

The lamp bead driving circuit and the polar plate driving circuit of the driving circuit are both electrically connected to the MCU processor; the MCU processor is set as a low-power-consumption microprocessor, and the processing process of the MCU processor on the digital signals of the time sequence comprises storage and filtering.

The communication interface of the wireless transmission air interface is set as a low-power-consumption wide area network wireless communication baseband, a radio frequency transceiver and a corresponding antenna in the chip, the microprocessor transmits data to the gateway through the wireless communication interface, and the gateway transmits the data to the server according to an internet protocol.

The renewable energy source power supply and the rechargeable battery are electrically connected to the power supply management unit, and the renewable energy source interface is electrically connected to the rechargeable battery; the power supply management unit is used for performing voltage conversion on an off-chip renewable energy power supply or a traditional power supply, converting the voltage into a voltage for normal operation of an internal circuit, and supplying the voltage to each unit; the renewable energy source interface charges the rechargeable battery, and the rechargeable battery is used for ensuring continuous and uninterrupted operation of the terminal equipment.

In order to miniaturize the whole VOCs collecting terminal, renewable energy sources and rechargeable batteries are particularly introduced, so that the terminal can also collect natural energy such as wind energy, solar energy, geothermal energy, hydroenergy and other energy sources in the field without a power supply completely, the rechargeable batteries are charged, and the batteries can ensure that terminal equipment can work continuously.

The design mode of the SOC chip of the PID sensor adopts a SiP packaging mode to design the chip; the chip is a complete signal chip. Besides the acquisition, processing and transmission of signals, the vacuum ultraviolet lamp driving circuit and the potential pre-charging DAC of the signal acquisition polar plate are also provided. The SOC chip of this patent has still integrateed the power management unit for carry out voltage conversion to off-chip renewable energy power or traditional power supply, convert the voltage that the internal circuit normally worked into, supply each unit respectively.

In summary, the invention provides the SOC/SiP chip design of the integrated lamp bead driving circuit, the polar plate driving circuit, the ADC, the DAC, the microprocessor, the memory, the wireless transmission baseband, the wireless transmission radio frequency transceiver, and the power management unit for the first time; the VOCs sensor scheme of lamp beads, pole plates, a power supply, an antenna, a battery and a single chip is provided for the first time.

The SOC chip of the PID sensor disclosed by the invention has high integration level, can compress a supply chain for VOCs on-line monitoring, and simplifies the design of terminal equipment to only need one chip and lamp beads, a structure, an antenna, a battery and renewable energy equipment. In the prior art, circuits of the system SOC part are all discrete in function, and discrete devices are needed for system construction. Some devices even need to cooperate with each other, so that the system design is complex and the supply chain is too long;

the miniaturization of the terminal equipment is facilitated; at present, no sensor integrates a low-power wireless transmission air interface unit in precedent. The patent provides a direct wireless transmission mode, which can support the world that VOCs are monitored on line and connected with everything in the future; the SOC design has cost advantages and great advantages in online monitoring of large numbers of arrangements of VOCs, and the patent is not limited to the limitation of the microsystems described in the patent to SOC chips on single process and single crystal silicon substrates, including but not limited to single packaged chips designed using SiP packaging technology, chiplet, etc.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.