1. A subminiature chip rectifier device comprising an outer casing (10), characterized in that: a production cavity (15) is arranged in the outer shell (10), a sliding cavity (11) is arranged on the lower side of the production cavity (15), a fixing plate (12) is fixedly arranged between the sliding cavity (11) and the production cavity (15), the opening of the production cavity (15) faces outwards, and an extension cavity (46) is communicated and arranged in the end wall of the production cavity (15) far away from the opening of the production cavity (15);

the extension chamber (46) slidable mounting is equipped with butt piece (13), slidable mounting is equipped with movable block (16) in production chamber (15) upper end wall, the terminal surface sets firmly in movable block (16) lower extreme face and connects cylinder (17), it is located to connect cylinder (17) lower extreme set firmly connecting block (20) of movable block (16) downside, be equipped with opening chamber (21) of depositing downwards in connecting block (20) lower extreme face, deposit chamber (21) end wall in symmetry be equipped with two with deposit draw-in groove (37) of chamber (21) intercommunication, slidable mounting is equipped with fixture block (23) in draw-in groove (37), slidable mounting is equipped with in slide chamber (11) lower extreme wall and links up piece (24).

2. The subminiature chip rectifier device of claim 1, wherein: it is equipped with opening up opening chamber (25) in piece (24) up end to link up, slidable mounting is equipped with in opening chamber (25) and promotes piece (27), end wall internal fixation has slave cylinder (26) under opening chamber (25), slave cylinder (26) upper end with promote terminal surface fixed connection under piece (27), it has four edges to set firmly to promote piece (27) up end promote driven tool bit (40) that piece (27) central line array set up, driven tool bit (40) can cut the wafer.

3. The subminiature chip rectifier device of claim 1, wherein: the fixture block (23) is far away from the end face of one side of the central line of the storage cavity (21) and the clamping groove (37) is far away from the end wall of one side of the central line of the storage cavity (21), the end wall is fixedly connected through a return spring (38), and the fixture block (23) is extended to the lower end face of one end in the storage cavity (21) and is an inclined plane.

4. The subminiature chip rectifier device of claim 1, wherein: deposit chamber (21) end wall internal stability and be equipped with basic block protection film (22), basic block protection film (22) protection gets into deposit the chip outer peripheral face in chamber (21) can not worn and torn, terminal surface has set firmly four edges under connecting block (20) initiative tool bit (39) that connecting block (20) central line array set up, initiative tool bit (39) can cut the wafer.

5. The subminiature chip rectifier device of claim 4, wherein: the production chamber (15) terminal surface in-connection is equipped with along production chamber (15) outside opening longitudinal symmetry's linking chamber (35), sliding installation is equipped with sliding plate (19) in linking chamber (35), linking chamber (35) end wall internal fixation has initiative cylinder (36), initiative cylinder (36) with sliding plate (19) power is connected, sliding plate (19) are close to the terminal surface internal fixation of extension chamber (46) one side has linking cylinder (18), the upside link up cylinder (18) and be close to extension chamber (46) one end with moving block (16) fixed connection, downside link up cylinder (18) and be close to extension chamber (46) one end with link up piece (24) fixed connection.

6. The subminiature chip rectifier device of claim 5, wherein: prolong chamber (46) and keep away from it is equipped with transmission chamber (31) to link up cylinder (18) one side, transmission chamber (31) are close to link up end wall internal fixation on cylinder (18) one side has motor (41), motor (41) are kept away from link up cylinder (18) one end power connection is equipped with driving shaft (42), motor (41) are close to power connection is equipped with control power supply (43) on the terminal surface of linking up cylinder (18) one side, control power supply (43) fixed mounting prolong chamber (46) with between transmission chamber (31).

7. The subminiature chip rectifier device of claim 6, wherein: the butt joint block (13) is far away from the end face of one side of the connecting cylinder (18) and the extension cavity (46) is far away from the end face of one side of the connecting cylinder (18), the butt joint block (13) is far away from the end face of one side of the connecting cylinder (18), and a trigger block (44) is fixedly arranged on the end face of one side of the connecting cylinder (18).

8. The subminiature chip rectifier device of claim 6, wherein: a rotating gear (29) fixedly arranged on the driving shaft (42) is arranged in the transmission cavity (31), the upper side and the lower side of the rotating gear (29) are symmetrically provided with moving racks (28) which are meshed and connected with the rotating gear (29), sliding cavities (30) are symmetrically arranged in the end walls at two sides of the production cavity (15), connecting plates (33) are arranged in the sliding cavities (30) in a sliding mode, the moving rack (28) is slidably mounted between the sliding cavity (30) and the transmission cavity (31), the connecting plate (33) is fixedly connected with the movable rack (28), a connecting plate (32) is arranged between the sliding cavity (30) and the production cavity (15) in a sliding way, the connection plate (32) is fixedly connected with the connection plate (33), and a clamping block (34) fixedly mounted on the connection plate (32) is arranged in the production cavity (15).

9. The subminiature chip rectifier device of claim 8, wherein: the butt joint block (13) with press from both sides tight piece (34) and be close to the protection piece that protection wafer piece set firmly in the terminal surface of extension chamber (46) central line one side prevents to cause great extrusion force to the wafer piece, butt joint block (13) with press from both sides tight piece (34) and be close to the terminal surface of production chamber (15) opening one side is the cambered surface with the same radian of wafer.

10. The subminiature chip rectifier device of claim 9, wherein: be equipped with in the terminal surface about fixed plate (12) and run through chamber (14) with the same size of wafer piece internal chip, be equipped with opening promotion chamber (47) up in promotion piece (27) upper end face, sliding installation is equipped with sliding block (80) in promotion chamber (47), promotion chamber (47) lower end wall internal fixation has promotion cylinder (48), promotion cylinder (48) upper end with sliding block (80) lower terminal surface fixed connection.

Background

The mode that the base block of the chip rectifier element is cut from the wafer at the present stage is laser cutting, cutter cutting and the like, the ultra-small chip rectifier element base block cannot be cut by the laser, and can only be stripped from the wafer block by a physical mode.

The present application describes a subminiature chip rectifier device production apparatus capable of solving the above-mentioned problems.

Disclosure of Invention

The invention provides a subminiature chip rectifier element production device for solving the technical problems, and solves the problems of low yield and low efficiency in wafer block cutting.

The above object of the present invention is achieved by the following technical solutions: a subminiature sheet type rectifier element production device comprises an outer shell, wherein a production cavity is arranged in the outer shell, a sliding cavity is arranged on the lower side of the production cavity, a fixing plate is fixedly arranged between the sliding cavity and the production cavity, the opening of the production cavity faces outwards, and an extension cavity is communicated and arranged in the end wall of the production cavity, which is far away from the opening of the production cavity;

the extension intracavity slidable mounting is equipped with the butt piece, slidable mounting is equipped with the movable block in the production chamber upper end wall, the terminal surface sets firmly the connection cylinder under the movable block, the connection cylinder lower extreme sets firmly to be located the connecting block of movable block downside, be equipped with the chamber of depositing that the opening is down in the connecting block lower extreme face, deposit the intracavity end wall in the symmetry be equipped with two with deposit the draw-in groove of chamber intercommunication, slidable mounting is equipped with the fixture block in the draw-in groove, slidable mounting is equipped with linking piece under the chamber.

Preferably, an opening cavity with an upward opening is formed in the upper end face of the connecting block, a pushing block is arranged in the opening cavity in a sliding installation mode, a driven cylinder is fixedly arranged in the lower end wall of the opening cavity, the upper end of the driven cylinder is fixedly connected with the lower end face of the pushing block, four edges are fixedly arranged on the upper end face of the pushing block, a driven tool bit is arranged on the central line of the pushing block, and the driven tool bit can cut wafers.

Preferably, the end face of the clamping block, which is far away from the side of the central line of the storage cavity, is fixedly connected with the end wall of the clamping groove, which is far away from the side of the central line of the storage cavity, through a return spring, and the lower end face of the clamping block, which extends to the end of the storage cavity, is an inclined plane.

Preferably, a base block protective film is fixedly arranged in the end wall of the storage cavity, the base block protective film protects the peripheral surface of the chip entering the storage cavity from being abraded, four driving tool bits arranged along the central line array of the connecting block are fixedly arranged on the lower end face of the connecting block, and the driving tool bits can cut the wafer.

Preferably, a linking cavity which is vertically symmetrical along the outward opening of the production cavity is arranged in the end face of the production cavity in a communicated manner, a sliding plate is arranged in the linking cavity in a sliding manner, a driving cylinder is fixedly arranged in the end wall of the linking cavity, the driving cylinder is in power connection with the sliding plate, a linking cylinder is fixedly arranged in the end face of the sliding plate, which is close to one side of the extension cavity, the linking cylinder on the upper side is close to one end of the extension cavity and is fixedly connected with the moving block, and the linking cylinder on the lower side is close to one end of the extension cavity and is fixedly connected with the linking block.

Preferably, the extension chamber is far away from linking cylinder one side and is equipped with the transmission chamber, the transmission chamber is close to the end wall internal fixation that links up cylinder one side has the motor, the motor is far away from linking cylinder one end power connection is equipped with the driving shaft, the motor is close to power connection is equipped with the control power supply on the terminal surface that links up cylinder one side, the control power supply fixed mounting be in the extension chamber with between the transmission chamber.

Preferably, the end face of the butt joint block, which is far away from one side of the joining cylinder, is fixedly connected with the end face of the extension cavity, which is far away from one side of the joining cylinder, through a compression spring, and the end face of the butt joint block, which is far away from one side of the joining cylinder, is fixedly provided with a trigger block.

Preferably, the transmission cavity is internally provided with a rotating gear fixedly mounted on the driving shaft, the rotating gear is symmetrically provided with moving racks meshed and connected with the rotating gear at the upper side and the lower side, the end walls at the two sides of the production cavity are symmetrically provided with sliding cavities, the sliding cavities are internally provided with connecting plates in a sliding manner, the moving racks are slidably mounted between the sliding cavities and the transmission cavity, the connecting plates are fixedly connected with the moving racks, the sliding cavities are slidably mounted between the production cavity and connecting plates, the connecting plates are fixedly connected with the connecting plates, and the production cavity is internally provided with clamping blocks fixedly mounted on the connecting plates.

Preferably, a protection block for protecting the wafer block is fixedly arranged in the end face of one side, close to the central line of the extension cavity, of the abutting block and the clamping block, so that large extrusion force on the wafer block is prevented, and the end face of one side, close to the opening of the production cavity, of the abutting block and the clamping block is an arc face with the same radian as the wafer.

Preferably, a through cavity with the same size as the chip in the wafer is arranged in the upper end face and the lower end face of the fixing plate, a pushing cavity with an upward opening is arranged in the upper end face of the pushing block, a sliding block is arranged in the pushing cavity in a sliding mode, a pushing cylinder is fixedly arranged in the lower end wall of the pushing cavity, and the upper end of the pushing cylinder is fixedly connected with the lower end face of the sliding block.

The invention has the beneficial effects that: the invention can improve the efficiency of cutting the subminiature chip type rectification base block from the wafer block, reduces the cutting depth through the simultaneous up-and-down cutting, and has smaller probability of generating cracks compared with the unidirectional cutting wafer block.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of the present invention;

3 FIG. 32 3 is 3 a 3 schematic 3 view 3 of 3 A 3- 3 A 3 of 3 FIG. 31 3 according 3 to 3 an 3 embodiment 3 of 3 the 3 present 3 invention 3; 3

FIG. 3 is a schematic view of B-B in FIG. 1 according to an embodiment of the present invention;

FIG. 4 is an enlarged schematic view of the structure at C in FIG. 1 according to an embodiment of the present invention;

fig. 5 is an enlarged schematic view of the structure at D in fig. 2 according to the embodiment of the present invention.

In the figure: 10-outer housing, 11-sliding chamber, 12-fixed plate, 13-abutment block, 14-through chamber, 15-production chamber, 16-moving block, 17-connecting cylinder, 18-engaging cylinder, 19-sliding plate, 20-connecting block, 21-storage chamber, 22-base block protective film, 23-clamping block, 24-engagement block, 25-opening chamber, 26-driven cylinder, 27-pushing block, 28-moving rack, 29-rotating gear, 30-sliding chamber, 31-transmission chamber, 32-engagement plate, 33-connecting plate, 34-clamping block, 35-engagement chamber, 36-driving cylinder, 37-clamping groove, 38-return spring, 39-driving bit, 40-driven bit, 41-motor, 42-driving shaft, 43-control power supply, 44-trigger block, 45-compression spring, 46-extension cavity, 47-pushing cavity, 48-pushing cylinder and 80-sliding block.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings. The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.

The invention relates to a microminiature sheet type rectifier element production device, which comprises an outer shell 10, wherein a production cavity 15 is arranged in the outer shell 10, a sliding cavity 11 is arranged at the lower side of the production cavity 15, a fixed plate 12 is fixedly arranged between the sliding cavity 11 and the production cavity 15, the opening of the production cavity 15 faces outwards, an extension cavity 46 is communicated and arranged in the end wall of the production cavity 15 far away from the opening side of the production cavity 15, a butting block 13 is arranged in the extension cavity 46 in a sliding manner, a moving block 16 is arranged in the upper end wall of the production cavity 15 in a sliding manner, a connecting cylinder 17 is fixedly arranged in the lower end face of the moving block 16, a connecting block 20 positioned at the lower side of the moving block 16 is fixedly arranged at the lower end of the connecting block 17, a storage cavity 21 with a downward opening is arranged in the lower end face of the connecting block 20, two clamping grooves 37 communicated with the storage cavity 21 are symmetrically arranged in the end wall of the storage cavity 21, a clamping block 23 is arranged in the clamping groove 37 in a sliding mode, and a connecting block 24 is arranged on the lower end wall of the sliding cavity 11 in a sliding mode.

Beneficially, an opening cavity 25 with an upward opening is formed in the upper end face of the joining block 24, a pushing block 27 is arranged in the opening cavity 25 in a sliding installation mode, a driven cylinder 26 is fixedly arranged in the lower end wall of the opening cavity 25, the upper end of the driven cylinder 26 is fixedly connected with the lower end face of the pushing block 27, so that the driven cylinder 26 can control the pushing block 27 to move up and down, four driven tool bits 40 arranged along the central line array of the pushing block 27 are fixedly arranged on the upper end face of the pushing block 27, and the driven tool bits 40 can cut wafers.

Advantageously, an end surface of the latch 23 on a side away from the center line of the storage cavity 21 and an end wall of the catch 37 on a side away from the center line of the storage cavity 21 are fixedly connected through a return spring 38, and a lower end surface of one end of the latch 23 extending into the storage cavity 21 is an inclined surface.

Beneficially, a base block protective film 22 is fixedly arranged in the end wall of the storage cavity 21, the base block protective film 22 protects the peripheral surface of the chip entering the storage cavity 21 from being abraded, four active cutter heads 39 arranged along the central line array of the connecting block 20 are fixedly arranged on the lower end surface of the connecting block 20, and the active cutter heads 39 can cut the wafer.

Advantageously, the end face of the production cavity 15 is internally and communicatively provided with an engagement cavity 35 which is vertically symmetrical along the outward opening of the production cavity 15, a sliding plate 19 is slidably installed in the engagement cavity 35, an active cylinder 36 is fixedly installed in the end wall of the engagement cavity 35, the active cylinder 36 is in power connection with the sliding plate 19, an engagement cylinder 18 is fixedly installed in the end face of the sliding plate 19 close to one side of the extension cavity 46, one end of the engagement cylinder 18 on the upper side close to the extension cavity 46 is fixedly connected with the moving block 16, and one end of the engagement cylinder 18 on the lower side close to the extension cavity 46 is fixedly connected with the engagement block 24, so that the engagement cylinder 18 can control the moving block 16 and the engagement block 24 to move.

Advantageously, a transmission cavity 31 is arranged on one side, away from the engaging cylinder 18, of the extension cavity 46, a motor 41 is fixedly arranged in an end wall of the transmission cavity 31, close to one side of the engaging cylinder 18, one end, away from the engaging cylinder 18, of the motor 41 is provided with a driving shaft 42 in a power connection mode, a control power supply 43 is arranged on an end face, close to one side of the engaging cylinder 18, of the motor 41 in a power connection mode, and the control power supply 43 is fixedly arranged between the extension cavity 46 and the transmission cavity 31.

Advantageously, the end surface of the abutting block 13 on the side away from the engaging cylinder 18 and the end surface of the extension cavity 46 on the side away from the engaging cylinder 18 are fixedly connected through a compression spring 45, and a trigger block 44 is fixedly arranged on the end surface of the abutting block 13 on the side away from the engaging cylinder 18, and when the trigger block 44 moves into the control power supply 43, the control power supply 43 can be controlled to start, so that the motor 41 is powered on and started.

Beneficially, a rotating gear 29 fixedly mounted on the driving shaft 42 is arranged in the transmission cavity 31, moving racks 28 meshed with the rotating gear 29 are symmetrically arranged on the upper side and the lower side of the rotating gear 29, sliding cavities 30 are symmetrically arranged in the end walls on the two sides of the production cavity 15, connecting plates 33 are slidably arranged in the sliding cavities 30, the moving racks 28 are slidably arranged between the sliding cavities 30 and the transmission cavity 31, the connecting plates 33 are fixedly connected with the moving racks 28, connecting plates 32 are slidably arranged between the sliding cavities 30 and the production cavity 15, the connecting plates 32 are fixedly connected with the connecting plates 33, clamping blocks 34 fixedly mounted on the connecting plates 32 are arranged in the production cavity 15,

beneficially, a protection block for protecting the wafer block is fixedly arranged in the end face of the abutting block 13 and the end face of the clamping block 34 close to the central line side of the extension cavity 46, so as to prevent the wafer block from being subjected to a large extrusion force, and the end face of the abutting block 13 and the end face of the clamping block 34 close to the opening side of the production cavity 15 are arc faces with the same radian as the wafer.

Beneficially, a through cavity 14 having the same size as that of a chip in a wafer is arranged in the upper and lower end faces of the fixing plate 12, a pushing cavity 47 with an upward opening is arranged in the upper end face of the pushing block 27, a sliding block 80 is slidably mounted in the pushing cavity 47, a pushing cylinder 48 is fixedly arranged in the lower end wall of the pushing cavity 47, and the upper end of the pushing cylinder 48 is fixedly connected with the lower end face of the sliding block 80.

The following will explain in detail the steps of using a subminiature chip type rectifier device in this document with reference to fig. 1 to 5:

when the work is started:

1. when a wafer plate to be cut is placed in the production chamber 15, when the wafer plate pushes the abutting block 13 to move to the side close to the rotating gear 29, the abutting block 13 moves to the side close to the rotating gear 29 so as to drive the trigger block 44 to be inserted into the control power supply 43 and compress the compression spring 45, when the control power supply 43 is inserted into the control power supply 43, the motor 41 is started, the motor 41 drives the driving shaft 42 to rotate, the driving shaft 42 rotates to drive the rotating gear 29 to rotate, the rotating gear 29 rotates to drive the moving rack 28 to move, the moving rack 28 moves towards one side far away from the central line of the transmission cavity 31 to drive the connecting plate 33 to move towards one side close to the central line of the production cavity 15, the connecting plate 33 moves towards one side close to the central line of the production cavity 15 to drive the connecting plate 32 to move towards one side close to the central line of the production cavity 15, and the connecting plate 32 moves towards one side close to the central line of the production cavity 15 to drive the clamping block 34 to move towards one side close to the central line of the production cavity 15 to clamp and position the wafer plate.

2. Then, the vertically symmetrical engaging cylinders 18 are simultaneously started to drive the moving block 16 and the engaging block 24 to move towards the side close to the abutting block 13, when the connecting block 20 moves to a position above the position where the wafer plate needs to be cut for axial positioning, the driving cylinders 36 drive the sliding plates 19 to move so as to radially and simultaneously position the connecting block 20.

3. Then starting the connecting cylinder 17 to drive the connecting block 20 to move downwards, and simultaneously starting the driven cylinder 26 to drive the pushing block 27 to move upwards, when the pushing block 27 and the connecting block 20 move towards one side close to the wafer plate, the driving tool bit 39 and the driven tool bit 40 move towards one side close to the wafer plate to cut, so that the substrate of the chip rectifier element to be cut is quickly cut from the wafer plate.

4. Then promote cylinder 48 and drive sliding block 80 and upwards remove, thereby sliding block 80 upwards removes and promotes the base block to depositing in the chamber 21, drives fixture block 23 and to keeping away from when the base block upwards removes and depositing chamber 21 central line one side and remove and compress return spring 38, and after the base block removed to fixture block 23 top, fixture block 23 moved to be close to and deposits chamber 21 central line one side and remove under return spring's 38 resilience force drive and prevent to get into the base block that deposits in the chamber 21 and fall out and deposit chamber 21.

5. When one base block is cut, the driven air cylinder 26 and the connecting air cylinder 17 drive the pushing block 27 and the connecting block 20 to move to one side far away from the central line of the fixed plate 12 to enable the pushing block and the connecting block to return to the initial position, then the driving air cylinder 36 drives the sliding plate 19 to move to the next radial positioning, then the wafer plate is cut again, and when all the base blocks at the same radial position are cut, the connecting air cylinder 18 drives the connecting block 24 and the moving block 16 to move to the next axial position.

6. After the wafer plate is completely cut, the base block in the storage cavity 21 is directly taken out at one time, then the motor 41 is started to drive the driving shaft 42 to rotate reversely, the driving shaft 42 rotates reversely to drive the clamping block 34 to move to one side far away from the central line of the production cavity 15, then the resilience force of the compression spring 45 drives the abutting block 13 to push the wafer plate to move to the opening of the production cavity 15, and then the cut wafer plate is taken out.

The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.