1. The utility model provides a prevent bubble attachment device for nickel plating bath, includes electroplating bath (1), electroplating bath (1) bottom is provided with baffle (2), be provided with filter frame (3) on baffle (2), one side of electroplating bath (1) is provided with inlet tube (4), and relative opposite side is provided with outlet pipe (5), be provided with water pump (6) on outlet pipe (5), inlet tube (4) with outlet pipe (5) are connected, still be provided with a plurality of air guide hole (7) on electroplating bath (1), breather pipe (8) are connected on air guide hole (7), air pump (9) are connected on breather pipe (8), the top of electroplating bath (1) is provided with lift driver (10), lift driver (10) are connected on lifter plate (11), stores pylon (12) are connected on lifter plate (11), the part (13) is connected to the hanger (12).

2. A bubble adhesion preventing device for nickel plating bath according to claim 1, wherein a water stop valve (14) is provided on each of the water inlet pipe (4) and the water outlet pipe (5).

3. An anti-bubble attachment device for nickel plating baths in accordance with claim 1, characterized in that the water pump (6) is a micro water pump.

4. An anti-bubble attachment arrangement for a nickel plating bath according to claim 1, characterized in that said current carrier (2) is arranged obliquely at the bottom of said plating bath (1).

5. The bubble adhesion prevention device for the nickel plating bath according to claim 1, wherein a plurality of clamping grooves (15) are formed on the flow guiding body (2), a plurality of clamping plates (16) are arranged at the bottom of the filter frame (3), and the clamping plates (16) are correspondingly clamped in the clamping grooves (15).

6. An anti-bubble attachment means for a nickel plating bath according to claim 5, characterized in that said card (16) is arranged in a stepped shape.

7. An anti-bubble attachment device for nickel plating bath according to claim 1, characterized in that said vent pipe (8) comprises a first vent pipe (81) and a plurality of second vent pipes (82), one end of the plurality of second vent pipes (82) is connected to the first vent pipe (81), and the other opposite end is correspondingly connected to the air guide hole (7).

8. An anti-bubble attachment device for a nickel plating bath according to claim 1, wherein a connection hole (17) is provided on the filter frame (3), and the water inlet pipe (4) extends into the filter frame (3) through the connection hole (17).

9. An anti-bubble attachment device for nickel plating baths in accordance with claim 1, characterized in that a hand grip (18) is further provided on the filter frame (3).

Background

Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.

At present, along with the rapid development of the electronic industry, the trend of the miniaturization of electronic products is increasingly obvious, parts of various shapes need to be electroplated, the parts need to be assembled and welded after being plated, in order to ensure the oxidation resistance of the parts, mounting holes can be processed on the surfaces of the parts before the parts are plated, the later-stage assembly and welding are convenient, but the parts are plated in the process of plating, and due to the mounting holes on the surfaces of the parts, the parts are easy to generate bubbles on the surfaces of the mounting holes in the reaction process of an electroplating pool, and the bubbles are attached to the peripheries of the mounting holes of the parts, so that the plating on the surfaces of the parts is uneven, and the plating quality of the parts is seriously affected.

Disclosure of Invention

The invention aims to: the device is used for preventing bubbles from attaching to a nickel plating bath and aims to solve the problems that when an existing part with a hole is electroplated, bubbles generated by electroplating reaction are easy to attach to the surface of the hole of the part, so that the whole plating layer of the part is not flat, and the quality of the plating layer of the part is seriously affected.

In order to achieve the purpose, the invention adopts the following technical scheme: the utility model provides a prevent bubble adhesion apparatus for nickel plating bath, includes electroplates the pond, it is provided with the baffle to electroplate the bottom of the pool, be provided with the filter frame on the baffle, the one side of electroplating the pond is provided with the inlet tube, and relative opposite side is provided with the outlet pipe, be provided with the water pump on the outlet pipe, the inlet tube with the outlet pipe is connected, still be provided with a plurality of air guide hole on the electroplating the pond, the breather pipe is connected on the air guide hole, the air pump is connected on the breather pipe, the top of electroplating the pond is provided with the lift driver, the lift driver is connected on the lifter plate, and the stores pylon is connected on the lifter plate, the part is connected on the stores pylon.

As a further description of the above technical solution:

and the water inlet pipe and the water outlet pipe are both provided with a water stop valve.

As a further description of the above technical solution:

the water pump is a micro water pump.

As a further description of the above technical solution:

the flow guide body is obliquely arranged at the bottom of the electroplating pool.

As a further description of the above technical solution:

the flow guiding body is provided with a plurality of clamping grooves, the bottom of the filter frame is provided with a plurality of clamping plates, and the clamping plates are correspondingly clamped in the clamping grooves.

As a further description of the above technical solution:

the cardboard is the ladder shape and arranges.

As a further description of the above technical solution:

the breather pipe includes first breather pipe and a plurality of second breather pipe, and a plurality of second breather pipe one end is connected on the first breather pipe, the opposite other end corresponds to be connected in the air guide hole.

As a further description of the above technical solution:

the filter frame is provided with a connecting hole, and the water inlet pipe penetrates through the connecting hole and extends into the filter frame.

As a further description of the above technical solution:

the filter frame is also provided with a hand handle.

In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:

1. according to the electroplating device, the water inlet pipe and the water outlet pipe are arranged on the two sides of the electroplating pool respectively, and the water inlet pipe is connected with the water outlet pipe to form a water circulation system, so that the flowability of electroplating liquid in the electroplating pool is ensured, the electroplating efficiency of parts is improved, and meanwhile, bubbles are prevented from being attached to the periphery of part holes to influence the quality of part coatings.

2. According to the electroplating device, the flow of electroplating solution is further improved by arranging the flow guide body which is inclined downwards at the bottom of the electroplating pool, the unidirectional flow of the electroplating solution is ensured, meanwhile, the vent pipe is arranged on the electroplating pool, the air guide direction of the vent pipe is vertical to the flow direction of the electroplating solution, and the electroplating solution in the horizontal direction and the vertical direction fluctuates, so that all generated bubbles are broken, and the coating quality of parts is prevented from being influenced by the bubbles.

3. According to the invention, the filter frame is arranged in the electroplating layer, and the hand handle is arranged on the filter frame, so that when the impurities in the electroplating pool are excessive, the electroplating environment in the electroplating pool can be improved only by lifting the filter frame for washing.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a view showing a state of use of a bubble adhesion preventing device for a nickel plating bath.

FIG. 2 is a top view of an anti-bubble adhesion device for a nickel plating bath.

FIG. 3 is a front view of a filter frame in a bubble attachment preventing apparatus for a nickel plating bath.

FIG. 4 is a side view of a filter frame in a bubble attachment preventing apparatus for a nickel plating bath.

Illustration of the drawings:

1-an electroplating pool; 2-a flow guide body; 3-a filter frame; 4-water inlet pipe; 5-water outlet pipe; 6, a water pump; 7-air vents; 8-a breather pipe; 81-a first snorkel; 82-a second vent pipe; 9-an air pump; 10-a lift drive; 11-a lifter plate; 12-a hanger; 13-parts; 14-a water stop valve; 15-a card slot; 16-a clamping plate; 17-a connection hole; 18-hand handle.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the embodiments of the present invention, it should be noted that the terms "upper", "inner", and the like refer to orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that are conventionally arranged when the products of the present invention are used, and are used only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-4, the present invention provides a technical solution: the utility model provides a prevent bubble attachment device for nickel plating bath, includes electroplating bath 1, 1 bottom in electroplating bath is provided with baffle 2, be provided with filter frame 3 on the baffle 2, one side of electroplating bath 1 is provided with inlet tube 4, and relative opposite side is provided with outlet pipe 5, be provided with water pump 6 on the outlet pipe 5, inlet tube 4 with outlet pipe 5 is connected, still be provided with a plurality of air guide hole 7 on the electroplating bath 1, breather pipe 8 is connected on the air guide hole 7, air pump 9 is connected on the breather pipe 8, the top of electroplating bath 1 is provided with lift driver 10, lift driver 10 is connected on lifter plate 11, and stores pylon 12 is connected on lifter plate 11, and part 13 is connected on stores pylon 12.

And water stop valves 14 are arranged on the water inlet pipe 4 and the water outlet pipe 5. When not in use, the electroplating solution can not flow only by opening the water stop valve, the operation is easy, and the practicability is strong.

The water pump 6 is a micro water pump. The micro water pump is used for small-flow water, and water in the electroplating pool is prevented from being excessively splashed out of the electroplating pool due to fluctuation.

The current carrier 2 is obliquely arranged at the bottom of the electroplating pool 1. Further improving the fluidity of the plating solution.

The flow guiding body 2 is provided with a plurality of clamping grooves 15, the bottom of the filter frame 3 is provided with a plurality of clamping plates 16, and the clamping plates 16 are correspondingly clamped in the clamping grooves 15. The stability of the whole filter frame is improved.

The card 16 is arranged in a stepped shape.

The vent pipe 8 comprises a first vent pipe 81 and a plurality of second vent pipes 82, one ends of the second vent pipes 82 are connected to the first vent pipe 81, and the other opposite ends of the second vent pipes 82 are correspondingly connected to the air guide holes 7. The plurality of second vent pipes are uniformly distributed on the electroplating pool, so that the fluctuation frequency of the electroplating liquid in the air guide direction in the electroplating pool is consistent, and the bubble breakage rate is improved.

The filter frame 3 is provided with a connecting hole 17, and the water inlet pipe 4 penetrates through the connecting hole 17 and extends into the filter frame 3. So that the impurities are all introduced into the filter frame.

The filter frame 3 is also provided with a hand handle 18.

The working principle is as follows: set up inlet tube and outlet pipe respectively through the both sides setting at electroplating bath, the inlet tube is connected with the outlet pipe, form a water circulating system, thereby guarantee the plating solution mobility in the electroplating bath, when improving part electroplating efficiency, still avoid the bubble to adhere to around the part hole, influence part cladding material quality, simultaneously through setting up the decurrent baffle of a slope bottom the electroplating bath, the mobility of plating solution has further been improved, guarantee the one-way flow of plating solution, set up the breather pipe on electroplating bath, the direction of breather pipe air guide is perpendicular with plating solution flow direction, the horizontal direction and the vertical direction of plating solution are all producing undulantly, make the whole of gassing break, avoid the bubble to adhere to the surface at the part, influence the cladding material quality of part.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.