1. A metal polishing solution for polishing metal, which is characterized by comprising the following components:

the polishing agent comprises microorganisms, a microorganism culture solution and a corrosion inhibitor, wherein metabolites of the microorganisms can perform oxidation-reduction reaction with metals so as to polish the metals.

2. The metal polish of claim 1, wherein the microorganism comprises at least one of thiobacillus ferrooxidans, thiobacillus thiooxidans, thiobacillus acidophilus, and leptospirillum ferrooxidans.

3. The metal-polishing liquid according to claim 1, wherein the concentration of the microorganism is not less than 1 x 10⁶The microbial cell is one per mL, and the metabolite concentration of the microorganism is 1-15 g/L.

4. The metal polishing solution according to claim 1, wherein the corrosion inhibitor comprises at least one of chromate, silicate, polyphosphate, nitrate, nitrite, borate, benzotriazole, sodium alkylbenzenesulfonate, thiourea, oleic acid diethanolamine, thiosalicylic acid, ammonium lauryl sulfate, salicylhydroxamic acid, trichloroacetic acid, urotropine, mercaptobenzothiazole, crape myrtle leaf extract, rosin, lavender oil, and soluble protein.

5. The metal polishing solution according to claim 1, wherein the corrosion inhibitor is contained in an amount of 5 to 20 mg/L.

6. The metal polishing solution according to claim 1, wherein the temperature of the metal polishing solution is 20 to 40 ℃; and/or the presence of a gas in the gas,

the pH value of the microbial culture solution is 1-3.

7. A metal polishing method, comprising the steps of:

s10, soaking the metal to be processed in the metal polishing solution to polish the metal to be processed;

s20, washing and drying the soaked metal, namely finishing the polishing treatment of the metal;

wherein the metal-polishing liquid is the metal-polishing liquid according to claim 1.

8. The metal polishing method as set forth in claim 7, further comprising, before the step S10, the steps of:

and preliminarily cleaning the surface of the metal to be treated.

9. The metal polishing method according to claim 7, wherein the step S10 includes:

and soaking the metal to be treated in metal polishing solution for microbial polishing, and simultaneously performing auxiliary polishing treatment by using a flexible polishing pad.

10. The metal polishing method according to claim 9, wherein the material of the flexible polishing pad includes any one of fluff, fiber, and leather.

Background

The manufacturing process of a common metal part generally includes: refining, casting, forging, extruding, machining and the like. The surface of the processed metal part usually has some defects (scratches, cracks, impurities) or internal stress, and before application, surface polishing is required to improve the surface quality, so as to improve the service performance and prolong the service life of the part.

Currently, chemical polishing has become a common surface polishing method with unique advantages. In the chemical polishing method, because the removal process of the metal surface material is generally carried out in a chemical solution, no dust is generally generated in the polishing process; the contact area of the metal surface and the solution can be very large, chemical polishing can be suitable for workpieces with large surface areas, and different positions of the metal surface can be simultaneously polished.

However, chemical reagents are continuously consumed in the chemical polishing process, and in order to maintain the polishing performance, chemical reagents are continuously added into the polishing solution in a large amount, and the production process and discharge of the chemical reagents pollute the environment, such as: the chemical polishing process of the nitric acid-hydrochloric acid system can generate 'yellow smoke' (NO)₂Etc.) "and the like. Therefore, the chemical polishing method causes great environmental pollution.

Disclosure of Invention

The invention mainly aims to provide a metal polishing solution and a metal polishing method, and aims to provide a green and environment-friendly metal polishing solution.

In order to achieve the above object, the present invention provides a metal polishing solution for polishing a metal, the metal polishing solution comprising the following components:

the polishing agent comprises microorganisms, a microorganism culture solution and a corrosion inhibitor, wherein metabolites of the microorganisms can perform oxidation-reduction reaction with metals so as to polish the metals.

Optionally, the microorganism comprises at least one of thiobacillus ferrooxidans, thiobacillus thiooxidans, thiobacillus acidophilus, and leptospirillum ferrooxidans.

Optionally, the concentration of the microorganism is not less than 1 × 10⁶The microbial cell is one per mL, and the metabolite concentration of the microorganism is 1-15 g/L.

Optionally, the corrosion inhibitor comprises at least one of chromate, silicate, polyphosphate, nitrate, nitrite, borate, benzotriazole, sodium alkyl benzene sulfonate, thiourea, oleic acid diethanolamine, thiosalicylic acid, ammonium lauryl sulfate, salicylhydroxamic acid, trichloroacetic acid, urotropine, mercaptobenzothiazole, crape myrtle leaf extract, rosin, lavender oil, and soluble protein.

Optionally, the content of the corrosion inhibitor is 5-20 mg/L.

Optionally, the temperature of the metal polishing solution is 20-40 ℃; and/or the presence of a gas in the gas,

the pH value of the microbial culture solution is 1-3.

Further, the invention also provides a metal polishing method, which comprises the following steps:

s10, soaking the metal to be processed in the metal polishing solution to polish the metal to be processed;

s20, washing and drying the soaked metal, namely finishing the polishing treatment of the metal;

the metal polishing solution comprises microorganisms, a microorganism culture solution and a corrosion inhibitor, and metabolites of the microorganisms can perform redox reaction with metals so as to polish the metals.

Optionally, before step S10, the method further includes the following steps:

and preliminarily cleaning the surface of the metal to be treated.

Optionally, step S10 includes:

and soaking the metal to be treated in metal polishing solution for microbial polishing, and simultaneously performing auxiliary polishing treatment by using a flexible polishing pad.

Optionally, the material of the flexible polishing pad includes any one of wool, fiber, and leather.

In the technical scheme provided by the invention, the metal polishing solution comprises microorganisms, a microorganism culture solution and a corrosion inhibitor, and when the metal polishing solution is used for polishing metal, the microorganism can convert the metabolic raw material (namely nutrient substance) in the fresh microorganism culture solution into the oxidative metabolic product, the metabolic product and metal carry out redox reaction, so that the metal is oxidized into ions to be dissolved in the metal polishing solution, and meanwhile, the metabolic product is reduced into the metabolic raw material, the metabolic raw material is converted into metabolic products by the microorganism to participate in metal oxidation, so that the non-oxidative metabolic raw material is continuously and circularly oxidized into the metabolic products with oxidation effect on the metal by the microorganism, the continuous polishing of the metal surface can be realized, and the continuous and large-scale addition of chemical reagents is avoided, so that the pollution to the environment is reduced. In addition, through the addition of the corrosion inhibitor, a corrosion inhibition film can be formed on the metal surface to properly reduce the corrosion efficiency, so that the metal surface can be uniformly corroded and removed, the surface flatness of the polished metal is increased, and the quality of the polished metal surface is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other related drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic view of a metal polishing method according to embodiment 1 of the present invention.

The reference numbers illustrate:

reference numerals	Name (R)	Reference numerals	Name (R)
				1	Microorganisms	3	Flexible polishing pad
2	Copper (Cu)	4	Corrosion inhibition film

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.

In addition, the meaning of "and/or" appearing throughout includes three juxtapositions, exemplified by "A and/or B" including either A or B or both A and B. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Chemical polishing has become a common surface polishing method with unique advantages, however, chemical reagents are continuously consumed in the chemical polishing process, and in order to maintain the polishing performance, chemical reagents need to be continuously added into polishing solution in large quantities, and the production process and discharge of the chemical reagents pollute the environment, such as: the chemical polishing process of the nitric acid-hydrochloric acid system can generate 'yellow smoke' (NO)₂Etc.) "and the like. Thus, chemistryThe polishing method has great environmental pollution.

In view of this, the present invention provides a metal polishing solution for polishing metal, and aims to provide an environment-friendly metal polishing method. The metal polishing solution comprises microorganisms, a microorganism culture solution and a corrosion inhibitor, wherein metabolites of the microorganisms can perform redox reaction with metals, so that the metals are polished.

In the technical scheme provided by the invention, when the metal polishing solution is used for polishing metal, microorganisms can convert metabolic raw materials (namely nutrients) in a fresh microorganism culture solution into oxidative metabolic products, the metabolic products and the metal perform redox reaction, so that the metal is oxidized into ions and dissolved in the metal polishing solution, meanwhile, the metabolic products are reduced into the metabolic raw materials, and the metabolic raw materials are converted into the metabolic products by the microorganisms again to participate in metal oxidation. In addition, through the addition of the corrosion inhibitor, a corrosion inhibition film can be formed on the metal surface to properly reduce the corrosion efficiency, so that the metal surface can be uniformly corroded and removed, the surface flatness of the polished metal is increased, and the quality of the polished metal surface is improved.

In one embodiment, the microorganism comprises at least one of thiobacillus ferrooxidans, thiobacillus thiooxidans, thiobacillus acidophilus and leptospirillum ferrooxidans, i.e., the microorganism can be only thiobacillus ferrooxidans, thiobacillus thiooxidans, thiobacillus acidophilus or leptospirillum ferrooxidans, or can be a combination of the two. Preferably, the microorganism is Thiobacillus ferrooxidans. It should be noted that the present invention is not limited to the specific sources of the above microorganisms, and may be purchased by conventional means.

Wherein the Thiobacillus ferrooxidans or leptospirillum ferrooxidans can metabolize raw materials (namely nutrients) Fe in the microbial culture solution²⁺Conversion to Fe³⁺，Fe³⁺Oxidation-reduction reaction is carried out with metal, so that the metal is oxidized into metal ions to be dissolved, and simultaneously Fe³⁺Is reduced to Fe²⁺Then Fe²⁺And is converted into Fe again by microorganisms³⁺Participate in metal oxidation, thereby realizing the continuous polishing treatment of the metal surface. Specifically, when the metal polishing solution contains at least one of thiobacillus ferrooxidans and leptospirillum ferrooxidans, the metal polishing solution can polish one of iron, cobalt, nickel, tin, lead, aluminum, zinc, manganese, chromium and copper or their alloys, and referring to fig. 1, when the metal is copper, the principle is as follows:

the thiobacillus thiooxidans or the Acidithiobacillus caldus can oxidize nutrient substance elemental sulfur in the microbial culture solution into bivalent sulfur, the bivalent sulfur can perform oxidation-reduction reaction with metal, so that the metal is oxidized into ions to be dissolved in the metal polishing solution, the bivalent sulfur is reduced into the elemental sulfur, the elemental sulfur is converted into the bivalent sulfur again by the microbes to participate in metal oxidation, and therefore metal polishing is continuously performed. Specifically, when the metal-polishing liquid contains at least one of thiobacillus thiooxidans and thiobacillus caldus acidophilus, the metal-polishing liquid can polish one of iron, tin, lead, cobalt and zinc or an alloy thereof.

Further, the present invention is not limited to specific components of the microbial culture solution, and may be set correspondingly according to the cultured microorganism. In one embodiment, the microbial broth comprises any one of 9K medium, Leathen medium, 510 medium, or 317 medium. Specifically, Thiobacillus ferrooxidans or leptospirillum ferrooxidans is cultured mainly with any one of 9K medium, Leathen medium and 510 medium. Wherein, the 9K culture medium comprises the following components in concentration: (NH)₄)₂SO₄ 3g/L、MgSO₄·H₂O 0.5g/L、KCl 0.1g/L、K₂HPO₄ 0.5g/L、Ca(NO₃)₂0.01g/L of FeSO with concentration determined according to user requirements₄·7H₂And O. The Leathen medium comprises the following components in the following concentrations: (NH)₄)₂SO₄ 0.15g/L、MgSO₄·H₂O 0.5g/L、KCl 0.05g/L、K₂HPO₄ 0.05g/L、Ca(NO₃)₂0.01g/L of FeSO with concentration determined according to user requirements₄·7H₂And O. 510 medium included the following components at the following concentrations: (NH)₄)₂SO₄ 0.8g/L、MgSO₄·H₂O 2g/L、K₂HPO₄ 0.4g/L、Ca(NO₃)₂0.01g/L FeSO with concentration determined according to user requirements₄·7H₂O and trace elements (nitrilotriacetic acid 7.5g/L, MgSO)₄·7H₂O 15g/L、MnSO₄·H₂O 2.5g/L、NaCl 5g/L、FeSO₄·7H₂O 0.5g/L、CoCl₂·6H₂O 0.5g/L、CaCl₂ 0.5g/L、ZnSO4·7H₂O 0.5g/L、CuSO₄·5H₂O 0.05g/L、ALK(SO₄)₂·12H₂O 0.05g/L、H₃BO₃ 0.05g/L、Na₂MoO₄·2H₂O0.05 g/L). The thiobacillus thiooxidans or the thiobacillus acidophilus is cultured by using a 317 culture medium or a 9K culture medium, wherein the 317 culture medium comprises the following components in concentration: (NH)₄)₂SO₄ 0.3g/L、MgSO₄·7H₂O 0.5g/L、K₂HPO₄ 3.5g/L、CaCl₂0.25g/L and sulfur with concentration determined according to the needs of users. The 9K culture medium is FeSO which is a nutrient substance in the 9K culture medium for culturing Thiobacillus ferrooxidans or leptospirillum ferrooxidans₄·7H₂Changing O into sulfur.

Further, in order to make the microbial culture solution more suitable for growth and proliferation of microorganisms, in this embodiment, after the preparation of the microbial culture solution is completed, the pH of the microbial culture solution is adjusted to 1-3.

In order to polish the metal to be treated with the metal polishing liquidThe physiological rate is suitable, in this embodiment, the concentration of the microorganism is not less than 1X 10⁶The microbial cell is one per mL, and the metabolite concentration of the microorganism is 1-15 g/L. It will be appreciated that the specific values of the concentration of the microorganisms and of the metabolite concentrations of the microorganisms depend on the size of the metal to be treated and on the roughness of the metal surface. Further, the present invention is not limited to the initial inoculation concentration of the microorganism as long as the concentration of the microorganism is not less than 1X 10 when it is used as a metal polishing liquid⁶The microbial cell is one per mL, and the concentration of the metabolite of the microorganism is 1-15 g/L. In one embodiment, the microorganism and the microorganism culture solution are prepared by: subjecting the microorganism to 1 × 10⁵Inoculating into culture medium at a concentration of 1/mL, and culturing for about 1 day until the concentration of microorganism is 1 × 10⁶More than one/mL, metabolite Fe in microbial culture solution³⁺1 to 15 g/L. It will be appreciated that when the initial inoculation concentration of the microorganism is low (e.g., less than 1X 10)⁵one/mL), a certain period of time is required.

Further, in this embodiment, the corrosion inhibitor includes at least one of chromate, silicate, polyphosphate, nitrate, nitrite, borate, benzotriazole, sodium alkyl benzene sulfonate, thiourea, oleic acid diethanolamine, thiosalicylic acid, ammonium lauryl sulfate, salicylhydroxamic acid, trichloroacetic acid, urotropine, mercaptobenzothiazole, crape myrtle leaf extract, rosin, lavender oil and soluble protein. Therefore, the corrosion inhibitor can form a corrosion inhibition film on the surface of the metal to be treated so as to properly reduce the corrosion efficiency and prevent local areas such as crystal boundaries, flaws and the like from being corroded too fast, so that the metal surface can be corroded and removed more uniformly, and the surface flatness after polishing is further improved.

Wherein, the content of the corrosion inhibitor is 5-20 mg/L, so that the generation rate of a corrosion inhibition film on the surface of the metal to be treated is proper. Further, in order to increase the growth value and activity of the microorganisms and fully exert the characteristic of oxidizing the metabolic raw materials into metabolites, in this embodiment, the temperature of the metal polishing solution is 20 to 40 ℃ to provide an environment suitable for the growth of the microorganisms. The polishing treatment may be performed at 20 to 40 ℃ so that the microorganism can exhibit its characteristics more effectively.

Based on the metal polishing solution, the invention further provides a metal polishing method, and in one embodiment, the metal polishing method comprises the following steps:

and step S10, soaking the metal to be processed in the metal polishing solution to polish the metal to be processed.

Wherein, the metal polishing solution is the metal polishing solution. In specific implementation, the microorganism concentration and the metabolite concentration in the metal polishing solution are cultured to preset values for later use. In one embodiment, step S10 includes the following steps: subjecting the microorganism to 1 × 10⁵Inoculating the microorganism culture solution at a concentration of 1/mL, wherein the pH value of the microorganism culture solution is 1-3, and culturing the microorganism until the concentration of the microorganism is not less than 1 × 10⁶The microbial cell is used for standby when the concentration of the microbial metabolite is 1-15 g/L; and then partially or completely soaking the metal to be treated in metal polishing solution at the temperature of 20-40 ℃ for polishing treatment.

In order to make the polishing process more effective, before step S10, the method further includes the following steps: and preliminarily cleaning the surface of the metal to be treated. Specifically, the preliminary cleaning includes removing oil, removing burrs, removing metal chips, and the like.

Further, in the present embodiment, step S10 includes: and soaking the metal to be treated in metal polishing solution for microbial polishing, and simultaneously performing auxiliary polishing treatment by using a flexible polishing pad. Therefore, when the metal is soaked in the metal polishing solution, the polishing pad can remove the corrosion inhibition film at the high point of the metal surface, and accelerate the biological oxidation removal speed of the high point material, thereby realizing the smooth polishing of the metal surface. In one embodiment, the material of the flexible polishing pad includes any one of wool, fiber, and leather.

And step S20, washing and drying the soaked metal, namely finishing the polishing treatment of the metal.

The invention does not limit the soaking time of the metal to be treated in the metal polishing solution, and the soaking time is determined according to the metal type, the roughness of the metal surface and the removal rate of the metabolite in the microbial culture solution to the metal. It can be understood that if the same metal is polished in the same metal polishing solution, the soaking time of the metal with deeper scratches is longer.

The technical solutions of the present invention are further described in detail below with reference to specific examples and drawings, it should be understood that the following examples are merely illustrative of the present invention and are not intended to limit the present invention.

The components of each of the metal polishing solutions of examples 1 to 6 are shown in Table 1 below.

Example 1

(1) Microorganism 1 (Thiobacillus ferrooxidans) at 8.5X 10⁵The culture broth was inoculated into 510 medium (pH 2 medium) at a concentration of one/mL, and after 20 hours of culture at 25 ℃ the color of the culture broth changed to yellowish brown (due to light green Fe in the medium)²⁺The ions are continuously converted into yellow Fe by the thiobacillus ferrooxidans³⁺Ion), the concentration of Thiobacillus ferrooxidans at this time was 7.5X 10 by detection⁶Per mL, and Fe³⁺Stopping culturing when the ion concentration reaches 5 g/L; adding chromate with concentration of 10mg/L into the microorganism 1 and the microorganism culture solution, and mixing uniformly to obtain the metal polishing solution for later use.

(2) Removing oil, burrs and metal chips from copper 2, then soaking copper 2 in the metal polishing solution for polishing at 25 ℃, and continuously reacting Fe with microorganism 1 (thiobacillus ferrooxidans) in the metal polishing solution through a series of biochemical reactions of the microorganism 1²⁺Conversion of ions to Fe³⁺Ion, and Fe³⁺The ions have oxidability and can generate oxidation-reduction reaction with copper 2, and the zero-valent copper simple substance is oxidized to generate Fe²⁺Dissolved in a metal-polishing liquid, Fe³⁺The ions are also reduced to Fe²⁺Ion, Fe³⁺The ions are continuously consumed and are reutilized by the iron protoxide thiobacillus and converted into Fe³⁺Ions, and a corrosion inhibition film 4 is formed on the surface of the copper 2 continuously to reduce the corrosion efficiency; meanwhile, a flexible polishing pad 3 made of fluff is used for carrying out auxiliary polishing treatment so as to remove the corrosion inhibition film 4 at the high point of the surface of the copper 2.

(3) And after about 10 minutes, taking the copper 2 out of the metal polishing solution, and washing and drying the soaked copper 2 to finish the metal polishing treatment.

Example 2

(1) Thiobacillus thiooxidans is added at a ratio of 1.2X 10⁴The strain/mL was inoculated into 317 medium (pH 1 of the medium), cultured at 20 ℃ for 48 hours, and then detected, at which time the thiobacillus thiooxidans concentration was 8.5X 10⁶Per mL, and the metabolite SO₄ ^2-Stopping culturing when the ion concentration reaches 10g/L and the pH value is below 1; adding benzotriazole into the microorganism and the microorganism culture solution at a concentration of 5mg/L, and mixing uniformly to obtain the metal polishing solution for later use.

(2) Removing oil, removing burrs and metal chips from iron, and then soaking the iron in the metal polishing solution for polishing at the temperature of 20 ℃, and simultaneously performing auxiliary polishing treatment by using a flexible polishing pad made of fibers.

(3) And after about 12 minutes, taking the iron out of the metal polishing solution, and washing and drying the soaked iron to finish the metal polishing treatment.

Example 3

(1) Acidithiobacillus caldus is cultured at 2.3X 10%⁶Inoculating into 9K culture medium (pH of culture medium is 3) at a concentration of one/mL, culturing at 40 deg.C for 28 hr, and detecting at the concentration of Acidithiobacillus caldus of 9.3 × 10⁸Per mL, and the metabolite SO₄ ^2-Stopping culturing when the ion concentration reaches 15g/L and the pH value is below 1; adding the Lagerstroemia indica leaf extract into the microorganism and microorganism culture solution at a concentration of 20mg/L, and mixing to obtain metal polishing solution for use.

(2) Removing oil, removing burrs and metal chips from lead, and then soaking the lead in the metal polishing solution for polishing at 40 ℃, and simultaneously performing auxiliary polishing treatment by using a flexible polishing pad made of leather.

(3) And after about 10 minutes, taking the lead out of the metal polishing solution, and washing and drying the soaked lead to finish the metal polishing treatment.

Example 4

(1) Mixing leptospirillum ferrixide with the mixture of 1.7 multiplied by 10⁶Inoculating into Leathen culture medium (pH of 2), culturing at 30 deg.C for 24 hr, and detecting to obtain leptospira ferrooxidans with concentration of 8.5 × 10⁷Per mL, and Fe³⁺Stopping culturing when the ion concentration reaches 6 g/L; adding corrosion inhibitor (mixture of nitrite and rosin) into the microorganism and microorganism culture solution at concentration of 12mg/L, and mixing to obtain metal polishing solution for use.

(2) Removing oil, removing burrs and metal chips from zinc, and then soaking the zinc in the metal polishing solution for polishing at 30 ℃, and simultaneously performing auxiliary polishing treatment by using a flexible polishing pad made of fluff.

(3) And after about 15 minutes, taking the zinc out of the metal polishing solution, and washing and drying the soaked zinc to finish the metal polishing treatment.

Example 5

(1) Mixing microorganism (Thiobacillus ferrooxidans and Thiobacillus thiooxidans) at a ratio of 5.7 × 10⁵The microorganism was inoculated into 9K medium (pH 2 medium) at a concentration of 2.6X 10, cultured at 35 ℃ for 22 hours, and then detected⁷Stopping culturing when the concentration of the metabolite reaches 9 g/L; adding a corrosion inhibitor (a mixture of thiosalicylic acid and urotropine) into the microorganisms and the microorganism culture solution at a concentration of 10mg/L, and uniformly mixing to obtain the metal polishing solution for later use.

(2) And (2) removing oil, burrs and metal chips from copper, and then soaking the copper in the metal polishing solution for polishing at the temperature of 35 ℃, and simultaneously performing auxiliary polishing by using a flexible polishing pad made of leather.

(3) And after about 10 minutes, taking the copper out of the metal polishing solution, and washing and drying the soaked copper to finish the polishing treatment of the metal.

Example 6

(1) Mixing microorganism (Thiobacillus thiooxidans and Acidithiobacillus caldus) at a ratio of 9 × 10⁶The microorganism was inoculated into 317 medium (pH 3 medium) at a concentration of 6.8X 10, cultured at 25 ℃ for 30 hours, and then detected⁸Stopping culturing when the cell count per mL and the ion concentration of the metabolite reaches 12 g/L; adding a corrosion inhibitor (a mixture of nitrate, thiourea and lavender oil) into the microorganisms and the microorganism culture solution at a concentration of 15mg/L, and uniformly mixing to obtain the metal polishing solution for later use.

(2) Removing oil, removing burrs and metal chips from the cobalt-nickel alloy, then soaking the cobalt-nickel alloy in the metal polishing solution for polishing at the temperature of 25 ℃, and simultaneously performing auxiliary polishing treatment by using a flexible polishing pad made of fibers.

(3) And after about 7 minutes, taking the copper out of the metal polishing solution, and washing and drying the soaked cobalt-nickel alloy to finish the polishing treatment of the metal.

The above is only a preferred embodiment of the present invention, and it is not intended to limit the scope of the invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall be included in the scope of the present invention.