1. A hypereutectic Al-Cu alloy, characterized in that the hypereutectic Al-Cu alloy comprises primary Al₂Cu phase and TiC_B@ TiBC seed crystal, wherein the content of Cu is 33.5-53.0 wt% and TiC is based on 100 wt% of hypereutectic Al-Cu series alloy_BThe content of the @ TiBC crystal seed is 0.005 wt% -4.0 wt%.

2. The hypereutectic Al-Cu base alloy according to claim 1, wherein TiC is based on 100 wt% of the hypereutectic Al-Cu base alloy_BThe content of the @ TiBC crystal seed is 0.01 to 2.5 weight percent.

3. The hypereutectic Al-Cu base alloy according to claim 1, wherein TiC is based on 100 wt% of the hypereutectic Al-Cu base alloy_BThe content of the @ TiBC crystal seed is 0.1 to 1.0 weight percent.

4. The hypereutectic Al-Cu based alloy according to claim 1, wherein a C content in the core portion is higher than a C content in the shell portion, and a B content in the core portion is lower than a B content in the shell portion.

5. The hypereutectic Al-Cu based alloy of claim 1, wherein said B-doped TiC is_BMade of TiC_xB_yWherein, x is more than 0.72 and less than 0.81, and y is more than 0 and less than 0.17.

6. A method for producing a hypereutectic Al-Cu alloy, the method comprising:

preparing pure aluminum, pure copper and TiC_BA TiCb-Al seed alloy of @ TiBC seed;

adding pure aluminum into a smelting furnace, heating and melting to 680-730 ℃, and adding pure copper into the melt;

keeping the temperature of the melt at 720-780 ℃, adding TiCb-Al seed crystal alloy, and keeping the temperature for 10-60 min;

keeping the temperature of the melt at 700-730 ℃, refining the melt for 15-40 min, then adjusting the temperature of the melt to 630-730 ℃, pouring to obtain hypereutectic Al-Cu alloy material,

wherein the hypereutectic Al-Cu alloy comprises primary Al₂Cu phase and TiC_B@ TiBC seed crystal, based on 100 wt% of hypereutectic Al-Cu series alloy, the content of Cu is 33.5 wt% -53.0 wt%, and TiC_BThe content of the @ TiBC crystal seed is 0.005 wt% -4.0 wt%.

7. The method of claim 6, wherein TiC is based on 100 wt% of hypereutectic Al-Cu alloy_BThe content of the @ TiBC crystal seed is 0.02 wt% -1.5 wt%.

8. The method of claim 6, wherein TiC is based on 100 wt% of hypereutectic Al-Cu alloy_BThe content of the @ TiBC crystal seed is 0.1 to 1.0 weight percent.

9. The method of manufacturing of claim 6, wherein the TiC is based on 100 wt% of the TiCB-Al seed alloy_BThe content of the @ TiBC crystal seed is 0.5 wt% -5.0 wt%.

Background

At present, research and application on Al-Cu alloys mostly focus on hypoeutectic alloys with Cu content less than 11 wt%, which can be heat-treated for strengthening, have good processability and high strength, and are suitable for producing parts with complex structure and bearing large load, for example, high-strength Al-Cu alloys represented by ZL205A alloy start to replace a large amount of traditional ferrous metal materials in the industrial production field due to excellent mechanical properties.

Primary Al as an intermetallic compound is present in a hypereutectic Al-Cu alloy₂And the Cu phase has the advantages of high temperature resistance, high strength, high hardness and the like compared with the traditional material, so the hypereutectic Al-Cu alloy has good application prospect in the fields of key part materials of aeroengines and the like.

However, due to primary Al in the hypereutectic Al-Cu based alloy₂The morphology of the Cu phase causes the alloy to be high in brittleness. At present, for primary Al₂The research on the morphological characteristics of the Cu phase mainly focuses on researching the tissue evolution rule of the alloy through various parameters such as different cooling speeds, different initial components, different heating powers, different drawing speeds, transition acceleration and the like in directional solidification, and the problem that the problem of Al generated in the early stage cannot be effectively solved₂The brittleness of hypereutectic Al-Cu alloy caused by the morphology of Cu phase is large.

Disclosure of Invention

In order to solve at least one of the above problems, the present invention provides a hypereutectic Al — Cu-based alloy and a method for producing the same.

Objects of the inventionIt is intended to provide a novel Al alloy having improved primary Al content₂Hypereutectic Al-Cu alloy with Cu phase morphology.

Another object of the present invention is to provide a primary Al alloy with improved properties, which is inexpensive to manufacture and simple in production process₂Hypereutectic Al-Cu alloy with Cu phase morphology.

According to an aspect of the present invention, there is provided a hypereutectic Al-Cu series alloy including primary Al₂Cu phase and TiC_B@ TiBC seed crystal, wherein the content of Cu is 33.5-53.0 wt% and TiC is based on 100 wt% of hypereutectic Al-Cu series alloy_BThe content of the @ TiBC crystal seed is 0.005 wt% -4.0 wt%.

Alternatively, TiC based on 100 wt% of hypereutectic Al-Cu based alloy_BThe content of the @ TiBC crystal seed can be 0.01 wt% -2.5 wt%.

Alternatively, TiC based on 100 wt% of hypereutectic Al-Cu based alloy_BThe content of the @ TiBC seed crystal can be 0.1 wt% -1.0 wt%.

Alternatively, the C content in the core portion may be higher than that in the shell portion, and the B content in the core portion may be lower than that in the shell portion.

Optionally, the B doped TiC_BMay consist of TiC_xB_yWherein, x is more than 0.72 and less than 0.81, and y is more than 0 and less than 0.17.

According to another aspect of the present invention, there is provided a method for producing a hypereutectic Al — Cu-based alloy, the method comprising: preparing pure aluminum, pure copper and TiC_BA TiCb-Al seed alloy of @ TiBC seed; adding pure aluminum into a smelting furnace, heating and melting to 680-730 ℃, and adding pure copper into the melt; keeping the temperature of the melt at 720-780 ℃, adding TiCb-Al seed crystal alloy, and keeping the temperature for 10-60 min; maintaining the temperature of the melt at 700-730 ℃, refining the melt for 15-40 min, then adjusting the temperature of the melt to 630-730 ℃, and pouring to obtain a hypereutectic Al-Cu alloy material, wherein the hypereutectic Al-Cu alloy comprises primary Al₂Cu phase and TiC_B@ TiBC seed crystal, based on 100 wt% of hypereutectic Al-Cu series alloy, the Cu content is 33.5 wt% -53.0 wt%,TiC_Bthe content of the @ TiBC crystal seed is 0.005 wt% -4.0 wt%.

Alternatively, TiC based on 100 wt% of hypereutectic Al-Cu based alloy_BThe content of the @ TiBC crystal seed can be 0.02 wt% -1.5 wt%.

Alternatively, TiC based on 100 wt% of hypereutectic Al-Cu based alloy_BThe content of the @ TiBC seed crystal can be 0.1 wt% -1.0 wt%.

Optionally, the TiC based on 100 wt% of the TiCB-Al seed alloy_BThe content of the @ TiBC seed crystal can be 0.5 wt% to 5.0 wt%.

As described above, according to the embodiment of the present invention, TiC is introduced into a hypereutectic Al-Cu system alloy_B@ TiBC seed crystal, primary Al₂The morphology of the Cu phase is obviously improved, and the coarse dendrites are changed into thin and long plate sheets or blocks, thereby solving the problem of primary Al₂The brittleness of hypereutectic Al-Cu alloy caused by the morphology of Cu phase is large.

In addition, according to embodiments of the present invention, since a complicated process and a high-cost material are not required, primary Al can be improved₂The morphology of the Cu phase, therefore, the invention can provide the primary Al with improved characteristics of low manufacturing cost and simple production process₂Hypereutectic Al-Cu alloy with Cu phase morphology.

Drawings

The above and other aspects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a hypereutectic Al-40Cu alloy, containing 0.04 wt% TiC, according to the prior art_BComparison of the macroscopic and microscopic structures of the hypereutectic Al-40Cu alloy of @ TiBC seed crystal;

FIG. 2 is a hypereutectic Al-50Cu alloy, containing 0.1 wt% TiC, according to the prior art_BComparison of the macroscopic structure of the hypereutectic Al-50Cu alloy of the @ TiBC seed.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described as follows with reference to the accompanying drawings.

This disclosure may, however, be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It will be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated materials and/or ingredients, but do not preclude the presence or addition of one or more other materials and/or ingredients.

As described in the background section, the hypereutectic Al-Cu alloy contains primary Al as an intermetallic compound₂The Cu phase, so the hypereutectic Al-Cu alloy has good application prospect in the fields of key component materials of aeroengines and the like.

However, primary Al₂The Cu phase is in a coarse dendritic morphology in hypereutectic Al-Cu alloy. The macro-and microstructure of a hypereutectic Al-40Cu alloy according to the prior art is shown in fig. 1 and the macro-structure of a hypereutectic Al-50Cu alloy according to the prior art is shown in fig. 2. As shown in FIGS. 1 and 2, primary Al was observed in the macro structure of the hypereutectic Al-40Cu based alloy₂The Cu phase has coarse dendritic morphology, and the sizes of the coarse dendritic morphology and the coarse dendritic morphology reach the centimeter grade and are mutually staggered. For hypereutectic Al-50Cu alloys with very high Cu content, primary Al₂The coarse dendrite morphology of the Cu phase is more remarkable. In the microstructure of the hypereutectic Al-40Cu alloy according to the prior art shown in FIG. 1, the structure marked by red arrows is primary Al with coarse dendrite morphology₂Cu phase, primary Al₂Each dendrite of the Cu phase is arranged by a plurality of plate-like structures.

Due to primary Al₂The coarse dendrite morphology of the Cu phase leads to poor flow properties of the alloy melt of the hypereutectic Al-Cu alloy, and thus poor formability, and it can be seen from fig. 1 and 2 that the hypereutectic Al-Cu alloy according to the prior art has a rough surface and many defects such as shrinkage porosity and shrinkage cavity. The practical application effect of the prior hypereutectic Al-Cu alloy is not ideal due to the structural defects of the hypereutectic Al-Cu alloy, so that the hypereutectic is limitedApplication and popularization of Al-Cu alloy. Therefore, how to improve the primary Al in the hypereutectic Al-Cu alloy₂The morphology of the Cu phase becomes a technical problem to be solved urgently.

At present, for primary Al in hypereutectic Al-Cu alloy₂The research of the Cu phase still remains to research the tissue evolution law of the alloy through various parameters such as different cooling speeds, different initial components, different heating powers, different drawing speeds, transition acceleration and the like in directional solidification. However, none of these measures can effectively improve primary Al₂The morphology of the Cu phase and also leads to complicated manufacturing processes and significantly increased production costs.

According to the embodiment of the invention, the primary Al with the improvement can be provided with low manufacturing cost and simple production process₂Hypereutectic Al-Cu alloy with Cu phase morphology. Hypereutectic Al-Cu-based alloys according to embodiments of the invention may include primary Al₂Cu phase and TiC_B@ TiBC seed crystal.

The TiCB-Al seed alloy and TiC contained in the TiCB-Al seed alloy are described in detail in the patent publication No. CN111996424A previously filed by the applicant_B@ TiBC seed crystal.

TiC_BThe @ TiBC seed crystal comprises a core part and a shell part, wherein the core part contains B-doped TiC_BThe shell portion covers at least a portion of the core portion and includes a TiBC ternary phase. The C content in the core portion is higher than that in the shell portion, and the B content in the core portion is lower than that in the shell portion. B doped TiC_BMeans that B atoms occupy TiC_xTiC formed by C vacancy of crystal_BA phase and having TiC_xThe lattice structure of the crystal. B doped TiC_BMade of TiC_xB_yWherein, x is more than 0.72 and less than 0.81, and y is more than 0 and less than 0.17. TiBC ternary phase refers to a ternary phase consisting of Ti, B and C and having no TiC_xA crystal lattice structure, wherein x < 1.

To TiC_BIn the course of subsequent studies with @ TiBC seed crystals, the inventors found that TiC was introduced into a hypereutectic Al-Cu alloy_B@ TiBC seed crystal, primary Al₂The morphology of the Cu phase is significantly improved.

Also shown in FIG. 1 is a TiC content of 0.04 wt% according to an embodiment of the present invention_BThe macro and micro structure of the hypereutectic Al-40Cu alloy of @ TiBC seed crystal. By comparison, it was found that when only a small amount (0.04 wt% based on the total weight of the hypereutectic Al-40Cu alloy) of TiC was added to the hypereutectic Al-40Cu alloy_BAt @ TiBC seed, primary Al₂The morphology of the Cu phase can be obviously improved, and the appearance is that primary Al can not be seen from the macroscopic structure₂Coarse dendritic morphology of Cu phase and due to primary Al₂The dendritic crystal morphology of the Cu phase is improved, so that the alloy melt of the hypereutectic Al-Cu alloy has good flowing property and good forming property, and the surface of the hypereutectic Al-Cu alloy is fine and smooth and basically has no defects of shrinkage porosity, shrinkage cavity and the like. In addition, 0.04 wt% of TiC_BIn the microstructure of the hypereutectic Al-40Cu alloy of the @ TiBC seed crystal, primary Al, for example, marked by red arrows, does not appear₂Coarse dendrite morphology of the Cu phase. That is, adding TiC_BAfter seeding with @ TiBC seed, primary Al₂The morphology of the Cu phase is obviously improved, and the Cu phase presents a flaky or blocky morphology of a slender plate.

Also shown in FIG. 2 is a TiC content of 0.1 wt% according to an embodiment of the invention_BThe macroscopic structure of the hypereutectic Al-50Cu alloy of @ TiBC seed crystal is characterized in that only 0.1 wt% of TiC is added into the hypereutectic Al-50Cu alloy with very high Cu content_BAfter seeding with @ TiBC seed, primary Al₂The morphology of the Cu phase can be obviously improved, and the shrinkage porosity and hole shrinkage conditions are also greatly improved. As can be seen from the above description with reference to the accompanying drawings, TiC is introduced into a hypereutectic Al-Cu alloy_BAfter seeding with @ TiBC seed, primary Al₂The appearance of the Cu phase is obviously improved, thereby solving the problem of primary Al₂The brittleness of hypereutectic Al-Cu alloy caused by the morphology of Cu phase is large.

According to the embodiment of the present invention, other alloying elements (for example, at least one of Mn, Mg, Zn, and Cu) may be added to the hypereutectic Al — Cu-based alloy as needed, and the addition of the other alloying elements does not affect TiC_B@ TiBC seed crystal pair primary Al₂The appearance improvement effect of the Cu phase.

According to the inventionIn the illustrated embodiment, the Cu content may be 33.5 wt% to 53.0 wt%, TiC based on 100 wt% of the hypereutectic Al-Cu based alloy_BThe content of the @ TiBC crystal seed can be 0.005 wt% -4.0 wt%. That is, Cu may take any value within the range of 33.5 wt% to 53.0 wt%, TiC_BThe @ TiBC seed crystal can take any value within the range of 0.005 wt% to 4.0 wt%.

When TiC_BWhen the content of the @ TiBC seed crystal is less than 0.005 wt%, the primary Al is treated₂The appearance improvement effect of the Cu phase is not ideal enough, and the Cu phase is TiC_BWhen the content of the @ TiBC seed crystal is more than 4.0 wt%, the influence on Al is not influenced₂The morphology of the Cu phase improves, but because of the addition of excessive TiC_BThe @ TiBC seed crystal may result in waste of material.

According to an embodiment of the present invention, preferably, TiC_BThe content of the @ TiBC crystal seed can be 0.01 wt% -2.5 wt%. Preferably, TiC_BThe content of the @ TiBC seed crystal can be 0.1 wt% -1.0 wt%.

Hereinafter, a method of manufacturing a hypereutectic Al — Cu-based alloy according to an embodiment of the present invention will be described. However, it is to be understood that the hypereutectic Al — Cu based alloy according to the embodiment of the present invention is not limited by the manufacturing method described below, and hypereutectic Al — Cu based alloys having the above-described structure manufactured by other methods are also within the scope of the present invention.

The preparation method of the hypereutectic Al-Cu alloy material according to the embodiment of the invention comprises the following steps: (1) preparing pure aluminum, pure copper and TiC_BA TiCb-Al seed alloy of @ TiBC seed; (2) adding pure aluminum into a smelting furnace, heating and melting to 680-730 ℃, and adding pure copper into the melt; (3) keeping the temperature of the melt at 720-780 ℃, adding TiCb-Al seed crystal alloy, and keeping the temperature for 10-60 min; (4) maintaining the temperature of the melt at 700-730 ℃, refining the melt for 15-40 min, then adjusting the temperature of the melt to 630-730 ℃, and pouring to obtain a hypereutectic Al-Cu alloy material, wherein the hypereutectic Al-Cu alloy comprises primary Al₂Cu phase and TiC_B@ TiBC seed crystal, based on 100 wt% of hypereutectic Al-Cu series alloy, the content of Cu is 33.5 wt% -53.0 wt%, and TiC_BThe content of the @ TiBC crystal seed is 0.005wt％～4.0wt％。

According to an embodiment of the invention, in step (1), Cu and TiC in the hypereutectic Al-Cu system alloy can be prepared according to final needs_BContent of @ TiBC seed crystals pure aluminum, pure copper and containing TiC_BA TiCb-Al seed alloy of @ TiBC seed.

According to an embodiment of the invention, the content of Cu is 33.5 wt% to 53.0 wt%, TiC based on 100 wt% of hypereutectic Al-Cu-based alloy_BThe content of the @ TiBC crystal seed is 0.005 wt% -4.0 wt%.

Preferably, TiC based on 100 wt% of hypereutectic Al-Cu based alloy_BThe content of the @ TiBC crystal seed is 0.02 wt% -1.5 wt%. Preferably, TiC based on 100 wt% of hypereutectic Al-Cu based alloy_BThe content of the @ TiBC crystal seed is 0.1 to 1.0 weight percent.

According to an embodiment of the present invention, TiC in a hypereutectic Al-Cu based alloy_BThe @ TiBC seed may be introduced by adding a TiCB-Al seed alloy. TiC based on 100 wt% TiCb-Al seed alloy_BThe content of the @ TiBC seed crystal can be 0.5 wt% to 5.0 wt%.

In the step (2), pure aluminum is added into a smelting furnace, pure copper is added into the melt when the temperature is raised to be molten to 680-730 ℃, and a stage stirring operation is applied until the pure aluminum is completely dissolved and the melt is promoted to be homogenized. If the temperature is lower than 680 ℃, pure copper may not be sufficiently dissolved, and if the temperature exceeds 730 ℃, the temperature is too high, which may cause defects such as shrinkage porosity and shrinkage cavity of the alloy melt.

In the step (3), the temperature of the melt is kept between 720 and 780 ℃, then the TiCb-Al seed crystal alloy is added, the temperature is kept for 10 to 60 minutes, and the mixture is stirred in stages until the TiCb-Al seed crystal alloy fully plays a role. The temperature below 720 ℃ or above 780 ℃ can affect the primary Al₂The appearance improvement effect of the Cu phase. If the holding time is less than 10min, TiC in the TiCb-Al seed crystal alloy_BThe @ TiBC seed crystal does not function sufficiently. If the heat preservation time exceeds 60min, unnecessary energy waste can be caused.

In the step (4), the temperature of the melt is kept between 700 and 730 ℃, the melt is refined for 15 to 40 minutes, the alloy components are checked again, the temperature of the melt is adjusted to between 630 and 730 ℃ after the alloy components are qualified, and the hypereutectic Al-Cu alloy material is obtained by pouring. The refining effect can be influenced when the temperature of the solution exceeds the temperature range of 700-730 ℃ and the refining treatment time exceeds the time range of 15-40 min. In addition, the temperature of the molten metal exceeding the pouring temperature range of 630-730 ℃ can affect the quality of the casting.

Hereinafter, three specific examples of hypereutectic Al — Cu-based alloys and methods of manufacturing the same according to embodiments of the present invention are described.

Example 1

According to example 1, a hypereutectic Al-Cu based alloy comprises 40 wt% Cu and 0.04 wt% TiC based on 100 wt% hypereutectic Al-Cu based alloy_B@ TiBC seed crystal.

In the production of the hypereutectic Al-Cu alloy of example 1, the Cu content and TiC were determined_B@ TiBC seed crystal is prepared from pure aluminum, pure copper and TiCb-Al seed crystal alloy. Wherein TiC is based on 100 wt% of TiCb-Al seed alloy_BThe content of the @ TiBC seed crystal can be 1.5 wt%.

Then, pure aluminum is added into the smelting furnace, pure copper is added into the melt when the temperature is increased to be melted to 700 ℃, and a staged stirring operation is applied until the pure aluminum is completely dissolved and the melt is promoted to be homogenized.

And then, sampling and inspecting the alloy melt, keeping the temperature of the melt at 725 ℃ after the components are qualified, adding the TiCb-Al seed crystal alloy, and keeping the temperature for 10-60 min, wherein the step stirring is applied in the period.

Keeping the temperature of the melt at 720 ℃, refining the melt for 30min, checking alloy components again, adjusting the temperature of the melt to 660 ℃ after the alloy components are qualified, and pouring to obtain the hypereutectic Al-Cu alloy according to the embodiment 1.

FIG. 1 is a hypereutectic Al-40Cu alloy according to the prior art, TiC according to example 1, containing 0.04 wt%_BComparison of the macroscopic and microscopic structures of the hypereutectic Al-40Cu alloy of the @ TiBC seed. Referring to the macro and micro structures of the hypereutectic Al-40Cu alloy without the seed alloy in FIG. 1, primary Al can be seen₂Cu phase difference is usually coarse to centimeter grade, solidification tableRough surface, multiple shrinkage cavities, Al₂Cu dendrite disclination. Referring to FIG. 1, 0.04 wt% TiC is added_BMacro and micro structure of the hypereutectic Al-40Cu alloy of @ TiBC seed crystal, and TiC not added_BCompared with the hypereutectic Al-40Cu material of the @ TiBC crystal seed, the primary Al₂The average grain size of the Cu phase is thinned to about 230 mu m from a plurality of centimeters, the appearance of the Cu phase is changed into a thin and long plate shape or a block shape from developed dendrites, the solidified surface is fine and smooth, and the defects of shrinkage porosity and shrinkage cavity are basically avoided.

Example 2

According to example 2, a hypereutectic Al-Cu based alloy comprises 50 wt% Cu and 0.1 wt% TiC based on 100 wt% hypereutectic Al-Cu based alloy_B@ TiBC seed crystal.

In the production of the hypereutectic Al-Cu alloy of example 1, the Cu content and TiC were determined_B@ TiBC seed crystal is prepared from pure aluminum, pure copper and TiCb-Al seed crystal alloy. Wherein TiC is based on 100 wt% of TiCb-Al seed alloy_BThe content of the @ TiBC seed crystal can be 1.5 wt%.

Then, pure aluminum is added into the smelting furnace, pure copper is added into the melt when the temperature is increased to be melted to 710 ℃, and a staged stirring operation is applied until the melt is completely dissolved and the melt is promoted to be homogenized.

And then, sampling and inspecting the alloy melt, keeping the temperature of the melt at 740 ℃ after the components are qualified, adding the TiCb-Al seed crystal alloy, keeping the temperature for 10-60 min, and stirring in stages.

And keeping the temperature of the melt at 715 ℃, refining the melt for 25min, checking alloy components again, adjusting the temperature of the melt to 690 ℃ after the alloy components are qualified, and pouring to obtain the hypereutectic Al-Cu alloy according to the embodiment 2.

FIG. 2 is a hypereutectic Al-50Cu alloy according to the prior art, TiC according to example 2, containing 0.1 wt%_BMacro texture comparison of hypereutectic Al-50Cu alloys of @ TiBC seed. For hypereutectic Al-50Cu alloys with very high Cu content, no TiC is added_BAt @ TiBC seed, primary Al₂The coarse dendrite morphology of the Cu phase is more obvious, and the solidification surface is extremely rough. After adding TiC_BAfter the seed of @ TiBC, Al is nascent₂The coarse dendrite of the Cu phase becomes fine, and the solidification surface of the hypereutectic Al-50Cu alloy is obviously improved, and basically has no shrinkage porosity and shrinkage cavity defects.

As described above, according to the embodiment of the present invention, TiC is introduced into a hypereutectic Al-Cu system alloy_B@ TiBC seed crystal, primary Al₂The morphology of the Cu phase is obviously improved, and the coarse dendrites are changed into thin and long plate sheets or blocks, thereby solving the problem of primary Al₂The brittleness of hypereutectic Al-Cu alloy caused by the morphology of Cu phase is large.

In addition, according to embodiments of the present invention, since a complicated process and a high-cost material are not required, primary Al can be improved₂The morphology of the Cu phase, therefore, the invention can provide the primary Al with improved characteristics of low manufacturing cost and simple production process₂Hypereutectic Al-Cu alloy with Cu phase morphology.

Although a few embodiments of the present disclosure have been shown and described, it would be appreciated by those skilled in the art that changes may be made in these embodiments without departing from the principles and spirit of the disclosure, the scope of which is defined in the claims and their equivalents.