1. The utility model provides a be used for PTC to generate heat piece bonding with graphite alkene conducting resin which characterized in that: the raw material formula comprises the following raw materials in parts by weight: 45-55 parts of far infrared transmitting agent, 90-110 parts of graphene, 180-220 parts of copper powder and 400-500 parts of high temperature resistant polymer material; the high-temperature-resistant high polymer material is at least one of high-temperature-resistant glue and high-temperature-resistant phenolic resin.

2. The graphene conductive adhesive for bonding the PTC heating sheet according to claim 1, wherein: the raw material formula comprises the following raw materials in parts by weight: comprises the following raw materials in parts by weight: 48-52 parts of far infrared emitting agent, 95-105 parts of graphene, 190-210 parts of copper powder and 440-460 parts of high temperature resistant polymer material.

3. The graphene conductive adhesive for bonding the PTC heating sheet according to claim 1, wherein: the raw material formula comprises the following raw materials in parts by weight: 50 parts of far infrared emitting agent, 100 parts of graphene, 200 parts of copper powder and 450 parts of high temperature resistant polymer material.

4. The graphene conductive adhesive for bonding the PTC heating sheet according to claim 1, wherein: the high-temperature resistant glue is glue resistant to the temperature of more than 800 ℃.

Background

PTC (positive Temperature coefficient) means a positive Temperature coefficient of resistance, i.e., a characteristic in which the resistance increases with an increase in Temperature, and a material possessing this characteristic is called a PTC material, whose resistance remains substantially constant below the curie Temperature and rapidly increases with an increase in Temperature above the curie Temperature. At present, PTC materials are mainly classified into titanate-based, metal oxide-based, and polymer-based ones, and among them, barium titanate ceramics is most commonly used. The PTC heating element generates heat by the joule effect when current flows through the PTC material, and has two advantages of constant temperature heating and high working safety compared with the conventional heating element. Just because of the two advantages, PTC heating elements are more and more widely used.

The PTC heating sheet manufactured by using the PTC heating element needs to be fixed on a component to be heated when in use, the existing method adopts a mode of sticking silicone gel, CN106658775A discloses an application of the silicone gel on a PTC electric heater product, the silicone gel used as an insulating layer is doped with a heat-conducting filler, and the filler can be alumina ceramic powder, silicon carbide powder, zinc oxide powder, aluminum nitride ceramic powder, boron nitride ceramic powder or magnesium oxide ceramic powder. The technical scheme has the following disadvantages: the heat-resistant effect of the organic silicon silica gel is poor.

Disclosure of Invention

The invention aims to provide a graphene conductive adhesive for bonding a PTC heating sheet.

In order to achieve the above objects and other related objects, the present invention provides the following technical solutions: a graphene conductive adhesive for bonding a PTC heating sheet comprises the following raw materials in parts by weight: 45-55 parts of far infrared transmitting agent, 90-110 parts of graphene, 180-220 parts of copper powder and 400-500 parts of high temperature resistant polymer material; the high-temperature-resistant high polymer material is at least one of high-temperature-resistant glue and high-temperature-resistant phenolic resin.

The preferable technical scheme is as follows: the raw material formula comprises the following raw materials in parts by weight: comprises the following raw materials in parts by weight: 48-52 parts of far infrared emitting agent, 95-105 parts of graphene, 190-210 parts of copper powder and 440-460 parts of high temperature resistant polymer material.

The preferable technical scheme is as follows: the raw material formula comprises the following raw materials in parts by weight: 50 parts of far infrared emitting agent, 100 parts of graphene, 200 parts of copper powder and 450 parts of high temperature resistant polymer material.

The preferable technical scheme is as follows: the high-temperature resistant glue is glue resistant to the temperature of more than 800 ℃.

Due to the application of the technical scheme, compared with the prior art, the invention has the advantages that:

1. the invention uses high temperature resistant polymer material as adhesive, which can not be decomposed under high temperature generated by PTC heating element.

2. When the PTC heating element is not conducted to heat, the graphene and the far infrared emitting agent act together to generate a certain amount of heat to heat the part to be heated, so that the heat preservation effect is achieved to a certain degree.

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.

Example 1: graphene conductive adhesive for bonding PTC heating sheets

Graphene conductive adhesive for bonding PTC heating sheets (also called metal semiconductor heating sheets)

Materials used: the adhesive is prepared from a far infrared emitting agent (dry powder), graphene powder, copper powder and high-molecular high-temperature-resistant adhesive which is purchased from Beijing Zema New technology Co., Ltd and can be used as a Zema high-temperature adhesive which is produced at 800 ℃, 1200 ℃ and 2000 ℃. In this example, 1200 ℃ Zema high temperature adhesive was specifically selected.

The proportion is as follows: 50 g of far infrared emitting agent (dry powder), 100 g of graphene, 200 g of copper powder and 400 g of high-molecular high-temperature-resistant glue.

The using method comprises the following steps: uniformly coating the prepared slurry on an electrode, arranging a semiconductor heating sheet (or a metal semiconductor heating sheet), covering another semiconductor electrode coated with the slurry, and baking in an electric oven at 150-200 ℃ for 30 minutes.

And (3) testing: the PTC that the graphite alkene conducting resin encapsulation that makes with this embodiment generates heat the piece and generates heat the piece with the PTC of current conductive silica gel encapsulation and contrast. The power 2KW (PTC heating piece quantity is the same, is 23, long 35 centimetres) that the PTC heating member is the same, and the electrode all adopts the aluminum alloy electrode slice, inserts aluminum alloy square pipe after high temperature resistant insulating gold paper parcel and compresses tightly, except that the encapsulation that adopts glue other the samely. Two ends of the pressed aluminum alloy square tube are sealed by high-temperature-resistant glue. Two PTC heating bodies (one each packaged by graphene packaging adhesive and original conductive silica gel) with the same power are placed in a barrel filled with 50 liters of water, and are electrified and heated at the same time. The PTC heater is electrified, the initial water temperature in the barrel is the same (20 ℃), and the heating is carried out for 10 minutes: the water temperatures are respectively 28 ℃ (graphene conductive adhesive package); 26.7 deg.C (prior art conductive silicone encapsulation). Heating for 20 minutes: the water temperature is 35.5 ℃ (graphene conductive adhesive package) respectively; 32.5 deg.c (prior art conductive silicone encapsulation). Heating for 30 minutes: the water temperature is 41 ℃ (graphene conductive adhesive package) respectively; 37.5 ℃ (prior art conductive silicone encapsulation). Heating for 40 minutes: the water temperature is respectively 47 ℃ (graphene conductive adhesive encapsulation); 42.7 deg.C (prior art conductive silicone encapsulation). Heating for 50 minutes: the water temperature is 54 ℃ (graphene conductive adhesive package) respectively; 48.5 deg.C (conductive silicone encapsulated). Heating for 60 minutes: the water temperature is 60 ℃ (graphene conductive adhesive package) respectively; 54 deg.c (prior art conductive silicone encapsulation). The PTC heating body stops electrifying, and after 10 minutes, the water temperature is 55 ℃ respectively (the graphene conductive adhesive is packaged); 47 ℃ (prior art conductive silica gel encapsulation); after 20 minutes, the water temperature is 44 ℃ (graphene conductive adhesive package); 35 deg.c (prior art conductive silicone encapsulation). After 30 minutes, the water temperature is 36 ℃ (the graphene conductive adhesive is packaged); 24 ℃ (prior art conductive silicone encapsulation).

Possible causes for the above results: firstly, the graphene can accelerate the movement of metal ions in the PTC heating sheet (or the metal semiconductor heating sheet), thereby generating heat. Secondly, the far infrared emission agent can conduct the heat generated by the PTC heating sheet (or the metal semiconductor heating sheet) outwards; and thirdly, the high-molecular high-temperature-resistant glue added with copper powder is not easy to age at high temperature, the high-molecular high-temperature-resistant glue can resist high temperature of about 800 ℃, and the traditional conductive silica gel is easy to age, so that the packaged heating equipment has power attenuation performance every year. Fourthly, the highest temperature of the semiconductor heating strip packaged by the conductive adhesive can reach 350 degrees (about 270 degrees in the traditional mode) after being electrified. And fifthly, when the electrification heating is stopped, the graphene and the far infrared emitting agent act together to generate a certain amount of heat to heat the water, so that the temperature reduction speed after the electrification is stopped is reduced.

Example 2: graphene conductive adhesive for bonding PTC heating sheets

A graphene conductive adhesive for bonding a PTC heating sheet comprises the following raw materials in parts by weight: 45 parts by weight of far infrared emitting agent, 90 parts by weight of graphene, 180 parts by weight of copper powder and 400 parts by weight of high temperature resistant polymer material; the high-temperature-resistant high polymer material is high-temperature-resistant phenolic resin. The high temperature resistant phenolic resin is boron phenolic resin.

When the material is used, the far infrared emitting agent, the graphene and the copper powder are added into the high-temperature-resistant phenolic resin and stirred into a slurry state.

Example 3: graphene conductive adhesive for bonding PTC heating sheets

A graphene conductive adhesive for bonding a PTC heating sheet comprises the following raw materials in parts by weight: 55 parts of far infrared emitting agent, 110 parts of graphene, 220 parts of copper powder and 500 parts of high temperature resistant polymer material; the high-temperature-resistant high polymer material is high-temperature-resistant glue. The high-temperature resistant glue is 1400 ℃ resistant glue disclosed in the publication No. CN 108359387.

Example 4: graphene conductive adhesive for bonding PTC heating sheets

A graphene conductive adhesive for bonding a PTC heating sheet comprises the following raw materials in parts by weight: 43 parts by weight of far infrared emitting agent, 97 parts by weight of graphene, 210 parts by weight of copper powder and 430 parts by weight of high temperature resistant polymer material; the high-temperature-resistant high polymer material is high-temperature-resistant glue and high-temperature-resistant phenolic resin, and the weight ratio of the high-temperature-resistant high polymer material to the high-temperature-resistant phenolic resin is 1: 1 in a mass ratio.

The foregoing is illustrative of the preferred embodiment of the present invention and is not to be construed as limiting thereof in any way, and any modifications or variations thereof that fall within the spirit of the invention are intended to be included within the scope thereof.