1. The utility model provides a heat conduction PA insulation hot melt adhesive which characterized in that: comprises the following components in parts by weight:

20-30 parts of PA;

20-30 parts of tackifying resin;

10-20 parts of synthetic wax;

10-20 parts of boron nitride;

10-20 parts of aluminum nitride;

5-15 parts of a plasticizer;

1-2 parts of an antioxidant.

2. The heat-conducting PA insulating hot melt adhesive as claimed in claim 1, wherein PA is nylon 6 and has a relative viscosity of 2.0-2.4; the tackifying resin is 138 rosin glyceride particles; the synthetic wax is coal-based synthetic wax; the plasticizer is polyethylene wax; the antioxidant is 1010; the boron nitride is powder, and the particle size is 50-70 um;

the aluminum nitride is powder with a particle size of 10-20 um.

3. A preparation method of a heat-conducting PA insulating hot melt adhesive is characterized by comprising the following steps,

a. the following components are taken according to parts by weight:

20-30 parts of PA (polyamide),

20-30 parts of tackifying resin,

10-20 parts of synthetic wax,

10-20 parts of boron nitride, namely,

10-20 parts of aluminum nitride,

5-15 parts of a plasticizer, namely,

1-2 parts of an antioxidant;

b. sequentially adding PA, tackifying resin, boron nitride, aluminum nitride, synthetic wax and an antioxidant into a reaction kettle, uniformly stirring, and heating to a molten state to obtain a molten state mixture;

c. b, pouring the mixture obtained in the step b into an extruder, and extruding the mixture into a water tank by using the extruder to obtain a glue stick;

d. and c, cutting the hot melt adhesive rod obtained in the step c to obtain the hot melt adhesive.

4. The preparation method of the heat-conducting PA insulating hot melt adhesive is characterized by comprising the following components in parts by weight: 23 parts of PA nylon 6, 30 parts of tackifying resin, 10 parts of synthetic wax, 10 parts of boron nitride and 20 parts of aluminum nitride 6 parts of plasticizer.

Background

The hot melt adhesive has the advantages of low price, excellent bonding property and the like, and is widely applied to the bonding aspect of electronic and electric appliances. Electronic apparatus can produce a large amount of heats at long-time working process, and the hot melt adhesive on the market at present uses macromolecular material as the main part mostly, and the cohesiveness is good but the heat conductivity is not enough, influences the electrical apparatus and uses.

In the prior art, high polymer resin, synthetic wax, a plasticizer, an antioxidant and a filler are mixed and heated to a molten state, and a hot melt adhesive is obtained after cooling, so that the heat generated by an electric appliance cannot be dissipated in time when the hot melt adhesive is used in the electric appliance due to poor heat conductivity of the added raw materials, and the service life of the electric appliance is influenced.

Disclosure of Invention

In order to overcome the defects in the background art, the PA (polyamide) hot melt adhesive is mainly used, and the heat-conducting powder is filled in the PA plastic, so that the heat-conducting filler is uniformly and orderly distributed in the PA plastic to form a heat-conducting passage, and the heat-conducting property of the hot melt adhesive is improved.

The technical scheme adopted by the invention for solving the technical problems is as follows: the formula of the heat-conducting PA insulating hot melt adhesive is provided, and the heat-conducting PA insulating hot melt adhesive is prepared from the following components in parts by weight:

20-30 parts of PA;

20-30 parts of tackifying resin;

10-20 parts of synthetic wax;

10-20 parts of boron nitride;

10-20 parts of aluminum nitride;

5-15 parts of a plasticizer;

1-2 parts of antioxidant

The PA is nylon 6, and the relative viscosity is 2.0-2.4; the tackifying resin is 138 rosin glyceride particles; the synthetic wax is coal-based synthetic wax; the plasticizer is polyethylene wax; the antioxidant is 1010; the boron nitride is powder, and the particle size is 50-70 um; the aluminum nitride is powder with a particle size of 10-20 um.

The preparation method of the heat-conducting PA insulating hot melt adhesive comprises the following steps:

a. the following components are taken according to parts by weight:

20-30 parts of PA (polyamide),

20-30 parts of tackifying resin,

10-20 parts of synthetic wax,

10-20 parts of boron nitride, namely,

10-20 parts of aluminum nitride,

5-15 parts of a plasticizer, namely,

1-2 parts of an antioxidant;

b. sequentially adding PA, tackifying resin, boron nitride, aluminum nitride, synthetic wax and an antioxidant into a reaction kettle, uniformly stirring, and heating to a molten state to obtain a molten state mixture;

c. b, pouring the mixture obtained in the step b into an extruder, and extruding the mixture into a water tank by using the extruder to obtain a glue stick;

d. and c, cutting the hot melt adhesive rod obtained in the step c to obtain the hot melt adhesive.

The invention takes PA (polyamide) hot melt adhesive as a main material, and aluminum nitride heat conduction powder is filled in PA plastic, so that heat conduction fillers are uniformly and orderly distributed in the PA plastic to form a heat conduction path, and the heat conduction performance of the hot melt adhesive is improved. When the heat dissipation device is used in an electric appliance, the total heat of the electric appliance can be dissipated in time. The product fills the technical blank field of the heat-conducting hot melt adhesive.

Detailed Description

Detailed description of the preferred embodiment

The invention provides a heat-conducting PA insulating hot melt adhesive with a special formula, which comprises the following components in parts by weight: 20-30 parts of PA, 20-30 parts of tackifying resin, 10-20 parts of synthetic wax, 10-20 parts of boron nitride, 10-20 parts of aluminum nitride, 5-15 parts of plasticizer and 1-2 parts of antioxidant. According to the insulating hot melt adhesive, aluminum nitride is added as a heat conducting agent, so that heat conducting fillers are uniformly and orderly distributed in PA plastic to form a heat conducting passage, and particularly, aluminum oxide is uniformly distributed in a colloid to form a three-dimensional heat conducting passage so that the hot melt adhesive shows the characteristic of heat conduction.

As a preferable scheme, the specific proportion of each component of the hot melt adhesive is that each component comprises the following components in parts by weight: 30 parts of PA nylon 6, wherein the relative viscosity of the nylon 6 is 2.0-2.4, 23 parts of 138 rosin glyceride particles, 10 parts of coal-based synthetic wax, 15 parts of boron nitride with the particle size of 50-70um, 15 parts of aluminum nitride with the particle size of 10-20um, 6 parts of polyethylene wax and 1 part of antioxidant 1010.

The preparation method comprises the following steps:

a. sequentially adding PA, tackifying resin, boron nitride, aluminum nitride, synthetic wax and antioxidant into a reaction kettle, stirring uniformly, and heating to a molten state to obtain a molten state mixture.

b. And (c) pouring the mixture obtained in the step a into an extruder, and extruding the mixture into a water tank by using the extruder to obtain the glue stick.

c. And c, cutting the hot melt adhesive rod obtained in the step b to obtain the hot melt adhesive.

The heat-conducting PA insulating hot melt adhesive prepared according to the scheme has the main properties that: viscosity number at 180 ℃ of 12000 cps; the thermal conductivity was 2.5w/(m deg.C).

Detailed description of the invention

Preferably, the formula of the hot melt adhesive can be prepared according to the following parts by weight: 23 parts of PA nylon 6, wherein the relative viscosity of the nylon 6 is 2.0-2.4, 30 parts of 138 rosin glyceride particles, 10 parts of coal-based synthetic wax, 10 parts of aluminum nitride with the particle size of 50-70um and 20 parts of aluminum nitride with the particle size of 10-20um, 6 parts of polyethylene wax plasticizer and 1 part of antioxidant 1010.

The preparation method comprises the following steps:

a. sequentially adding PA, tackifying resin, boron nitride, aluminum nitride, synthetic wax and antioxidant into a reaction kettle, stirring uniformly, and heating to a molten state to obtain a molten state mixture.

b. And (c) pouring the mixture obtained in the step a into an extruder, and extruding the mixture into a water tank by using the extruder to obtain the glue stick.

c. And c, cutting the hot melt adhesive rod obtained in the step b to obtain the hot melt adhesive.

The heat-conducting PA insulating hot melt adhesive prepared by the steps has the main properties that: viscosity number of 11000cps at 180 deg.C; thermal conductivity 3w/(m × DEG C)

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.