1. A method for on-line zoning adjustment of polishing head wafer loading and unloading pressure, wherein the polishing head comprises a plurality of pressure zones, the method comprising:

respectively acquiring the set pressure of each pressure subarea of the polishing head;

acquiring actual pressure corresponding to each pressure partition of the polishing head in real time according to the set pressure of each pressure partition of the polishing head;

correcting the next preset configuration pressure of the current pressure subarea in real time according to the set pressure and the actual pressure of the current pressure subarea;

and correcting the next preset configuration pressure of the current pressure subarea to obtain a pressure correction value, and taking the pressure correction value as the actual configuration pressure of the corresponding subarea.

2. A method for on-line zoning adjustment of polishing head wafer loading and unloading pressure as recited in claim 1, wherein the step of correcting the next preset configuration pressure of the current pressure zone in real time based on the set pressure and the actual pressure of the current pressure zone comprises: the pressure correction is not performed for the first time and the second time, and the preset configuration pressure is corrected from the third time of loading and unloading the sheet.

3. A method for on-line zoning adjusting polishing head wafer loading and unloading pressure as recited in claim 2, wherein the next preset configuration pressure for the current pressure zone is modified using a linear function.

4. A method as claimed in claim 1, wherein the actual pressure of each pressure zone of the polishing head is obtained in real time by a sensor.

5. A system for on-line zoned adjustment of polishing head wafer loading and unloading pressure, comprising:

the set pressure acquisition module is used for respectively acquiring the set pressure of each pressure subarea of the polishing head;

the monitoring module is used for acquiring actual pressure corresponding to each pressure partition of the polishing head in real time according to the set pressure of each pressure partition of the polishing head;

the correction module is used for correcting the next preset configuration pressure of the current pressure subarea in real time according to the set pressure and the actual pressure of the current pressure subarea;

and the configuration module is used for correcting the next preset configuration pressure of the current pressure subarea to obtain a pressure correction value, and the pressure correction value is used as the actual configuration pressure of the corresponding subarea.

6. The system for on-line zoned adjustment of polishing head wafer pressure as recited in claim 5, wherein the correction module comprises: and the correcting subunit is used for correcting the next preset configuration pressure of the current pressure partition by using the linear function.

7. The system for on-line zoned adjustment of polishing head wafer pressure as recited in claim 5, wherein the monitoring module comprises: and the sensor acquisition unit is used for acquiring the actual pressure corresponding to each pressure partition of the polishing head in real time through the sensor.

8. A terminal, comprising: at least one processor, and a memory communicatively coupled to the at least one processor, wherein the memory stores instructions executable by the at least one processor to cause the at least one processor to perform the method for on-line zoned adjustment of polishing head wafer pressure as recited in any one of claims 1-4.

9. A computer readable storage medium having stored thereon computer instructions for causing a computer to perform the method for on-line zoned adjusting polishing head wafer pressure of any of claims 1-4.

Background

During the Chemical-Mechanical Polishing (CMP) process, failure in loading and unloading the wafer often occurs, which not only seriously affects the automatic operation efficiency of the equipment, but also causes wafer breakage, reduces the equipment productivity and increases the manufacturing cost. The CMP process is a full-automatic wafer planarization technology, in the process, a polishing head adsorbs a wafer from a loading table to finish a wafer carrying action, then the polishing head transmits the wafer to a polishing pad for polishing, and after polishing is finished, the polishing head releases the adsorbed wafer onto the loading table to finish a wafer unloading action. The loading and unloading piece is an important link in the wafer transmission process, and the faults of the loading and unloading piece are the phenomenon of high occurrence frequency due to the fact that the loading table related to the loading and unloading piece is complex in structure, poor in multi-region pressure control accuracy of the polishing head and the like.

When the polishing head loads and unloads the wafer, the setting size of each area pressure value is a fixed value which is already configured, but along with the increase and continuous aging of the service life of consumables in each area of the polishing head, when the same pressure is set in the same area, the deviation between the actual pressure and the set pressure in the area is larger and larger, and the success rate of loading and unloading the wafer and the overall operation efficiency of the equipment are reduced.

Disclosure of Invention

Therefore, the method and the system for adjusting the loading and unloading pressure of the polishing head in an online partition manner provided by the invention overcome the defects of low loading and unloading success rate of the polishing head and low overall operation efficiency of the equipment in the prior art.

In order to achieve the purpose, the invention provides the following technical scheme:

in a first aspect, an embodiment of the present invention provides a method for adjusting pressure of a loading/unloading wafer of a polishing head in-line zoning, where the polishing head includes a plurality of pressure zones, the method including:

respectively acquiring the set pressure of each pressure subarea of the polishing head;

acquiring actual pressure corresponding to each pressure partition of the polishing head in real time according to the set pressure of each pressure partition of the polishing head;

correcting the next preset configuration pressure of the current pressure subarea in real time according to the set pressure and the actual pressure of the current pressure subarea;

and correcting the next preset configuration pressure of the current pressure subarea to obtain a pressure correction value, and taking the pressure correction value as the actual configuration pressure of the corresponding subarea.

In an embodiment, the modifying the next preset configuration pressure of the current pressure zone in real time according to the set pressure and the actual pressure of the current pressure zone includes: the pressure correction is not performed for the first time and the second time, and the preset configuration pressure is corrected from the third time of loading and unloading the sheet.

In one embodiment, the next preset configuration pressure for the current pressure partition is modified using a linear function.

In one embodiment, the actual pressure corresponding to each pressure zone of the polishing head is obtained in real time through a sensor.

In a second aspect, an embodiment of the present invention provides a system for online zoning adjustment of polishing head wafer loading/unloading pressure, including: the set pressure acquisition module is used for respectively acquiring the set pressure of each pressure subarea of the polishing head;

the monitoring module is used for acquiring actual pressure corresponding to each pressure partition of the polishing head in real time according to the set pressure of each pressure partition of the polishing head;

the correction module is used for correcting the next preset configuration pressure of the current pressure subarea in real time according to the set pressure and the actual pressure of the current pressure subarea;

and the configuration module is used for correcting the next preset configuration pressure of the current pressure subarea to obtain a pressure correction value, and the pressure correction value is used as the actual configuration pressure of the corresponding subarea.

In one embodiment, the correction module includes: and the correcting subunit is used for correcting the next preset configuration pressure of the current pressure partition by using the linear function.

In one embodiment, the monitoring module includes: and the sensor acquisition unit is used for acquiring the actual pressure corresponding to each pressure partition of the polishing head in real time through the sensor.

In a third aspect, an embodiment of the present invention provides a terminal, including: at least one processor, and a memory communicatively coupled to the at least one processor, wherein the memory stores instructions executable by the at least one processor to cause the at least one processor to perform the method for on-line zoned adjustment of polishing head wafer pressure according to the first aspect of embodiments of the present invention.

In a fourth aspect, embodiments of the present invention provide a computer-readable storage medium having stored thereon computer instructions for causing a computer to perform a method for on-line zoning adjustment of polishing head wafer pressure according to the first aspect of the embodiments of the present invention.

The technical scheme of the invention has the following advantages:

the method and the system for adjusting the loading and unloading pressure of the polishing head in the online subarea manner continuously adjust the actual configuration pressure of equipment, ensure that the actual pressure of the polishing head is more stable when the polishing head loads and unloads the wafer, keep smaller deviation with the target pressure, reduce the failure rate and the fragment rate of loading and unloading the wafer, and improve the operation efficiency of the equipment.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a flow chart of one particular example of a method for on-line zoned adjustment of polishing head load lock pressure provided by an embodiment of the present invention;

FIG. 2 is a block diagram of a system for on-line zoned adjustment of polishing head load lock pressure according to an embodiment of the present invention;

FIG. 3 is a block diagram illustrating an exemplary embodiment of a terminal of a system for zoned online adjustment of polishing head load lock pressure according to the present disclosure.

Detailed Description

The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

Example 1

According to the method for adjusting the pressure of the loading and unloading piece of the polishing head in the online subarea manner, the polishing head comprises a plurality of pressure subareas, as shown in fig. 1, the method comprises the following steps:

step S1: and respectively acquiring the set pressure of each pressure subarea of the polishing head.

In the embodiment of the present invention, as shown in the following table, the set pressure of each pressure zone of the polishing head is obtained in advance, and each item of data is stored in the storage module.

Step S2: and acquiring actual pressure corresponding to each pressure partition of the polishing head in real time according to the set pressure of each pressure partition of the polishing head.

In the embodiment of the invention, the actual pressure corresponding to each pressure partition of the polishing head is obtained in real time through the sensor. By way of example only, and not by way of limitation, in practical applications, corresponding sensors are selected according to actual requirements. As shown in the above table, according to the set pressure, the actual pressure is detected for each partition, and at the same time, the actual pressure is stored in the table and placed in the storage module.

Step S3: and correcting the next preset configuration pressure of the current pressure subarea in real time according to the set pressure and the actual pressure of the current pressure subarea.

In the embodiment of the invention, the adjustment is carried out according to the relation between the historical set pressure and the actual pressure, and the adjustment needs to be calculated according to the first two groups of data before the adjustment, so the pressure correction is not carried out for the first time and the second time, and the correction of the preset configuration pressure is carried out from the third time of loading and unloading the sheets. Meanwhile, the data of the first two times are saved in the storage module.

In the embodiment of the invention, the next preset configuration pressure of the current pressure zone is corrected by utilizing the linear function. By way of example only, and not by way of limitation, in practical applications, the corresponding function is selected according to actual requirements.

Step S4: and correcting the next preset configuration pressure of the current pressure subarea to obtain a pressure correction value, and taking the pressure correction value as the actual configuration pressure of the corresponding subarea.

According to the method for adjusting the loading and unloading pressure of the polishing head in the online subarea, which is provided by the embodiment of the invention, the polishing head comprises a plurality of pressure subareas. The method comprises the following steps: respectively acquiring the set pressure of each pressure subarea of the polishing head; acquiring actual pressure corresponding to each pressure partition of the polishing head in real time according to the set pressure of each pressure partition of the polishing head; correcting the next preset configuration pressure of the current pressure subarea in real time according to the set pressure and the actual pressure of the current pressure subarea; and correcting the next preset configuration pressure of the current pressure subarea to obtain a pressure correction value, and taking the pressure correction value as the actual configuration pressure of the corresponding subarea. The success rate of loading and unloading the sheets and the overall operation efficiency of the equipment are improved.

Example 2

An embodiment of the present invention provides a system for online zone adjustment of pressure of a polishing head loading/unloading pad, as shown in fig. 2, including:

a set pressure acquiring module 1 for respectively acquiring set pressures of the pressure zones of the polishing head; this module executes the method described in step S1 in embodiment 1, and is not described herein again.

The monitoring module 2 is used for acquiring actual pressure corresponding to each pressure partition of the polishing head in real time according to the set pressure of each pressure partition of the polishing head; this module executes the method described in step S2 in embodiment 1, and is not described herein again.

The correction module 3 is used for correcting the next preset configuration pressure of the current pressure subarea in real time according to the set pressure and the actual pressure of the current pressure subarea; this module executes the method described in step S3 in embodiment 1, and is not described herein again.

The configuration module 4 is used for correcting the next preset configuration pressure of the current pressure subarea to obtain a pressure correction value, and the pressure correction value is used as the actual configuration pressure of the corresponding subarea; this module executes the method described in step S4 in embodiment 1, and is not described herein again.

In one embodiment, the modification module 3 includes: and the correcting subunit is used for correcting the next preset configuration pressure of the current pressure partition by using the linear function. By way of example only, and not by way of limitation, in practical applications, the corresponding correction function is selected according to actual requirements.

In a specific embodiment, the monitoring module 2 includes: and the sensor acquisition unit is used for acquiring the actual pressure corresponding to each pressure partition of the polishing head in real time through the sensor. The selection of the sensor is correspondingly selected according to actual requirements, and is not limited herein.

In a specific embodiment, after the modification module receives an instruction to be adjusted by the main system and a configuration pressure to be adjusted, the monitoring module accesses two sets of setting pressures and actual pressures corresponding to the configuration pressure stored in the storage module, calculates an adjustment coefficient according to a relationship between the two sets of pressures, adjusts the configuration pressure value to a setting pressure value, sends the setting pressure to the equipment main system, and the equipment main system issues the setting pressure to the equipment hardware interface, where a specific adjustment process is as follows:

setting the configured pressure of the polishing head 1 area k equal to ZkFn in a certain step of loading or unloading, accessing and querying the storage module by the monitoring module, retrieving two sets of data (ZkFsn1, ZkFan1) and (ZkFsn2, ZkFan2) corresponding to the configured pressure of the polishing head 1 area k equal to ZkFn, and adjusting the set pressure ZkFn according to the two sets of data.

If ZkFan1 is not equal to ZkFan2, the relationship between the two connecting lines is y-kx + b, the adjusted pressure is ZkFsn, and k, b and ZkFsn obtained through calculation are shown as the following formulas:

k＝(ZkFsn2-ZkFsn1)/(ZkFan2-ZkFan1)

b＝ZkFsn1-(ZkFan1*(ZkFsn2-ZkFsn1)/(ZkFan2-ZkFan1))

ZkFsn＝k*ZkFn+b

if ZkFan1 equals ZkFan2, then ZkFsn — ZkFsn 2.

After the monitoring module calculates, the adjusting module transmits the ZkFsn value to the equipment main system, and the equipment main system transmits a pressure value equal to the ZkFsn value to the hardware interface.

Before the pressure is set in the next step, the monitoring module collects the set pressure ZkFsn and the actual pressure at this time, and the collected actual pressure is ZkFan. And configuring corresponding data with pressure equal to ZkFn in the storage module for updating, wherein the updating result is as follows:

ZkFsn1＝ZkFsn2，

ZkFan1＝ZkFan2，

ZkFsn2＝ZkFsn，

ZkFan2＝ZkFan，

the embodiment of the invention provides a system for adjusting the pressure of a polishing head loading and unloading piece in an online partition mode.

Example 3

An embodiment of the present invention provides a terminal, as shown in fig. 3, including: at least one processor 401, such as a CPU (Central Processing Unit), at least one communication interface 403, memory 404, and at least one communication bus 402. Wherein a communication bus 402 is used to enable connective communication between these components. The communication interface 403 may include a Display (Display) and a Keyboard (Keyboard), and the optional communication interface 403 may also include a standard wired interface and a standard wireless interface. The Memory 404 may be a RAM (random Access Memory) or a non-volatile Memory (non-volatile Memory), such as at least one disk Memory. The memory 404 may optionally be at least one memory device located remotely from the processor 401. Wherein processor 401 may perform the method for adjusting polishing head wafer loading pressure in online zoning embodiment 1. A set of program codes is stored in the memory 404 and the processor 401 calls the program codes stored in the memory 404 for performing the method of online zoning for adjusting polishing head loading and unloading pressure in embodiment 1.

The communication bus 402 may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus. The communication bus 402 may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, only one line is shown in FIG. 3, but this does not represent only one bus or one type of bus. The memory 404 may include a volatile memory (RAM), such as a random-access memory (RAM); the memory may also include a non-volatile memory (english: non-volatile memory), such as a flash memory (english: flash memory), a hard disk (english: hard disk drive, abbreviated: HDD) or a solid-state drive (english: SSD); the memory 404 may also comprise a combination of memories of the kind described above. The processor 401 may be a Central Processing Unit (CPU), a Network Processor (NP), or a combination of a CPU and an NP.

The memory 404 may include a volatile memory (RAM), such as a random-access memory (RAM); the memory may also include a non-volatile memory (english: non-volatile memory), such as a flash memory (english: flash memory), a hard disk (english: hard disk drive, abbreviated: HDD) or a solid-state drive (english: SSD); the memory 404 may also comprise a combination of memories of the kind described above.

The processor 401 may be a Central Processing Unit (CPU), a Network Processor (NP), or a combination of a CPU and an NP.

The processor 401 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit (ASIC), a Programmable Logic Device (PLD), or a combination thereof. The PLD may be a Complex Programmable Logic Device (CPLD), a field-programmable gate array (FPGA), a General Array Logic (GAL), or any combination thereof.

Optionally, the memory 404 is also used to store program instructions. Processor 401 may invoke program instructions to implement the method for adjusting polishing head wafer loading pressure in an in-line zone as described in example 1.

An embodiment of the present invention further provides a computer-readable storage medium, where computer-executable instructions are stored on the computer-readable storage medium, and the computer-executable instructions may execute the method for adjusting the pressure of the polishing head loading/unloading piece in online zoning according to embodiment 1. The storage medium may be a magnetic Disk, an optical Disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a Flash Memory (Flash Memory), a Hard Disk (Hard Disk Drive, abbreviated as HDD), a Solid State Drive (SSD), or the like; the storage medium may also comprise a combination of memories of the kind described above.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the spirit or scope of the invention.