1. A heat dissipation structure that combines to resist shock, its characterized in that includes:

a thermally conductive housing;

a heat source located within the thermally conductive housing;

the shock absorption component is arranged in the heat conduction shell so as to form a space between the heat source and the heat conduction shell; and

at least one heat transfer element which can be deformed by gravity is arranged in the space in a twisting mode, so that heat conduction can be carried out between the heat source and the heat conduction shell.

2. The structure of claim 1, wherein the heat transfer member has a thickness d, wherein d is 0.025mm or less and 0.1mm or less.

3. The heat dissipation structure combined with vibration prevention according to claim 1, wherein the heat transfer member is a metal foil.

4. The heat dissipation structure combined with vibration prevention as claimed in claim 1, wherein the heat transfer member has a double-layered structure, and one of the layers is an aluminum foil or a copper foil.

5. The structure for dissipating heat in combination with vibration damping as defined in claim 4, wherein the other layer of the heat transfer member is Mylar.

6. The structure of claim 1, wherein said heat transfer member comprises a flexible section and two fixed sections, and said flexible section is integrally connected between said two fixed sections.

7. The structure for dissipating heat in combination with vibration damping as defined in claim 6, wherein two of said fixing sections are adhered to said heat source.

8. The structure for dissipating heat in combination with vibration damping as claimed in claim 7, wherein two of the fixing sections are adhered to an inner wall of the heat conductive housing.

9. The structure of claim 6, wherein the flexible section abuts against the inner wall of the heat conductive housing.

10. The structure for dissipating heat in combination with vibration damping as defined in claim 9, wherein said flexure section abuts against said heat source.

11. A storage device comprising the shockproof heat dissipating structure of claim 1, wherein the hard disk operates to generate the heat source.

12. The storage device of claim 11, wherein the heat transfer element comprises a flexible section and two fixed sections, the flexible section is integrally connected between the two fixed sections, and the flexible section abuts against the heat source.

13. A heat dissipating structure mounting method for mounting the vibration-proof combined heat dissipating structure of claim 1, comprising the steps of:

the shock-absorbing member and at least one heat transfer element capable of deforming under gravity are arranged on the heat source and placed in the heat-conducting shell, so that a space is formed between the heat source and the heat-conducting shell, and heat conduction can be carried out between the heat source and the heat-conducting shell.

Background

At present, in the conventional structure such as a removable hard disk or a structure for loading a storage device, in order to provide shock absorption effects such as shock absorption or shock absorption, a shock absorption element made of a material such as rubber is disposed in a box body for loading the hard disk, and is disposed between the hard disk and the box body, so that the hard disk does not directly contact the box body, when the box body is vibrated by an external force, the vibration energy is not directly transmitted to the hard disk through the box body to cause the hard disk to be vibrated, and the vibration energy is absorbed by the shock absorption element only, thereby having the similar effects and effects of shock absorption, shock absorption or shock absorption.

However, because there is no heat transmission structure between the hard disk or the storage device and the box body under the technical limitation of shock resistance, and if the box body is a closed structure, the heat generated by the hard disk is not easy to dissipate or cool when the hard disk is operated in the box body, the problem of heat dissipation is more and more difficult to overcome.

Therefore, it is desirable to provide a heat dissipation structure and a storage device with shock resistance to solve the above problems.

Disclosure of Invention

The invention aims to provide a shockproof heat dissipation structure, a storage device and a heat dissipation structure installation method, which are easy to dissipate heat and good in heat dissipation effect.

In order to achieve the purpose, the invention adopts the following technical scheme:

a heat dissipating structure combined with shock prevention, comprising:

a thermally conductive housing;

a heat source located within the thermally conductive housing;

the shock absorption component is arranged in the heat conduction shell so as to form a space between the heat source and the heat conduction shell; and

at least one heat transfer element which can be deformed by gravity is arranged in the space in a twisting mode, so that heat conduction can be carried out between the heat source and the heat conduction shell.

Preferably, the heat transfer member has a thickness d of 0.025 mm. ltoreq. d.ltoreq.0.1 mm.

Preferably, the heat transfer member is a metal foil.

Preferably, the heat transfer member has a double-layer structure, and one layer of the heat transfer member is an aluminum foil or a copper foil.

Preferably, the other layer of the heat transfer element is mylar.

Preferably, the heat transfer element comprises a flexible section and two fixed sections, and the flexible section is integrally connected between the two fixed sections.

Preferably, two of said fixed segments are affixed to said heat source.

Preferably, the flexible section abuts against the inner wall of the heat-conducting shell.

Preferably, the flexible section abuts against the heat source.

In order to achieve the above object, the present invention further provides a storage device, which comprises the above shockproof heat dissipation structure, wherein the hard disk is operated to generate the heat source.

Preferably, the heat transfer element comprises a flexible section and two fixed sections, the flexible section is integrally connected between the two fixed sections, and the flexible section abuts against the heat source.

In order to achieve the above object, the present invention further provides a method for installing the above shockproof heat dissipation structure, wherein the method for installing the shockproof heat dissipation structure comprises the following steps:

the shock-absorbing member and at least one heat transfer element capable of deforming under gravity are arranged on the heat source and placed in the heat-conducting shell, so that a space is formed between the heat source and the heat-conducting shell, and heat conduction can be carried out between the heat source and the heat-conducting shell.

The invention has the beneficial effects that:

the invention provides a shockproof heat dissipation structure, wherein a heat conduction shell is mainly used for bearing a hard disk, a shock absorption component and a heat transfer element and is assembled and annularly arranged outside the hard disk, the shock absorption component and the heat transfer element, thereby providing protection for the components. The shock-absorbing member is arranged in the heat-conducting shell, so that an interval space is formed between the hard disk or the heat source and the heat-conducting shell, and when the heat-conducting shell is vibrated, the shock-absorbing member can absorb the shock energy transmitted to the hard disk or the heat source, thereby having the shock-absorbing function and effect. The heat transfer element is arranged in the space in a twisting mode, so that heat conduction can be achieved between the heat source and the heat conduction shell, and therefore the purpose of heat dissipation and cooling of the heat source is achieved.

The invention also provides a storage device which comprises the shockproof heat dissipation structure and can realize heat dissipation of a heat source.

The invention also provides a method for installing the heat dissipation structure, which comprises the steps of arranging the shock absorption component and the at least one heat transfer element capable of deforming under the action of gravity on the heat source to form an integral structure, and then integrally placing the integral structure in the heat conduction shell, so that the heat dissipation structure is convenient to assemble, and the shock absorption effect and the heat dissipation effect can be simultaneously ensured.

Drawings

Fig. 1 is an exploded view of a heat-conducting housing in a heat dissipation structure incorporating shock protection according to an embodiment of the present invention;

FIG. 2 is an exploded view of the hard disk, the shock absorbing member and the heat transfer element in the heat dissipation structure with shock absorption according to one embodiment of the present invention;

FIG. 3 is a schematic view of the hard disk, the shock absorbing member and the heat transfer element in the heat dissipation structure with shock absorption according to an embodiment of the present invention;

FIG. 4 is a perspective view of a shock-absorbing heat dissipating structure according to an embodiment of the present invention;

FIG. 5 is a cross-sectional view of a perspective view of a heat dissipation structure with shock absorption according to an embodiment of the present invention;

FIG. 6 is a cross-sectional view of another perspective of the heat dissipation structure with shock absorption according to an embodiment of the present invention;

fig. 7 is a schematic cross-sectional view of a heat dissipation structure with shock absorption according to a second embodiment of the present invention.

Detailed Description

In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

Example one

Fig. 1 is an exploded view of a heat-conducting housing in a heat dissipation structure incorporating shock protection according to an embodiment of the present invention; FIG. 2 is an exploded view of the hard disk, the shock absorbing member and the heat transfer element in the heat dissipation structure with shock absorption according to one embodiment of the present invention; FIG. 3 is a schematic view of the hard disk, the shock absorbing member and the heat transfer element in the heat dissipation structure with shock absorption according to an embodiment of the present invention.

Referring to fig. 1, 2 and 3, the present embodiment provides a shockproof heat dissipation structure, which includes a heat conductive housing 1, a hard disk 2, a shock absorbing member 3 and a heat transfer member 4.

The heat conducting casing 1 is mainly used for carrying the hard disk 2, the shock absorbing member 3 and the heat transfer element 4, and is assembled and annularly arranged outside the hard disk 2, the shock absorbing member 3 and the heat transfer element 4, so as to provide protection for the hard disk 2, the shock absorbing member 3 and the heat transfer element 4, and the heat conducting casing 1 can be made of materials with better heat conductivity, such as aluminum, and the like, so as to provide better heat dissipation effect. In the embodiment of the present invention, the heat conductive housing 1 includes a base 10 and an upper cover 11, and the base 10 and the upper cover 11 are combined in an upper and lower covering manner to form the heat conductive housing 1, so that the components can be disposed in the heat conductive housing 1.

The hard disk 2 is located in the heat-conducting housing 1, and the hard disk 2 can be regarded as a heat source 20 because the hard disk 2 generates heat during operation. The main purpose of this embodiment is to conduct and release the heat generated by the hard disk 2 or the heat source 20 to the heat-conducting housing 1, so as to help the hard disk 2 or the heat source 20 to dissipate heat or reduce the operating temperature of the hard disk 2.

The shock-absorbing member 3 can be made of rubber material, and the shock-absorbing member 3 is disposed in the heat-conducting housing 1, so that a space 100 is formed between the hard disk 2 or the heat source 20 and the heat-conducting housing 1, and by disposing the space 100, when the heat-conducting housing 1 is vibrated, the shock-absorbing member 3 can absorb the shock energy transmitted to the hard disk 2 or the heat source 20, thereby having shock-absorbing effect and efficacy. In the embodiment of the present invention, the shock absorbing member 3 is extended along one side of the hard disk 2, and a concave groove 30 is formed on one side of the shock absorbing member 3, the concave groove 30 provides a space for tightly placing one side of the hard disk 2, and a protruding point-shaped abutting portion 31 is formed on the other side of the shock absorbing member 3, and by arranging the abutting portion 31, the contact portion or area with the heat conducting housing 1 can be reduced, so as to improve the shock absorbing effect, wherein the number of the abutting portion 31 can be plural, that is, the number of the abutting portion 31 is at least two.

The heat transfer member 4 is made of a material deformable by gravity, such as a metal foil, wherein the metal foil is specifically an aluminum foil or a copper foil. In the embodiment of the present invention, the heat transfer element 4 may also be a double-layer structure, and one layer is formed by the above-mentioned metal foil, which may be an aluminum foil or a copper foil; the other layer is mylar. The Mylar material has a softer texture, so that the transmission of vibration energy can be reduced or avoided, and meanwhile, the Mylar material also has heat transfer characteristics to provide a proper heat transfer effect. In addition, the thickness of the heat transfer element 4 is d, wherein d is more than or equal to 0.025mm and less than or equal to 0.1 mm.

FIG. 4 is a perspective view of a shock-absorbing heat dissipating structure according to an embodiment of the present invention; FIG. 5 is a cross-sectional view of a perspective view of a heat dissipation structure with shock absorption according to an embodiment of the present invention; fig. 6 is a cross-sectional view of another view of the heat dissipation structure with shock absorption according to an embodiment of the present invention.

Further, as shown in fig. 4, 5 and 6, the heat transfer element 4 is disposed in the space 100 in a twisted manner, the heat transfer element 4 includes a flexible section 40 and two fixed sections 41, and the flexible section 40 is integrally connected between the two fixed sections 41; in the present embodiment, the flexible section 40 abuts against the inner wall of the heat-conducting housing 1, and the two fixing sections 41 are respectively adhered to the hard disk 2 or the heat source 20. Thus, the heat transfer member 4 can conduct heat between the hard disk 2 and the heat conductive housing 1 (or between the heat source 20 and the heat conductive housing 1), so as to transfer the heat of the hard disk 2 or the heat source 20 to the heat conductive housing 1, thereby providing the purposes of heat dissipation and cooling for the hard disk 2 or the heat source 20.

Therefore, the heat dissipation structure combined with shock resistance and the storage device thereof can be obtained through the structural composition.

Example two

Fig. 7 is a schematic cross-sectional view of a heat dissipation structure with shock absorption according to a second embodiment of the present invention, as shown in fig. 7. Wherein, the flexible section 40 of the heat transfer element 4 can also be attached to the hard disk 2 or the heat source 20, and the two fixing sections 41 are adhered to the inner wall of the heat conductive housing 1. With such a change of configuration, the heat transfer member 4 can be disposed in the space 100 in a twisted manner to achieve heat conduction between the hard disk 2 or the heat source 20 and the heat conductive housing 1.

The embodiment also provides a storage device, which comprises the shockproof heat dissipation structure and can realize heat dissipation of the hard disk 2 or the heat source 20. In which a hard disk 2 is operated to generate a heat source 20. A heat conducting member 4 capable of deforming under gravity is provided between the hard disk 2 and the heat conducting housing 1, and the heat conducting member 4 is used to help the hard disk 2 to dissipate heat.

Wherein, the flexible section 40 is abutted against the hard disk 2 or the heat source 20 to achieve the purpose of cooling the hard disk 2 or the heat source 20.

The embodiment also provides a heat dissipation structure installation method, which is used for installing the shockproof heat dissipation structure, and the shockproof heat dissipation structure installation method comprises the following steps:

the shock-absorbing member 3 and at least one heat transfer element 4 capable of deforming under gravity are disposed on a heat source and placed in the heat-conducting casing 1, so that a space is formed between the heat source and the heat-conducting casing 1 for heat conduction between the heat source and the heat-conducting casing 1.

The embodiment also provides a method for installing a heat dissipation structure, which comprises the steps of firstly arranging the shock absorption member 3 and at least one heat transfer element 4 which can deform under the action of gravity on a heat source to form an integral structure, then integrally placing the integral structure in the heat conduction shell 1, thereby facilitating the assembly and simultaneously ensuring the shock resistance and the heat dissipation effect.

However, the above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that all changes in the equivalent techniques and means used in the specification and drawings of the present invention are also included in the scope of the present invention, and it is obvious that the present invention is also encompassed by the present invention.

In the description herein, it is to be understood that the terms "upper", "lower", "right", and the like are based on the orientations and positional relationships shown in the drawings and are used for convenience in description and simplicity in operation, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be constructed in a particular operation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.

In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

In addition, the foregoing is only the preferred embodiment of the present invention and the technical principles applied. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.